CN109795188A - 一种具有良好耐热性的覆铜板及其制备方法 - Google Patents
一种具有良好耐热性的覆铜板及其制备方法 Download PDFInfo
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- CN109795188A CN109795188A CN201811625553.0A CN201811625553A CN109795188A CN 109795188 A CN109795188 A CN 109795188A CN 201811625553 A CN201811625553 A CN 201811625553A CN 109795188 A CN109795188 A CN 109795188A
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- Prior art keywords
- copper
- resin
- heat resistance
- clad laminate
- epoxy resin
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- 238000002360 preparation method Methods 0.000 title claims description 25
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000011347 resin Substances 0.000 claims abstract description 60
- 239000003822 epoxy resin Substances 0.000 claims abstract description 52
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 52
- 239000003960 organic solvent Substances 0.000 claims abstract description 30
- 239000007787 solid Substances 0.000 claims abstract description 27
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 claims abstract description 18
- 239000004744 fabric Substances 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 14
- 239000011889 copper foil Substances 0.000 claims abstract description 13
- 239000005011 phenolic resin Substances 0.000 claims abstract description 13
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical compound N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 claims abstract description 12
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 10
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 150000002118 epoxides Chemical class 0.000 claims description 9
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 8
- 239000000460 chlorine Substances 0.000 claims description 8
- 229910052801 chlorine Inorganic materials 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N 1H-imidazole Chemical group C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 239000000498 cooling water Substances 0.000 claims description 2
- 238000004132 cross linking Methods 0.000 claims description 2
- 238000004090 dissolution Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 238000004945 emulsification Methods 0.000 claims description 2
- 235000013312 flour Nutrition 0.000 claims description 2
- 238000001879 gelation Methods 0.000 claims description 2
- 238000002386 leaching Methods 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000010008 shearing Methods 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- RCHKEJKUUXXBSM-UHFFFAOYSA-N n-benzyl-2-(3-formylindol-1-yl)acetamide Chemical compound C12=CC=CC=C2C(C=O)=CN1CC(=O)NCC1=CC=CC=C1 RCHKEJKUUXXBSM-UHFFFAOYSA-N 0.000 claims 1
- 230000009477 glass transition Effects 0.000 abstract description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 33
- 238000000034 method Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 14
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KDVYCTOWXSLNNI-UHFFFAOYSA-N 4-t-Butylbenzoic acid Chemical compound CC(C)(C)C1=CC=C(C(O)=O)C=C1 KDVYCTOWXSLNNI-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000010426 asphalt Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000012824 chemical production Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- URJFKQPLLWGDEI-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=[C]N1CC1=CC=CC=C1 URJFKQPLLWGDEI-UHFFFAOYSA-N 0.000 description 1
- -1 2- ethyl Chemical group 0.000 description 1
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 description 1
- LCHYEKKJCUJAKN-UHFFFAOYSA-N 2-propylphenol Chemical compound CCCC1=CC=CC=C1O LCHYEKKJCUJAKN-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- JXCHMDATRWUOAP-UHFFFAOYSA-N diisocyanatomethylbenzene Chemical compound O=C=NC(N=C=O)C1=CC=CC=C1 JXCHMDATRWUOAP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- WSGCRAOTEDLMFQ-UHFFFAOYSA-N nonan-5-one Chemical compound CCCCC(=O)CCCC WSGCRAOTEDLMFQ-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
原物料 | 固体重量(克) |
低溴环氧树脂 | 100 |
双氰胺 | 2.5 |
2-甲基咪唑(2-MI) | 0.09 |
Claims (10)
Priority Applications (1)
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CN201811625553.0A CN109795188B (zh) | 2018-12-28 | 2018-12-28 | 一种具有良好耐热性的覆铜板及其制备方法 |
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CN201811625553.0A CN109795188B (zh) | 2018-12-28 | 2018-12-28 | 一种具有良好耐热性的覆铜板及其制备方法 |
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Publication Number | Publication Date |
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CN109795188A true CN109795188A (zh) | 2019-05-24 |
CN109795188B CN109795188B (zh) | 2021-08-06 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109536099A (zh) * | 2018-11-23 | 2019-03-29 | 南亚新材料科技股份有限公司 | 一种适用于汽车的覆铜箔板用粘合剂及其制备方法 |
CN110328914A (zh) * | 2019-06-17 | 2019-10-15 | 吉安市宏瑞兴科技有限公司 | 一种适用于pcb制程具有良好阻燃性的覆铜板及其制备方法 |
CN110588116A (zh) * | 2019-09-04 | 2019-12-20 | 重庆德凯实业股份有限公司 | 一种阻燃耐热覆铜箔环氧玻纤布基层压板及其制备方法 |
CN111424294A (zh) * | 2020-05-15 | 2020-07-17 | 惠州联合铜箔电子材料有限公司 | 反转铜箔生产工艺 |
CN112080107A (zh) * | 2020-09-27 | 2020-12-15 | 诸暨企为科技有限公司 | 一种电子材料及其制备工艺 |
CN113290978A (zh) * | 2021-05-13 | 2021-08-24 | 莱州鹏洲电子有限公司 | 一种高cti高抗剥离强度的cem-1覆铜板及其制备方法 |
CN113307993A (zh) * | 2021-04-27 | 2021-08-27 | 建滔电子材料(江阴)有限公司 | 一种玻璃纱玻纤布及其制备工艺 |
CN116461190A (zh) * | 2023-04-26 | 2023-07-21 | 江苏耀鸿电子有限公司 | 一种高耐蚀环氧树脂覆铜板及其制备方法 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101323698A (zh) * | 2007-06-15 | 2008-12-17 | 比亚迪股份有限公司 | 一种阻燃性组合物和覆铜板以及它们的制备方法 |
CN102604512A (zh) * | 2005-03-15 | 2012-07-25 | 日本化药株式会社 | 环氧树脂、环氧树脂组合物、使用该环氧树脂的预浸渍体及叠层板 |
CN102731966A (zh) * | 2012-07-09 | 2012-10-17 | 广东生益科技股份有限公司 | 热固性环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
CN102775733A (zh) * | 2012-08-09 | 2012-11-14 | 广东生益科技股份有限公司 | 热固性树脂组合物及使用其制作的预浸体与覆铜箔层压板 |
CN102838843A (zh) * | 2012-09-20 | 2012-12-26 | 宏昌电子材料股份有限公司 | 一种增韧环氧树脂组合物及其应用 |
CN103642446A (zh) * | 2013-12-10 | 2014-03-19 | 上海南亚覆铜箔板有限公司 | 无铅高耐热覆铜板及其制备方法 |
CN103897350A (zh) * | 2014-04-17 | 2014-07-02 | 苏州生益科技有限公司 | 一种热固性树脂组合物及使用其制作的半固化片及层压板 |
CN105175995A (zh) * | 2015-08-03 | 2015-12-23 | 广东生益科技股份有限公司 | 一种覆铜板用环氧树脂组合物及其应用 |
CN105619962A (zh) * | 2016-01-15 | 2016-06-01 | 广德龙泰电子科技有限公司 | 一种覆铜板的制备方法 |
CN105667012A (zh) * | 2016-01-15 | 2016-06-15 | 广德龙泰电子科技有限公司 | 一种无铅耐CAF高Tg覆铜板 |
CN107298831A (zh) * | 2017-07-20 | 2017-10-27 | 南亚新材料科技股份有限公司 | 改善耐漏电起痕指数及钻孔加工性能半固化片及其应用 |
-
2018
- 2018-12-28 CN CN201811625553.0A patent/CN109795188B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102604512A (zh) * | 2005-03-15 | 2012-07-25 | 日本化药株式会社 | 环氧树脂、环氧树脂组合物、使用该环氧树脂的预浸渍体及叠层板 |
CN101323698A (zh) * | 2007-06-15 | 2008-12-17 | 比亚迪股份有限公司 | 一种阻燃性组合物和覆铜板以及它们的制备方法 |
CN102731966A (zh) * | 2012-07-09 | 2012-10-17 | 广东生益科技股份有限公司 | 热固性环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
CN102775733A (zh) * | 2012-08-09 | 2012-11-14 | 广东生益科技股份有限公司 | 热固性树脂组合物及使用其制作的预浸体与覆铜箔层压板 |
CN102838843A (zh) * | 2012-09-20 | 2012-12-26 | 宏昌电子材料股份有限公司 | 一种增韧环氧树脂组合物及其应用 |
CN103642446A (zh) * | 2013-12-10 | 2014-03-19 | 上海南亚覆铜箔板有限公司 | 无铅高耐热覆铜板及其制备方法 |
CN103897350A (zh) * | 2014-04-17 | 2014-07-02 | 苏州生益科技有限公司 | 一种热固性树脂组合物及使用其制作的半固化片及层压板 |
CN105175995A (zh) * | 2015-08-03 | 2015-12-23 | 广东生益科技股份有限公司 | 一种覆铜板用环氧树脂组合物及其应用 |
CN105619962A (zh) * | 2016-01-15 | 2016-06-01 | 广德龙泰电子科技有限公司 | 一种覆铜板的制备方法 |
CN105667012A (zh) * | 2016-01-15 | 2016-06-15 | 广德龙泰电子科技有限公司 | 一种无铅耐CAF高Tg覆铜板 |
CN107298831A (zh) * | 2017-07-20 | 2017-10-27 | 南亚新材料科技股份有限公司 | 改善耐漏电起痕指数及钻孔加工性能半固化片及其应用 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109536099A (zh) * | 2018-11-23 | 2019-03-29 | 南亚新材料科技股份有限公司 | 一种适用于汽车的覆铜箔板用粘合剂及其制备方法 |
CN110328914A (zh) * | 2019-06-17 | 2019-10-15 | 吉安市宏瑞兴科技有限公司 | 一种适用于pcb制程具有良好阻燃性的覆铜板及其制备方法 |
CN110588116A (zh) * | 2019-09-04 | 2019-12-20 | 重庆德凯实业股份有限公司 | 一种阻燃耐热覆铜箔环氧玻纤布基层压板及其制备方法 |
CN111424294A (zh) * | 2020-05-15 | 2020-07-17 | 惠州联合铜箔电子材料有限公司 | 反转铜箔生产工艺 |
CN112080107A (zh) * | 2020-09-27 | 2020-12-15 | 诸暨企为科技有限公司 | 一种电子材料及其制备工艺 |
CN113307993A (zh) * | 2021-04-27 | 2021-08-27 | 建滔电子材料(江阴)有限公司 | 一种玻璃纱玻纤布及其制备工艺 |
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CN116461190A (zh) * | 2023-04-26 | 2023-07-21 | 江苏耀鸿电子有限公司 | 一种高耐蚀环氧树脂覆铜板及其制备方法 |
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