CN110010521B - 基板处理装置、其控制方法、保存有程序的存储介质 - Google Patents

基板处理装置、其控制方法、保存有程序的存储介质 Download PDF

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Publication number
CN110010521B
CN110010521B CN201811515896.1A CN201811515896A CN110010521B CN 110010521 B CN110010521 B CN 110010521B CN 201811515896 A CN201811515896 A CN 201811515896A CN 110010521 B CN110010521 B CN 110010521B
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substrate
arm
image sensor
rotation angle
corners
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Chinese (zh)
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CN110010521A (zh
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山川纯逸
对马拓也
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Ebara Corp
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Ebara Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1694—Program controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0476—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/42—Servomotor, servo controller kind till VSS
    • G05B2219/42249—Relative positioning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Robotics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201811515896.1A 2017-12-13 2018-12-11 基板处理装置、其控制方法、保存有程序的存储介质 Active CN110010521B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-238793 2017-12-13
JP2017238793A JP7030497B2 (ja) 2017-12-13 2017-12-13 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体

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CN110010521A CN110010521A (zh) 2019-07-12
CN110010521B true CN110010521B (zh) 2024-03-01

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US (1) US10991605B2 (https=)
JP (1) JP7030497B2 (https=)
KR (1) KR102497959B1 (https=)
CN (1) CN110010521B (https=)
TW (1) TWI794325B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7421340B2 (ja) * 2020-01-06 2024-01-24 株式会社荏原製作所 基板処理装置、および基板処理方法
JP7464472B2 (ja) * 2020-07-17 2024-04-09 株式会社ディスコ 加工装置
JP7517936B2 (ja) * 2020-10-01 2024-07-17 株式会社ディスコ 加工装置
US12237220B2 (en) 2021-04-15 2025-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for determining horizontal position of substrate using lasers
CN117859199A (zh) * 2021-08-26 2024-04-09 东京毅力科创株式会社 治具基板和示教方法
US11942341B2 (en) * 2022-01-26 2024-03-26 Asmpt Nexx, Inc. Adaptive focusing and transport system for electroplating
WO2025064070A1 (en) * 2023-09-22 2025-03-27 Applied Materials, Inc. Handling panel substrates
CN117182956B (zh) * 2023-09-26 2026-01-27 天津普达软件技术有限公司 一种用于板材工件抓取和放置的端拾器配置方法
TWI886625B (zh) * 2023-11-02 2025-06-11 揚博科技股份有限公司 用於基板之影像檢測裝置
WO2026014009A1 (ja) * 2024-07-08 2026-01-15 東京エレクトロン株式会社 基板処理システム及び情報処理装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10329064A (ja) * 1997-05-29 1998-12-15 Mitsubishi Electric Corp 産業ロボット装置及び産業ロボットの制御方法
JP2003017545A (ja) * 2001-07-04 2003-01-17 Matsushita Electric Ind Co Ltd 基板の位置決め方法と装置
JP2008040394A (ja) * 2006-08-10 2008-02-21 Orc Mfg Co Ltd アライメント装置および露光装置
CN101782375A (zh) * 2009-01-20 2010-07-21 Ckd株式会社 三维测量装置
JP2014053343A (ja) * 2012-09-05 2014-03-20 Toyota Motor Corp 半導体位置決め装置、及び半導体位置決め方法
CN104681474A (zh) * 2013-12-02 2015-06-03 株式会社大亨 工件处理装置、工件输送系统

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229994A (en) 1975-09-02 1977-03-07 Toshiba Corp Method of electing an oil filled bushing
EP1063186A1 (en) * 1997-12-03 2000-12-27 Nikon Corporation Substrate transferring device and method
JP2001308003A (ja) * 2000-02-15 2001-11-02 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP3795820B2 (ja) * 2002-03-27 2006-07-12 株式会社東芝 基板のアライメント装置
EP1643233A4 (en) * 2003-07-08 2010-11-17 Kanagawa Kagaku Gijutsu Akad PHOTODETECTION DEVICE AND CORRESPONDING METHOD
JP2006214942A (ja) * 2005-02-04 2006-08-17 Ricoh Co Ltd 光ファイバープローブ、光検出装置及び光検出方法
JP5132904B2 (ja) 2006-09-05 2013-01-30 東京エレクトロン株式会社 基板位置決め方法，基板位置検出方法，基板回収方法及び基板位置ずれ補正装置
DE102009016288B4 (de) * 2009-01-02 2013-11-21 Singulus Technologies Ag Verfahren und Vorrichtung für die Ausrichtung von Substraten
JP5614326B2 (ja) * 2010-08-20 2014-10-29 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
TWI580814B (zh) 2010-10-21 2017-05-01 荏原製作所股份有限公司 基板處理裝置，以及鍍覆裝置及鍍覆方法
JP5750327B2 (ja) 2010-10-21 2015-07-22 株式会社荏原製作所 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法
JP5490741B2 (ja) 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
CN103907208B (zh) * 2011-11-29 2016-09-21 株式会社爱发科 太阳能电池的制造方法以及太阳能电池
JP6117724B2 (ja) * 2014-03-26 2017-04-19 東京エレクトロン株式会社 塗布装置および塗布方法
CN107427202B (zh) * 2015-03-26 2020-09-04 皇家飞利浦有限公司 用于照射人类或动物身体内部的感兴趣结构的设备、系统和方法
KR101626374B1 (ko) * 2016-01-26 2016-06-01 주식회사 마이크로비전 모서리 기반 코너 추정을 이용한 정밀 위치 보정 방법
FR3050273B1 (fr) * 2016-04-15 2018-05-04 Tiama Methode et systeme de verification d'une installation d'inspection optique de recipients en verre
US10653937B2 (en) * 2016-06-14 2020-05-19 Garmin Switzerland Gmbh Position-based laser range finder

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10329064A (ja) * 1997-05-29 1998-12-15 Mitsubishi Electric Corp 産業ロボット装置及び産業ロボットの制御方法
JP2003017545A (ja) * 2001-07-04 2003-01-17 Matsushita Electric Ind Co Ltd 基板の位置決め方法と装置
JP2008040394A (ja) * 2006-08-10 2008-02-21 Orc Mfg Co Ltd アライメント装置および露光装置
CN101782375A (zh) * 2009-01-20 2010-07-21 Ckd株式会社 三维测量装置
JP2014053343A (ja) * 2012-09-05 2014-03-20 Toyota Motor Corp 半導体位置決め装置、及び半導体位置決め方法
CN104681474A (zh) * 2013-12-02 2015-06-03 株式会社大亨 工件处理装置、工件输送系统

Also Published As

Publication number Publication date
US20190181026A1 (en) 2019-06-13
US10991605B2 (en) 2021-04-27
TWI794325B (zh) 2023-03-01
TW201937009A (zh) 2019-09-16
KR102497959B1 (ko) 2023-02-08
JP2019106479A (ja) 2019-06-27
KR20190070853A (ko) 2019-06-21
JP7030497B2 (ja) 2022-03-07
CN110010521A (zh) 2019-07-12

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