CN110176407A - 运动装置 - Google Patents

运动装置 Download PDF

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CN110176407A
CN110176407A CN201910628196.1A CN201910628196A CN110176407A CN 110176407 A CN110176407 A CN 110176407A CN 201910628196 A CN201910628196 A CN 201910628196A CN 110176407 A CN110176407 A CN 110176407A
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turntable
telecontrol equipment
pallet
electric machine
gravity
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CN110176407B (zh
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吴火亮
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Shanghai Yinguan Semiconductor Technology Co Ltd
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Shanghai Yinguan Semiconductor Technology Co Ltd
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Priority to US17/594,766 priority Critical patent/US20220216088A1/en
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Publication of CN110176407A publication Critical patent/CN110176407A/zh
Priority to KR1020217039162A priority patent/KR102677414B1/ko
Priority to KR1020237042585A priority patent/KR102646040B1/ko
Priority to PCT/CN2020/086368 priority patent/WO2020221096A1/zh
Priority to JP2021564750A priority patent/JP7307980B2/ja
Priority to JP2023040320A priority patent/JP2023063474A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0675—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum of the ejector type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

本发明提供了一种运动装置，包括：托盘；旋转台，位于所述托盘下方，且其上表面设有环形上部凹腔，下表面设有下部凹腔，其中上部凹腔与下部凹腔在垂直于旋转台的上表面的投影方向上的投影相互错开；旋转电机，容纳在环形上部凹腔内，并包括旋转电机动子和旋转电机定子，旋转电机定子相对于旋转台固定，旋转电机动子相对于托盘固定；垂直移动装置，位于下部凹腔内并构造成能够驱动旋转台垂直移动；浮动重力补偿装置，位于下部凹腔内并构造成能够对旋转台进行重力补偿。与现有技术相比，本发明的运动装置垂向尺寸显著减小，且通过浮动重力补偿装置的应用，显著增加运动装置的垂向运动精度。

Description

运动装置
技术领域
本发明涉及集成电路装备制造领域，更具体的涉及一种运动装置，所述运动装置可提供高精度的垂向运动和旋转功能。
背景技术
在半导体硅片膜厚的检测领域，要求工件台可以和硅片传输系统完成硅片的交接，同时需要承载着12英寸或者8英寸硅片完成360°旋转和垂向运动，完成硅片膜厚的检测。所以对于应用在膜厚检测的工件台装置中，旋转/垂直移动台是其核心部件。随着对产率要求的不断提高，膜厚检测精度的不断提升，工件台的运行速度、加速度和性能也随之提高。这就要求工件台具有更加的轻量化，更加的扁平化，更高的运动精度的设计。在美国专利US2004246012A1中，提出一种该领域的工件台方案。如图1所示，该发明的垂向移动台(支承平台112)固定在垂向装置上，卡盘单元固定在垂向移动台上。且垂向装置是通过直线电机驱动楔形块，同时依靠两个0.5mm厚的簧片提供往复力从而实现垂向运动。该发明结构较为简单，但高度尺寸较大，很难实现扁平化设计。
在美国专利US6779278B1中，提出另外一种该领域的工件台方案。如图2所示，该发明的垂向移动台(Z平台)固定在垂向装置上，卡盘固定在垂向移动台上。且垂向装置是通过音圈电机实现直驱，并通过弹簧实现音圈电机的重力补偿，降低音圈电机负载。该发明结构较为简单，垂向尺寸较小，基本实现了扁平化设计。但由于音圈电机采用了弹簧进行重力补偿，垂向精度很难实现高精度。
因此，在集成电路的装备制造领域，需要一种能够实现扁平化设计，同时解决垂向的运动精度偏低的精密运动装置。
发明内容
本发明通过提供一种具有扁平结构的精密运动装置来解决现有技术中运动装置高度尺寸偏大的问题，实现扁平化设计，并解决垂向的运动精度偏低的问题。
具体来说，本发明通过提供一种运动装置来解决上述问题，该装置包括：运动装置，包括：
托盘；
旋转台，所述旋转台位于所述托盘下方，所述旋转台的上表面设有环形上部凹腔，所述旋转台的下表面设有下部凹腔，其中所述上部凹腔与所述下部凹腔在垂直于所述旋转台的上表面的投影方向上的投影相互错开；
旋转电机，所述旋转电机容纳在所述环形上部凹腔内，所述旋转电机包括旋转电机动子和旋转电机定子，所述旋转电机定子相对于所述旋转台固定，所述旋转电机动子相对于所述托盘固定；
垂直移动装置，所述垂直移动装置位于所述下部凹腔内并构造成能够驱动所述旋转台垂直移动；
浮动重力补偿装置，所述浮动重力补偿装置位于所述下部凹腔内并构造成能够对所述旋转台进行重力补偿。
在一实施例中，所述垂直移动装置和所述浮动重力补偿装置彼此集成并位于所述下部凹腔内。
在一实施例中，所述下部凹腔包括多个下部凹腔，所述垂直移动装置和所述浮动重力补偿装置分别位于不同的下部凹腔内。
在一实施例中，所述浮动重力补偿装置为磁浮重力补偿装置。
在一实施例中，所述浮动重力补偿装置为气浮重力补偿装置。
在一实施例中，所述多个下部凹腔包括中心凹腔和周部凹腔，所述中心凹腔的平面位置由所述环形上部凹腔所围绕，并用于容纳所述垂直移动装置；所述周部凹腔位于所述环形上部凹腔的外周，并用于容纳所述浮动重力补偿装置。
在一实施例中，所述运动装置还包括上下片装置，所述上下片装置构造成将工件放置到所述托盘或从所述托盘移走工件。
在一实施例中，所述垂直移动装置包括音圈电机，所述音圈电机为中空式结构，以及所述托盘为真空卡盘装置。
在一实施例中，所述下部凹腔包括四个周部凹腔，每个所述周部凹腔容纳一个浮动重力补偿装置。
在一实施例中，所述垂直移动装置和所述浮动重力补偿装置彼此集成的结构包括：
音圈电机定子，所述音圈电机定子外表面套设有内磁环；以及
音圈电机动子，所述音圈电机动子外表面套设有外磁环。
现有技术中能够实现多维度运动的运动装置中用于实现旋转运动和垂向运动的部分通常彼此叠置，使得运动装置垂向尺寸偏大。与现有技术相比，本发明的运动装置垂向尺寸显著减小，且通过浮动重力补偿装置的应用，显著增加运动装置的垂向运动精度。
附图说明
图1是根据本发明的精密运动装置的立体图。
图2是根据本发明的精密运动装置剖视图。
图3是根据本发明的精密运动装置俯视图，其中托盘被移除。
图4是根据本发明的磁浮重力补偿装置的立体图。
图5是根据本发明的磁浮重力补偿装置的剖视图。
图6是根据本发明的旋转台底座的俯视立体图。
图7是根据本发明的旋转台底座的仰视立体图。
图8是根据本发明的精密运动装置的音圈电机的剖视图。
图9是根据本发明的一种磁浮重力补偿装置的布局的另一实施例。
图10是根据本发明的一种磁浮重力补偿装置的又一实施例。
具体实施方式
以下将结合附图对本发明的较佳实施例进行详细说明，以便更清楚理解本发明的目的、特点和优点。应理解的是，附图所示的实施例并不是对本发明范围的限制，而只是为了说明本发明技术方案的实质精神。
在下文的描述中，出于说明各种公开的实施例的目的阐述了某些具体细节以提供对各种公开实施例的透彻理解。但是，相关领域技术人员将认识到可在无这些具体细节中的一个或多个细节的情况来实践实施例。在其它情形下，与本申请相关联的熟知的装置、结构和技术可能并未详细地示出或描述从而避免不必要地混淆实施例的描述。
除非语境有其它需要，在整个说明书和权利要求中，词语“包括”和其变型，诸如“包含”和“具有”应被理解为开放的、包含的含义，即应解释为“包括，但不限于”。
在整个说明书中对“一个实施例”或“一实施例”的提及表示结合实施例所描述的特定特点、结构或特征包括于至少一个实施例中。因此，在整个说明书的各个位置“在一个实施例中”或“在一实施例”中的出现无需全都指相同实施例。另外，特定特点、结构或特征可在一个或多个实施例中以任何方式组合。
如该说明书和所附权利要求中所用的单数形式“一”和“所述”包括复数指代物，除非文中清楚地另外规定。应当指出的是术语“或”通常以其包括“和/或”的含义使用，除非文中清楚地另外规定。
在以下描述中，为了清楚展示本发明的结构及工作方式，将借助诸多方向性词语进行描述，但是应当将“前”、“后”、“左”、“右”、“外”、“内”、“向外”、“向内”、“上”、“下”等词语理解为方便用语，而不应当理解为限定性词语。
现参照附图来描述根据本发明的扁平精密运动装置100。如图1所示，扁平精密运动装置100包括上下片装置、托盘102、旋转移动台103、垂向运动装置104、浮动重力补偿装置105、水平向运动装置106和支架108。
上下片装置固定在运动装置外壳108上。该上下片装置用于和外部机械手(未示出)、托盘102共同完成硅片的交接。如图1所示，该上下片装置包括四个接片手101a、101b、101c和101d。该上下片装置通过四个接片手101a、101b、101c和101d将待测量的硅片从外部机械手接收并转移至托盘102上，以及将测量完成的硅片从托盘102转移至外部机械手。
在图2所示实施例中，托盘102由吸盘1021和吸盘底座1022组成，用于硅片的固定。在该实施例中，托盘102是真空式吸盘，通过在圆盘形吸盘1021上设有通气孔并在其下方形成真空来通过真空吸附而将硅片固定在吸盘1021上。但应理解，托盘102也可通过其他方式将硅片固定在吸盘1021上，例如通过卡爪卡压住硅片的周边而将硅片固定。
如图2所示，旋转台103设置在托盘102下方，能够带动托盘102绕中心轴线旋转运动。旋转台103包括：旋转电机定子1031、旋转电机动子1032、轴承1033、旋转台底座1034、旋转光栅尺1035。
旋转台底座1034的具体结构参见图6和7。如图6所示，旋转台底座1034呈大致长方体形状，具体为水平截面为大致正方形的长方体。但应理解，旋转台底座1034的形状并不限于上述形状，而是可根据需要任意设置。在旋转台底座1034的上表面上设有环形凹腔1034a，且在下表面上设有下部凹腔(如下文所述)。上述环形凹腔1034a和下部凹腔在垂直于旋转台底座1034的上表面方向上的投影彼此错开，从而该环形凹腔1034a和下部凹腔可以设置在相同的垂向高度上，由此能够显著降低旋转台底座1034的垂向尺寸。旋转台底座1034的该结构有效降低了整个运动装置的垂向高度。
具体地，该环形凹腔1034a的内周壁和外周壁呈圆筒状。在内周壁顶部围绕形成圆形面1034c。在托盘102是通过真空吸附来固定硅片的情况下，在该圆形面上形成有托盘供气孔1034b。
如图7所示，在旋转台底座1034的下表面上设有下部凹腔。下部凹腔包括浮动重力补偿装置腔体1034d和垂直音圈电机腔体1034e。具体在该实施例中，旋转台底座1034的外周轮廓与上述环形凹腔1034a之间的四个角部位置分别设有浮动重力补偿装置腔体1034d，用于容纳浮动重力补偿装置105。在旋转台底座1034的下表面中央与环形凹腔1034a的内周壁所围绕的区域相对应的位置设有垂直音圈电机腔体1034e。
再参见图2，旋转电机定子1031呈具有一定厚度的圆筒状并容纳且固定在旋转台底座1034的环形凹腔1034a内。旋转台底座1034位于托盘102下方，其中环形凹腔1034a的内周壁顶部所围绕的圆形面1034c用于承载托盘102。旋转电机动子1032也容纳于环形凹腔1034a内，并位于旋转电机定子1031内周内。旋转电机动子1032与吸盘底座1022固定连接。旋转电机动子1032能够相对于旋转电机定子1031进行旋转运动，从而驱动吸盘底座1022，并进而带动托盘102进行旋转运动，并由旋转光栅尺1035提供旋转位置信号。轴承1033设置在旋转电机动子1032和旋转台底座1034之间，为旋转台提供旋转导向。
如图2所示，垂直移动装置104位于旋转台底座1034下表面上的垂直音圈电机腔体1034e内，并承载旋转台底座1034。在该实施例中，垂直移动装置104包括:音圈电机动子1041、音圈电机定子1042、垂向导轨1043、垂向光栅尺1044、以及垂向底座1045(见图3)。音圈电机定子1042固定在垂向底座1045上，音圈电机动子1041套设在音圈电机定子1042上并能相对于音圈电机定子1042垂直移动，音圈电机动子1041与旋转台底座1034固定连接，驱动旋转台103进行垂向运动，并由垂向光栅尺1044提供垂向位置信号。在所示实施例中，垂向光栅尺1044设置在旋转台底座1034的四周并竖直放置，从而确定旋转台底座1034以及所承载托盘102的竖直位置。
图8中具体示出了音圈电机的结构。音圈电机定子1042为圆筒形中空结构。音圈电机动子1041呈圆柱形，且在下表面上设有中心通孔10411和环腔，该环腔用于容纳音圈电机定子1042的圆筒壁，当托盘102为真空吸附式托盘时，该中心通孔10411为真空管路提供安装空间。应理解，垂直装置104也可以替代地设置为例如液压移动装置等的其他线性移动装置而不脱离本发明的范围。
在旋转台底座1034与水平底座1062之间设有垂向导轨1043。在图3所示实施例中，一共设置两个垂向导轨1043a、1043b分别设置在呈大致长方体形状的旋转台底座1034与垂向底座1045之间。每个垂向导轨包括分别固定在旋转台底座1034和垂向底座1045上的导轨和滑块，为垂向运动提供导向作用，从而使得旋转台底座1034及其承载的托盘102能够相对于垂向底座1045垂向运动。
在本实施例中，四组浮动重力补偿装置105分别布置在旋转台底座1034的四个角部内的浮动重力补偿装置腔体1034d内，为垂向音圈电机提供重力补偿，提高垂向的运动精度。浮动重力补偿装置105可以是气浮重力补偿装置或者磁浮重力补偿装置。
图4和5以磁浮重力补偿装置为例示出了浮动重力补偿装置105，包括：内磁环支架1051、内磁环1052、外磁环1053、以及外磁环座1054。其中内磁环支架1051包括圆柱形杆部1051a和位于杆部顶部的圆盘状头部1051b。内磁环1052套设在内磁环支架1051的圆柱形杆部1051a的外周表面上。而圆盘状头部1051b与浮动重力补偿装置腔体1034d的顶部接触，并承载旋转台底座1034。外磁环座1054呈圆筒状，而外磁环1053嵌入在外磁环座1054的内表面内。内磁环1052与外磁环1053之间形成环形间隙。内磁环1052的磁极方向沿轴向(Z向)向上，而外磁环1053的磁极方向沿径向向外。但应理解，内磁环1052的磁极方向可沿轴向向下，而外磁环1052的磁极方向沿径向向内。通过内磁环1052与外磁环1053之间的磁力，能够将内磁环支架1051上推，从而对浮动重力补偿装置腔体1034d的顶面施加向上的托举力，使得该托举力大致等于旋转台底座1034以及旋转台底座1034所承载的例如旋转台电机和托盘的其他装置的重力。
气浮重力补偿装置的示例未在附图中示出。该装置通过使用加压空气对浮动重力补偿装置腔体1034d的顶面施加向上的托举力，使得该托举力大致等于旋转台底座1034以及旋转台底座1034所承载的例如旋转台电机和托盘的其他装置的重力。
如图1和2所示，水平向运动装置106包括：两个水平导轨1061a和1061b、水平底座1062、水平直线电机1063、以及水平光栅尺1064。水平直线电机1063的动子和定子分别固定在水平底座1062和垂向底座1045上，为垂向底座1045提供水平向运动。水平底座1062与支架108固定连接。水平光栅尺1064为水平向运动提供水平位置信号。在所示实施例中，水平光栅尺1064设置在垂向底座1045的下侧，但应理解，水平光栅尺1064可设置在任何位置，只要能够获取垂向底座1045的水平移动信号即可。垂向底座1045上固定有垂直移动装置104的音圈电机定子1042，为旋转台103提供支撑。两个水平导轨1061a和1061b固定在支架108的两侧，并位于支架108与水平底座1062之间，为水平向运动提供导向。水平导轨1061a和1061b包括导轨和在导轨上滑动的滑块。导轨和滑块分别设置在支架108和水平底座1062上。
在上述实施例中，采用了4个浮动重力补偿装置105布局在旋转台底座1034的四个角部。但也可如图9所示实施例中那样采用三角形布局，优选为120°等角布局。即，在旋转台底座1034上设置三个浮动重力补偿装置腔体1034d，分别用于容纳浮动重力补偿装置105a、105b、105c。
图10示出了本发明的另一变型实施例。在前述两个实施例中采用了音圈电机和浮动重力补偿装置105为两个分开装置的方案，其中音圈电机布置在旋转台底座1034的中心，沿Z轴方向推动旋转台以及托盘102，通过布置在外周的浮动重力补偿装置105(四角布置或者三角布置)给音圈电机提供重力补偿。而本实施例采用音圈电机和磁浮重力补偿装置形式的浮动重力补偿装置105组合在一起的一体式结构，布置在旋转台底座1034的中心。如图10所示，音圈电机定子1051外表面套设有内磁环1052，而电机线圈1054外周套设有外磁环1053。因此，音圈电机定子1051兼作内磁环支架，而电机线圈1054兼作外磁环支架。从而该一体式结构既用作一方面能通过内磁环1052与外磁环1053之间的磁力产生悬浮力，补偿音圈电机的重力，另一方面能通过线圈切割磁场产生洛伦兹力，为沿Z向运动的旋转台以及托盘102提供垂直运动的驱动力。
以上已详细描述了本发明的较佳实施例，但应理解到，若需要，能修改实施例的方面来采用各种专利、申请和出版物的方面、特征和构思来提供另外的实施例。
考虑到上文的详细描述，能对实施例做出这些和其它变化。一般而言，在权利要求中，所用的术语不应被认为限制在说明书和权利要求中公开的具体实施例，而是应被理解为包括所有可能的实施例连同这些权利要求所享有的全部等同范围。

Claims (10)

1.一种运动装置，包括：
托盘；
旋转台，所述旋转台位于所述托盘下方，所述旋转台的上表面设有环形上部凹腔，所述旋转台的下表面设有下部凹腔，其中所述上部凹腔与所述下部凹腔在垂直于所述旋转台的上表面的投影方向上的投影相互错开；
旋转电机，所述旋转电机容纳在所述环形上部凹腔内，所述旋转电机包括旋转电机动子和旋转电机定子，所述旋转电机定子相对于所述旋转台固定，所述旋转电机动子相对于所述托盘固定；
垂直移动装置，所述垂直移动装置位于所述下部凹腔内并构造成能够驱动所述旋转台垂直移动；以及
浮动重力补偿装置，所述浮动重力补偿装置位于所述下部凹腔内并构造成能够对所述旋转台进行重力补偿。
2.如权利要求1所述的运动装置，其特征在于，所述垂直移动装置和所述浮动重力补偿装置彼此集成并位于所述下部凹腔内。
3.如权利要求1所述的运动装置，其特征在于，所述下部凹腔包括多个下部凹腔，所述垂直移动装置和所述浮动重力补偿装置分别位于不同的下部凹腔内。
4.如权利要求1或3所述的运动装置，其特征在于，所述浮动重力补偿装置为磁浮重力补偿装置。
5.如权利要求1所述的运动装置，其特征在于，所述浮动重力补偿装置为气浮重力补偿装置。
6.如权利要求3所述的运动装置，其特征在于，所述多个下部凹腔包括中心凹腔和周部凹腔，所述中心凹腔的平面位置由所述环形上部凹腔所围绕，并用于容纳所述垂直移动装置；所述周部凹腔位于所述环形上部凹腔的外周，并用于容纳所述浮动重力补偿装置。
7.如权利要求1所述的运动装置，其特征在于，所述运动装置还包括上下片装置，所述上下片装置构造成将工件放置到所述托盘或从所述托盘移走工件。
8.如权利要求1所述的运动装置，其特征在于，所述垂直移动装置包括音圈电机，所述音圈电机为中空式结构，以及所述托盘为真空卡盘装置。
9.根据权利要求6所述的运动装置，其特征在于，所述下部凹腔包括四个周部凹腔，每个所述周部凹腔容纳一个浮动重力补偿装置。
10.根据权利要求2所述的运动装置，其特征在于，所述垂直移动装置和所述浮动重力补偿装置彼此集成的结构包括：
音圈电机定子，所述音圈电机定子外表面套设有内磁环；以及
音圈电机动子，所述音圈电机动子外表面套设有外磁环。
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