CN112103231A - 一种晶圆盒装载装置和晶圆盒装载方法 - Google Patents
一种晶圆盒装载装置和晶圆盒装载方法 Download PDFInfo
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- CN112103231A CN112103231A CN202011285956.2A CN202011285956A CN112103231A CN 112103231 A CN112103231 A CN 112103231A CN 202011285956 A CN202011285956 A CN 202011285956A CN 112103231 A CN112103231 A CN 112103231A
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- 238000011068 loading method Methods 0.000 title claims abstract description 73
- 241000252254 Catostomidae Species 0.000 claims abstract 6
- 238000000034 method Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 6
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 88
- 238000001179 sorption measurement Methods 0.000 description 6
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202011285956.2A CN112103231B (zh) | 2020-11-17 | 2020-11-17 | 一种晶圆盒装载装置和晶圆盒装载方法 |
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CN202011285956.2A CN112103231B (zh) | 2020-11-17 | 2020-11-17 | 一种晶圆盒装载装置和晶圆盒装载方法 |
Publications (2)
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CN112103231A true CN112103231A (zh) | 2020-12-18 |
CN112103231B CN112103231B (zh) | 2021-03-02 |
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CN202011285956.2A Active CN112103231B (zh) | 2020-11-17 | 2020-11-17 | 一种晶圆盒装载装置和晶圆盒装载方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117936932A (zh) * | 2024-01-23 | 2024-04-26 | 江西京九电源(九江)有限公司 | 一种铅酸电池盒及其定位装配设备 |
Citations (13)
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---|---|---|---|---|
JPH01278740A (ja) * | 1988-05-02 | 1989-11-09 | Hitachi Kiden Kogyo Ltd | クリーンルーム内のウエハキャリアの搬送方法 |
JP2001189371A (ja) * | 1999-06-01 | 2001-07-10 | Semiconductor Leading Edge Technologies Inc | ロードポート調整治具、foup測定治具、foupウェーハプレーン測定治具、キネマティックピン形状評価治具、キネマティックピン位置評価治具、およびこれらを用いる調整・測定・評価方法 |
KR20070071263A (ko) * | 2005-12-29 | 2007-07-04 | 엘지.필립스 엘시디 주식회사 | 스토커 시스템 및 그 제어 방법 |
CN103569629A (zh) * | 2012-07-26 | 2014-02-12 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 料盒更换装置、插片机和半导体设备 |
CN204029838U (zh) * | 2014-09-02 | 2014-12-17 | 天津英利新能源有限公司 | 一种辅助硅片插片的装置 |
CN204809199U (zh) * | 2015-07-31 | 2015-11-25 | 中芯国际集成电路制造(北京)有限公司 | 一种晶圆盒运送系统 |
KR101575652B1 (ko) * | 2015-07-06 | 2015-12-09 | 코리아테크노(주) | 퍼지용 노즐과 이를 이용한 foup 흡착장치 |
CN206363994U (zh) * | 2017-01-17 | 2017-07-28 | 中芯国际集成电路制造(天津)有限公司 | 晶圆装载装置 |
CN109791905A (zh) * | 2017-09-15 | 2019-05-21 | 应用材料公司 | 用于确定载体悬浮系统的对准的方法 |
CN209045518U (zh) * | 2018-12-17 | 2019-06-28 | 盐城阿特斯协鑫阳光电力科技有限公司 | 一种硅片存储装置 |
CN110039514A (zh) * | 2018-01-15 | 2019-07-23 | 均豪精密工业股份有限公司 | 机械手臂装置及机械手臂装置的控制方法 |
CN210910010U (zh) * | 2019-11-05 | 2020-07-03 | 深圳市冠乔科技有限公司 | 一种包装线机箱上料机械人 |
CN211654783U (zh) * | 2020-03-24 | 2020-10-09 | 厦门市三安集成电路有限公司 | 一种晶圆盒 |
-
2020
- 2020-11-17 CN CN202011285956.2A patent/CN112103231B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01278740A (ja) * | 1988-05-02 | 1989-11-09 | Hitachi Kiden Kogyo Ltd | クリーンルーム内のウエハキャリアの搬送方法 |
JP2001189371A (ja) * | 1999-06-01 | 2001-07-10 | Semiconductor Leading Edge Technologies Inc | ロードポート調整治具、foup測定治具、foupウェーハプレーン測定治具、キネマティックピン形状評価治具、キネマティックピン位置評価治具、およびこれらを用いる調整・測定・評価方法 |
KR20070071263A (ko) * | 2005-12-29 | 2007-07-04 | 엘지.필립스 엘시디 주식회사 | 스토커 시스템 및 그 제어 방법 |
CN103569629A (zh) * | 2012-07-26 | 2014-02-12 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 料盒更换装置、插片机和半导体设备 |
CN204029838U (zh) * | 2014-09-02 | 2014-12-17 | 天津英利新能源有限公司 | 一种辅助硅片插片的装置 |
KR101575652B1 (ko) * | 2015-07-06 | 2015-12-09 | 코리아테크노(주) | 퍼지용 노즐과 이를 이용한 foup 흡착장치 |
CN204809199U (zh) * | 2015-07-31 | 2015-11-25 | 中芯国际集成电路制造(北京)有限公司 | 一种晶圆盒运送系统 |
CN206363994U (zh) * | 2017-01-17 | 2017-07-28 | 中芯国际集成电路制造(天津)有限公司 | 晶圆装载装置 |
CN109791905A (zh) * | 2017-09-15 | 2019-05-21 | 应用材料公司 | 用于确定载体悬浮系统的对准的方法 |
CN110039514A (zh) * | 2018-01-15 | 2019-07-23 | 均豪精密工业股份有限公司 | 机械手臂装置及机械手臂装置的控制方法 |
CN209045518U (zh) * | 2018-12-17 | 2019-06-28 | 盐城阿特斯协鑫阳光电力科技有限公司 | 一种硅片存储装置 |
CN210910010U (zh) * | 2019-11-05 | 2020-07-03 | 深圳市冠乔科技有限公司 | 一种包装线机箱上料机械人 |
CN211654783U (zh) * | 2020-03-24 | 2020-10-09 | 厦门市三安集成电路有限公司 | 一种晶圆盒 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117936932A (zh) * | 2024-01-23 | 2024-04-26 | 江西京九电源(九江)有限公司 | 一种铅酸电池盒及其定位装配设备 |
CN117936932B (zh) * | 2024-01-23 | 2025-06-24 | 江西京九电源(九江)有限公司 | 一种铅酸电池盒及其定位装配设备 |
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CN112103231B (zh) | 2021-03-02 |
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Effective date of registration: 20241121 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Country or region after: China Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Country or region before: China |
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