CN110211979B - 光检测装置及其制造方法 - Google Patents

光检测装置及其制造方法 Download PDF

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CN110211979B
CN110211979B CN201910468930.2A CN201910468930A CN110211979B CN 110211979 B CN110211979 B CN 110211979B CN 201910468930 A CN201910468930 A CN 201910468930A CN 110211979 B CN110211979 B CN 110211979B
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substrate
electrode
insulating film
bonding
film layer
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CN110211979A (zh
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藤井宣年
萩本贤哉
青柳健一
香川惠永
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Sony Corp
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Sony Corp
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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201910468930.2A 2013-03-22 2014-03-14 光检测装置及其制造方法 Active CN110211979B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-060691 2013-03-22
JP2013060691A JP5939184B2 (ja) 2013-03-22 2013-03-22 半導体装置の製造方法
CN201410095150.5A CN104064574B (zh) 2013-03-22 2014-03-14 半导体装置和制造方法

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CN110211979A CN110211979A (zh) 2019-09-06
CN110211979B true CN110211979B (zh) 2022-11-18

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CN201910445485.8A Active CN110190076B (zh) 2013-03-22 2014-03-14 半导体装置和制造方法
CN201410095150.5A Active CN104064574B (zh) 2013-03-22 2014-03-14 半导体装置和制造方法
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CN201810156644.8A Pending CN108198834A (zh) 2013-03-22 2014-03-14 半导体装置和制造方法

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US (6) US9190275B2 (cg-RX-API-DMAC7.html)
JP (1) JP5939184B2 (cg-RX-API-DMAC7.html)
KR (1) KR102158394B1 (cg-RX-API-DMAC7.html)
CN (4) CN110211979B (cg-RX-API-DMAC7.html)
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JP5517800B2 (ja) * 2010-07-09 2014-06-11 キヤノン株式会社 固体撮像装置用の部材および固体撮像装置の製造方法
JP5682327B2 (ja) * 2011-01-25 2015-03-11 ソニー株式会社 固体撮像素子、固体撮像素子の製造方法、及び電子機器
JP5939184B2 (ja) * 2013-03-22 2016-06-22 ソニー株式会社 半導体装置の製造方法
TWI648986B (zh) * 2014-04-15 2019-01-21 Sony Corporation 攝像元件、電子機器
TWI676280B (zh) * 2014-04-18 2019-11-01 日商新力股份有限公司 固體攝像裝置及具備其之電子機器
JP6570417B2 (ja) * 2014-10-24 2019-09-04 株式会社半導体エネルギー研究所 撮像装置および電子機器
JP2016092413A (ja) * 2014-10-29 2016-05-23 株式会社半導体エネルギー研究所 撮像装置および電子機器
JP6335099B2 (ja) * 2014-11-04 2018-05-30 東芝メモリ株式会社 半導体装置および半導体装置の製造方法
JP2016174016A (ja) * 2015-03-16 2016-09-29 株式会社東芝 半導体装置および半導体装置の製造方法
JP2016181531A (ja) * 2015-03-23 2016-10-13 ソニー株式会社 半導体装置、および半導体装置の製造方法、固体撮像素子、撮像装置、並びに電子機器
JP2017117828A (ja) 2015-12-21 2017-06-29 ソニー株式会社 固体撮像素子および電子装置
CN110914993B (zh) * 2017-07-25 2023-08-15 索尼半导体解决方案公司 固态摄像装置
TWI905469B (zh) * 2017-10-30 2025-11-21 日商索尼半導體解決方案公司 固體攝像裝置及電子機器
WO2020079945A1 (ja) * 2018-10-15 2020-04-23 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器
CN110233980B (zh) * 2019-06-27 2021-11-02 Oppo广东移动通信有限公司 一种有源像素图像传感器及图像处理方法、存储介质
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