CN110062550B - 电气装置及马达驱动装置 - Google Patents

电气装置及马达驱动装置 Download PDF

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CN110062550B
CN110062550B CN201910047057.XA CN201910047057A CN110062550B CN 110062550 B CN110062550 B CN 110062550B CN 201910047057 A CN201910047057 A CN 201910047057A CN 110062550 B CN110062550 B CN 110062550B
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CN110062550A (zh
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堀越真一
中川裕也
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Fanuc Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/06Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • H05K7/14322Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10272Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10409Screws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Motor Or Generator Frames (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本发明提供一种电气装置及马达驱动装置,该马达驱动装置(10)具有:印刷基板(14),其印刷有图案;以及树脂基板(12),其通过使树脂成型而形成,并且未印刷图案,印刷基板(14)被设置于树脂基板(12)上。

Description

电气装置及马达驱动装置
技术领域
本发明涉及具有印刷有图案的印刷基板的电气装置及马达驱动装置。
背景技术
在日本专利特开2005-243742号公报中,揭示了在印刷基板上搭载有短路棒的马达驱动装置。
发明内容
在日本专利特开2005-243742号公报所记载的技术中,印刷基板必须确保供短路棒搭载的面积,并且由于每单位面积的单价高的印刷基板的面积增大,因此存在马达驱动装置的制造成本增加的担忧。
本发明是为解决上述问题而完成的,目的在于提供一种能够抑制制造成本的电气装置及马达驱动装置。
本发明的第1形态的电气装置具有:印刷基板,其印刷有图案;以及树脂基板,其通过使树脂成型而形成,并且未印刷图案,所述印刷基板被设置于所述树脂基板上。
根据本发明,能够缩小单价高的印刷基板的面积,因此能够抑制制造成本。
根据参照附图进行说明的以下的实施方式应该能够容易地理解上述目的、特征以及优点。
附图说明
图1是示出马达驱动装置的内部构造的示意图。
图2是示出以往的马达驱动装置的内部构造的示意图。
具体实施方式
〔第1实施方式〕
[马达驱动装置的构成]
图1是示出马达驱动装置10的内部构造的示意图。马达驱动装置10是对供给至未图示的马达的电力进行控制的装置。马达驱动装置10具有树脂基板12、设置于树脂基板12上的印刷基板14、以及同样被设置于树脂基板12上的短路棒16。
树脂基板12是通过对树脂材料进行注塑成型而制成的板状的构件。印刷基板14是通过在由树脂形成的板层叠而成的板上印刷图案而制成的板状的构件。
在印刷基板14上搭载有控制部20、连接器18等,该控制部20由多个电子元件构成,对供给至马达的电力进行控制,该连接器18用于与其他印刷基板14电连接。短路棒16与未图示的功率元件相连接,比在控制部20中流通的电流更大的电流在短路棒16中流通。虽然在树脂基板12上设置了连接印刷基板14与功率元件的配线等,但在树脂基板12上未印刷图案。
树脂基板12具有用于对印刷基板14进行定位的第1定位部22。第1定位部22通过卡扣等而构成,并将印刷基板14相对于树脂基板12固定。
在树脂基板12上具有用于对短路棒16进行定位的第2定位部24。第2定位部24沿着短路棒16的形状而形成为槽状。短路棒16由未图示的螺栓连接于功率元件。
树脂基板12形成有供螺栓插入的多个螺栓插入孔26,该螺栓用于将树脂基板12固定于未图示的外壳。在制成马达驱动装置10时,首先,在树脂基板12上设置印刷基板14以及短路棒16。其后,树脂基板12被移动至外壳内,并且树脂基板12被螺栓固定于外壳。
[作用效果]
图2是示出以往的马达驱动装置10的内部构造的示意图。在以往,在印刷基板14上设置短路棒16,并且印刷基板14被螺栓固定于外壳。因此,印刷基板14除了用于搭载控制部20的面积以外,还需要确保用于供短路棒16设置的面积。另外,为了提高将印刷基板14螺合于外壳时的工作效率,有时需要减少印刷基板14的个数,并将印刷基板14的面积设置得比实际供控制部20搭载的区域更大。然而,有印刷基板14每单位面积的单价高,并且马达驱动装置10的制造成本增加的担忧。
在此,在本实施方式中,在通过注塑成型而形成的树脂基板12上设置印刷基板14和短路棒16。由此,印刷基板14只要确保用于供控制部20搭载的面积即可,能够缩小印刷基板14的面积,从而能够抑制马达驱动装置10的制造成本。另外,在树脂基板12上搭载有印刷基板14和短路棒16的状态下,能够将树脂基板12固定于外壳,因此也能够确保马达驱动装置10的组装性。
另外,树脂基板12具有用于对印刷基板14进行定位的第1定位部22,以及用于对短路棒16进行定位的第2定位部24。由此,能够提高印刷基板14以及短路棒16向树脂基板12的设置的容易性。
此外,在本实施方式中,虽然对马达驱动装置10进行了说明,但在其他的向设备供给电力的装置中,也能够通过在树脂基板12上设置印刷基板14的构成,来缩小印刷基板14的面积,从而抑制制造成本。
〔能够从实施方式得到的技术构思〕
以下,对能够从上述实施方式掌握的技术构思进行记载。
电气装置(10)具有:印刷基板(14),其印刷有图案;以及树脂基板(12),其通过使树脂成型而形成,并且未印刷图案,所述印刷基板(14)被设置于所述树脂基板(12)上。由此,能够缩小印刷基板(14)的面积,抑制电气装置(10)的制造成本。
在上述电气装置(10)中,所述树脂基板(12)也可以具有进行所述印刷基板(14)的定位的第1定位部(22)。由此,能够提高印刷基板(14)向树脂基板(12)的设置的容易性。
在上述电气装置(10)中,也可以具有流通有比在所述印刷基板(14)的所述图案中流通的电流更大的电流的短路棒(16),所述短路棒(16)被设置于所述树脂基板(12)上。由此,能够缩小印刷基板(14)的面积,抑制电气装置(10)的制造成本。
在上述电气装置(10)中,所述树脂基板(12)也可以具有进行所述短路棒(16)的定位的第2定位部(24)。由此,能够提高短路棒(16)向树脂基板(12)的设置的容易性。
上述电气装置(10)是向马达供给电力的马达驱动装置(10),在所述印刷基板(14)上可以搭载有对供给至所述马达的电力进行控制的控制部(20)。由此,能够缩小印刷基板(14)的面积,抑制马达驱动装置(10)的制造成本。

Claims (4)

1.一种电气装置,其特征在于,具有:
印刷基板,其印刷有图案;
树脂基板,其通过使树脂成型而形成,并且未印刷图案;以及
短路棒,比在所述印刷基板的所述图案中流通的电流更大的电流在所述短路棒中流通,
所述印刷基板被设置于所述树脂基板上,
所述短路棒被设置在所述印刷基板所设置的区域外的所述树脂基板上。
2.根据权利要求1所述的电气装置,其特征在于,
所述树脂基板具有进行所述印刷基板的定位的第1定位部。
3.根据权利要求1或2所述的电气装置,其特征在于,
所述树脂基板具有进行所述短路棒的定位的第2定位部。
4.一种马达驱动装置,其特征在于,
权利要求1-3中的任一项所述的电气装置是向马达供给电力的马达驱动装置,
在所述印刷基板上搭载有对供给至所述马达的电力进行控制的控制部。
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CN210247288U (zh) * 2018-01-19 2020-04-03 发那科株式会社 电气装置及马达驱动装置

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US10827638B2 (en) 2020-11-03
CN110062550A (zh) 2019-07-26
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JP2019125751A (ja) 2019-07-25
US20190230809A1 (en) 2019-07-25
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