CN109983588B - 半导体元件 - Google Patents
半导体元件 Download PDFInfo
- Publication number
- CN109983588B CN109983588B CN201780069747.4A CN201780069747A CN109983588B CN 109983588 B CN109983588 B CN 109983588B CN 201780069747 A CN201780069747 A CN 201780069747A CN 109983588 B CN109983588 B CN 109983588B
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- layer
- conductive semiconductor
- electrode
- semiconductor
- semiconductor layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/034—Manufacture or treatment of coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
Landscapes
- Led Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0149373 | 2016-11-10 | ||
| KR1020160149373A KR102738456B1 (ko) | 2016-11-10 | 2016-11-10 | 반도체 소자 |
| PCT/KR2017/012751 WO2018088851A1 (ko) | 2016-11-10 | 2017-11-10 | 반도체 소자 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109983588A CN109983588A (zh) | 2019-07-05 |
| CN109983588B true CN109983588B (zh) | 2023-07-18 |
Family
ID=62110765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780069747.4A Active CN109983588B (zh) | 2016-11-10 | 2017-11-10 | 半导体元件 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10784409B2 (enExample) |
| EP (1) | EP3540793B1 (enExample) |
| JP (1) | JP7118447B2 (enExample) |
| KR (1) | KR102738456B1 (enExample) |
| CN (1) | CN109983588B (enExample) |
| WO (1) | WO2018088851A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102575569B1 (ko) * | 2018-08-13 | 2023-09-07 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
| CN111276595A (zh) * | 2018-12-04 | 2020-06-12 | 展晶科技(深圳)有限公司 | 发光二极管及其制作方法 |
| CN111276596B (zh) * | 2018-12-05 | 2024-02-06 | 光宝光电(常州)有限公司 | 发光单元 |
| KR102734544B1 (ko) * | 2019-03-15 | 2024-11-27 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
| CN110224049A (zh) * | 2019-05-31 | 2019-09-10 | 深圳市华星光电半导体显示技术有限公司 | micro LED芯片及其制备方法 |
| CN114203747B (zh) * | 2021-12-08 | 2025-08-19 | 泉州三安半导体科技有限公司 | 一种发光二极管 |
| DE102022119108A1 (de) * | 2022-07-29 | 2024-02-01 | Ams-Osram International Gmbh | Optoelektronisches halbleiterbauelement und verfahren zur herstellung zumindest eines optoelektronischen halbleiterbauelements |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110117964A (ko) * | 2010-04-22 | 2011-10-28 | 삼성엘이디 주식회사 | 반도체 발광 소자 |
| CN103840040A (zh) * | 2012-11-22 | 2014-06-04 | 株式会社东芝 | 半导体发光器件及其制造方法 |
| JP2015103590A (ja) * | 2013-11-22 | 2015-06-04 | スタンレー電気株式会社 | 半導体発光装置 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8008673B2 (en) * | 2007-08-03 | 2011-08-30 | Panasonic Corporation | Light-emitting device |
| KR100986570B1 (ko) * | 2009-08-31 | 2010-10-07 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
| US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
| KR101799451B1 (ko) * | 2011-06-02 | 2017-11-20 | 엘지이노텍 주식회사 | 발광 소자 |
| EP2562814B1 (en) * | 2011-08-22 | 2020-08-19 | LG Innotek Co., Ltd. | Light emitting device and light emitting device package |
| KR101186684B1 (ko) * | 2012-03-29 | 2012-09-28 | 서울옵토디바이스주식회사 | 발광 다이오드 및 그것을 제조하는 방법 |
| KR102160070B1 (ko) * | 2013-10-28 | 2020-09-25 | 서울바이오시스 주식회사 | 근자외선 발광 소자 |
| KR20130128841A (ko) * | 2012-05-18 | 2013-11-27 | 삼성전자주식회사 | 멀티셀 어레이를 갖는 반도체 발광장치 및 그 제조방법, 그리고 발광모듈 및 조명장치 |
| CN102683534B (zh) * | 2012-05-21 | 2015-02-25 | 厦门市三安光电科技有限公司 | 垂直式交流发光二极管器件及其制作方法 |
| JP2014139998A (ja) * | 2013-01-21 | 2014-07-31 | Toshiba Corp | 半導体発光装置 |
| KR102037865B1 (ko) | 2013-02-01 | 2019-10-30 | 삼성전자주식회사 | 반도체 발광소자 및 반도체 발광소자 제조방법 |
| DE102013105870A1 (de) * | 2013-06-06 | 2014-12-24 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| JP6215612B2 (ja) * | 2013-08-07 | 2017-10-18 | ソニーセミコンダクタソリューションズ株式会社 | 発光素子、発光素子ウェーハ及び電子機器 |
| CN104465691A (zh) * | 2013-09-16 | 2015-03-25 | 上海蓝光科技有限公司 | 一种高压发光二极管结构及其制造方法 |
| CN103730479A (zh) * | 2013-11-29 | 2014-04-16 | 南京大学扬州光电研究院 | 一种多发光子区GaN基LED集成芯片 |
| US9768345B2 (en) * | 2013-12-20 | 2017-09-19 | Apple Inc. | LED with current injection confinement trench |
| KR102197082B1 (ko) * | 2014-06-16 | 2020-12-31 | 엘지이노텍 주식회사 | 발광 소자 및 이를 포함하는 발광소자 패키지 |
| DE112015005634T5 (de) | 2014-12-19 | 2017-09-07 | Seoul Viosys Co., Ltd. | Halbleiter-lichtemissionseinrichtung und verfahren zur herstellung von dieser |
| KR102417158B1 (ko) | 2015-01-29 | 2022-07-07 | 서울바이오시스 주식회사 | 반도체 발광소자 |
| CN110061027B (zh) * | 2015-02-13 | 2024-01-19 | 首尔伟傲世有限公司 | 发光元件 |
| JP6545981B2 (ja) * | 2015-03-12 | 2019-07-17 | アルパッド株式会社 | 半導体発光装置 |
| KR102480220B1 (ko) * | 2016-04-08 | 2022-12-26 | 삼성전자주식회사 | 발광 다이오드 모듈 및 이를 구비한 디스플레이 패널 |
-
2016
- 2016-11-10 KR KR1020160149373A patent/KR102738456B1/ko active Active
-
2017
- 2017-11-10 WO PCT/KR2017/012751 patent/WO2018088851A1/ko not_active Ceased
- 2017-11-10 EP EP17869479.0A patent/EP3540793B1/en active Active
- 2017-11-10 JP JP2019524358A patent/JP7118447B2/ja active Active
- 2017-11-10 CN CN201780069747.4A patent/CN109983588B/zh active Active
- 2017-11-10 US US16/348,601 patent/US10784409B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110117964A (ko) * | 2010-04-22 | 2011-10-28 | 삼성엘이디 주식회사 | 반도체 발광 소자 |
| CN103840040A (zh) * | 2012-11-22 | 2014-06-04 | 株式会社东芝 | 半导体发光器件及其制造方法 |
| JP2014107291A (ja) * | 2012-11-22 | 2014-06-09 | Toshiba Corp | 半導体発光素子及びその製造方法 |
| JP2015103590A (ja) * | 2013-11-22 | 2015-06-04 | スタンレー電気株式会社 | 半導体発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US10784409B2 (en) | 2020-09-22 |
| EP3540793A1 (en) | 2019-09-18 |
| KR20180052256A (ko) | 2018-05-18 |
| CN109983588A (zh) | 2019-07-05 |
| WO2018088851A1 (ko) | 2018-05-17 |
| JP2019536274A (ja) | 2019-12-12 |
| US20200066938A1 (en) | 2020-02-27 |
| JP7118447B2 (ja) | 2022-08-16 |
| EP3540793B1 (en) | 2024-07-17 |
| KR102738456B1 (ko) | 2024-12-04 |
| EP3540793A4 (en) | 2020-06-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210714 Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Applicant after: Suzhou Leyu Semiconductor Co.,Ltd. Address before: Han Guoshouershi Applicant before: LG INNOTEK Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Applicant after: Suzhou Liyu Semiconductor Co.,Ltd. Address before: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Applicant before: Suzhou Leyu Semiconductor Co.,Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |