CN110015635A - 环境传感器、环境传感器中间产品和用于制造多个环境传感器的方法 - Google Patents
环境传感器、环境传感器中间产品和用于制造多个环境传感器的方法 Download PDFInfo
- Publication number
- CN110015635A CN110015635A CN201910015173.3A CN201910015173A CN110015635A CN 110015635 A CN110015635 A CN 110015635A CN 201910015173 A CN201910015173 A CN 201910015173A CN 110015635 A CN110015635 A CN 110015635A
- Authority
- CN
- China
- Prior art keywords
- substrate
- sensor
- diaphragm
- sensor chip
- bonding agent
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 48
- 230000007613 environmental effect Effects 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000013067 intermediate product Substances 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 239000000126 substance Substances 0.000 claims abstract description 46
- 238000000465 moulding Methods 0.000 claims abstract description 45
- 239000007767 bonding agent Substances 0.000 claims abstract description 39
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000002390 adhesive tape Substances 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 230000008901 benefit Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000010408 film Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
- G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0154—Moulding a cap over the MEMS device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018200140.5A DE102018200140A1 (de) | 2018-01-08 | 2018-01-08 | Umweltsensor, Umweltsensorzwischenprodukt und Verfahren zum Herstellen einer Vielzahl von Umweltsensoren |
| DE102018200140.5 | 2018-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110015635A true CN110015635A (zh) | 2019-07-16 |
Family
ID=66995489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910015173.3A Pending CN110015635A (zh) | 2018-01-08 | 2019-01-08 | 环境传感器、环境传感器中间产品和用于制造多个环境传感器的方法 |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN110015635A (de) |
| DE (1) | DE102018200140A1 (de) |
| TW (1) | TW201931475A (de) |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040038442A1 (en) * | 2002-08-26 | 2004-02-26 | Kinsman Larry D. | Optically interactive device packages and methods of assembly |
| DE102004002163A1 (de) * | 2004-01-15 | 2005-08-04 | Robert Bosch Gmbh | Gassensormodul und ein Verfahren zu seiner Herstellung |
| DE102004031318A1 (de) * | 2004-06-29 | 2006-01-19 | Robert Bosch Gmbh | Premold-Gehäuse |
| CN1914723A (zh) * | 2004-01-06 | 2007-02-14 | 飞思卡尔半导体公司 | 包装光学传感器的方法 |
| US20110274299A1 (en) * | 2010-05-06 | 2011-11-10 | Stmicroelectronics S.R.L. | Encapsulated micro-electro-mechanical device, in particular a mems acoustic transducer |
| CN102270589A (zh) * | 2010-06-01 | 2011-12-07 | 罗伯特·博世有限公司 | 半导体元件的制造方法和相应的半导体元件 |
| US20130307094A1 (en) * | 2011-03-11 | 2013-11-21 | Panasonic Corporation | Sensor |
| US8617934B1 (en) * | 2000-11-28 | 2013-12-31 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages |
| CN103698369A (zh) * | 2012-09-27 | 2014-04-02 | 森斯瑞股份公司 | 化学传感器 |
| US20140346623A1 (en) * | 2013-05-23 | 2014-11-27 | Infineon Technologies Ag | Film-Covered Open-Cavity Sensor Package |
| US20150059485A1 (en) * | 2013-08-30 | 2015-03-05 | Robert Bosch Gmbh | Micromechanical sensor system and corresponding manufacturing method |
| CN105789149A (zh) * | 2015-01-14 | 2016-07-20 | 盛思锐股份公司 | 传感器组件 |
| DE102015106442A1 (de) * | 2015-04-27 | 2016-11-10 | Infineon Technologies Ag | Chipgehäuse und Verfahren zu seiner Herstellung |
| CN106395731A (zh) * | 2015-07-29 | 2017-02-15 | 盛思锐股份公司 | 气体传感器、阵列及其制造方法 |
| CN106469660A (zh) * | 2015-08-21 | 2017-03-01 | 意法半导体(R&D)有限公司 | 具有光学树脂透镜的模制测距和接近度传感器 |
| DE102015222756A1 (de) * | 2015-11-18 | 2017-05-18 | Robert Bosch Gmbh | Sensorelement für einen Drucksensor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8828807B1 (en) * | 2013-07-17 | 2014-09-09 | Infineon Technologies Ag | Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compound |
-
2018
- 2018-01-08 DE DE102018200140.5A patent/DE102018200140A1/de not_active Withdrawn
-
2019
- 2019-01-04 TW TW108100318A patent/TW201931475A/zh unknown
- 2019-01-08 CN CN201910015173.3A patent/CN110015635A/zh active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8617934B1 (en) * | 2000-11-28 | 2013-12-31 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages |
| US20040038442A1 (en) * | 2002-08-26 | 2004-02-26 | Kinsman Larry D. | Optically interactive device packages and methods of assembly |
| CN1914723A (zh) * | 2004-01-06 | 2007-02-14 | 飞思卡尔半导体公司 | 包装光学传感器的方法 |
| DE102004002163A1 (de) * | 2004-01-15 | 2005-08-04 | Robert Bosch Gmbh | Gassensormodul und ein Verfahren zu seiner Herstellung |
| DE102004031318A1 (de) * | 2004-06-29 | 2006-01-19 | Robert Bosch Gmbh | Premold-Gehäuse |
| US20110274299A1 (en) * | 2010-05-06 | 2011-11-10 | Stmicroelectronics S.R.L. | Encapsulated micro-electro-mechanical device, in particular a mems acoustic transducer |
| CN102270589A (zh) * | 2010-06-01 | 2011-12-07 | 罗伯特·博世有限公司 | 半导体元件的制造方法和相应的半导体元件 |
| US20130307094A1 (en) * | 2011-03-11 | 2013-11-21 | Panasonic Corporation | Sensor |
| CN103698369A (zh) * | 2012-09-27 | 2014-04-02 | 森斯瑞股份公司 | 化学传感器 |
| US20140346623A1 (en) * | 2013-05-23 | 2014-11-27 | Infineon Technologies Ag | Film-Covered Open-Cavity Sensor Package |
| US20150059485A1 (en) * | 2013-08-30 | 2015-03-05 | Robert Bosch Gmbh | Micromechanical sensor system and corresponding manufacturing method |
| CN105789149A (zh) * | 2015-01-14 | 2016-07-20 | 盛思锐股份公司 | 传感器组件 |
| DE102015106442A1 (de) * | 2015-04-27 | 2016-11-10 | Infineon Technologies Ag | Chipgehäuse und Verfahren zu seiner Herstellung |
| CN106395731A (zh) * | 2015-07-29 | 2017-02-15 | 盛思锐股份公司 | 气体传感器、阵列及其制造方法 |
| CN106469660A (zh) * | 2015-08-21 | 2017-03-01 | 意法半导体(R&D)有限公司 | 具有光学树脂透镜的模制测距和接近度传感器 |
| DE102015222756A1 (de) * | 2015-11-18 | 2017-05-18 | Robert Bosch Gmbh | Sensorelement für einen Drucksensor |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201931475A (zh) | 2019-08-01 |
| DE102018200140A1 (de) | 2019-07-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190716 |