CN110015635A - Environmental sensor, environmental sensor intermediate products and the method for manufacturing multiple environmental sensors - Google Patents
Environmental sensor, environmental sensor intermediate products and the method for manufacturing multiple environmental sensors Download PDFInfo
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- CN110015635A CN110015635A CN201910015173.3A CN201910015173A CN110015635A CN 110015635 A CN110015635 A CN 110015635A CN 201910015173 A CN201910015173 A CN 201910015173A CN 110015635 A CN110015635 A CN 110015635A
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 230000007613 environmental effect Effects 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000013067 intermediate product Substances 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 239000000126 substance Substances 0.000 claims abstract description 46
- 238000000465 moulding Methods 0.000 claims abstract description 45
- 239000007767 bonding agent Substances 0.000 claims abstract description 39
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000002390 adhesive tape Substances 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 230000008901 benefit Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000010408 film Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
- G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0154—Moulding a cap over the MEMS device
Abstract
The method (10) that the present invention relates to a kind of for manufacturing the environmental sensor of multiple media-resistants, wherein, bonding agent (20) is applied on the surface (16a) of molding substance (16) in region between each sensor chip (14), and, diaphragm (22) is laminated in the substrate (12) in the region of multiple sensor chips (14) on the surface (12a) for being arranged in the substrate (12), wherein, which covers multiple sensor chip (14).The invention further relates to a kind of environmental sensor intermediate products and a kind of environmental sensor of media-resistant (10).
Description
Technical field
The present invention relates to a kind of environmental sensors of media-resistant.The invention further relates to a kind of environmental sensor intermediate products.
The present invention additionally relates to a kind of method for manufacturing the environmental sensor of multiple media-resistants.
Background technique
For measuring the sensor of environmental factor, such as pressure, humidity or gas sensor, need directly to contact with environment
To realize its function.In contrast, when sensor is used in such as smart phone or unmanned plane, it is desirable that protection sensor is exempted from
It is affected by environment, i.e., it is influenced from dust and water.
It is known to be for a possibility that solving this conflict, by means of impermeable dust and water but gas-permeable every
Film closes the medium channel of sensor.One example is the micro-pore septum formed by expanded ptfe.
Size needed for such diaphragm must be prefabricated into sensor and it is applied to corresponding sensor core on piece.
10 2,015 222 756 A1 of DE discloses a kind of conventional sensors element for pressure sensor, the sensing
Device element has sensor membrane, limited number of piezoresistance is disposed in the sensor membrane, wherein these piezoelectric electros
Resistance is arranged such that can produce voltage change in the case where pressure change in circuit.
Summary of the invention
The present invention provides a kind of environmental sensor of media-resistant.Furthermore the present invention provides a kind of production of environmental sensor centre
Product, the environmental sensor intermediate products include substrate, are disposed with multiple sensor chips on the surface of this substrate, these biographies
Sensor chip at least partially uses molding substance injection encapsulated；The mould is applied in region between each sensor chip
Bonding agent on the surface of substance processed；And it is laminated in the region of multiple sensor chips on the surface for being arranged in the substrate
Diaphragm onto the substrate, the diaphragm cover multiple sensor chip.
The present invention additionally provides a kind of methods for manufacturing the environmental sensor of multiple media-resistants.This method includes providing
Substrate is disposed with multiple sensor chips on the surface of this substrate, these sensor chips at least partially use molding substance
Injection encapsulated.
This method is additionally included in the region between each sensor chip bonding agent being applied to the molding substance
On surface.This method furthermore include multiple sensor chips on the surface for being arranged in the substrate region in diaphragm is laminated
Onto the substrate, wherein the diaphragm covers multiple sensor chip.
This method further includes that multiple sensor chip is divided into the individually environmental sensor to form multiple media-resistant.
A design of the invention is the environmental sensor for thus providing a kind of media-resistant, among a kind of environmental sensor
Product and a kind of method for manufacturing the environmental sensor of multiple media-resistants, they allow at low cost by means of applying diaphragm
Lian Di, dust-proof and waterproof environmental sensor is manufactured to parallelization.
Compared with diaphragm to be sequentially applied to single sensor core on piece, The inventive process provides parallel mistakes
The advantages of journey guides.
Existing standard technology can be used by advantageous mode when realizing this method and (such as fluid adhesive and is divided into list
A packaging), these standard technologies are all executable at all Conventional manufacturers.Under the background of the method for the present invention, therefore generate
Significant decrease in terms of material cost and process costs.
Such as manufacturer need not again manufacture diaphragm at the very small list within the scope of square millimeter for single sensor
Part size, it is achieved that reduced manufacturing cost.
Furthermore, it is possible to same for a large amount of sensor (such as several hundred to thousands of) in a unique processing step
When apply diaphragm, this generates the raising of number of packages flow and accordingly decrease process costs.
Moreover, it is no longer necessary to apply diaphragm less than the positioning accuracy in 100 micron ranges.This is realized in manufacture work
Reduced equipment requirement in skill process and accordingly reduce process costs.
Therefore, core of the invention is to recognize as follows: carrying out manufacturing environment sensor using film molding and makes it possible in mould
Big diaphragm face formula is adhered on entire base strip in base strip level after system.Then diaphragm covering is all is located at
Sensor on this.These sensors are divided into individually in the single technique of packaging-follow the bus followed by progress.
Advantageous embodiment and improvement project are obtained from dependent claims and from the explanation of reference attached drawing.
It is proposed according to an advantageous modification, which is made of liquid adhesive, and the liquid adhesive to give in advance
On fixed pattern, the surface for being preferably applied to the molding substance on the longitudinal direction of the substrate and/or in transverse direction.Such application figure
Case or distribution pattern are advantageous, because can be made very with a small amount of single dispensing section (Dispense-Strecken) herein
A large amount of sensor chip is ready for subsequent diaphragm and applies.
It is proposed according to another advantageous modification, providing quantity on this substrate is n × m sensor chip, wherein
Apply n+1+m+1 application section of the bonding agent on the surface of the molding substance.Using with 30 × 100, i.e. 3000
When the base strip of sensor chip, applying quantity advantageously on molding substance is 31+101, i.e. 132 dispensing section, to incite somebody to action
All the sensors chip is ready for subsequent diaphragm bonding.
In contrast, in this example, when being adhered to diaphragm on the sensor with metal lid housing in the past, it is necessary to
3000 single allocation steps are carried out with the positioning accuracy request of considerably higher fixing fabric structure sum.When base strip increases,
The advantages of this parallelization also with area and therefore with number of sensors and correspondingly square formula expands.
It is proposed according to another advantageous modification, in the corresponding packaging sawing being set between these sensor chips
Bonding agent is applied on the surface of the molding substance in the region of line.
Its advantage is that the part in the region for having been applied to sawing line of diaphragm and bonding agent is removed by sawing.
It is proposed according to another advantageous modification, is applied the bonding agent by distribution, silk-screen printing or mould printing
It is added on the surface of the molding substance.It therefore, can be in an advantageous manner in phase in the case where executing silk screen or screen printing
Bonding agent is efficiently applied on the surface of molding substance in the shorter time, is sensed it is possible thereby to reduce in manufacturing environment
Process lasting time and process costs when device.
It is proposed that the substrate is together with silk screen or template by means of in the substrate and the silk according to another advantageous modification
Hole in net or template is mechanically aligned with each other by the centring means being introduced into these holes, so as to by the bonding agent
It is applied on the surface of the molding substance.
The requirement of actively careful alignment silk screen and base strip is eliminated in this way.It is possible thereby to by reducing to work
The requirement of skill equipment carrys out cost of implementation reduction.Compared with distributing liquid adhesive, this technique alternative solution has obtained degree of parallelism
Further increase and due to improve technique flow and bring cost reduction.
According to another advantageous modification propose, by bonding agent on the surface for be applied to the molding substance before it is pre- solid
Change.Therefore, not only in the case where distributing liquid adhesive but also in the case where method for printing screen, in addition to conventional binder
So-called B rank (Stage) bonding agent can also be used.It, first will bonding before applying diaphragm in the case where these materials
Agent precuring.By this precuring, keeps adhesive pattern stable and additionally avoid the bonding agent quilt when applying diaphragm
It smears and reaches on chip surface.
It is proposed according to another advantageous modification, it is in the region of multiple sensor chip that the diaphragm is substantially whole
It is laminated to face in the substrate, wherein when the diaphragm to be laminated on the surface of the molding substance, which is distributed in this
Adhesiveness is assigned between multiple sensor chips and between the molding substance and the diaphragm.
Compared with single diaphragm is applied in order on the single sensor with metal lid housing in the past, this mode
The diaphragms of all the sensors will be used for by, which having the advantage that, (i.e. concurrently) is applied to base strip simultaneously.This generates techniques
The reduced cost for significantly improving and correspondingly causing of flow.
Another advantage compared with being individually applied in metal lid housing is, single big diaphragm member can be used
It is laminated in entire base strip.Thus it eliminates and is walked when manufacturing diaphragm for each diaphragm to be divided into single technique
Suddenly.By using low-cost liquid adhesive, during fabrication, diaphragm also needs the additional adhesive film with preparatory structuring
It is combined.
In addition, the parallelization of this method to eliminate the single inspection after applying diaphragm.To diaphragm and its bonding
Control can component is divided into it is single after carry out in final single inspection, this is final single to check in standard work
It is all clearly determining anyway in skill.These advantages generate apparent cost when manufacturing diaphragm and reduce.
It is proposed according to another advantageous modification, the seamed edge outstanding from the molding substance of multiple sensor chip
Prevent the bonding agent from flowing on the surface of multiple sensor chip as fluid stopping seamed edge.
Sharp edge outstanding, with 20 to 70 μm of protruding portions passes through in the slave molding substance of chip (preferably silicon chip)
Film molding generates, wherein protruding portion can be advantageously adjusted simultaneously by properly selecting thin-film material and film thickness
And it can further increase.Effect by these seamed edges as fluid stopping seamed edge, this has been preferably prevented from bonding agent and has flowed to chip list
On face.
It is proposed according to another advantageous modification, it is by mechanically sawing that this is more after bonding agent solidification
A sensor chip is divided into individually, wherein packs sawing lines for the base along these being arranged between these sensor chips
Bottom disjunction.
After the curing schedule for solidifying bonding agent, by mechanical sawing (for packing-being divided into single standard work
Skill) base strip is separated, to obtain single sensor unit in an advantageous manner.Be made without not protected for diaphragm
The sensor of shield is compared, herein without generating other fringe costs because pack-be divided into single singulation in other words this two
It must be executed in the same manner in the case of kind.
By sawing, the part in the region for having been applied to sawing line of diaphragm and bonding agent is removed.It is remaining viscous
Agent and diaphragm is connect to terminate with flushing with the outer seamed edge of corresponding sensor packaging.Therefore, the method proposed automatically guarantees anti-
The diaphragm area only stretched out still can be moved freely or be agitated, otherwise this may negatively affect component reliability and can be after
Continuous processability.
It is proposed according to another advantageous modification, the substrate is before through mechanical sawing disjunction with the flat of the substrate
Smooth downside is substantially fixed on adhesive face by entire surface, especially on adhesive tape.
In order to from sawing waterEnter with particle, does not have septate pressure sensor and gas to pass
Sensor must typically be divided on sawing adhesive tape in other words splicing tape single in corresponding fixed position, wherein thus should
It is more than base strip it is lateral under be bonded on adhesive tape and carry out sawing from back side.It is problematic herein to be, since packaging topology causes
Only the bearing surface of very little uses for adhesive tape and sensor surface.
Due to bearing surface it is small cause adhesive tape to adhere to insufficient situation under, sensor may fall off in sawing from adhesive tape,
This may cause component damage and loss in productivity.In contrast, by the diaphragm being applied in base strip by entire surface, component or
Sensor chip is protected and from the entrance of the pollutant in sawing.Therefore environment can be passed in the context of the present invention
Sensor is divided into individually in normal place.Here, base strip can be adhered on adhesive tape by entire surface with flat downside.Due to subtracting
Few topology and the bearing surface increased, therefore avoid substrate and fall off from adhesive tape.
It is proposed according to another advantageous modification, which is made of gas sensor or pressure sensor.
Therefore, other than low-cost manufacturability, the diaphragm is arranged also realizes the ring of offer media-resistant in an advantageous manner
Border sensor.
Described configuration and improvement project can be arbitrarily combined with each other.
Other feasible configuration, improvement project and implementations of the invention further include previously or subsequently reference of the invention
Embodiment description feature without specifically mentioned combination.
Detailed description of the invention
Attached drawing should be provided and be further understood to embodiment of the present invention.They illustrate embodiment and are used for and say
Bright book relatively explains the principle of the present invention and concept.
Many advantages in other embodiments and above-mentioned advantage are all obtained and checking attached drawing.Member shown in figure
What element was not necessarily shown in mutual ratio.
Attached drawing is shown:
The cross section of environmental sensor in the state that Fig. 1 is before diaphragm is laminated in preferred embodiment according to the present invention regards
Figure；
The top view of Fig. 2 substrate, preferred embodiment is disposed with multiple sensor chips according to the present invention on the surface thereof；
Fig. 3 on the surface that bonding agent is applied to molding substance by preferred embodiment according to the present invention after environment pass
The viewgraph of cross-section of sensor；
The cross section of environmental sensor of the Fig. 4 after diaphragm is laminated in substrate by preferred embodiment according to the present invention
View；
Fig. 5 is according to the preferred embodiment of the present invention multiple to be divided into single environmental sensor；With
Fig. 6 is according to the preferred embodiment of the present invention for manufacturing the flow chart of the method for the environmental sensor of media-resistant.
As long as no opposite explanation is provided, in the diagram of attached drawing, identical appended drawing reference marks identical or function
Identical element, component or component.
Specific embodiment
Fig. 1 show preferred embodiment according to the present invention be laminated diaphragm before in the state of environmental sensor it is transversal
Face view.
Environmental sensor 10 or environmental sensor intermediate products shown in Fig. 1 have substrate 12, on the 12a of its surface
It is disposed with sensor chip 14.
Within molding substance 16, (be not shown in Fig. 1) of multiple sensor chips 14 with construction on the base 12
Electrical connection between conductor rails is made up of an electrical connecting element 18 in bonding line form respectively.Alternatively, this is electrically connected
Connecing can for example be installed to be formed by the flip-chip of multiple sensor chip 14 on the base 12.
In order to realize that the medium channel for leading to sensor chip 14, sensor chip have multiple in upper area
Drilling.
Bonding agent 20 is applied in region on the surface 16a of molding substance 16 between each sensor chip 14.
Fig. 2 shows the top views of substrate, and preferred embodiment is disposed with multiple sensors on the surface thereof according to the present invention
Chip.
Show that six sensor chips 14, these sensor chips are arranged in substrate and use in current displaying
16 injection encapsulated of molding substance.Apply in region on the surface 16a of molding substance 16 between each sensor chip 14
There is bonding agent 20.
Bonding agent 20 is preferably made of liquid adhesive 20, which is applied to mould with pattern shown in Fig. 2
On the surface of substance 16 processed, i.e., on longitudinal L of substrate and on transverse direction Q, i.e., applied with comb mesh pattern.Substitute fluid adhesive
Agent, such as other suitable bonding agents with different viscosity performance can be applied.
Displaying shown in Fig. 2 is a part of biggish (unshowned in Fig. 2) base strip, which can be with
Including, for example, 30 × 100 sensor chips.
Environment after Fig. 3 is shown on the surface that bonding agent is applied to molding substance by preferred embodiment according to the present invention
The viewgraph of cross-section of sensor.
Bonding agent 20 is applied in the region for being set to each packaging sawing line 24 between these sensor chips 14
On the surface 16a of molding substance 16.
This application is preferably carried out by silk-screen printing or mould printing or alternatively by distribution herein.
Here, substrate 12 is together with (in Fig. 3 unshowned) silk screen or web plate by means of in substrate 12 and silk screen or net
Drilling 12b1,12b2 in plate pass through the centralizer 26 being introduced into drilling 12b1,12b2 and are mechanically in alignment with each other, so as to
Bonding agent 20 is applied on the surface 16a of molding substance 16.
Alternatively, can by bonding agent 20 on the surface 16a for be applied to molding substance 16 before precuring.
Seamed edge 16b outstanding is used as fluid stopping seamed edge and thus anti-in the slave molding substance 16 of multiple sensor chip 14
Only bonding agent 20 is flow on the surface of multiple sensor chip 14.
Fig. 4 shows the transversal of after diaphragm is laminated in substrate by preferred embodiment according to the present invention environmental sensor
Face view.
In Fig. 4, diaphragm 22 is substantially laminated to substrate 12 by entire surface in the region of multiple sensor chip 14
On.As in Fig. 4 it can be seen that, when diaphragm 22 to be laminated on the surface of molding substance 16, bonding agent 20 is distributed in this
Between multiple sensor chips 14.This assigns adhesiveness between molding substance 16 and diaphragm 22.
The substrate is substantially fixed before through mechanical sawing disjunction with the flat downside 12c of substrate 12 by entire surface
On adhesive face, especially on adhesive tape 28.
Fig. 5, which is shown, according to the preferred embodiment of the present invention multiple is divided into single environmental sensor.
After bonding agent solidification, multiple sensor chip 14 is divided into individually by mechanically sawing, to constitute
The environmental sensor 10 of multiple media-resistants.Here, along the packaging sawing line being arranged between sensor chip 14 by substrate 12
Disjunction.Three are shown in current displaying is divided into single sensor chip or environmental sensor.
Fig. 6 shows according to the preferred embodiment of the present invention for manufacturing the process of the method for the environmental sensor of media-resistant
Figure.
This method includes providing S1 substrate, is disposed with multiple sensor chips on the surface of this substrate, these sensors
Chip at least partially uses molding substance injection encapsulated, wherein passes through the electrical connection element of bonding line form within molding substance
Part come carry out multiple sensor chip and construction being electrically connected between the conductor rails in substrate.
This method, which is additionally included in the region between each sensor chip, applies S2 to the molding substance for bonding agent
Surface on.Furthermore this method includes in the region of multiple sensor chips on the surface for being arranged in the substrate by membrane layer
On folded S3 to the substrate, wherein the diaphragm covers multiple sensor chip.
This method further includes being divided into multiple sensor chip individually by mechanically sawing S4, wherein along setting
Packaging sawing line between these sensor chips is set by the substrate disjunction.
Although describing the present invention by preferred embodiment above, the present invention is not limited to these implementations
Example, but can modify in various ways.The present invention more particularly to be altered or modified in a wide variety of ways, without departing from this
The core of invention.
Such as the shape, size and/or property of the component of the environmental sensor can be changed.
Claims (14)
1. a kind of method of the environmental sensor (10) for manufacturing multiple media-resistants, this method have follow steps:
It provides (S1) substrate (12), is disposed with multiple sensor chips (14), these sensors on the surface (12a) of the substrate
Chip at least partially uses molding substance (16) injection encapsulated；
Bonding agent (20) are applied into the table that (S2) arrives the molding substance (16) in region between each sensor chip (14)
On face (16a)；
By diaphragm (22) in the region of the multiple sensor chip (14) on the surface (12a) for being arranged in the substrate (12)
(S3) is laminated to the substrate (12), wherein the diaphragm (22) covers the multiple sensor chip (14)；And
The multiple sensor chip (14) is divided into single (S4) to constitute the environmental sensor (10) of the multiple media-resistant.
2. being somebody's turn to do the method according to claim 1, wherein the bonding agent (20) is made of liquid adhesive (20)
Liquid adhesive is applied to the mould on (Q) with predetermined pattern, preferably on the longitudinal direction (L) of the substrate (12) and/or laterally
On the surface (16a) of substance (16) processed.
3. according to the method described in claim 2, it is characterized in that, providing quantity in the substrate (12) is n × m sensor
Chip (14), wherein n+1+m+1 application section of the bonding agent (20) is coated on the surface (16a) of the molding substance (16).
4. the method according to one of above claim, which is characterized in that be set between sensor chip (14)
The bonding agent (20) is applied on the surface (16a) of the molding substance (16) in the region of each packaging sawing line (24).
5. the method according to one of above claim, which is characterized in that by distribution, silk-screen printing or mould printing come
The bonding agent (20) is applied on the surface (16a) of the molding substance (16).
6. according to the method described in claim 5, it is characterized in that, the substrate (12) is together with silk screen or template by means of at this
Hole (12b1,12b2) in substrate (12) and the silk screen or the template is by being introduced in these holes (12b1,12b2)
Centring means (26) it is mechanically aligned with each other, so that the bonding agent (20) to be applied to the surface of the molding substance (16)
On (16a).
7. the method according to one of above claim, which is characterized in that the bonding agent (20) is being applied to the molding
Precuring before on the surface (16a) of substance (16).
8. the method according to one of above claim, which is characterized in that in the region of multiple sensor chip (14)
It is middle that the diaphragm (22) is substantially laminated to by entire surface in the substrate (12), wherein the diaphragm (22) is being laminated to the molding
When on the surface of substance (16), which is distributed between the multiple sensor chip (14) and in the molding
Cause to adhere between substance (16) and the diaphragm (22).
9. the method according to one of above claim, which is characterized in that the multiple sensor chip (14) from this
Molding substance (16) seamed edge outstanding (16b) prevents the bonding agent (20) from flowing to the multiple sensor core as fluid stopping seamed edge
On the surface of piece (14).
10. the method according to one of claim 4 to 9, which is characterized in that after the bonding agent (20) solidification, pass through
Mechanically the multiple sensor chip (14) is divided into single (S4) by sawing, wherein along setting in these sensor cores
Packaging sawing line (24) between piece (14) is by substrate (12) disjunction.
11. according to the method described in claim 10, it is characterized in that, the substrate (12) is passing through mechanical sawing (S4) disjunction
It is substantially fixed on adhesive face by entire surface with the flat downside (12c) of the substrate (12) before, especially on adhesive tape (28).
12. a kind of environmental sensor intermediate products, comprising:
Substrate (12), is disposed with multiple sensor chips (14) on the surface of this substrate, these sensor chips are at least local
Ground molding substance (16) injection encapsulated；
The bonding being applied in region between each sensor chip (14) on the surface (16a) of the molding substance (16)
Agent (20)；And
The base is laminated in the region of the multiple sensor chip (14) on the surface (12a) for being arranged in the substrate (12)
Diaphragm (22) on bottom (12), the diaphragm cover the multiple sensor chip (14).
13. a kind of environmental sensor of media-resistant (10), by being manufactured according to claim 1 to method described in one of 10.
14. the environmental sensor (10) of media-resistant according to claim 12, wherein the environmental sensor (10) is by gas
Sensor or pressure sensor are constituted.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018200140.5A DE102018200140A1 (en) | 2018-01-08 | 2018-01-08 | Environmental sensor, environmental sensor intermediate, and method of manufacturing a variety of environmental sensors |
| DE102018200140.5 | 2018-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110015635A true CN110015635A (en) | 2019-07-16 |
Family
ID=66995489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910015173.3A Pending CN110015635A (en) | 2018-01-08 | 2019-01-08 | Environmental sensor, environmental sensor intermediate products and the method for manufacturing multiple environmental sensors |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN110015635A (en) |
| DE (1) | DE102018200140A1 (en) |
| TW (1) | TW201931475A (en) |
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Also Published As
| Publication number | Publication date |
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| DE102018200140A1 (en) | 2019-07-11 |
| TW201931475A (en) | 2019-08-01 |
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Application publication date: 20190716 |