TW201923943A - Method and apparatus for determining alignment of a carrier levitation system - Google Patents

Method and apparatus for determining alignment of a carrier levitation system Download PDF

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TW201923943A
TW201923943A TW107129975A TW107129975A TW201923943A TW 201923943 A TW201923943 A TW 201923943A TW 107129975 A TW107129975 A TW 107129975A TW 107129975 A TW107129975 A TW 107129975A TW 201923943 A TW201923943 A TW 201923943A
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carrier
distance
magnetic
alignment
magnetic unit
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克里斯蒂安沃爾夫岡 埃曼
布利塔 施巴赫
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美商應用材料股份有限公司
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Abstract

A method for determining an alignment of a carrier levitation system is provided. The carrier levitation system includes a plurality of magnetic units, the plurality of magnetic units being adapted for contactlessly levitating a carrier. The plurality of magnetic units includes a first magnetic unit and a second magnetic unit. The method includes measuring a first distance from the first magnetic unit to the carrier. The method includes measuring a second distance from the second magnetic unit to the carrier. The method includes determining, from at least the first distance and the second distance, the alignment of the carrier levitation system.

Description

用以決定一載體懸浮系統之對準的方法Method for determining alignment of a carrier suspension system

數個實施例是有關於一種處理系統,一載體係提出於此處理系統中。更特別的是,此處所述之數個實施例係有關於數種用以決定一裝置之一對準的方法,此裝置用以導引一處理系統中的一載體。Several embodiments relate to a processing system in which a carrier is proposed. More specifically, the embodiments described herein relate to several methods for determining the alignment of a device for guiding a carrier in a processing system.

數種在處理腔室中用以執行數種製程之系統係已知,此些製程舉例為在處理腔室中之基板的塗佈。數種方法係已知而用以沈積材料於基板上。作為一例子來說,基板可藉由使用蒸發製程、物理氣相沈積(physical vapor deposition,PVD)製程、或化學氣相沈積(chemical vapor deposition,CVD)製程塗佈。物理氣相沈積製程例如是濺射製程、噴塗(spraying)製程等。製程可於沈積設備之處理腔室中執行,將塗佈之基板係位在處理腔室中。沈積材料係提供至處理腔室中。數種材料可使用以用於沈積於基板上,此些材料例如是小分子、金屬、氧化物、氮化物、及碳化物。再者,其他製程可在處理腔室中執行,像是蝕刻、成型(structuring)、退火、或類似者。Several systems are known in the processing chamber for performing several processes. Examples of these processes are coating of substrates in the processing chamber. Several methods are known for depositing materials on a substrate. As an example, the substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process, or a chemical vapor deposition (CVD) process. The physical vapor deposition process is, for example, a sputtering process, a spraying process, or the like. The process can be performed in the processing chamber of the deposition equipment, and the coated substrate is located in the processing chamber. A deposition material is provided into the processing chamber. Several materials can be used for deposition on the substrate, such as small molecules, metals, oxides, nitrides, and carbides. Furthermore, other processes may be performed in the processing chamber, such as etching, structuring, annealing, or the like.

舉例來說,塗佈製程可視為用於舉例為在顯示器製造技術中的大面積基板。塗佈之基板可使用於數種應用中及數種技術領域中。舉例來說,一種應用可為有機發光二極體(organic light emitting diode,OLED)面板。其他應用包括絕緣面板、例如是半導體裝置之微電子學、具有薄膜電晶體(thin film transistors,TFTs)之基板、彩色濾光片或類似者。OLEDs係為固態裝置,由(有機)分子之薄膜所組成。在應用電的情況下,(有機)分子之薄膜係產生光。作為一例子來說,OLED顯示器可在電子裝置上提供明亮的顯示器,及相較於舉例為液晶顯示器(liquid crystal displays,LCDs)來說係使用較少的功率。在處理腔室中,有機分子係產生(舉例為蒸發、濺射、或噴塗等)及沈積成層於基板上。粒子可舉例為通過具有邊界或特定圖案的遮罩,以沈積材料於基板上的所需位置,而舉例形成OLED圖案於基板上。For example, the coating process can be regarded as a large-area substrate used for example in display manufacturing technology. The coated substrate can be used in several applications and in several technical fields. For example, one application may be an organic light emitting diode (OLED) panel. Other applications include insulating panels, such as microelectronics for semiconductor devices, substrates with thin film transistors (TFTs), color filters, or the like. OLEDs are solid-state devices composed of thin films of (organic) molecules. In the case of electricity, a thin film of (organic) molecules generates light. As an example, OLED displays can provide bright displays on electronic devices and use less power than liquid crystal displays (LCDs), for example. In the processing chamber, organic molecules are generated (eg, evaporated, sputtered, or sprayed, etc.) and deposited on the substrate. The particles can be exemplified by forming a OLED pattern on the substrate through a mask having a boundary or a specific pattern to deposit a material at a desired position on the substrate.

處理系統可包括導引裝置,用以舉例為在塗佈製程期間在處理腔室中導引基板。導引裝置可適用於在處理腔室中提供載體及/或在處理腔室中傳送載體。導引裝置之對準可提供。作為一例子來說,對準應準確,以達成良好的製程結果,以舉例為確保載體在處理腔室中支撐於目標位置中,或確保載體在處理腔室中根據目標路徑移動。決定導引裝置之對準應較佳地以有時間效率且有成本效益的方式執行。The processing system may include a guide device, for example, to guide the substrate in the processing chamber during the coating process. The guiding device may be adapted to provide a carrier in the processing chamber and / or to transfer the carrier in the processing chamber. Guiding device alignment is available. As an example, the alignment should be accurate to achieve good process results. Examples are to ensure that the carrier is supported in the target position in the processing chamber, or to ensure that the carrier moves in the processing chamber according to the target path. The determination of the alignment of the guidance device should preferably be performed in a time-efficient and cost-effective manner.

有鑑於上述,可提供改善一裝置之對準的設備及方法係有需求的,此裝置係用以於處理系統中導引載體。In view of the foregoing, there is a need for an apparatus and method that can improve the alignment of a device that is used to guide a carrier in a processing system.

根據一實施例,提出一種用以決定一載體懸浮系統之一對準的方法。載體懸浮系統包括數個磁性單元,此些磁性單元適用於非接觸懸浮一載體,其中此些磁性單元包括一第一磁性單元及一第二磁性單元。此方法包括測量從第一磁性單元至載體之一第一距離。此方法包括測量從第二磁性單元至載體之一第二距離。此方法包括自至少第一距離及第二距離決定載體懸浮系統之對準。According to an embodiment, a method for determining an alignment of a carrier suspension system is proposed. The carrier suspension system includes a plurality of magnetic units. The magnetic units are suitable for non-contact suspension of a carrier. The magnetic units include a first magnetic unit and a second magnetic unit. The method includes measuring a first distance from the first magnetic unit to one of the carriers. The method includes measuring a second distance from the second magnetic unit to one of the carriers. The method includes determining the alignment of the carrier suspension system from at least a first distance and a second distance.

根據其他實施例,提出一種用以決定一載體懸浮系統之一對準的方法。磁性懸浮系統包括數個磁性單元,此些磁性單元適用於非接觸懸浮一載體。此些磁性單元包括一第一磁性單元及一第二磁性單元。此方法包括當載體係由至少第一磁性單元非接觸懸浮時,測量從第一磁性單元至載體之一第一距離。此方法包括當載體係由至少第二磁性單元非接觸懸浮時,測量從第二磁性單元至載體之一第二距離。方法包括從至少第一距離及第二距離決定載體懸浮系統之對準。According to other embodiments, a method for determining alignment of a carrier suspension system is proposed. The magnetic levitation system includes several magnetic units, which are suitable for non-contact levitation of a carrier. These magnetic units include a first magnetic unit and a second magnetic unit. The method includes measuring a first distance from the first magnetic unit to the carrier when the carrier is suspended non-contact by at least the first magnetic unit. The method includes measuring a second distance from the second magnetic unit to the carrier when the carrier is suspended non-contact by at least the second magnetic unit. The method includes determining an alignment of the carrier suspension system from at least a first distance and a second distance.

根據其他實施例,提出一種用以決定一載體懸浮系統之一對準的方法。磁性懸浮系統包括數個磁性單元。此些磁性單元適用於非接觸懸浮一載體。此些磁性單元包括一第一磁性單元及一第二磁性單元。方法包括當載體係由一機械支撐件機械地支撐時,測量從第一磁性單元至載體之一第一距離。方法包括當載體係由機械支撐件機械地支撐時,測量從第二磁性單元至載體之一第二距離。此方法包括從至少第一距離及第二距離決定磁性懸浮系統及/或機械支撐件之一對準。According to other embodiments, a method for determining alignment of a carrier suspension system is proposed. The magnetic levitation system includes several magnetic units. These magnetic units are suitable for non-contact suspension of a carrier. These magnetic units include a first magnetic unit and a second magnetic unit. The method includes measuring a first distance from the first magnetic unit to the carrier when the carrier is mechanically supported by a mechanical support. The method includes measuring a second distance from the second magnetic unit to the carrier when the carrier is mechanically supported by a mechanical support. The method includes determining an alignment of one of the magnetic levitation system and / or the mechanical support from at least a first distance and a second distance.

根據其他實施例,提出一種設備。設備包括一載體懸浮系統,包括數個磁性單元。此些磁性單元適用於非接觸懸浮一載體。此些磁性單元包括一第一磁性單元及一第二磁性單元。設備包括一第一距離感測器。設備包括一第二距離感測器。設備包括一控制單元,連接於該第一距離感測器及該第二距離感測器。控制單元裝配以從至少一第一距離及一第二距離決定載體懸浮系統之一對準。第一距離係從第一磁性單元至載體,第二距離係從第二磁性單元至載體。為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:According to other embodiments, a device is proposed. The device includes a carrier suspension system including several magnetic units. These magnetic units are suitable for non-contact suspension of a carrier. These magnetic units include a first magnetic unit and a second magnetic unit. The device includes a first distance sensor. The device includes a second distance sensor. The device includes a control unit connected to the first distance sensor and the second distance sensor. The control unit is assembled to determine the alignment of one of the carrier suspension systems from at least a first distance and a second distance. The first distance is from the first magnetic unit to the carrier, and the second distance is from the second magnetic unit to the carrier. In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:

詳細的參照將以數種實施例達成,數種實施例的一或多個例子係繪示於圖式中。在下方圖式之說明中,相同參考編號係意指相同的元件。一般來說,僅有有關於個別實施例之相異處係進行說明。各例子係藉由說明的方式提供且不意味為一限制。再者,所說明或敘述而做為一實施例之部份之特徵可用於其他實施例或與其他實施例結合,以取得再其他實施例。此意指本說明包括此些調整及變化。Detailed reference will be made in several embodiments, one or more examples of which are shown in the drawings. In the description of the drawings below, the same reference numerals refer to the same elements. Generally, only the differences between the individual embodiments are described. The examples are provided by way of illustration and are not meant to be limiting. Furthermore, the features described or described as part of one embodiment can be used in or combined with other embodiments to obtain still other embodiments. This means that this description includes such adjustments and changes.

此處所述之數個實施例包含載體之非接觸懸浮及/或傳送,載體舉例為基板載體。本揭露通篇所使用之名稱「非接觸」可理解為載體之重量係不由機械接觸或機械力支承,但由磁力支承的意義。特別是,載體可利用磁力支承於懸浮或浮動狀態,而取代機械力。於一些應用中,在系統中之載體的懸浮期間及舉例為移動期間,載體及設備之其餘部份之間可不存有任何機械接觸。Several embodiments described herein include non-contact suspension and / or transfer of a carrier. The carrier is exemplified by a substrate carrier. The name "non-contact" used throughout this disclosure can be understood as meaning that the weight of the carrier is not supported by mechanical contact or mechanical force, but is supported by magnetic force. In particular, the carrier can be supported in a floating or floating state by magnetic force instead of mechanical force. In some applications, there is no mechanical contact between the carrier and the rest of the device during the suspension of the carrier in the system and, for example, during the movement.

相較於用以在處理系統中導引載體之機械裝置,優點係非接觸懸浮不會遭遇摩擦力而影響載體之移動的線性度及/或精密度。載體之非接觸傳送係提供載體之無摩擦移動,其中舉例為在沈積製程中相對於遮罩之載體的位置可在具有高精密度下控制及維持。再者,懸浮係提供載體之快速加速或減速及/或載體速度之精細調整。Compared with the mechanical device used to guide the carrier in the processing system, the advantage is that the non-contact suspension will not encounter friction and affect the linearity and / or precision of the carrier's movement. The non-contact conveying of the carrier provides frictionless movement of the carrier. For example, the position of the carrier relative to the mask in the sedimentation process can be controlled and maintained with high precision. Moreover, the suspension system provides fast acceleration or deceleration of the carrier and / or fine adjustment of the carrier speed.

舉例來說,在沈積製程期間,載體之非接觸懸浮或傳送係有利的,沒有粒子係在載體傳送期間因載體及設備之部件之間的機械接觸產生,設備之部件例如是機械軌道。因此,非接觸懸浮或傳送係提供沈積改善純度及均勻性之層於基板上,特別是因為粒子產生係在使用非接觸懸浮時減到最少。For example, during the deposition process, non-contact suspension or transfer of the carrier is advantageous, and no particles are generated during the transfer of the carrier due to the mechanical contact between the carrier and the components of the device, such as mechanical tracks. Therefore, the non-contact suspension or transfer system provides a layer for improving the purity and uniformity of the substrate, especially because the particle generation system is minimized when using the non-contact suspension.

根據可與此處所述其他實施例結合之數個實施例,載體可為適用於載運或支撐物體之載體。載體可定義一平面,舉例為實質上平行於基板接收表面之一平面。According to several embodiments that can be combined with other embodiments described herein, the carrier may be a carrier suitable for carrying or supporting an object. The carrier may define a plane, for example, a plane substantially parallel to the receiving surface of the substrate.

根據可與此處所述其他實施例結合之數個實施例,載體可適用於運載一個基板及/或數個基板。載體可為基板載體。舉例來說,載體可適用於運載一個大面積基板及/或數個大面積基板。According to several embodiments that can be combined with other embodiments described herein, the carrier can be adapted to carry one substrate and / or several substrates. The carrier may be a substrate carrier. For example, the carrier may be suitable for carrying one large-area substrate and / or several large-area substrates.

根據數個實施例,大面積基板或個別之載體可具有至少0.67 m2 之尺寸。尺寸可為從約0.67 m2 (0.73 m x 0.92 m – 第4.5代)至約8 m2 ,更特別是從約2 m2 至約9 m2 或甚至達12 m2 。舉例來說,大面積基板或載體可為第4.5代、第5代、第7.5代、第8.5代、或甚至是第10代。第4.5代對應於約0.67 m2 之基板(0.73 m x 0.92 m)、第5代對應於約1.4 m2 之基板(1.1 m x 1.3 m)、第7.5代對應於約4.29 m2 之基板(1.95 m x 2.2 m)、第8.5代對應於約5.7 m2 之基板(2.2 m x 2.5 m)、第10代對應於約8.7 m2 之基板(2.85 m × 3.05 m)。甚至例如是第11代及第12代之更高代及對應之基板面積可以類似之方式應用。According to several embodiments, the large-area substrate or individual carriers may have a size of at least 0.67 m 2 . Dimensions can be from about 0.67 m 2 (0.73 mx 0.92 m-4.5th generation) to about 8 m 2 , more particularly from about 2 m 2 to about 9 m 2 or even up to 12 m 2 . For example, the large-area substrate or carrier may be the 4.5th generation, the 5th generation, the 7.5th generation, the 8.5th generation, or even the 10th generation. The 4.5th generation corresponds to a substrate of approximately 0.67 m 2 (0.73 mx 0.92 m), the 5th generation corresponds to a substrate of approximately 1.4 m 2 (1.1 mx 1.3 m), and the 7.5th generation corresponds to a substrate of approximately 4.29 m 2 (1.95 mx 2.2 m), the 8.5th generation corresponds to a substrate of about 5.7 m 2 (2.2 mx 2.5 m), and the 10th generation corresponds to a substrate of about 8.7 m 2 (2.85 m × 3.05 m). Even higher generations and corresponding substrate areas such as the 11th and 12th generations can be applied in a similar manner.

如此處所使用之名稱「基板」包含實質上非撓性基板及撓性基板兩者。非撓性基板舉例為玻璃基板、晶圓、例如是藍寶石或類似者之透明水晶片、或玻璃板材。撓性基板例如是網格(web)或箔。名稱「實質上非撓性」係理解為與「撓性」有所區別。根據可與此處所述其他實施例結合之數個實施例,此處所述之數個實施例可用於顯示器PVD,也就是用於顯示器市場之大面積基板上的濺射沈積。The name "substrate" as used herein includes both substantially non-flexible substrates and flexible substrates. Examples of the non-flexible substrate are a glass substrate, a wafer, a transparent crystal wafer such as sapphire or the like, or a glass plate. The flexible substrate is, for example, a web or a foil. The name "substantially inflexible" is understood to be different from "flexible". According to several embodiments that can be combined with other embodiments described herein, the several embodiments described herein can be used for display PVD, that is, sputtering deposition on large-area substrates for the display market.

根據可與此處所述其他實施例結合之數個實施例,載體可適用於運載遮罩之載體,舉例為邊緣排除遮罩(edge exclusion mask),用以避免基板之邊緣在沈積製程中塗佈。載體可為遮罩載體。According to several embodiments that can be combined with other embodiments described herein, the carrier may be suitable for a carrier that carries a mask, such as an edge exclusion mask to prevent the edges of the substrate from being coated in the deposition process. cloth. The carrier may be a mask carrier.

根據此處所述之數個實施例之載體並非必須限定於基板載體或遮罩載體。此處所述之方法亦應用於其他形式之載體,也就是適用於運載除了舉例為基板或遮罩之外的物體或裝置之載體。The carrier according to the embodiments described herein is not necessarily limited to a substrate carrier or a mask carrier. The methods described herein are also applicable to other forms of carriers, that is, carriers suitable for carrying objects or devices other than substrates or masks, for example.

為了具體之目的,圖式係繪示成垂直定向之載體。此處所述之數個實施例係不限於垂直定向之載體。載體之其他定向可亦提供,舉例為水平定向。For specific purposes, the drawings are shown as vertically oriented carriers. The embodiments described herein are not limited to vertically oriented carriers. Other orientations of the carrier can also be provided, for example horizontal orientation.

於本揭露中,術語「實質上水平」方向可包括彼此間形成達10度或甚至達15度之小角度的方向。術語「實質上垂直」方向可包括彼此間形成小於90度之角度的方向,舉例為至少80度或至少75度。類似之考量係應用於實質上平行或垂直軸、平面、面積、定向或類似者之概念。In this disclosure, the term "substantially horizontal" direction may include directions that form a small angle of up to 10 degrees or even up to 15 degrees with each other. The term "substantially vertical" direction may include directions that form an angle of less than 90 degrees with each other, for example, at least 80 degrees or at least 75 degrees. Similar considerations apply to concepts that are substantially parallel or vertical axes, planes, areas, orientations, or the like.

此處所述之一些實施例包含「垂直方向」之概念。垂直方向係視為一方向,平行或實質上平行於沿著重力延伸之方向。垂直方向可從準確垂直度(後者以重力定義)偏移舉例為達15度之角度。Some embodiments described herein include the concept of "vertical orientation". The vertical direction is considered to be a direction that is parallel or substantially parallel to a direction extending along gravity. The vertical direction can be shifted from an exact verticality (the latter is defined by gravity) to an angle of up to 15 degrees, for example.

此處所述之數個實施例可更包含「水平方向」之概念。水平方向係理解為與垂直方向有所區別。水平方向可垂直或實質上垂直於由重力所定義之準確垂直方向。Several embodiments described herein may further include the concept of "horizontal direction". The horizontal direction is understood to be different from the vertical direction. The horizontal direction may be vertical or substantially perpendicular to the exact vertical direction defined by gravity.

此處所述之數個實施例係有關於一種用以決定載體懸浮系統之對準的方法。在提供數個實施例之詳細說明之前,為了具體之目的,首先參照第1圖。第1圖繪示根據此處所述實施例之設備100的例子。此處所述方法之數個實施例可藉由使用繪示於第1圖中之設備100來執行。此處所述之方法係不限於利用第1圖中所示之設備100執行。The embodiments described herein relate to a method for determining the alignment of a carrier suspension system. Before providing detailed descriptions of several embodiments, for specific purposes, reference is first made to FIG. 1. FIG. 1 illustrates an example of a device 100 according to the embodiment described herein. Several embodiments of the method described herein can be performed by using the apparatus 100 shown in Figure 1. The method described here is not limited to being performed using the apparatus 100 shown in FIG.

第1圖中所示之設備100包括載體110。載體110支撐基板120。載體110包括第一被動磁性單元150,舉例為鐵磁材料棒。設備100包括載體懸浮系統,載體懸浮系統包括數個磁性單元170。此些磁性單元170舉例為主動磁性單元,例如是電磁裝置、螺線管、線圈或超導體磁鐵。此些磁性單元之個別磁性單元係以參考編號175表示。載體懸浮系統在第一方向192中延伸。載體110係沿著此些磁性單元170為可移動的。第一被動磁性單元150及此些磁性單元170係裝配,以用於提供磁性懸浮力來懸浮載體110。磁性懸浮力係於第二方向194中延伸。The device 100 shown in FIG. 1 includes a carrier 110. The carrier 110 supports the substrate 120. The carrier 110 includes a first passive magnetic unit 150, for example, a rod of ferromagnetic material. The apparatus 100 includes a carrier suspension system including a plurality of magnetic units 170. Such magnetic units 170 are exemplified as active magnetic units, such as electromagnetic devices, solenoids, coils, or superconducting magnets. Individual magnetic units of these magnetic units are denoted by reference number 175. The carrier suspension system extends in a first direction 192. The carrier 110 is movable along these magnetic units 170. The first passive magnetic unit 150 and the magnetic units 170 are assembled to provide a magnetic levitation force to suspend the carrier 110. The magnetic levitation force extends in the second direction 194.

第1圖中所示之設備100可包括數個距離感測器(未繪示),設置於此些磁性單元170。距離感測器可設置於此些磁性單元170之各主動磁性單元。距離感測器可裝配,以用於在非接觸懸浮載體期間測量此些磁性單元及載體之間的距離。The device 100 shown in FIG. 1 may include a plurality of distance sensors (not shown) disposed on the magnetic units 170. The distance sensor may be disposed on each active magnetic unit of these magnetic units 170. The distance sensor can be assembled for measuring the distance between these magnetic units and the carrier during non-contact suspension of the carrier.

第1圖中所示之設備100包括磁性驅動結構180。磁性驅動結構180包括數個其他的磁性單元,舉例為主動磁性單元。磁性驅動結構之個別磁性單元係以參考編號185表示。載體110可包括第二被動磁性單元160,以與磁性驅動結構180之磁性單元交互作用。磁性驅動結構180之磁性單元舉例為沿著第一方向192驅動處理系統中之載體。舉例來說,第二被動磁性單元160可包括數個永久磁鐵,以交替極性之方式配置。生成之第二被動磁性單元160之磁場可與磁性驅動結構180之此些磁性單元交互作用,以在載體110懸浮時於第一方向192中移動載體110。The device 100 shown in FIG. 1 includes a magnetic driving structure 180. The magnetic driving structure 180 includes several other magnetic units, such as an active magnetic unit. The individual magnetic units of the magnetic drive structure are designated by reference number 185. The carrier 110 may include a second passive magnetic unit 160 to interact with the magnetic unit of the magnetic driving structure 180. The magnetic unit of the magnetic driving structure 180 is exemplified as a carrier driving the processing system along the first direction 192. For example, the second passive magnetic unit 160 may include several permanent magnets, which are arranged in an alternating polarity manner. The magnetic field of the generated second passive magnetic unit 160 may interact with these magnetic units of the magnetic driving structure 180 to move the carrier 110 in the first direction 192 when the carrier 110 is suspended.

第1圖中所示之設備100包括機械支撐件140,舉例為數個滾軸、固定軸承(retainer bearings)或應急軸承(emergency bearings)。機械支撐件140係設置於懸浮之載體之下方。機械支撐件140係固定於磁性驅動結構180。磁性支撐件140可適用於在載體懸浮系統懸浮載體110之失效情況中抓取載體110。舉例來說,在塗佈製程或其他製程中,載體110可藉由此些磁性單元170來磁性懸浮。在舉例為因為失去功率而懸浮載體110係突然中斷的情況中,載體110在最糟的情況中可能停止磁性懸浮及掉落。根據此處所述之數個實施例,載體110可落於機械支撐件上。機械支撐件可抓取載體及避免損害載體或系統之其他部份。The device 100 shown in FIG. 1 includes a mechanical support 140, such as a plurality of rollers, retainer bearings or emergency bearings. The mechanical support 140 is disposed below the suspended carrier. The mechanical support 140 is fixed to the magnetic driving structure 180. The magnetic support 140 can be adapted to grasp the carrier 110 in the case of failure of the carrier suspension system to suspend the carrier 110. For example, in the coating process or other processes, the carrier 110 may be magnetically suspended by the magnetic units 170. In the case where the suspended carrier 110 is suddenly interrupted due to loss of power, the carrier 110 may stop magnetic suspension and fall in the worst case. According to several embodiments described herein, the carrier 110 may fall on a mechanical support. The mechanical support can grab the carrier and avoid damage to the carrier or other parts of the system.

繪示於第1圖中之設備可包括沈積源(未繪示)。沈積源可配置而用於塗佈由懸浮之載體110支撐的基板,舉例為垂直配置之基板。在塗佈製程期間,非接觸懸浮之載體110可藉由磁性驅動結構180在第一方向192中移動。The apparatus shown in FIG. 1 may include a deposition source (not shown). The deposition source may be configured to coat a substrate supported by the suspended carrier 110, for example, a substrate disposed vertically. During the coating process, the non-contact suspended carrier 110 can be moved in the first direction 192 by the magnetic driving structure 180.

設備100包括控制單元130。控制單元130可連接於此些磁性單元170及/或距離感測器。控制單元130可裝配以用於控制載體110之磁性懸浮。控制單元130可裝配,以舉例為基於供應至控制單元130之距離感測器測量的測量距離,在載體110懸浮期間用於控制載體110及此些磁性單元170之間的距離。在控制單元130的控制之下,磁性驅動結構180可驅動載體110。The device 100 includes a control unit 130. The control unit 130 may be connected to the magnetic units 170 and / or the distance sensor. The control unit 130 can be equipped for controlling the magnetic suspension of the carrier 110. The control unit 130 can be assembled, for example, to control the distance between the carrier 110 and the magnetic units 170 during the suspension of the carrier 110 based on the measurement distance measured by the distance sensor supplied to the control unit 130. Under the control of the control unit 130, the magnetic driving structure 180 can drive the carrier 110.

根據可與此處所述其他實施例結合之數個實施例,控制單元可包括數個控制器,舉例為數個區域控制器(local controllers)。此些控制器之各控制器可連接於及/或設置於此些磁性單元170之個別磁性單元。此些控制器之一控制器可裝配,以舉例為基於設置在磁性單元之距離感測器測量之測量距離,且測量距離供應至控制器,在懸浮載體110期間用於控制載體110及磁性單元之間的距離。According to several embodiments that can be combined with other embodiments described herein, the control unit may include several controllers, such as several local controllers. Each of the controllers may be connected to and / or provided with an individual magnetic unit of the magnetic units 170. One of these controllers can be assembled, for example, based on the measurement distance measured by a distance sensor provided on the magnetic unit, and the measurement distance is supplied to the controller for controlling the carrier 110 and the magnetic unit during the suspension of the carrier 110 the distance between.

此處所述之數個實施例係提供一種方法,用以決定載體懸浮系統之對準。載體懸浮系統包括數個磁性單元170。此處所述之數個實施例更提供決定機械支撐件140及磁性驅動結構180之對準。此方法之數個實施例可藉由控制單元130或藉由設備之其他控制單元執行。The embodiments described herein provide a method for determining the alignment of a carrier suspension system. The carrier suspension system includes several magnetic units 170. Several embodiments described herein further provide for determining the alignment of the mechanical support 140 and the magnetic drive structure 180. Several embodiments of this method may be performed by the control unit 130 or by other control units of the device.

第2a-b圖繪示根據此處所述實施例之適用於非接觸懸浮載體110之數個磁性單元170的示意圖。第2a-b圖繪示磁性驅動結構180。磁性驅動結構180包括數個其他的磁性單元,用以在載體傳送方向中驅動載體110。此些磁性單元170係配置於第一方向192中。磁性驅動結構180係配置於第一方向192中。此些磁性單元170及磁性驅動結構180之及此些其他之磁性單元係繪示成矩形。以虛線繪示之載體110可藉由此些磁性單元170非接觸懸浮及/或傳送。Figures 2a-b are schematic diagrams of several magnetic units 170 suitable for the non-contact suspension carrier 110 according to the embodiments described herein. 2a-b illustrate the magnetic driving structure 180. The magnetic driving structure 180 includes several other magnetic units for driving the carrier 110 in the carrier conveying direction. The magnetic units 170 are disposed in the first direction 192. The magnetic driving structure 180 is disposed in the first direction 192. The magnetic units 170 and the magnetic driving structure 180 and the other magnetic units are shown as rectangles. The carrier 110 shown in dashed lines can be suspended and / or transferred by the magnetic units 170 in a non-contact manner.

繪示於第2a圖中之此些磁性單元170之磁性單元係良好地對準。繪示於第2a圖中之磁性驅動結構180的磁性單元係良好地對準。舉例來說,表示此些磁性單元170的矩形全部具有相同角定向及各矩形之底部邊緣係與第一參考線212對準。第一參考線212於第一方向192中延伸。第一參考線212表示用於此些磁性單元170之目標對準。表示磁性驅動結構180之此些磁性單元之矩形全部具有相同之角定向及各矩形之頂部邊緣對準於第二參考線222。第二參考線222於第一方向192中延伸。第二參考線222表示用於磁性驅動結構之目標對準。The magnetic units of the magnetic units 170 shown in Figure 2a are well aligned. The magnetic units of the magnetic driving structure 180 shown in Figure 2a are well aligned. For example, the rectangles representing the magnetic units 170 all have the same angular orientation and the bottom edge of each rectangle is aligned with the first reference line 212. The first reference line 212 extends in a first direction 192. The first reference line 212 indicates the target alignment for such magnetic units 170. The rectangles representing the magnetic units of the magnetic driving structure 180 all have the same angular orientation and the top edge of each rectangle is aligned with the second reference line 222. The second reference line 222 extends in the first direction 192. The second reference line 222 indicates the target alignment for the magnetic drive structure.

第2b圖中所示之此些磁性單元170及磁性驅動結構180係呈現出未對準(misalignment)。如圖所示,其中部份之此些磁性單元170的底部邊緣係沒有對準於第一參考線212,但位在相對於第一參考線212之一角度處及/或與第一參考線212相隔一距離。磁性驅動結構180之一些磁性單元的頂部邊緣係沒有對準於第二參考線222,但位在相對於第二參考線222之一角度處及/或與第二參考線222相隔一距離。第2b圖中所示之未對準係以誇大的方式繪示,以較易於了解。The magnetic units 170 and the magnetic driving structure 180 shown in FIG. 2b are misaligned. As shown in the figure, the bottom edges of some of these magnetic units 170 are not aligned with the first reference line 212, but are located at an angle with respect to the first reference line 212 and / or with the first reference line 212 are separated by a distance. The top edges of some of the magnetic units of the magnetic driving structure 180 are not aligned with the second reference line 222 but are located at an angle relative to the second reference line 222 and / or spaced apart from the second reference line 222 by a distance. The misalignment shown in Figure 2b is illustrated in an exaggerated manner for easier understanding.

為了根據此處所述之數個實施例決定載體懸浮系統之對準,利用雷射追蹤儀(laser trackers)或精密量規(precision scales)之測量可使用。此些測量可為複雜且耗費時間。利用此些方法可能難以到達用以收集關於磁性單元之位置所需資料的測量點。In order to determine the alignment of the carrier suspension system according to several embodiments described herein, measurements using laser trackers or precision scales can be used. Such measurements can be complex and time consuming. With these methods, it may be difficult to reach the measurement points used to collect the information required for the location of the magnetic unit.

第3a-b圖繪示根據此處所述實施例之用以決定載體懸浮系統之對準的方法之示意圖。Figures 3a-b are schematic diagrams illustrating a method for determining the alignment of a carrier suspension system according to the embodiments described herein.

第3a-b圖繪示出載體110。載體110可舉例為適用支撐基板或遮罩。其他形式之載體可亦考慮。繪示於第3a-b圖中之設備包括載體懸浮系統,載體懸浮系統包括數個磁性單元170。Figures 3a-b show the carrier 110. The carrier 110 may be, for example, a suitable supporting substrate or a mask. Other forms of carriers may also be considered. The equipment shown in Figures 3a-b includes a carrier suspension system, and the carrier suspension system includes a plurality of magnetic units 170.

根據可與此處所述其他實施例結合之數個實施例,載體懸浮系統可適用於非接觸懸浮及/或傳送載體110。載體懸浮系統可適用於在第一方向192中傳送載體110。According to several embodiments that may be combined with other embodiments described herein, the carrier suspension system may be adapted for non-contact suspension and / or transport of the carrier 110. The carrier suspension system may be adapted to transport the carrier 110 in the first direction 192.

此些磁性單元170包括第一磁性單元312及第二磁性單元314。於一些實施例中,此些磁性單元170可包括其他磁性單元,舉例為以虛線繪示之磁性單元316。此些磁性單元170可配置於第一方向192中。此些磁性單元170係適用於配置在第一方向192中。此些磁性單元170係適用於非接觸懸浮載體110。The magnetic units 170 include a first magnetic unit 312 and a second magnetic unit 314. In some embodiments, the magnetic units 170 may include other magnetic units, such as the magnetic unit 316 shown in dashed lines. These magnetic units 170 may be disposed in the first direction 192. The magnetic units 170 are suitable for being disposed in the first direction 192. These magnetic units 170 are suitable for the non-contact suspension carrier 110.

如第3a-b圖中所示,從第一磁性單元312至載體110之第一距離322係測量。第一距離322可藉由第一距離感測器(未繪示)測量,第一距離感測器設置於第一磁性單元312。從第二磁性單元314至載體110之第二距離324可測量。第二距離324可藉由第二距離感測器(未繪示)測量,第二距離感測器設置於第二磁性單元314。從此些磁性單元170至載體110之一或多個其他距離可測量。從第三磁性單元至載體110之第三距離可測量,第三磁性單元舉例為其中一個磁性單元316。第三距離可藉由第三距離感測器測量,第三距離感測器設置於第三磁性單元。從此些磁性單元170之第四磁性單元至載體110之第四距離可測量。第四距離可由第四距離感測器測量,第四距離感測器設置於第四磁性單元。甚至從此些磁性單元170至載體110之其他距離可測量。As shown in Figures 3a-b, the first distance 322 from the first magnetic unit 312 to the carrier 110 is measured. The first distance 322 can be measured by a first distance sensor (not shown), and the first distance sensor is disposed on the first magnetic unit 312. A second distance 324 from the second magnetic unit 314 to the carrier 110 is measurable. The second distance 324 can be measured by a second distance sensor (not shown), and the second distance sensor is disposed on the second magnetic unit 314. One or more other distances from these magnetic units 170 to the carrier 110 are measurable. The third distance from the third magnetic unit to the carrier 110 is measurable. The third magnetic unit is exemplified by one of the magnetic units 316. The third distance can be measured by a third distance sensor, and the third distance sensor is disposed on the third magnetic unit. A fourth distance from the fourth magnetic unit 170 of these magnetic units 170 to the carrier 110 can be measured. The fourth distance can be measured by a fourth distance sensor, and the fourth distance sensor is disposed on the fourth magnetic unit. Even other distances from these magnetic units 170 to the carrier 110 can be measured.

於第3a圖中所示之範例性實施例中,第一距離322及第二距離324係在載體為磁性懸浮之狀態中時進行測量。第3a圖中所繪示之載體110係由載體懸浮系統非接觸懸浮,如向上箭頭390所示。載體110及設備之其他部件之間係沒有機械接觸,設備之其他部件舉例為機械支撐件140。第3a圖中所繪示之載體110並非機械地支撐。In the exemplary embodiment shown in Figure 3a, the first distance 322 and the second distance 324 are measured when the carrier is magnetically suspended. The carrier 110 shown in FIG. 3a is non-contact suspended by the carrier suspension system, as shown by an upward arrow 390. There is no mechanical contact between the carrier 110 and other components of the device. The other components of the device are, for example, mechanical supports 140. The carrier 110 shown in FIG. 3a is not mechanically supported.

如第3a圖中所示,第一距離322及第二距離324可在載體110藉由第一磁性單元312及第二磁性單元314磁性懸浮時進行測量。在第3a圖中所示之範例性實施例中,載體110係由第一磁性單元312及第二磁性單元314共同地非接觸懸浮。於其他實施例中,舉例為根據所考慮之應用,載體110可藉由單一磁性單元或藉由此些磁性單元170之多於兩個磁性單元來非接觸懸浮。As shown in FIG. 3a, the first distance 322 and the second distance 324 can be measured when the carrier 110 is magnetically suspended by the first magnetic unit 312 and the second magnetic unit 314. In the exemplary embodiment shown in FIG. 3a, the carrier 110 is non-contactly suspended by the first magnetic unit 312 and the second magnetic unit 314. In other embodiments, for example, according to the application under consideration, the carrier 110 may be non-contact suspended by a single magnetic unit or by more than two magnetic units from these magnetic units 170.

載體110係不需在磁性懸浮狀態中來測量第一距離322及第二距離324。舉例來說,如第3b圖中所示,第一距離322及第二距離324可在載體110為機械地支撐時進行測量。The carrier 110 does not need to measure the first distance 322 and the second distance 324 in a magnetically suspended state. For example, as shown in FIG. 3b, the first distance 322 and the second distance 324 can be measured when the carrier 110 is mechanically supported.

第3b圖中所繪示之設備包括機械支撐件140。機械支撐件140可包括數個支撐元件142。第3b圖中所繪示之載體110係由機械支撐件140機械地支撐。繪示於第3b圖中之載體110係不在非接觸懸浮狀態中。在第3b圖中所示之範例性實施例中,第一距離322及第二距離324係在載體110由機械支撐件140支撐時進行測量。The device shown in FIG. 3b includes a mechanical support 140. The mechanical support 140 may include several support elements 142. The carrier 110 shown in FIG. 3b is mechanically supported by the mechanical support 140. The carrier 110 shown in FIG. 3b is not in a non-contact suspension state. In the exemplary embodiment shown in FIG. 3b, the first distance 322 and the second distance 324 are measured when the carrier 110 is supported by the mechanical support 140.

第一距離322及第二距離324,及根據此處所述數個實施例測量之從此些磁性單元170至載體110之任何其他距離係提供有關於此些磁性單元170之對準的資訊。舉例來說,如果第一距離322係實質上相同於第二距離324,第一磁性單元312及第二磁性單元314良好地對準係決定,舉例為如第2a圖中所示。如果第一距離322係實質上不同於第二距離324,未對準之情況可能存在,舉例為如第2b圖中所示。利用測量之距離,可能之未對準可偵測出來。The first distance 322 and the second distance 324, and any other distances from the magnetic units 170 to the carrier 110 measured according to several embodiments described herein, provide information about the alignment of the magnetic units 170. For example, if the first distance 322 is substantially the same as the second distance 324, the first magnetic unit 312 and the second magnetic unit 314 are well aligned, as shown in FIG. 2a. If the first distance 322 is substantially different from the second distance 324, misalignment may exist, for example, as shown in FIG. 2b. Using the measured distance, possible misalignment can be detected.

有鑑於上述,提出用以決定載體懸浮系統之對準的方法。載體懸浮系統包括數個磁性單元170。此些磁性單元170適用於非接觸懸浮載體110。此些磁性單元170包括第一磁性單元312及第二磁性單元314。此方法包括測量從第一磁性單元312至載體110之第一距離322。此方法包括測量從第二磁性單元314至載體110之第二距離324。此方法包括自至少第一距離322及第二距離324決定載體懸浮系統之對準。In view of the above, a method for determining the alignment of a carrier suspension system is proposed. The carrier suspension system includes several magnetic units 170. Such magnetic units 170 are suitable for the non-contact suspension carrier 110. The magnetic units 170 include a first magnetic unit 312 and a second magnetic unit 314. The method includes measuring a first distance 322 from the first magnetic unit 312 to the carrier 110. The method includes measuring a second distance 324 from the second magnetic unit 314 to the carrier 110. The method includes determining the alignment of the carrier suspension system from at least a first distance 322 and a second distance 324.

舉例來說,方法可根據有關於第3a-b圖之此處所述實施例來執行。根據可與此處所述其他實施例結合之數個實施例,方法可包括藉由載體懸浮系統非接觸懸浮載體110。第一距離322及第二距離324可在載體110非接觸懸浮時進行測量。方法可替代地或額外地包括藉由機械支撐件140機械地支撐載體。第一距離322及第二距離324可在載體機械地支撐時進行測量。For example, the method may be performed according to the embodiments described herein with respect to Figures 3a-b. According to several embodiments that can be combined with other embodiments described herein, the method may include non-contact suspending the carrier 110 by a carrier suspension system. The first distance 322 and the second distance 324 can be measured when the carrier 110 is in non-contact suspension. The method may alternatively or additionally include mechanically supporting the carrier by a mechanical support 140. The first distance 322 and the second distance 324 can be measured while the carrier is mechanically supported.

根據其他實施例,提出用以決定載體懸浮系統之對準的方法。載體懸浮系統包括數個磁性單元170。此些磁性單元170適用於磁性懸浮載體110。此些磁性單元170包括第一磁性單元312及第二磁性單元314。此方法可包括藉由此些磁性單元170之一或多個磁性單元非接觸懸浮載體110。此方法包括在載體由至少第一磁性單元312非接觸懸浮時測量從第一磁性單元312至載體110之第一距離322。此方法包括在載體由至少第二磁性單元314非接觸懸浮時測量從第二磁性單元314至載體110之第二距離324。此方法包括自至少第一距離322及第二距離324決定載體懸浮系統之對準。According to other embodiments, a method for determining the alignment of a carrier suspension system is proposed. The carrier suspension system includes several magnetic units 170. Such magnetic units 170 are suitable for the magnetic suspension carrier 110. The magnetic units 170 include a first magnetic unit 312 and a second magnetic unit 314. The method may include non-contact suspending the carrier 110 by one or more of the magnetic units 170. The method includes measuring a first distance 322 from the first magnetic unit 312 to the carrier 110 when the carrier is non-contact suspended by at least the first magnetic unit 312. This method includes measuring a second distance 324 from the second magnetic unit 314 to the carrier 110 when the carrier is non-contact suspended by at least the second magnetic unit 314. The method includes determining the alignment of the carrier suspension system from at least a first distance 322 and a second distance 324.

根據其他實施例,提出用以決定載體懸浮系統之對準的方法。載體懸浮系統包括數個磁性單元170。此些磁性單元170適用於磁性懸浮載體110。此些磁性單元170包括第一磁性單元312及第二磁性單元314。此方法可包括藉由機械支撐件140機械地支撐載體110。此方法包括在載體110由機械支撐件140機械地支撐時測量從第一磁性單元312至載體110之第一距離322。此方法包括在載體110由機械支撐件140機械地支撐時測量從第二磁性單元314至載體110之第二距離324。此方法包括自至少第一距離322及第二距離324決定機械支撐件140及/或載體懸浮系統之對準。According to other embodiments, a method for determining the alignment of a carrier suspension system is proposed. The carrier suspension system includes several magnetic units 170. Such magnetic units 170 are suitable for the magnetic suspension carrier 110. The magnetic units 170 include a first magnetic unit 312 and a second magnetic unit 314. This method may include mechanically supporting the carrier 110 by a mechanical support 140. The method includes measuring a first distance 322 from the first magnetic unit 312 to the carrier 110 while the carrier 110 is mechanically supported by the mechanical support 140. This method includes measuring a second distance 324 from the second magnetic unit 314 to the carrier 110 while the carrier 110 is mechanically supported by the mechanical support 140. The method includes determining the alignment of the mechanical support 140 and / or the carrier suspension system from at least a first distance 322 and a second distance 324.

此處所述之數個實施例包含利用載體本身來決定載體懸浮系統及/或機械支撐件之對準。Several embodiments described herein include using the carrier itself to determine the alignment of the carrier suspension system and / or mechanical support.

優點係不需要例如是雷射追蹤儀、反射器或傾斜感測器(inclination sensors)之額外裝置來測量對準。相較於例如是利用雷射測量之其他方法,此處所述之方法係提供簡單及有效率的方法,而較不複雜及不耗費時間。The advantage is that no additional devices such as laser trackers, reflectors or inclination sensors are needed to measure the alignment. Compared to other methods such as using laser measurement, the method described here provides a simple and efficient method without being complicated and time consuming.

從磁性單元至載體110之距離可利用距離感測器測量。舉例來說,距離感測器可設置於此些磁性單元170中或位於此些磁性單元170,用以協助控制由設備執行的磁性懸浮程序。相同之距離感測器可亦使用於測量舉例為根據此處所述數個實施例之第一距離322及第二距離324。於一些情況中,除了已經存在於系統中來控制非接觸懸浮之距離感測器之外,沒有額外的距離感測器可能需用以決定此些磁性單元170之對準。根據可與此處所述其他實施例結合之數個實施例,第一距離322可由第一距離感測器測量,第一距離感測器設置於第一磁性單元312。 第二距離324可由第二距離感測器測量,第二距離感測器位於第二磁性單元314。方法可包括利用第一距離感測器及/或第二距離感測器來控制載體110或其他載體之非接觸懸浮。The distance from the magnetic unit to the carrier 110 can be measured using a distance sensor. For example, the distance sensor may be disposed in or located in the magnetic units 170 to assist in controlling the magnetic levitation process performed by the device. The same distance sensor can also be used in measurement examples such as the first distance 322 and the second distance 324 according to several embodiments described herein. In some cases, no additional distance sensor may be needed to determine the alignment of these magnetic units 170 other than the distance sensors already present in the system to control non-contact hovering. According to several embodiments that can be combined with other embodiments described herein, the first distance 322 can be measured by a first distance sensor, and the first distance sensor is disposed on the first magnetic unit 312. The second distance 324 can be measured by a second distance sensor, and the second distance sensor is located on the second magnetic unit 314. The method may include using the first distance sensor and / or the second distance sensor to control the non-contact suspension of the carrier 110 or other carriers.

既然此處所述之方法係易於執行,此方法可定期地執行,以確保磁性單元較長時期良好地對準。在執行第一次對準之後,磁性單元之對準在某一時間點可能惡化。舉例為有鑑於系統之元件經過一段時間相對於彼此小移動,此惡化係可能發生。系統之元件經過一段時間相對於彼此小移動舉例為因為不同製程循環中反覆地開啟及關閉真空。舉例為有鑑於在非接觸懸浮期間從載體至磁性單元的距離係非常小,例如是舉例為從1至8 mm,更特別是從1至4 mm,舉例為從2至3 mm,元件之此種小移動可能影響磁性單元之對準。定期地提供磁性單元之高精密度之對準係有利的。此處所述之簡單及有效率的方法係提供此種做法。基於舉例為雷射追蹤儀之其他方法係複雜且難以理解,使得頻繁地執行此些方法係不利的。Since the method described here is easy to implement, this method can be performed periodically to ensure that the magnetic units are well aligned for a longer period of time. After performing the first alignment, the alignment of the magnetic unit may deteriorate at a certain point in time. As an example, this deterioration may occur in view of the small movement of the elements of the system relative to each other over a period of time. The small movement of the components of the system relative to each other over time is exemplified by the vacuum being turned on and off repeatedly in different process cycles. For example, in view of the very small distance from the carrier to the magnetic unit during non-contact suspension, for example from 1 to 8 mm, more particularly from 1 to 4 mm, and from 2 to 3 mm, for example, This small movement may affect the alignment of the magnetic unit. It is advantageous to regularly provide a high-precision alignment of the magnetic unit. The simple and efficient method described here provides this approach. Other methods based on examples of laser trackers are complex and difficult to understand, making frequent execution of such methods disadvantageous.

藉由根據此處所述之數個實施例決定對準,舉例為如第2b圖中所示之未對準可避免。在良好地對準磁性單元之下,可確保非接觸懸浮及傳送載體的良好操作,且可避免未對準之磁性單元的不利效應。舉例來說,此些不利效應可包括懸浮之載體與未對準之載體的碰撞(有鑑於懸浮之載體及載體懸浮系統之間的小距離),而可能致使粒子產生或損害載體或磁性單元。未對準之磁性單元的其他不利效應包括在磁性懸浮製程之控制中的飽和效應(saturation effects),而在最糟情況中可能導致懸浮之載體掉落。此處所述之數個實施例確保載體在非接觸懸浮期間精準定位係提供。By deciding alignment according to several embodiments described herein, for example, misalignment can be avoided as shown in Figure 2b. Under the good alignment of the magnetic unit, it can ensure the good operation of non-contact suspension and transfer carrier, and can avoid the adverse effects of the misaligned magnetic unit. For example, such adverse effects may include collisions of suspended carriers with misaligned carriers (in view of the small distance between suspended carriers and carrier suspension systems), which may cause particles to generate or damage the carrier or magnetic unit. Other adverse effects of misaligned magnetic units include saturation effects in the control of the magnetic levitation process, and in the worst case may cause the suspended carrier to fall. Several embodiments described herein ensure that precise positioning of the carrier during non-contact suspension is provided.

其他優點係包含在載體110機械地支撐時測量從磁性單元至載體110之距離的實施例係提供決定機械支撐件140相對於此些磁性單元170之對準。機械支撐件140舉例為數個固定軸承,可機械地連接於磁性驅動結構180,舉例為固定於磁性驅動結構180。舉例來說,機械支撐件140之支撐元件可固定於磁性驅動結構180。有鑑於機械支撐件140及磁性驅動結構180之間的機械連接,決定機械支撐件140之對準可提供決定磁性驅動結構180之磁性單元的對準。此處所述之數個實施例係提供決定包含於設備中之載體的非接觸懸浮及傳送之所有元件的相對對準。Other advantages include embodiments in which the distance from the magnetic unit to the carrier 110 is measured while the carrier 110 is mechanically supported, which provides a determination of the alignment of the mechanical support 140 relative to these magnetic units 170. The mechanical support 140 is, for example, a plurality of fixed bearings, which can be mechanically connected to the magnetic driving structure 180, and is exemplarily fixed to the magnetic driving structure 180. For example, the supporting element of the mechanical support 140 may be fixed to the magnetic driving structure 180. In view of the mechanical connection between the mechanical support 140 and the magnetic drive structure 180, determining the alignment of the mechanical support 140 can provide the alignment of the magnetic units of the magnetic drive structure 180. The several embodiments described herein provide the relative alignment of all components that determine the non-contact suspension and transfer of the carrier contained in the device.

包含在載體110機械地支撐時測量從磁性單元至載體110之距離的實施例係更提供優點,此些實施例可甚至在磁性單元之實質上未對準的情況中執行。在此種情況中,在載體110非接觸懸浮時,測量第一距離322及第二距離324可能是困難的。舉例來說,在實質上未對準之情況中,因懸浮控制電路之飽和效應而可能致使非接觸懸浮載體為不可行的。甚至在磁性單元之相當程度的未對準的情況中,包含在載體機械地支撐時測量第一距離322及第二距離324之實施例可執行。Embodiments that include measuring the distance from the magnetic unit to the carrier 110 while the carrier 110 is mechanically supported provide even more advantages, such embodiments can be performed even in the case where the magnetic unit is substantially misaligned. In this case, it may be difficult to measure the first distance 322 and the second distance 324 when the carrier 110 is in non-contact suspension. For example, in the case of substantial misalignment, the non-contact suspension carrier may be rendered infeasible due to the saturation effect of the suspension control circuit. Even in the case of a considerable degree of misalignment of the magnetic unit, embodiments involving measuring the first distance 322 and the second distance 324 while the carrier is mechanically supported may be performed.

其他優點係此處所述之方法可在真空條件下執行。後者係在一些其他方法中無法實行,舉例為基於雷射測量或傾斜感測器之方法。在真空下測量第一距離322及第二距離324之優點係在真空條件下產生的效應可列入考量來決定載體懸浮系統及/或機械支撐件之對準。在真空條件下產生的效應例如是舉例為磁性單元或系統之其他元件的變形。也就是說,對準可在真空處理舉例為由磁性單元所懸浮之載體中的基板時存在的相同製程條件下決定。Other advantages are that the methods described herein can be performed under vacuum. The latter is not possible in some other methods, such as methods based on laser measurement or tilt sensor. The advantage of measuring the first distance 322 and the second distance 324 under vacuum is that the effects produced under vacuum conditions can be considered to determine the alignment of the carrier suspension system and / or the mechanical support. The effects produced under vacuum conditions are, for example, deformations of magnetic units or other elements of the system. That is, the alignment can be determined under the same process conditions that exist when vacuum processing a substrate in a carrier suspended by a magnetic unit, for example.

根據可與此處所述其他實施例結合之數個實施例,第一距離322、第二距離324及/或根據此處所述數個實施例之從載體至磁性單元的任何其他距離可在真空條件下進行測量。距離可在真空係供應於包含載體的處理腔室中時進行測量。名稱「真空」可理解為具有少於舉例為10 mbar之真空壓力之技術真空的含義。根據此處所述之數個實施例的設備可包括一或多個真空幫浦,例如是渦輪幫浦及/或冷凍幫浦,連接於真空腔室來在真空腔室之內側產生真空。According to several embodiments that may be combined with other embodiments described herein, the first distance 322, the second distance 324, and / or any other distance from the carrier to the magnetic unit according to the embodiments described herein may be at Measure under vacuum. The distance can be measured when the vacuum system is supplied in a processing chamber containing a carrier. The name "vacuum" can be understood as meaning a technical vacuum with a vacuum pressure of less than 10 mbar, for example. The apparatus according to several embodiments described herein may include one or more vacuum pumps, such as turbine pumps and / or cryopumps, connected to the vacuum chamber to generate a vacuum inside the vacuum chamber.

此處所述之數個實施例係包含決定載體懸浮系統的對準。決定載體懸浮系統的對準可包含比較一磁性單元之測量位置與一或多個其他的磁性單元之測量位置,或比較一磁性單元之測量位置與一或多個參考位置。Several embodiments described herein include determining the alignment of the carrier suspension system. Determining the alignment of the carrier suspension system may include comparing the measurement position of a magnetic unit with the measurement positions of one or more other magnetic units, or comparing the measurement position of a magnetic unit with one or more reference positions.

根據可與此處所述其他實施例結合之數個實施例,決定載體懸浮系統之對準可包括下述之至少一者:決定此些磁性單元170之二或多個磁性單元之相對對準;決定第一磁性單元312相對於第二磁性單元314之相對對準;決定第一磁性單元312相對於此些磁性單元170之其他的磁性單元之相對對準;決定第二磁性單元314相對於此些磁性單元170之其他的磁性單元之相對對準;決定第一磁性單元312、第二磁性單元314、或此些磁性單元170之任何其他的磁性單元相對於一或多個參考位置的對準;及比較第一距離322、第二距離324及/或從磁性單元至載體110之任何其他距離與參考距離。According to several embodiments that can be combined with other embodiments described herein, determining the alignment of the carrier suspension system may include at least one of the following: determining the relative alignment of two or more of these magnetic units 170 ; Determine the relative alignment of the first magnetic unit 312 with respect to the second magnetic unit 314; determine the relative alignment of the first magnetic unit 312 with respect to other magnetic units of these magnetic units 170; determine the relative alignment of the second magnetic unit 314 with respect to The relative alignment of other magnetic units of these magnetic units 170; determines the alignment of the first magnetic unit 312, the second magnetic unit 314, or any other magnetic unit of these magnetic units 170 with respect to one or more reference positions And compare the first distance 322, the second distance 324, and / or any other distance from the magnetic unit to the carrier 110 with the reference distance.

根據可與此處所述其他實施例結合之數個實施例,決定載體懸浮系統之對準可包括從至少第一距離322及第二距離324計算參考值來用於從載體110至此些磁性單元170之一磁性單元之距離。參考值可由平均操作計算。參考值可由平均此些磁性單元至載體之二或多個測量距離來計算。舉例來說,參考值可藉由平均至少第一距離及第二距離來計算。According to several embodiments that can be combined with other embodiments described herein, determining the alignment of the carrier suspension system may include calculating reference values from at least a first distance 322 and a second distance 324 for use from the carrier 110 to the magnetic units 170 is the distance of one magnetic unit. The reference value can be calculated by the averaging operation. The reference value can be calculated by averaging two or more measurement distances of these magnetic units to the carrier. For example, the reference value may be calculated by averaging at least a first distance and a second distance.

根據可與此處所述其他實施例結合之數個實施例,決定載體懸浮系統之對準可包括比較第一距離322、第二距離324、及選擇之第三距離及/或任何其他測量距離與計算之參考值。藉由比較測量距離與計算之參考值,磁性單元是否良好地對準可決定出來,及在可能有未對準的情況中個別之偏差為多少可決定出來。According to several embodiments that can be combined with other embodiments described herein, determining the alignment of the carrier suspension system may include comparing the first distance 322, the second distance 324, and the selected third distance and / or any other measurement distance And calculated reference value. By comparing the measured distance with the calculated reference value, it can be determined whether the magnetic unit is well aligned, and how much the individual deviation is in the case of possible misalignment.

載體懸浮系統之未對準可以數種可行的方式校正。舉例來說,第一磁性單元312及/或第二磁性單元314之位置可機械地調整來對準此些磁性單元170。根據可與此處所述其他實施例結合之數個實施例,此方法可包括對載體懸浮系統及/或對磁性驅動結構執行對準操作。對準操作可為機械對準操作。對載體懸浮系統之對準操作可包括至少部份基於決定的對準來調整載體懸浮系統之此些磁性單元之至少一磁性單元的位置。對磁性驅動結構之對準操作可包括至少部份基於決定之對準來調整磁性驅動結構之此些磁性單元之至少一磁性單元的位置。Misalignment of the carrier suspension system can be corrected in several feasible ways. For example, the positions of the first magnetic unit 312 and / or the second magnetic unit 314 can be mechanically adjusted to align the magnetic units 170. According to several embodiments that may be combined with other embodiments described herein, this method may include performing an alignment operation on a carrier suspension system and / or a magnetic drive structure. The alignment operation may be a mechanical alignment operation. The alignment operation on the carrier suspension system may include adjusting a position of at least one magnetic unit of the magnetic units of the carrier suspension system based at least in part on the determined alignment. The alignment operation on the magnetic drive structure may include adjusting a position of at least one magnetic unit of the magnetic units of the magnetic drive structure based at least in part on the determined alignment.

舉例來說,一或多個磁性單元之位置可調整,使得在調整之後的磁性單元係分別與第一參考線212或第二參考線222對準,如第2a圖中所示。For example, the position of the one or more magnetic units can be adjusted so that the adjusted magnetic units are aligned with the first reference line 212 or the second reference line 222, respectively, as shown in FIG. 2a.

在替代之例子中,磁性單元之位置可不改變。在接續的載體之非接觸懸浮或傳送中,舉例為在第一距離322及第二距離324已經測量之後發生之塗佈製程中,載體懸浮系統的控制可把第一距離322及第二距離324之測量值列入考量,以補償偵測之未對準。舉例來說,根據第一距離322及第二距離324之測量值,控制單元可在接續懸浮程序中個別地控制從個別之磁性單元至懸浮之載體的距離,以補償偵測之未對準。In an alternative example, the position of the magnetic unit may not change. In the non-contact suspension or transfer of successive carriers, for example, in the coating process that occurs after the first distance 322 and the second distance 324 have been measured, the control of the carrier suspension system can control the first distance 322 and the second distance 324 The measured values are taken into consideration to compensate for misalignment detected. For example, according to the measured values of the first distance 322 and the second distance 324, the control unit can individually control the distance from the individual magnetic unit to the suspended carrier in the subsequent suspension process to compensate for the detected misalignment.

根據可與此處所述其他實施例結合之其他實施例,此方法可包括藉由此些磁性單元非接觸懸浮載體或其他載體。方法可包括至少部份基於決定之對準來控制第一懸浮距離及第二懸浮距離。第一懸浮距離可為從第一磁性單元至非接觸懸浮之載體的距離,非接觸懸浮之載體舉例為載體110或其他載體。第二懸浮距離可為從第二磁性單元至非接觸懸浮之載體的距離。控制可包括個別地控制第一懸浮距離及第二懸浮距離。控制可包括設定用於第一懸浮距離之第一目標值及設定用於第二懸浮距離之第二目標距離。第一目標值可不同於第二目標值。According to other embodiments that can be combined with other embodiments described herein, the method may include non-contact suspending the carrier or other carriers by the magnetic units. The method may include controlling the first levitating distance and the second levitating distance based at least in part on the determined alignment. The first suspension distance may be the distance from the first magnetic unit to the non-contact suspension carrier. Examples of the non-contact suspension carrier are the carrier 110 or other carriers. The second suspension distance may be a distance from the second magnetic unit to the non-contact suspension carrier. Control may include individually controlling the first levitation distance and the second levitation distance. Control may include setting a first target value for the first levitation distance and setting a second target distance for the second levitation distance. The first target value may be different from the second target value.

在非接觸懸浮期間,個別地控制從磁性單元至載體之距離以補償偵測之未對準係提供優點,舉例為在磁性懸浮程序中之控制的飽和效應可減少或甚至避免,而提供較大的頻寬。更準確之懸浮程序可提供。During non-contact levitation, individually controlling the distance from the magnetic unit to the carrier to compensate for detected misalignment provides advantages. For example, the effect of control saturation in magnetic levitation procedures can be reduced or even avoided, while providing greater Bandwidth. More accurate suspension procedures are available.

第4圖繪示根據此處所述實施例之用以決定載體懸浮系統之對準的方法。FIG. 4 illustrates a method for determining the alignment of a carrier suspension system according to the embodiments described herein.

如第4圖中所示,從第一磁性單元312至載體110之第一距離322可在載體110位在第一位置532中時進行測量。從第二磁性單元314至載體110之第二距離324可在載體110位在第一位置532中時進行測量。第一距離322及第二距離324可在載體110位在相同位置中時進行測量。As shown in FIG. 4, the first distance 322 from the first magnetic unit 312 to the carrier 110 can be measured when the carrier 110 is in the first position 532. The second distance 324 from the second magnetic unit 314 to the carrier 110 can be measured when the carrier 110 is in the first position 532. The first distance 322 and the second distance 324 can be measured when the carrier 110 is in the same position.

根據可與此處所述其他實施例結合之數個實施例,第一磁性單元312及/或第二磁性單元314可面對在第一位置中的載體110。第一位置可為處理腔室中之一位置。載體110可以機械支撐狀態支承在第一位置中。根據此處所述之數個實施例,在第一位置中之載體110可藉由機械支撐件140機械地支撐。According to several embodiments that may be combined with other embodiments described herein, the first magnetic unit 312 and / or the second magnetic unit 314 may face the carrier 110 in the first position. The first position may be one of the positions in the processing chamber. The carrier 110 may be supported in the first position in a mechanically supported state. According to several embodiments described herein, the carrier 110 in the first position may be mechanically supported by a mechanical support 140.

載體110可替代地或額外地以磁懸浮狀態支承於第一位置中。在第一位置中的載體110可藉由此些磁性單元170之至少一磁性單元非接觸懸浮。使用於磁性懸浮在第一位置中之載體110的磁性單元之數量可決定於數個因素,舉例為載體之尺寸、維度及重量。The carrier 110 may alternatively or additionally be supported in the first position in a magnetically suspended state. The carrier 110 in the first position can be non-contact suspended by at least one magnetic unit of the magnetic units 170. The number of magnetic units of the carrier 110 magnetically suspended in the first position may be determined by several factors, such as the size, dimensions, and weight of the carrier.

第5a-b圖繪示根據此處所述實施例之用以決定載體懸浮系統之對準的方法。Figures 5a-b illustrate a method for determining the alignment of a carrier suspension system according to the embodiments described herein.

根據其他實施例,及如第5a-b圖中所示,第一距離322及第二距離324可在不同位置之載體110進行測量。第5a圖繪示在載體110位在第一位置532中時測量第一距離322。當測量第一距離322時,在第一位置532中之載體110可根據此處所述數個實施例磁性懸浮或機械地支撐。舉例來說,在第一位置532中之載體可藉由第一磁性單元312磁性懸浮。在測量第一距離322之後,載體110可從第5a圖中所示之第一位置532移動至第5b圖中所示之第二位置534。According to other embodiments, and as shown in Figures 5a-b, the first distance 322 and the second distance 324 may be measured at the carrier 110 at different positions. Figure 5a illustrates the measurement of the first distance 322 when the carrier 110 is in the first position 532. When the first distance 322 is measured, the carrier 110 in the first position 532 may be magnetically suspended or mechanically supported according to several embodiments described herein. For example, the carrier in the first position 532 may be magnetically suspended by the first magnetic unit 312. After measuring the first distance 322, the carrier 110 can be moved from the first position 532 shown in FIG. 5a to the second position 534 shown in FIG. 5b.

第5b圖繪示在載體110位於第二位置534中時測量第二距離324之示意圖。當測量第二距離324時,位在第二位置534中之載體110可根據此處所述之數個實施例磁性懸浮或機械地支撐。舉例來說,在第二位置534中之載體可藉由第二磁性單元314磁性懸浮。FIG. 5b is a schematic diagram of measuring the second distance 324 when the carrier 110 is in the second position 534. When the second distance 324 is measured, the carrier 110 in the second position 534 may be magnetically suspended or mechanically supported according to several embodiments described herein. For example, the carrier in the second position 534 may be magnetically suspended by the second magnetic unit 314.

根據可與此處所述其他實施例結合之數個實施例,從第一磁性單元312至載體110之第一距離322可在載體110位在第一位置532中時進行測量。從第二磁性單元314至載體110之第二距離324可在載體110位在第二位置534中時進行測量。According to several embodiments that can be combined with other embodiments described herein, the first distance 322 from the first magnetic unit 312 to the carrier 110 can be measured when the carrier 110 is in the first position 532. The second distance 324 from the second magnetic unit 314 to the carrier 110 may be measured when the carrier 110 is in the second position 534.

舉例為在測量第一距離之後,載體110可從第一位置532移動到第二位置534。從第一位置532至第二位置534之移動可為在第一方向192中之移動。從第一位置532至第二位置534之移動可為水平移動。從第一位置532至第二位置534之移動可由磁性驅動結構提供及/或導引。從第一位置532至第二位置534之移動可替代地或額外地由機械支撐件提供及/或導引。For example, after measuring the first distance, the carrier 110 may be moved from the first position 532 to the second position 534. The movement from the first position 532 to the second position 534 may be a movement in the first direction 192. The movement from the first position 532 to the second position 534 may be a horizontal movement. The movement from the first position 532 to the second position 534 may be provided and / or guided by a magnetic drive structure. The movement from the first position 532 to the second position 534 may alternatively or additionally be provided and / or guided by a mechanical support.

第一磁性單元312及/或第二磁性單元314可面對在第二位置534中之載體。第二位置534可為處理腔室中之一位置。在第二位置中之載體110可由機械支撐件機械地支撐。在第二位置534中之載體110可替代地或額外地由載體懸浮系統非接觸懸浮。The first magnetic unit 312 and / or the second magnetic unit 314 may face the carrier in the second position 534. The second position 534 may be one of the positions in the processing chamber. The carrier 110 in the second position may be mechanically supported by a mechanical support. The carrier 110 in the second position 534 may alternatively or additionally be non-contact suspended by a carrier suspension system.

舉例來說,當載體110係在第一位置532中時,此些磁性單元170之一、二、三或多個磁性單元可面對載體110。面對載體110之磁性單元的數量可舉例為決定於磁性單元及載體110之長度之間的間隔。方法可包括測量從面對第一位置中之載體之各磁性單元至在第一位置中之載體的距離。For example, when the carrier 110 is in the first position 532, one, two, three, or more of the magnetic units 170 may face the carrier 110. The number of magnetic units facing the carrier 110 can be determined, for example, by the interval between the magnetic unit and the length of the carrier 110. The method may include measuring a distance from each magnetic unit facing the carrier in the first position to the carrier in the first position.

舉例來說,當載體110係位於第二位置534中時,此些磁性單元之二、三或多個磁性單元可面對載體110。方法可包括測量從面對在第二位置534中之載體110的各磁性單元至在第二位置534中之載體110的距離。For example, when the carrier 110 is located in the second position 534, two, three, or more of the magnetic units may face the carrier 110. The method may include measuring a distance from each magnetic unit facing the carrier 110 in the second position 534 to the carrier 110 in the second position 534.

第6a-c圖繪示根據此處所述實施例之包括數個磁性單元170之設備500的示意圖。在範例之實施例中,此些磁性單元170包括磁性單元512、514、516及518。設備500包括處理腔室550。6a-c are schematic diagrams of an apparatus 500 including a plurality of magnetic units 170 according to the embodiments described herein. In the exemplary embodiment, the magnetic units 170 include magnetic units 512, 514, 516, and 518. The apparatus 500 includes a processing chamber 550.

第6a圖繪示在第一位置532中之載體110的示意圖。兩個磁性單元512及514面對在第一位置532中的載體110。從磁性單元512到在第一位置532中之載體110的距離521係進行測量。從磁性單元514到在第一位置532中之載體110之距離522係進行測量。在測量距離521及522之後,載體110係從繪示於第6a圖中之第一位置532移動到繪示於第6b圖中之第二位置534。FIG. 6 a is a schematic diagram of the carrier 110 in the first position 532. The two magnetic units 512 and 514 face the carrier 110 in the first position 532. The distance 521 from the magnetic unit 512 to the carrier 110 in the first position 532 is measured. The distance 522 from the magnetic unit 514 to the carrier 110 in the first position 532 is measured. After measuring the distances 521 and 522, the carrier 110 moves from the first position 532 shown in FIG. 6a to the second position 534 shown in FIG. 6b.

第6b圖中繪示面對在第二位置534中之載體110之兩個磁性單元514及516的示意圖。從磁性單元514到在第二位置534中之載體110之距離523係進行測量。從磁性單元516到在第二位置534中之載體110之距離524係進行測量。在測量距離523及524之後,載體110可從繪示於第6b圖中之第二位置534移動到繪示於第6c圖中之第三位置536。Figure 6b shows a schematic diagram of the two magnetic units 514 and 516 facing the carrier 110 in the second position 534. The distance 523 from the magnetic unit 514 to the carrier 110 in the second position 534 is measured. The distance 524 from the magnetic unit 516 to the carrier 110 in the second position 534 is measured. After measuring the distances 523 and 524, the carrier 110 can be moved from the second position 534 shown in FIG. 6b to the third position 536 shown in FIG. 6c.

第6c圖繪示面對在第三位置536中之載體110之兩個磁性單元516及518的示意圖。從磁性單元516到第三位置536中之載體110的距離525係進行測量。 從磁性單元518到第三位置536中之載體110的距離526係進行測量。Figure 6c shows a schematic diagram of the two magnetic units 516 and 518 facing the carrier 110 in the third position 536. The distance 525 from the magnetic unit 516 to the carrier 110 in the third position 536 is measured. The distance 526 from the magnetic unit 518 to the carrier 110 in the third position 536 is measured.

在載體110由載體懸浮系統非接觸懸浮時或在載體110由機械支撐件機械地支撐時,可測量距離521、522、523、524、525及526。測量之距離521、522、523、524、525及526可收集於一表格中。測量之距離521、522、523、524、525及526、或其之任何組合可根據此處所述之數個實施例使用於決定載體懸浮系統及/或機械支撐件之對準。The distances 521, 522, 523, 524, 525, and 526 can be measured when the carrier 110 is non-contactly suspended by the carrier suspension system or when the carrier 110 is mechanically supported by a mechanical support. The measured distances 521, 522, 523, 524, 525 and 526 can be collected in a table. The measured distances 521, 522, 523, 524, 525 and 526, or any combination thereof, can be used to determine the alignment of the carrier suspension system and / or mechanical support according to several embodiments described herein.

根據可與此處所述其他實施例結合之數個實施例,方法可包括提供載體110於處理腔室中,舉例為繪示於第6a-c圖中之處理腔室550中。According to several embodiments that can be combined with other embodiments described herein, the method may include providing a carrier 110 in a processing chamber, for example, shown in processing chamber 550 in Figures 6a-c.

載體懸浮系統、第一磁性單元312、第二磁性單元314、及/或此些磁性單元170可位在處理腔室中。機械支撐件140可位在處理腔室中。第一距離感測器732、第二距離感測器734及/或根據此處所述數個實施例之任何其他距離感測器可位在處理腔室中。The carrier suspension system, the first magnetic unit 312, the second magnetic unit 314, and / or these magnetic units 170 may be located in the processing chamber. The mechanical support 140 may be located in the processing chamber. The first distance sensor 732, the second distance sensor 734, and / or any other distance sensor according to several embodiments described herein may be located in the processing chamber.

方法可包括在載體110位於處理腔室中時,測量從第一磁性單元312至載體110之第一距離322、從第二磁性單元314至載體110之第二距離324、及/或從磁性單元至載體110之任何其他距離。The method may include measuring a first distance 322 from the first magnetic unit 312 to the carrier 110, a second distance 324 from the second magnetic unit 314 to the carrier 110, and / or from the magnetic unit when the carrier 110 is in the processing chamber. Any other distance to the carrier 110.

處理腔室可為真空腔室。處理腔室可為真空沈積腔室。處理腔室可包括一或多個沈積源,用以塗佈在處理腔室中之基板。The processing chamber may be a vacuum chamber. The processing chamber may be a vacuum deposition chamber. The processing chamber may include one or more deposition sources for coating a substrate in the processing chamber.

根據可與此處所述其他實施例結合之數個實施例,方法可包括測量從此些磁性單元170至載體110之第三距離。第三距離可為從第一磁性單元312至載體110之距離、從第二磁性單元314至載體110的距離、或從此些磁性單元170至第三磁性單元至載體110至距離。方法可包括從至少第一距離、第二距離及第三距離決定載體懸浮系統及/或機械支撐件之對準。According to several embodiments that can be combined with other embodiments described herein, the method may include measuring a third distance from these magnetic units 170 to the carrier 110. The third distance may be the distance from the first magnetic unit 312 to the carrier 110, the distance from the second magnetic unit 314 to the carrier 110, or the distance from these magnetic units 170 to the third magnetic unit to the carrier 110. The method may include determining the alignment of the carrier suspension system and / or the mechanical support from at least a first distance, a second distance, and a third distance.

根據可與此處所述其他實施例結合之數個實施例,方法可包括測量從此些磁性單元170至載體之數個距離。此些距離之各距離可為從此些磁性單元170之一磁性單元至載體110之距離。此些距離可包括第一距離322、第二距離324、第三距離、第四距離、第五距離或甚至其他距離。此些距離可包括二、三、四、五或多個距離,舉例為達20個或甚至更多個距離。方法可包括從此些距離決定載體懸浮系統及/或機械支撐件之對準。方法可包括從此些距離之至少二或多個距離、至少三或多個距離、至少四或多個距離或至少五或多個距離來決定載體懸浮系統及/或機械支撐件之對準。According to several embodiments that may be combined with other embodiments described herein, the method may include measuring several distances from such magnetic units 170 to the carrier. Each of these distances may be a distance from one of the magnetic units 170 to the carrier 110. Such distances may include a first distance 322, a second distance 324, a third distance, a fourth distance, a fifth distance, or even other distances. Such distances may include two, three, four, five or more distances, for example up to 20 or even more distances. The method may include determining the alignment of the carrier suspension system and / or the mechanical support from these distances. The method may include determining the alignment of the carrier suspension system and / or the mechanical support from at least two or more, at least three or more, at least four or more, or at least five or more of these distances.

根據可與此處所述其他實施例結合之數個實施例,數個磁性單元170可包括三個磁性單元。此方法可包括測量從第三磁性單元至載體之第三距離。第三距離可在載體位在第一位置532中或第二位置534中時進行測量。載體懸浮系統及/或機械支撐件之對準可從至少第一距離、第二距離及第三距離、或其之組合決定。According to several embodiments that can be combined with other embodiments described herein, the plurality of magnetic units 170 may include three magnetic units. This method may include measuring a third distance from the third magnetic unit to the carrier. The third distance may be measured when the carrier is in the first position 532 or the second position 534. The alignment of the carrier suspension system and / or the mechanical support may be determined from at least a first distance, a second distance, and a third distance, or a combination thereof.

根據可與此處所述其他實施例結合之數個實施例,數個磁性單元170可包括2、3、4、5、6、7、8、9、10、11、12或更多個磁性單元,舉例為達24個或更多個磁性單元。此些磁性單元170可包括兩列之磁性單元,舉例為兩列之達12個或更多個的磁性單元。According to several embodiments that can be combined with other embodiments described herein, the plurality of magnetic units 170 may include 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, or more magnetic units. Units, for example up to 24 or more magnetic units. Such magnetic units 170 may include two rows of magnetic units, for example, two rows of up to 12 or more magnetic units.

根據可與此處所述其他實施例結合之數個實施例,方法可包括測量數個距離。從此些磁性單元之各磁性單元至載體之距離可進行測量。方法可包括從測量之此些距離決定載體懸浮系統及/或機械支撐件之對準。According to several embodiments that may be combined with other embodiments described herein, the method may include measuring several distances. The distance from each of these magnetic units to the carrier can be measured. The method may include determining the alignment of the carrier suspension system and / or the mechanical support from these measured distances.

根據可與此處所述其他實施例結合之數個實施例,從第一磁性單元至載體之第一距離及從第二磁性單元至載體之第二距離可在載體位在第一位置532中時進行測量。方法可包括在載體位在第二位置534中時測量從第二磁性單元至載體之第三距離。舉例來說,根據此處所述之數個實施例的第一磁性單元及第一距離可分別對應於磁性單元512及距離521,如第6a圖中所示。根據此處所述之數個實施例的第二磁性單元、第二距離及第三距離可分別對應於磁性單元514、距離522及距離523,如第6a-b圖中所示。方法可包括從至少第一距離、第二距離及第三距離、或其之組合決定載體懸浮系統及/或機械支撐件之對準。According to several embodiments that can be combined with other embodiments described herein, the first distance from the first magnetic unit to the carrier and the second distance from the second magnetic unit to the carrier may be in the carrier in the first position 532 Take measurements. The method may include measuring a third distance from the second magnetic unit to the carrier while the carrier is in the second position 534. For example, the first magnetic unit and the first distance according to the embodiments described herein may correspond to the magnetic unit 512 and the distance 521, respectively, as shown in FIG. 6a. The second magnetic unit, the second distance, and the third distance according to several embodiments described herein may correspond to the magnetic unit 514, the distance 522, and the distance 523, respectively, as shown in Figures 6a-b. The method may include determining the alignment of the carrier suspension system and / or the mechanical support from at least a first distance, a second distance, and a third distance, or a combination thereof.

根據可與此處所述其他實施例結合之數個實施例,在第二磁性單元位在第一位置時,舉例為第6a圖中所示之距離521之從第一磁性單元至載體的第一距離及/或舉例為距離522之從第二磁性單元至載體之第二距離可進行測量。此些磁性單元可包括第三磁性單元,舉例為繪示於第6a-c圖中所示之磁性單元516。方法可包括在載體位在第二位置534中時測量從第三磁性單元至載體之第三距離,舉例為繪示於第6b圖中之距離524。方法可包括在載體位在第二位置時測量從第二磁性單元至載體之第四距離,舉例為繪示於第6b圖中之距離523。方法可包括從至少第一距離、第二距離、第三距離、及第四距離、或其之組合決定載體懸浮系統及/或機械支撐件之對準。According to several embodiments that can be combined with other embodiments described herein, when the second magnetic unit is in the first position, for example, the distance from the first magnetic unit to the carrier at the distance 521 shown in FIG. 6a is exemplified. A distance and / or a second distance from the second magnetic unit to the carrier, for example a distance 522, may be measured. These magnetic units may include a third magnetic unit, such as the magnetic unit 516 shown in FIGS. 6a-c. The method may include measuring a third distance from the third magnetic unit to the carrier when the carrier is in the second position 534, for example, the distance 524 shown in FIG. 6b. The method may include measuring a fourth distance from the second magnetic unit to the carrier when the carrier is in the second position, for example, the distance 523 shown in FIG. 6b. The method may include determining the alignment of the carrier suspension system and / or the mechanical support from at least a first distance, a second distance, a third distance, and a fourth distance, or a combination thereof.

相較於舉例為僅有一個距離係測量來用於各磁性單元之方法,藉由測量從相同磁性單元至載體之數個距離來用於不同位置之載體,有關於載體單元之對準的更多資訊可取得。因此,對準或可能的未對準可能更準確地決定。Compared to the example where only one distance measurement is used for each magnetic unit, the measurement of several distances from the same magnetic unit to the carrier for different positions of the carrier is more relevant for the alignment of the carrier unit. More information is available. As a result, alignment or possible misalignment may be determined more accurately.

根據可與此處所述其他實施例結合之數個實施例,使用於此處所述方法中之載體110係為裝配以用於測量從此些磁性單元至載體之距離的載體,此裝配舉例為特別裝配。使用於此處所述之方法中的載體110可為一測量載體。相較於製程載體,也就是在舉例為沈積製程之製程中由載體懸浮系統懸浮之載體,測量載體可為不同形式的載體。舉例來說,相較於製程載體,測量載體可更準確地製造。相較於製程載體,測量載體可具有不同維度,此維度舉例為高度及/或長度。測量載體可長於或短於製程載體。測量載體可具有可調整尺寸,舉例為可調整之長度及/或高度。According to several embodiments that can be combined with other embodiments described herein, the carrier 110 used in the method described herein is a carrier assembled for measuring the distance from these magnetic units to the carrier. This assembly example is Special assembly. The carrier 110 used in the method described herein may be a measurement carrier. Compared with the process carrier, that is, the carrier suspended by the carrier suspension system in the process exemplified by the sunken process, the measurement carrier may be a carrier of different forms. For example, a measurement carrier can be manufactured more accurately than a process carrier. Compared to the process carrier, the measurement carrier may have different dimensions, such as height and / or length. The measurement carrier can be longer or shorter than the process carrier. The measurement carrier may have an adjustable size, for example an adjustable length and / or height.

根據可與此處所述其他實施例結合之數個實施例,此處所述之方法可利用不同載體重覆數次。According to several embodiments that can be combined with other embodiments described herein, the method described herein can be repeated several times with different carriers.

舉例來說,在第一輪中,可使用相對小尺寸之載體,此載體舉例為測量載體。特別是,此載體之高度可比製程載體小,使得從載體至載體懸浮系統之距離大於用於製程載體的距離。此可確保載體於移動通過系統時不會接觸或碰撞磁性單元或系統之其他元件,特別是在數個磁性單元具有相對大程度的未對準的情況中。針對此種載體來說,從磁性單元至載體之距離可進行測量及對準可根據此處所述之數個實施例決定。在基於第一輪中測量的距離決定磁性單元之對準之後,機械對準操作可應用於載體懸浮系統。舉例來說,一些磁性單元之位置可調整,以對準載體懸浮系統。在對準操作之後,可執行第二輪之方法。在第二輪中,舉例來說,可使用具有較大尺寸之第二載體。具有較大尺寸之載體可不與磁性單元碰撞,因為後者已經進行第一輪的對準。針對此第二個載體來說,從磁性單元至載體之距離可亦如此處所述進行測量。對準可基於此些距離第二次決定。藉由重複此方法數次,在此方法之各輪中,載體懸浮系統及/或機械支撐件之對準可進一步改善。For example, in the first round, a relatively small-sized carrier may be used, and this carrier is exemplified as a measurement carrier. In particular, the height of the carrier may be smaller than that of the process carrier, so that the distance from the carrier to the carrier suspension system is greater than the distance used for the process carrier. This ensures that the carrier does not touch or collide with the magnetic unit or other components of the system when moving through the system, especially where several magnetic units have a relatively large degree of misalignment. For such a carrier, the distance from the magnetic unit to the carrier can be measured and aligned according to several embodiments described herein. After determining the alignment of the magnetic units based on the distance measured in the first round, the mechanical alignment operation can be applied to the carrier suspension system. For example, the position of some magnetic units can be adjusted to align with the carrier suspension system. After the alignment operation, a second round of the method can be performed. In the second round, for example, a second carrier having a larger size may be used. A carrier with a larger size may not collide with the magnetic unit because the latter has already undergone the first round of alignment. For this second carrier, the distance from the magnetic unit to the carrier can also be measured as described here. Alignment can be determined a second time based on these distances. By repeating this method several times, the alignment of the carrier suspension system and / or mechanical support can be further improved in each round of the method.

根據可與此處所述其他實施例結合之數個實施例,載體110係為第一載體。方法可包括測量從第一磁性單元至第二載體之第三距離,第二載體具有不同於第一載體之尺寸。方法可包括測量從第二磁性單元至第二載體之第四距離。方法可包括從至少第三距離及第四距離來決定載體懸浮系統及/或機械支撐件之對準。According to several embodiments that can be combined with other embodiments described herein, the carrier 110 is a first carrier. The method may include measuring a third distance from the first magnetic unit to the second carrier, the second carrier having a size different from the first carrier. The method may include measuring a fourth distance from the second magnetic unit to the second carrier. The method may include determining the alignment of the carrier suspension system and / or the mechanical support from at least a third distance and a fourth distance.

根據此處所述之數個實施例之從磁性單元至載體之測量距離可為在垂直方向中的距離,垂直方向舉例為第二方向194。舉例來說,第一距離322及/或第二距離324可為在第二方向194中的距離。第一距離322、第二距離324、或從磁性單元至載體之任何其他距離可為垂直或實質上垂直於第一方向192之方向中的距離。According to several embodiments described herein, the measurement distance from the magnetic unit to the carrier may be a distance in a vertical direction, and the vertical direction is exemplified as the second direction 194. For example, the first distance 322 and / or the second distance 324 may be a distance in the second direction 194. The first distance 322, the second distance 324, or any other distance from the magnetic unit to the carrier may be a distance in a direction that is perpendicular or substantially perpendicular to the first direction 192.

從磁性單元至載體的測量距離可為從磁性單元至載體之外部的距離,舉例為載體之上邊緣部。The measurement distance from the magnetic unit to the carrier may be the distance from the magnetic unit to the outside of the carrier, for example, the upper edge portion of the carrier.

在載體係支承於垂直定向中時,第一距離、第二距離、及/或根據此處所述數個實施例測量之從磁性單元至載體110之任何其他距離可進行測量。When the carrier is supported in a vertical orientation, the first distance, the second distance, and / or any other distance from the magnetic unit to the carrier 110 measured according to several embodiments described herein may be measured.

第一距離323、第二距離324、或根據此處所述數個實施例測量之從磁性單元至載體110之任何其他距離可為從1至8 mm,更特別是從1至4 mm,舉例為從2至3 mm。The first distance 323, the second distance 324, or any other distance from the magnetic unit to the carrier 110 measured according to several embodiments described herein may be from 1 to 8 mm, more particularly from 1 to 4 mm, for example For from 2 to 3 mm.

第一距離322可由第一距離感測器測量,第一距離感測器舉例為繪示於第7圖中之第一距離感測器732。當測量第一距離322時,第一距離感測器可位於載體110之上方及/或面對載體110。第一距離感測器可連接於、固定於第一磁性單元312及/或為第一磁性單元312之部份。第二距離324可由第二距離感測器測量,第二距離感測器舉例為繪示於第7圖中之第二距離感測器734。當測量第二距離324時,第二距離感測器734可位於載體110之上方及/或面對載體110。第二距離感測器734可連接於、固定於第二磁性單元314及/或為第二磁性單元314之部份。The first distance 322 can be measured by a first distance sensor. The first distance sensor is, for example, the first distance sensor 732 shown in FIG. 7. When measuring the first distance 322, the first distance sensor may be located above and / or face the carrier 110. The first distance sensor can be connected to, fixed to, and / or part of the first magnetic unit 312. The second distance 324 can be measured by a second distance sensor. The second distance sensor is an example of the second distance sensor 734 shown in FIG. 7. When the second distance 324 is measured, the second distance sensor 734 may be located above and / or face the carrier 110. The second distance sensor 734 may be connected to, fixed to, and / or part of the second magnetic unit 314.

根據可與此處所述其他實施例結合之數個實施例,方法可包括測量從磁性驅動結構180至載體110之數個距離,特別是數個垂直距離。數個距離感測器可提供於或固定在磁性驅動結構180,用以測量從磁性驅動結構180至載體110之此些距離。舉例為在載體110懸浮時及/或在載體110由機械支撐件140支撐時,此些距離感測器可配置於載體110之下方。此些距離感測器可在第一方向192中彼此分隔。方法可包括從至少第一距離322、第二距離324及從磁性驅動結構180至載體110之此些距離來決定機械支撐件140之對準。According to several embodiments that can be combined with other embodiments described herein, the method may include measuring several distances from the magnetic drive structure 180 to the carrier 110, particularly several vertical distances. A plurality of distance sensors may be provided on or fixed to the magnetic driving structure 180 to measure these distances from the magnetic driving structure 180 to the carrier 110. For example, when the carrier 110 is suspended and / or when the carrier 110 is supported by the mechanical support 140, these distance sensors may be disposed below the carrier 110. Such distance sensors may be separated from each other in the first direction 192. The method may include determining the alignment of the mechanical support 140 from at least a first distance 322, a second distance 324, and these distances from the magnetic drive structure 180 to the carrier 110.

根據其他實施例,及如第7圖中所示,設備500係提供。設備500包括載體懸浮系統。載體懸浮系統包括數個磁性單元170。此些磁性單元170適用於非接觸懸浮載體110。此些磁性單元170包括第一磁性單元312及第二磁性單元314。設備500包括第一距離感測器732。第一距離感測器732可適用於測量從第一磁性單元312至載體110之第一距離322。設備500包括第二距離感測器734。第二距離感測器734可適用於測量從第二磁性單元314至載體110之第二距離324。設備500包括控制單元750,連接於第一距離感測器732及第二距離感測器734。控制單元750係裝配以自至少第一距離322及第二距離324來決定載體懸浮系統之對準。According to other embodiments, and as shown in FIG. 7, the device 500 is provided. The apparatus 500 includes a carrier suspension system. The carrier suspension system includes several magnetic units 170. Such magnetic units 170 are suitable for the non-contact suspension carrier 110. The magnetic units 170 include a first magnetic unit 312 and a second magnetic unit 314. The device 500 includes a first distance sensor 732. The first distance sensor 732 may be adapted to measure a first distance 322 from the first magnetic unit 312 to the carrier 110. The device 500 includes a second distance sensor 734. The second distance sensor 734 may be adapted to measure a second distance 324 from the second magnetic unit 314 to the carrier 110. The device 500 includes a control unit 750 connected to the first distance sensor 732 and the second distance sensor 734. The control unit 750 is configured to determine the alignment of the carrier suspension system from at least a first distance 322 and a second distance 324.

在載體110由載體懸浮系統非接觸懸浮或由包括於設備500中之機械支撐件機械地支撐時,繪示於第7圖中之第一距離322及第二距離324可進行測量。The first distance 322 and the second distance 324 shown in FIG. 7 may be measured when the carrier 110 is non-contactly suspended by the carrier suspension system or mechanically supported by a mechanical support included in the device 500.

此處所述之設備的數個實施例係適用於執行此處所述之方法的實施例的任何方法特徵,特別是附屬方法申請專利範圍中所述之任何特徵。如此處所述之控制單元可適用於執行此處所述之方法的實施例的任何方法特徵,特別是附屬方法申請專利範圍中所述之任何特徵。舉例來說,控制單元750可裝配,以用於執行根據此處所述任何實施例之決定載體懸浮系統及/或機械支撐件之對準的方法特徵。Several embodiments of the apparatus described herein are applicable to any method feature of an embodiment of the method described herein, and in particular to any feature described in the scope of a patent application for a subsidiary method. A control unit as described herein may be adapted to perform any method feature of an embodiment of the method described herein, in particular any feature described in the scope of an attached method patent application. For example, the control unit 750 may be assembled for performing a method feature determining the alignment of the carrier suspension system and / or the mechanical support according to any of the embodiments described herein.

根據可與此處所述其他實施例結合之數個實施例, 第一磁性單元312、第二磁性單元314及/或此些磁性單元170之任何磁性單元可為主動磁性單元。According to several embodiments that can be combined with other embodiments described herein, the first magnetic unit 312, the second magnetic unit 314, and / or any of the magnetic units 170 may be an active magnetic unit.

根據可與此處所述其他實施例結合之數個實施例,主動磁性單元可裝配,以用於產生磁場來提供在垂直方向中延伸之磁性懸浮力,垂直方向舉例為繪示於圖示中的第二方向194。主動磁性單元可控制,以提供可調整之磁場。可調整之磁場可為靜態或動態磁場。主動磁性單元可為或包括一元件,此元件選自由電磁裝置;螺線管;線圈;超導磁鐵;或其之任何組合所組成之群組。According to several embodiments that can be combined with other embodiments described herein, the active magnetic unit can be assembled for generating a magnetic field to provide a magnetic levitation force extending in the vertical direction, which is illustrated in the vertical direction as an example in the illustration The second direction 194. The active magnetic unit can be controlled to provide an adjustable magnetic field. The adjustable magnetic field can be a static or dynamic magnetic field. The active magnetic unit may be or include an element selected from the group consisting of an electromagnetic device; a solenoid; a coil; a superconducting magnet; or any combination thereof.

術語「主動」磁性單元係於此使用來與「被動」磁性單元之概念有所區別。被動磁性單元可意指至少不在設備之操作期間具有數個磁性性質的元件,此些磁性性質係不面臨主動控制或調整。舉例來說,被動磁性單元之磁性性質可不在載體移動通過設備期間受到主動控制,被動磁性單元舉例為第1圖中所示之第一被動磁性單元150及第二被動磁性單元160。被動磁性單元可為磁性材料,例如是鐵磁材料、永久磁鐵或可具有永久磁性性質。The term "active" magnetic unit is used here to distinguish it from the concept of "passive" magnetic unit. A passive magnetic unit may mean an element that does not have at least several magnetic properties during operation of the device, such magnetic properties do not face active control or adjustment. For example, the magnetic properties of the passive magnetic unit may not be actively controlled while the carrier moves through the device. Examples of the passive magnetic unit are the first passive magnetic unit 150 and the second passive magnetic unit 160 shown in FIG. The passive magnetic unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet, or may have permanent magnetic properties.

相較於被動磁性單元,有鑑於主動磁性單元產生之磁場的可調性及可控性,主動磁性單元提供更多靈活性及精密度。Compared with passive magnetic units, in view of the adjustable and controllable magnetic field generated by active magnetic units, active magnetic units provide more flexibility and precision.

第8圖繪示根據此處所述實施例之設備500的示意圖。設備500包括載體懸浮系統。載體懸浮系統包括數個磁性單元170。此些磁性單元170包括第一磁性單元312、第二磁性單元314、第三磁性單元816及第四磁性單元818。設備500包括第一距離感測器732、第二距離感測器734、第三距離感測器836及第四距離感測器838。設備500包括控制單元750。設備500包括機械支撐件140。設備包括磁性驅動結構180。FIG. 8 is a schematic diagram of a device 500 according to the embodiment described herein. The apparatus 500 includes a carrier suspension system. The carrier suspension system includes several magnetic units 170. The magnetic units 170 include a first magnetic unit 312, a second magnetic unit 314, a third magnetic unit 816, and a fourth magnetic unit 818. The device 500 includes a first distance sensor 732, a second distance sensor 734, a third distance sensor 836, and a fourth distance sensor 838. The device 500 includes a control unit 750. The device 500 includes a mechanical support 140. The device includes a magnetic drive structure 180.

根據可與此處所述其他實施例結合之數個實施例,第一距離感測器732可連接於第一磁性單元312。 第二距離感測器734可連接於第二磁性單元314。第三距離感測器836可連接於第三磁性單元816。第四距離感測器838可連接於第四磁性單元818。According to several embodiments that can be combined with other embodiments described herein, the first distance sensor 732 can be connected to the first magnetic unit 312. The second distance sensor 734 may be connected to the second magnetic unit 314. The third distance sensor 836 can be connected to the third magnetic unit 816. The fourth distance sensor 838 may be connected to the fourth magnetic unit 818.

控制單元750可連接於第一距離感測器732、第二距離感測器734、第三距離感測器836及/或第四距離感測器838。 控制單元750可裝配,以用於自二或多個距離決定載體懸浮系統及/或機械支撐件140之對準。從磁性單元至載體之此二或多個距離係由設備500之距離感測器測量。The control unit 750 may be connected to the first distance sensor 732, the second distance sensor 734, the third distance sensor 836, and / or the fourth distance sensor 838. The control unit 750 can be assembled for determining the alignment of the carrier suspension system and / or the mechanical support 140 from two or more distances. The two or more distances from the magnetic unit to the carrier are measured by a distance sensor of the device 500.

在第8圖中所示之範例實施例中,第一距離322及第二距離324係在載體110由機械支撐件140支撐時進行測量。相同之設備500可亦使用於在載體110非接觸懸浮時測量第一距離及第二距離,及根據此處所述數個實施例之從磁性單元至載體之任何其他距離。In the exemplary embodiment shown in FIG. 8, the first distance 322 and the second distance 324 are measured when the carrier 110 is supported by the mechanical support 140. The same device 500 can also be used to measure the first distance and the second distance when the carrier 110 is in non-contact suspension, and any other distance from the magnetic unit to the carrier according to several embodiments described herein.

根據可與此處所述其他實施例結合之數個實施例,設備500可包括磁性驅動結構180,用以在載體傳送方向(也就是第一方向192)中驅動載體。磁性驅動結構180可包括數個磁性單元,舉例為繪示於第8圖中之主動磁性單元(也就是個別磁性單元185)。根據可與此處所述其他實施例結合之數個實施例,主動磁性單元可裝配,以用於提供在第一方向192中延伸的磁性驅動力。According to several embodiments that can be combined with other embodiments described herein, the device 500 may include a magnetic drive structure 180 for driving a carrier in a carrier transfer direction (ie, a first direction 192). The magnetic driving structure 180 may include several magnetic units, such as the active magnetic unit (ie, the individual magnetic unit 185) shown in FIG. 8 as an example. According to several embodiments that can be combined with other embodiments described herein, the active magnetic unit can be assembled for providing a magnetic driving force extending in the first direction 192.

根據可與此處所述其他實施例結合之數個實施例, 設備500可包括機械支撐件140。機械支撐件140可適用於機械地支撐載體110。機械支撐件140可配置於第一磁性單元312之下方、第二磁性單元314之下方及/或此些磁性單元170之下方。非接觸懸浮之載體及/或機械地支撐的載體可在機械支撐件之上方及/或此些磁性單元之下方。According to several embodiments that may be combined with other embodiments described herein, the device 500 may include a mechanical support 140. The mechanical support 140 may be adapted to mechanically support the carrier 110. The mechanical support 140 may be disposed below the first magnetic unit 312, below the second magnetic unit 314, and / or below these magnetic units 170. The non-contact suspended carrier and / or the mechanically supported carrier may be above the mechanical support and / or below these magnetic units.

根據可與此處所述其他實施例結合之數個實施例,機械支撐件140可包括一或多個支撐元件142,舉例為數個支撐元件142。機械支撐件140可包括數個滾軸或軸承,適用於支撐載體110。此些滾軸及軸承可配置於一平面中,舉例為水平面中。各滾軸或軸承可具有旋轉軸。旋轉軸可於水平方向中延伸。旋轉軸可於垂直或實質上垂直於第一方向192之方向中延伸。According to several embodiments that can be combined with other embodiments described herein, the mechanical support 140 may include one or more support elements 142, such as several support elements 142. The mechanical support 140 may include several rollers or bearings, and is suitable for supporting the carrier 110. These rollers and bearings can be arranged in a plane, for example in a horizontal plane. Each roller or bearing may have a rotating shaft. The rotation axis may extend in a horizontal direction. The rotation axis may extend in a direction that is perpendicular or substantially perpendicular to the first direction 192.

在圖式中,機械支撐件140係繪示成數個分離之支撐元件。此處所述之數個實施例係不限於此種機械支撐件。舉例來說,機械支撐件可包括連結於彼此之數個支撐元件。In the drawings, the mechanical support 140 is shown as a plurality of separate support elements. The embodiments described herein are not limited to such mechanical supports. For example, a mechanical support may include several support elements attached to each other.

根據可與此處所述其他實施例結合之數個實施例,機械支撐件140可包括數個固定軸承或應急軸承。機械支撐件140可適用於在載體懸浮系統於非接觸懸浮或傳送載體期間失效之情況中抓取載體。舉例來說,在塗佈製程或其他製程中,載體可藉由此些磁性單元170非接觸懸浮。在載體之非接觸懸浮舉例為因失去功率而突然中斷的情況中,載體在最糟的情況中可能停止磁性懸浮且掉落。根據此處所述之數個實施例,載體可落在機械支撐件上,特別是固定軸承或應急軸承上。機械支撐件140可抓取載體及避免損害載體或系統之其他部件。According to several embodiments that may be combined with other embodiments described herein, the mechanical support 140 may include several fixed bearings or emergency bearings. The mechanical support 140 may be adapted to grab a carrier in the event that the carrier suspension system fails during non-contact suspension or transfer of the carrier. For example, in the coating process or other processes, the carrier can be suspended in a non-contact manner by the magnetic units 170. In the case where the non-contact suspension of the carrier is exemplified by a sudden interruption due to a loss of power, the carrier may stop magnetic suspension and fall in the worst case. According to several embodiments described herein, the carrier may fall on a mechanical support, particularly a fixed bearing or an emergency bearing. The mechanical support 140 can grasp the carrier and avoid damage to the carrier or other components of the system.

第一距離感測器732、第二距離感測器734、第三距離感測器及/或第四距離感測器可配置於機械支撐件140之上方。The first distance sensor 732, the second distance sensor 734, the third distance sensor, and / or the fourth distance sensor may be disposed above the mechanical support 140.

根據可與此處所述其他實施例結合之數個實施例,機械支撐件140可固定於磁性驅動結構180。機械支撐件140可包括、機械地連接於或固定於磁性驅動結構180,使得機械支撐件140之對準可影響及/或決定磁性驅動結構180之對準。根據可與此處所述其他實施例結合之數個實施例,機械支撐件包括或機械地連接於磁性驅動結構180,使得決定機械支撐件140的對準係提供決定磁性驅動結構180之對準。According to several embodiments that can be combined with other embodiments described herein, the mechanical support 140 can be fixed to the magnetic drive structure 180. The mechanical support 140 may include, be mechanically connected to, or fixed to the magnetic drive structure 180 such that the alignment of the mechanical support 140 may affect and / or determine the alignment of the magnetic drive structure 180. According to several embodiments that can be combined with other embodiments described herein, the mechanical support includes or is mechanically connected to the magnetic drive structure 180 such that the alignment of the determining mechanical support 140 provides the determination of the alignment of the magnetic drive structure 180 .

此處所述之數個實施例提供磁性驅動結構之磁性單元的對準可決定及校正的優點。Several embodiments described herein provide the advantage that the alignment of the magnetic units of the magnetic drive structure can be determined and corrected.

根據可與此處所述其他實施例結合之數個實施例,設備500可包括處理腔室550。此些磁性單元170、載體110、機械支撐件140及/或磁性驅動結構180可位在處理腔室550中。第8圖中所示之載體110可在處理腔室550中移動,舉例為在第一方向192中移動,使得從第三磁性單元816及從第四磁性單元 818至載體110的其他距離可進行測量。According to several embodiments that may be combined with other embodiments described herein, the apparatus 500 may include a processing chamber 550. Such magnetic units 170, carriers 110, mechanical supports 140, and / or magnetic drive structures 180 may be located in the processing chamber 550. The carrier 110 shown in FIG. 8 can be moved in the processing chamber 550, for example, in the first direction 192, so that other distances from the third magnetic unit 816 and the fourth magnetic unit 818 to the carrier 110 can be performed. measuring.

第9圖繪示根據此處所述實施例之設備500的示意圖。根據可與此處所述其他實施例結合之數個實施例,控制單元750可連接於磁性驅動結構180。控制單元750可裝配,以基於機械支撐件及/或磁性驅動結構之決定的對準來對準磁性驅動結構。對準磁性驅動結構可為自動對準。對準磁性驅動結構可包括調整磁性驅動結構之一或多個磁性單元的位置。控制單元750可裝配,以基於載體懸浮系統之決定的對準來對準載體懸浮系統。對準載體懸浮系統可為自動對準。對準載體懸浮系統可包括調整載體懸浮系統之一或多個磁性單元的位置。FIG. 9 shows a schematic diagram of a device 500 according to the embodiment described herein. According to several embodiments that can be combined with other embodiments described herein, the control unit 750 can be connected to the magnetic driving structure 180. The control unit 750 can be assembled to align the magnetic drive structure based on a determined alignment of the mechanical support and / or the magnetic drive structure. The alignment magnetic driving structure may be automatically aligned. Aligning the magnetic drive structure may include adjusting a position of one or more magnetic units of the magnetic drive structure. The control unit 750 may be equipped to align the carrier suspension system with the determined alignment based on the carrier suspension system. The alignment carrier suspension system may be automatically aligned. Aligning the carrier suspension system may include adjusting the position of one or more magnetic units of the carrier suspension system.

在第7、8及9圖中所示之設備500中,可包括第1圖中所示之設備100的任何元件,及反之亦然。In the device 500 shown in Figs. 7, 8 and 9, any element of the device 100 shown in Fig. 1, and vice versa can be included.

根據可與此處所述其他實施例結合之數個實施例,數個磁性單元170可配置於第一方向192中。此些磁性單元170可為在第一方向192中延伸的磁性單元的線性陣列。由此些磁性單元170非接觸懸浮或傳送之載體可在第一方向192中延伸。According to several embodiments that can be combined with other embodiments described herein, several magnetic units 170 may be disposed in the first direction 192. Such magnetic units 170 may be a linear array of magnetic units extending in the first direction 192. Thus, the non-contact suspended or transported carriers of the magnetic units 170 may extend in the first direction 192.

根據可與此處所述其他實施例結合之數個實施例,機械支撐件140可具有在第一方向192中延伸的長度。機械支撐件140可適用於在第一方向192中導引載體。機械支撐件140可至少沿著在第一方向中之載體懸浮系統的長度於第一方向192中延伸。此些磁性單元170之各磁性單元可面對機械支撐件140。According to several embodiments that may be combined with other embodiments described herein, the mechanical support 140 may have a length extending in the first direction 192. The mechanical support 140 may be adapted to guide the carrier in the first direction 192. The mechanical support 140 may extend at least along the length of the carrier suspension system in the first direction in the first direction 192. Each of the magnetic units 170 may face the mechanical support 140.

根據可與此處所述其他實施例結合之數個實施例,磁性驅動結構180可適用於在第一方向192中驅動載體。第一方向192可為載體傳送方向。第一方向192可為水平方向。According to several embodiments that can be combined with other embodiments described herein, the magnetic drive structure 180 may be adapted to drive the carrier in the first direction 192. The first direction 192 may be a carrier conveying direction. The first direction 192 may be a horizontal direction.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

100、500‧‧‧設備100, 500‧‧‧ equipment

110‧‧‧載體 110‧‧‧ carrier

120‧‧‧基板 120‧‧‧ substrate

130、750‧‧‧控制單元 130, 750‧‧‧ control unit

140‧‧‧機械支撐件 140‧‧‧ mechanical support

142‧‧‧支撐元件 142‧‧‧Support element

150‧‧‧第一被動磁性單元 150‧‧‧ the first passive magnetic unit

160‧‧‧第二被動磁性單元 160‧‧‧Second passive magnetic unit

170、316、512、514、516、518‧‧‧磁性單元 170, 316, 512, 514, 516, 518‧‧‧ magnetic units

175、185‧‧‧個別磁性單元 175, 185‧‧‧ individual magnetic units

180‧‧‧磁性驅動結構 180‧‧‧ magnetic drive structure

192‧‧‧第一方向 192‧‧‧ first direction

194‧‧‧第二方向 194‧‧‧second direction

212‧‧‧第一參考線 212‧‧‧first reference line

222‧‧‧第二參考線 222‧‧‧Second reference line

312‧‧‧第一磁性單元 312‧‧‧The first magnetic unit

314‧‧‧第二磁性單元 314‧‧‧Second magnetic unit

322‧‧‧第一距離 322‧‧‧First distance

324‧‧‧第二距離 324‧‧‧Second Distance

390‧‧‧向上箭頭 390‧‧‧ up arrow

521、522、523、524、525、526‧‧‧距離 521, 522, 523, 524, 525, 526‧‧‧ distance

532‧‧‧第一位置 532‧‧‧first position

534‧‧‧第二位置 534‧‧‧Second position

536‧‧‧第三位置 536‧‧‧ third position

550‧‧‧處理腔室 550‧‧‧Processing chamber

732‧‧‧第一距離感測器 732‧‧‧First distance sensor

734‧‧‧第二距離感測器 734‧‧‧Second Distance Sensor

816‧‧‧第三磁性單元 816‧‧‧Third magnetic unit

818‧‧‧第四磁性單元 818‧‧‧Fourth magnetic unit

836‧‧‧第三距離感測器 836‧‧‧The third distance sensor

838‧‧‧第四距離感測器 838‧‧‧Fourth distance sensor

對本技術領域中具有通常知識者而言,充分及能夠實施之本揭露係更特別是提供於本說明的其餘部份,本說明的其他部份包括參照所附之圖式,其中:For those with ordinary knowledge in the technical field, a full and implementable disclosure is more particularly provided in the rest of this description. The other parts of this description include reference to the accompanying drawings, where

第1圖繪示根據此處所述實施例之設備的示意圖; FIG. 1 shows a schematic diagram of a device according to the embodiments described herein;

第2a-b圖繪示根據此處所述實施例之用於數個磁性單元之不同對準的示意圖; Figures 2a-b show schematic diagrams for different alignments of several magnetic units according to the embodiments described herein;

第3a-b、4及5a-b圖繪示根據此處所述實施例之用以決定載體懸浮系統之對準的方法;以及 Figures 3a-b, 4 and 5a-b illustrate methods for determining the alignment of a carrier suspension system according to the embodiments described herein; and

第6a-c、及7-9圖繪示根據此處所述實施例之設備的示意圖。 Figures 6a-c, and 7-9 show schematic diagrams of a device according to the embodiments described herein.

Claims (20)

一種用以決定一載體懸浮系統之一對準的方法,該載體懸浮系統包括複數個磁性單元(170),該些磁性單元適用於非接觸懸浮一載體(110),該些磁性單元包括一第一磁性單元(312)及一第二磁性單元(314),該方法包括: 測量從該第一磁性單元至該載體之一第一距離(322); 測量從該第二磁性單元至該載體之一第二距離(324);以及 自至少該第一距離及該第二距離決定該載體懸浮系統之該對準。A method for determining the alignment of a carrier suspension system. The carrier suspension system includes a plurality of magnetic units (170). The magnetic units are suitable for non-contact suspension of a carrier (110). The magnetic units include a first A magnetic unit (312) and a second magnetic unit (314). The method includes: Measuring a first distance from the first magnetic unit to the carrier (322); Measuring a second distance from the second magnetic unit to the carrier (324); and The alignment of the carrier suspension system is determined from at least the first distance and the second distance. 如申請專利範圍第1項所述之方法,更包括: 藉由該載體懸浮系統非接觸懸浮該載體,該第一距離及該第二距離係在該載體非接觸懸浮時測量;或者 藉由一機械支撐件(140)機械地支撐該載體,該第一距離及該第二距離係在該載體機械地支撐時測量。The method described in item 1 of the patent application scope further includes: Non-contact suspending the carrier by the carrier suspension system, the first distance and the second distance are measured when the carrier is non-contact suspending; or The carrier is mechanically supported by a mechanical support (140), and the first distance and the second distance are measured when the carrier is mechanically supported. 一種用以決定一載體懸浮系統之一對準的方法,該磁性懸浮系統包括複數個磁性單元(170),該些磁性單元適用於非接觸懸浮一載體(110),該些磁性單元包括一第一磁性單元(312)及一第二磁性單元(314),該方法包括: 當該載體係由至少該第一磁性單元非接觸懸浮時,測量從該第一磁性單元至該載體之一第一距離(322); 當該載體係由至少該第二磁性單元非接觸懸浮時,測量從該第二磁性單元至該載體之一第二距離(324);以及 從至少該第一距離及該第二距離決定該載體懸浮系統之該對準。A method for determining the alignment of a carrier suspension system. The magnetic suspension system includes a plurality of magnetic units (170). The magnetic units are suitable for non-contact suspension of a carrier (110). A magnetic unit (312) and a second magnetic unit (314). The method includes: Measuring the first distance from the first magnetic unit to the carrier when the carrier is non-contact suspended by at least the first magnetic unit (322); Measuring a second distance from the second magnetic unit to the carrier when the carrier is non-contact suspended by at least the second magnetic unit (324); and The alignment of the carrier suspension system is determined from at least the first distance and the second distance. 一種用以決定一載體懸浮系統之一對準的方法,該磁性懸浮系統包括複數個磁性單元(170),該些磁性單元適用於非接觸懸浮一載體(110),該些磁性單元包括一第一磁性單元(312)及一第二磁性單元(314),該方法包括: 當該載體係由一機械支撐件(140)機械地支撐時,測量從該第一磁性單元至該載體之一第一距離(322); 當該載體係由該機械支撐件機械地支撐時,測量從該第二磁性單元至該載體之一第二距離(324);以及 從至少該第一距離及該第二距離決定該載體懸浮系統之該對準及/或該機械支撐件之一對準。A method for determining the alignment of a carrier suspension system. The magnetic suspension system includes a plurality of magnetic units (170). The magnetic units are suitable for non-contact suspension of a carrier (110). The magnetic units include a first A magnetic unit (312) and a second magnetic unit (314). The method includes: When the carrier is mechanically supported by a mechanical support (140), measuring a first distance (322) from the first magnetic unit to the carrier; Measuring a second distance from the second magnetic unit to the carrier when the carrier is mechanically supported by the mechanical support (324); and The alignment of the carrier suspension system and / or the alignment of one of the mechanical supports is determined from at least the first distance and the second distance. 如申請專利範圍第2項所述之方法,其中該機械支撐件包括或機械地連接於一磁性驅動結構(180),該磁性驅動結構用以在一載體傳送方向中驅動該載體,使得決定該機械支撐件之一對準係提供決定該磁性驅動結構之一對準。The method according to item 2 of the patent application scope, wherein the mechanical support comprises or is mechanically connected to a magnetic driving structure (180) for driving the carrier in a carrier conveying direction, so that the An alignment of the mechanical support provides an alignment that determines the magnetic drive structure. 如申請專利範圍第4項所述之方法,其中該機械支撐件包括或機械地連接於一磁性驅動結構(180),該磁性驅動結構用以在一載體傳送方向中驅動該載體,使得決定該機械支撐件之該對準係提供決定該磁性驅動結構之一對準。The method according to item 4 of the patent application scope, wherein the mechanical support comprises or is mechanically connected to a magnetic driving structure (180) for driving the carrier in a carrier conveying direction, so that the The alignment of the mechanical support provides an alignment that determines one of the magnetic drive structures. 如申請專利範圍第1項所述之方法,其中該第一距離及該第二距離係在複數個真空條件下測量。The method according to item 1 of the scope of patent application, wherein the first distance and the second distance are measured under a plurality of vacuum conditions. 如申請專利範圍第3項所述之方法,其中該第一距離及該第二距離係在複數個真空條件下測量。The method of claim 3, wherein the first distance and the second distance are measured under a plurality of vacuum conditions. 如申請專利範圍第4項所述之方法,其中該第一距離及該第二距離係在複數個真空條件下測量。The method according to item 4 of the scope of patent application, wherein the first distance and the second distance are measured under a plurality of vacuum conditions. 如申請專利範圍第1項所述之方法, 其中該些磁性單元更包括一第三磁性單元,其中該第一距離及該第二距離之至少一者係在該載體位於一第一位置(532)中時測量,該方法更包括: 當該載體係位於一第二位置(534)中時,測量從該第三磁性單元至該載體之一第三距離; 其中該載體懸浮系統之該對準係從至少該第一距離、該第二距離、及該第三距離、或其之一組合決定。The method according to item 1 of the scope of patent application, wherein the magnetic units further include a third magnetic unit, wherein at least one of the first distance and the second distance is located at a first position of the carrier (532 ) Zhongshi measurement, the method further includes: When the carrier is located in a second position (534), measuring a third distance from the third magnetic unit to the carrier; The alignment of the carrier suspension system is determined from at least the first distance, the second distance, and the third distance, or a combination thereof. 如申請專利範圍第3項所述之方法, 其中該些磁性單元更包括一第三磁性單元,其中該第一距離及該第二距離之至少一者係在該載體位於一第一位置(532)中時測量,該方法更包括: 當該載體係位於一第二位置(534)中時,測量從該第三磁性單元至該載體之一第三距離; 其中該載體懸浮系統之該對準係從至少該第一距離、該第二距離、及該第三距離、或其之一組合決定。The method according to item 3 of the scope of patent application, wherein the magnetic units further include a third magnetic unit, wherein at least one of the first distance and the second distance is located at a first position of the carrier (532 ) Zhongshi measurement, the method further includes: When the carrier is located in a second position (534), measuring a third distance from the third magnetic unit to the carrier; The alignment of the carrier suspension system is determined from at least the first distance, the second distance, and the third distance, or a combination thereof. 如申請專利範圍第4項所述之方法,其中該些磁性單元更包括一第三磁性單元,其中該第一距離及該第二距離之至少一者係在該載體位於一第一位置(532)中時測量,該方法更包括: 當該載體係位於一第二位置(534)中時,測量從該第三磁性單元至該載體之一第三距離; 其中該載體懸浮系統之該對準係從至少該第一距離、該第二距離、及該第三距離、或其之一組合決定。The method according to item 4 of the scope of patent application, wherein the magnetic units further include a third magnetic unit, wherein at least one of the first distance and the second distance is located at a first position of the carrier (532 ) Zhongshi measurement, the method further includes: When the carrier is located in a second position (534), measuring a third distance from the third magnetic unit to the carrier; The alignment of the carrier suspension system is determined from at least the first distance, the second distance, and the third distance, or a combination thereof. 如申請專利範圍第1至12項之任一者所述之方法,其中決定該對準包括: 從至少該第一距離及該第二距離計算一參考值,該參考值用於從該載體至該些磁性單元之一磁性單元的一距離。The method as described in any one of claims 1 to 12, wherein determining the alignment includes: A reference value is calculated from at least the first distance and the second distance, and the reference value is used for a distance from the carrier to a magnetic unit of the magnetic units. 如申請專利範圍第1至12項之任一者所述之方法,更包括: 對該載體懸浮系統執行一對準操作,該對準操作包括:至少部份基於決定之該對準,調整該些磁性單元之至少一磁性單元的一位置。The method described in any one of claims 1 to 12 of the patent application scope further includes: Performing an alignment operation on the carrier suspension system, the alignment operation includes: adjusting a position of at least one magnetic unit of the magnetic units based at least in part on the determined alignment. 如申請專利範圍第1至12項之任一者所述之方法,更包括: 藉由該些磁性單元非接觸懸浮該載體或一其他載體;以及 至少部份基於決定之該對準,控制一第一懸浮距離及一第二懸浮距離,該第一懸浮距離係從該第一磁性單元至非接觸懸浮之該載體,該第二懸浮距離係從該第二磁性單元至非接觸懸浮之該載體。The method described in any one of claims 1 to 12 of the patent application scope further includes: Non-contact suspension of the carrier or another carrier by the magnetic units; and Based at least in part on the determined alignment, a first levitating distance and a second levitating distance are controlled, the first levitating distance is from the first magnetic unit to the non-contact levitating carrier, and the second levitating distance is from The second magnetic unit to the carrier suspended in non-contact. 如申請專利範圍第1至12項之任一者所述之方法,其中該載體係為一第一載體,該方法更包括: 測量從該第一磁性單元至一第二載體之一第三距離,該第二載體具有不同於該第一載體之一尺寸; 測量從該第二磁性單元至該第二載體之一第四距離;以及 從至少該第三距離及該第四距離決定該載體懸浮系統之該對準。The method according to any one of claims 1 to 12, wherein the carrier is a first carrier, and the method further includes: Measuring a third distance from the first magnetic unit to a second carrier, the second carrier having a size different from that of the first carrier; Measuring a fourth distance from the second magnetic unit to one of the second carriers; and The alignment of the carrier suspension system is determined from at least the third distance and the fourth distance. 如申請專利範圍第1至12項之任一者所述之方法,其中該第一距離係由一第一距離感測器(732)測量,該第一距離感測器設置於該第一磁性單元,及該第二距離係由一第二距離感測器(734)測量,該第二距離感測器設置於該第二磁性單元。The method according to any one of claims 1 to 12, wherein the first distance is measured by a first distance sensor (732), and the first distance sensor is disposed on the first magnetic field. The unit and the second distance are measured by a second distance sensor (734), and the second distance sensor is disposed on the second magnetic unit. 如申請專利範圍第17項所述之方法,更包括: 利用該第一距離感測器及/或該第二距離感測器來控制該載體或一其他載體之一非接觸懸浮。The method described in item 17 of the scope of patent application further includes: The first distance sensor and / or the second distance sensor are used to control the non-contact suspension of the carrier or one of the other carriers. 一種設備(500),包括: 一載體懸浮系統,包括複數個磁性單元(170),該些磁性單元適用於非接觸懸浮一載體(110),該些磁性單元包括一第一磁性單元(312)及一第二磁性單元(314); 一第一距離感測器(732); 一第二距離感測器(734);以及 一控制單元(750),連接於該第一距離感測器及該第二距離感測器,該控制單元裝配以從至少一第一距離及一第二距離決定該載體懸浮系統之一對準,該第一距離係從該第一磁性單元至該載體,該第二距離係從該第二磁性單元至該載體。A device (500) comprising: A carrier suspension system includes a plurality of magnetic units (170). The magnetic units are suitable for non-contact suspension of a carrier (110). The magnetic units include a first magnetic unit (312) and a second magnetic unit (314). ); A first distance sensor (732); A second distance sensor (734); and A control unit (750) connected to the first distance sensor and the second distance sensor. The control unit is configured to determine an alignment of one of the carrier suspension systems from at least a first distance and a second distance. The first distance is from the first magnetic unit to the carrier, and the second distance is from the second magnetic unit to the carrier. 如申請專利範圍第19項所述之設備,更包括: 一機械支撐件(140),適用於機械地支撐該載體;及 一磁性驅動結構(180),用以在一載體傳送方向中驅動該載體,該機械支撐件包括或機械地連接於該磁性驅動結構,該控制單元裝配以用於從至少該第一距離及該第二距離決定該磁性驅動結構之一對準。The equipment described in item 19 of the scope of patent application, further includes: A mechanical support (140) adapted to mechanically support the carrier; and A magnetic drive structure (180) is used to drive the carrier in a carrier conveying direction. The mechanical support includes or is mechanically connected to the magnetic drive structure. The control unit is configured for moving from at least the first distance and the The second distance determines the alignment of one of the magnetic driving structures.
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