CN110024120A - 电路管芯和互连件之间的自动对准 - Google Patents

电路管芯和互连件之间的自动对准 Download PDF

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Publication number
CN110024120A
CN110024120A CN201780072072.9A CN201780072072A CN110024120A CN 110024120 A CN110024120 A CN 110024120A CN 201780072072 A CN201780072072 A CN 201780072072A CN 110024120 A CN110024120 A CN 110024120A
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China
Prior art keywords
channel
solid
circuit die
tube core
channels
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CN201780072072.9A
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English (en)
Chinese (zh)
Inventor
安基特·马哈詹
米哈伊尔·L·佩库罗夫斯基
马修·S·斯泰
丹尼尔·J·泰斯
安·M·吉尔曼
肖恩·C·多兹
托马斯·J·梅茨勒
马修·R·D·史密斯
罗杰·W·巴顿
约瑟夫·E·赫南德斯
撒格尔·A·沙
卡拉·A·迈耶斯
詹姆斯·朱
特雷莎·M·格代尔
柳德米拉·A·佩库罗夫斯基
乔纳森·W·肯灵
杰里米·K·拉森
杰西卡·丘
凯拉·尼坤
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN110024120A publication Critical patent/CN110024120A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/002—Aligning microparts
    • B81C3/005—Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces
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    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
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    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
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    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01323—Manufacture or treatment of die-attach connectors using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
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    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01931—Manufacture or treatment of bond pads using blanket deposition
    • H10W72/01933—Manufacture or treatment of bond pads using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01935—Manufacture or treatment of bond pads using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
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    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
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    • H10W72/07302—Connecting or disconnecting of die-attach connectors using an auxiliary member
    • H10W72/07304—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
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    • H10W72/07304—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
    • H10W72/07307—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating the auxiliary member being a temporary substrate, e.g. a removable substrate
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    • H10W72/241—Dispositions, e.g. layouts
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    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Die Bonding (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN201780072072.9A 2016-11-21 2017-11-16 电路管芯和互连件之间的自动对准 Withdrawn CN110024120A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662424686P 2016-11-21 2016-11-21
US62/424,686 2016-11-21
US201762584223P 2017-11-10 2017-11-10
US62/584,223 2017-11-10
PCT/US2017/062030 WO2018094057A1 (en) 2016-11-21 2017-11-16 Automatic registration between circuit dies and interconnects

Publications (1)

Publication Number Publication Date
CN110024120A true CN110024120A (zh) 2019-07-16

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CN201780072072.9A Withdrawn CN110024120A (zh) 2016-11-21 2017-11-16 电路管芯和互连件之间的自动对准

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US (1) US10971468B2 (https=)
EP (1) EP3542398A4 (https=)
JP (1) JP7190430B2 (https=)
CN (1) CN110024120A (https=)
WO (1) WO2018094057A1 (https=)

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JP7402824B2 (ja) * 2018-05-22 2023-12-21 スリーエム イノベイティブ プロパティズ カンパニー 光制御端部を有する光学フィルム
WO2020058815A1 (en) * 2018-09-17 2020-03-26 3M Innovative Properties Company Flexible device including conductive traces with enhanced stretchability
EP3906759A4 (en) 2018-12-31 2022-10-12 3M Innovative Properties Company Flexible circuits on soft substrates
US11937381B2 (en) 2018-12-31 2024-03-19 3M Innovative Properties Company Forming electrical interconnections using capillary microfluidics
US12020951B2 (en) 2019-04-29 2024-06-25 3M Innovative Properties Company Methods for registration of circuit dies and electrical interconnects
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