CN110120375A - 功率用半导体装置 - Google Patents

功率用半导体装置 Download PDF

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Publication number
CN110120375A
CN110120375A CN201910381937.0A CN201910381937A CN110120375A CN 110120375 A CN110120375 A CN 110120375A CN 201910381937 A CN201910381937 A CN 201910381937A CN 110120375 A CN110120375 A CN 110120375A
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CN
China
Prior art keywords
power semiconductor
semiconductor device
lead terminal
sealing body
end portion
Prior art date
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Withdrawn
Application number
CN201910381937.0A
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English (en)
Chinese (zh)
Inventor
藤野纯司
石原三纪夫
新饲雅芳
原田启行
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN110120375A publication Critical patent/CN110120375A/zh
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JP6717103B2 (ja) * 2016-08-03 2020-07-01 株式会社豊田自動織機 半導体モジュール
JP6907670B2 (ja) * 2017-04-17 2021-07-21 三菱電機株式会社 半導体装置および半導体装置の製造方法
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WO2019229828A1 (ja) * 2018-05-29 2019-12-05 新電元工業株式会社 半導体モジュール
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JP6457144B1 (ja) * 2018-09-19 2019-01-23 株式会社加藤電器製作所 半導体モジュール
JP7108567B2 (ja) 2019-03-20 2022-07-28 株式会社東芝 パワーモジュール
JP7489933B2 (ja) 2021-02-24 2024-05-24 三菱電機株式会社 半導体装置及びその製造方法
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US10658284B2 (en) 2020-05-19
JP6316412B2 (ja) 2018-04-25
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