CN109791905A - 用于确定载体悬浮系统的对准的方法 - Google Patents

用于确定载体悬浮系统的对准的方法 Download PDF

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Publication number
CN109791905A
CN109791905A CN201780046305.8A CN201780046305A CN109791905A CN 109791905 A CN109791905 A CN 109791905A CN 201780046305 A CN201780046305 A CN 201780046305A CN 109791905 A CN109791905 A CN 109791905A
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CN
China
Prior art keywords
carrier
distance
magnet unit
alignment
suspension system
Prior art date
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Pending
Application number
CN201780046305.8A
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English (en)
Chinese (zh)
Inventor
克里斯蒂安·沃尔夫冈·埃曼
布里塔·斯帕
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN109791905A publication Critical patent/CN109791905A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Vehicles With Linear Motors And Vehicles That Are Magnetically Levitated (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Non-Mechanical Conveyors (AREA)
CN201780046305.8A 2017-09-15 2017-09-15 用于确定载体悬浮系统的对准的方法 Pending CN109791905A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/073319 WO2019052657A1 (en) 2017-09-15 2017-09-15 METHOD FOR DETERMINING THE ALIGNMENT OF A SUPPORT LEVITATION SYSTEM

Publications (1)

Publication Number Publication Date
CN109791905A true CN109791905A (zh) 2019-05-21

Family

ID=60019868

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780046305.8A Pending CN109791905A (zh) 2017-09-15 2017-09-15 用于确定载体悬浮系统的对准的方法

Country Status (5)

Country Link
JP (1) JP6704059B2 (ja)
KR (1) KR20190031430A (ja)
CN (1) CN109791905A (ja)
TW (1) TW201923943A (ja)
WO (1) WO2019052657A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112103231A (zh) * 2020-11-17 2020-12-18 西安奕斯伟硅片技术有限公司 一种晶圆盒装载装置和晶圆盒装载方法
CN113086552A (zh) * 2020-01-08 2021-07-09 细美事有限公司 输送机系统和输送机系统中的对准方法
CN115009857A (zh) * 2022-04-22 2022-09-06 江苏匠准数控机床有限公司 一种工件运载输送方法及装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220002515A (ko) * 2019-04-29 2022-01-06 어플라이드 머티어리얼스, 인코포레이티드 자기 부상 시스템, 자기 부상 시스템의 베이스 및 캐리어, 및 캐리어를 부상시키는 방법
CN220887670U (zh) * 2020-10-08 2024-05-03 应用材料公司 用于运输载体的载体运输系统以及用于基板的真空处理的设备
JP7216752B2 (ja) 2021-02-08 2023-02-01 キヤノントッキ株式会社 計測装置、インライン型蒸着装置および調整方法
WO2023118929A1 (en) * 2021-12-21 2023-06-29 Applied Materials, Inc. Method of inspecting a carrier transport system, vacuum processing apparatus, computer program, and computer-readable storage medium

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090056878A1 (en) * 2007-08-27 2009-03-05 Canon Anelva Corporation Transfer apparatus
WO2015158725A1 (de) * 2014-04-16 2015-10-22 Mecatronix Ag Vorrichtung zum halten, positionieren und/oder bewegen eines objekts

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07435Y2 (ja) * 1988-10-11 1995-01-11 旭硝子株式会社 真空処理炉の搬送装置
JPH0712335U (ja) * 1993-07-23 1995-02-28 神鋼電機株式会社 磁気懸垂式搬送装置
US8960099B2 (en) * 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
KR100827738B1 (ko) * 2004-12-20 2008-05-07 고쿠리츠 다이가쿠 호진 큐슈 코교 다이가쿠 초전도 자기 부상에 의한 비접촉 반송 장치
JP5058546B2 (ja) * 2006-09-27 2012-10-24 キヤノン株式会社 力発生装置およびこれを用いたステージ装置ならびに露光装置
JP4451901B2 (ja) * 2007-08-27 2010-04-14 キヤノンアネルバ株式会社 搬送装置
JP2012055063A (ja) * 2010-08-31 2012-03-15 Nikon Corp 移動体装置、露光装置、及びデバイス製造方法
CN109976103A (zh) * 2012-11-20 2019-07-05 株式会社尼康 曝光装置、移动体装置以及器件制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090056878A1 (en) * 2007-08-27 2009-03-05 Canon Anelva Corporation Transfer apparatus
WO2015158725A1 (de) * 2014-04-16 2015-10-22 Mecatronix Ag Vorrichtung zum halten, positionieren und/oder bewegen eines objekts
DE102014005547A1 (de) * 2014-04-16 2015-10-22 Mecatronix Ag Vorrichtung zum Halten, Positionieren und/oder Bewegen eines Objekts

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113086552A (zh) * 2020-01-08 2021-07-09 细美事有限公司 输送机系统和输送机系统中的对准方法
CN112103231A (zh) * 2020-11-17 2020-12-18 西安奕斯伟硅片技术有限公司 一种晶圆盒装载装置和晶圆盒装载方法
CN112103231B (zh) * 2020-11-17 2021-03-02 西安奕斯伟硅片技术有限公司 一种晶圆盒装载装置和晶圆盒装载方法
CN115009857A (zh) * 2022-04-22 2022-09-06 江苏匠准数控机床有限公司 一种工件运载输送方法及装置

Also Published As

Publication number Publication date
WO2019052657A1 (en) 2019-03-21
JP6704059B2 (ja) 2020-06-03
TW201923943A (zh) 2019-06-16
JP2019533896A (ja) 2019-11-21
KR20190031430A (ko) 2019-03-26

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