TW201923943A - 用以決定一載體懸浮系統之對準的方法及設備 - Google Patents

用以決定一載體懸浮系統之對準的方法及設備 Download PDF

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Publication number
TW201923943A
TW201923943A TW107129975A TW107129975A TW201923943A TW 201923943 A TW201923943 A TW 201923943A TW 107129975 A TW107129975 A TW 107129975A TW 107129975 A TW107129975 A TW 107129975A TW 201923943 A TW201923943 A TW 201923943A
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TW
Taiwan
Prior art keywords
carrier
distance
magnetic
alignment
magnetic unit
Prior art date
Application number
TW107129975A
Other languages
English (en)
Chinese (zh)
Inventor
克里斯蒂安沃爾夫岡 埃曼
布利塔 施巴赫
Original Assignee
美商應用材料股份有限公司
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Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201923943A publication Critical patent/TW201923943A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Vehicles With Linear Motors And Vehicles That Are Magnetically Levitated (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Non-Mechanical Conveyors (AREA)
TW107129975A 2017-09-15 2018-08-28 用以決定一載體懸浮系統之對準的方法及設備 TW201923943A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??PCT/EP2017/073319 2017-09-15
PCT/EP2017/073319 WO2019052657A1 (en) 2017-09-15 2017-09-15 METHOD FOR DETERMINING THE ALIGNMENT OF A SUPPORT LEVITATION SYSTEM

Publications (1)

Publication Number Publication Date
TW201923943A true TW201923943A (zh) 2019-06-16

Family

ID=60019868

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107129975A TW201923943A (zh) 2017-09-15 2018-08-28 用以決定一載體懸浮系統之對準的方法及設備

Country Status (5)

Country Link
JP (1) JP6704059B2 (ja)
KR (1) KR20190031430A (ja)
CN (1) CN109791905A (ja)
TW (1) TW201923943A (ja)
WO (1) WO2019052657A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220002515A (ko) * 2019-04-29 2022-01-06 어플라이드 머티어리얼스, 인코포레이티드 자기 부상 시스템, 자기 부상 시스템의 베이스 및 캐리어, 및 캐리어를 부상시키는 방법
KR102319196B1 (ko) * 2020-01-08 2021-10-29 세메스 주식회사 컨베이어 시스템 및 컨베이어 시스템에서의 정렬 방법
CN220887670U (zh) * 2020-10-08 2024-05-03 应用材料公司 用于运输载体的载体运输系统以及用于基板的真空处理的设备
CN112103231B (zh) * 2020-11-17 2021-03-02 西安奕斯伟硅片技术有限公司 一种晶圆盒装载装置和晶圆盒装载方法
JP7216752B2 (ja) 2021-02-08 2023-02-01 キヤノントッキ株式会社 計測装置、インライン型蒸着装置および調整方法
WO2023118929A1 (en) * 2021-12-21 2023-06-29 Applied Materials, Inc. Method of inspecting a carrier transport system, vacuum processing apparatus, computer program, and computer-readable storage medium
CN115009857B (zh) * 2022-04-22 2023-07-25 江苏匠准数控机床有限公司 一种工件运载输送方法及装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07435Y2 (ja) * 1988-10-11 1995-01-11 旭硝子株式会社 真空処理炉の搬送装置
JPH0712335U (ja) * 1993-07-23 1995-02-28 神鋼電機株式会社 磁気懸垂式搬送装置
US8960099B2 (en) * 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
KR100827738B1 (ko) * 2004-12-20 2008-05-07 고쿠리츠 다이가쿠 호진 큐슈 코교 다이가쿠 초전도 자기 부상에 의한 비접촉 반송 장치
JP5058546B2 (ja) * 2006-09-27 2012-10-24 キヤノン株式会社 力発生装置およびこれを用いたステージ装置ならびに露光装置
US7770714B2 (en) * 2007-08-27 2010-08-10 Canon Anelva Corporation Transfer apparatus
JP4451901B2 (ja) * 2007-08-27 2010-04-14 キヤノンアネルバ株式会社 搬送装置
JP2012055063A (ja) * 2010-08-31 2012-03-15 Nikon Corp 移動体装置、露光装置、及びデバイス製造方法
CN109976103A (zh) * 2012-11-20 2019-07-05 株式会社尼康 曝光装置、移动体装置以及器件制造方法
DE102014005547B4 (de) * 2014-04-16 2016-09-15 Mecatronix Ag Vorrichtung und Verfahren zum Halten, Positionieren und/oder Bewegen eines Objekts

Also Published As

Publication number Publication date
WO2019052657A1 (en) 2019-03-21
JP6704059B2 (ja) 2020-06-03
JP2019533896A (ja) 2019-11-21
KR20190031430A (ko) 2019-03-26
CN109791905A (zh) 2019-05-21

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