KR20190031430A - 캐리어 부상 시스템의 정렬을 결정하기 위한 방법 - Google Patents

캐리어 부상 시스템의 정렬을 결정하기 위한 방법 Download PDF

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Publication number
KR20190031430A
KR20190031430A KR1020187027479A KR20187027479A KR20190031430A KR 20190031430 A KR20190031430 A KR 20190031430A KR 1020187027479 A KR1020187027479 A KR 1020187027479A KR 20187027479 A KR20187027479 A KR 20187027479A KR 20190031430 A KR20190031430 A KR 20190031430A
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KR
South Korea
Prior art keywords
carrier
distance
magnetic
magnetic unit
alignment
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KR1020187027479A
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English (en)
Korean (ko)
Inventor
크리스찬 볼프강 에흐만
브리타 스패
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20190031430A publication Critical patent/KR20190031430A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Control Of Vehicles With Linear Motors And Vehicles That Are Magnetically Levitated (AREA)
KR1020187027479A 2017-09-15 2017-09-15 캐리어 부상 시스템의 정렬을 결정하기 위한 방법 KR20190031430A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/073319 WO2019052657A1 (en) 2017-09-15 2017-09-15 METHOD FOR DETERMINING THE ALIGNMENT OF A SUPPORT LEVITATION SYSTEM

Publications (1)

Publication Number Publication Date
KR20190031430A true KR20190031430A (ko) 2019-03-26

Family

ID=60019868

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187027479A KR20190031430A (ko) 2017-09-15 2017-09-15 캐리어 부상 시스템의 정렬을 결정하기 위한 방법

Country Status (5)

Country Link
JP (1) JP6704059B2 (ja)
KR (1) KR20190031430A (ja)
CN (1) CN109791905A (ja)
TW (1) TW201923943A (ja)
WO (1) WO2019052657A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113710828A (zh) * 2019-04-29 2021-11-26 应用材料公司 磁悬浮系统、磁悬浮系统的基座和载体以及悬浮载体的方法
KR102319196B1 (ko) * 2020-01-08 2021-10-29 세메스 주식회사 컨베이어 시스템 및 컨베이어 시스템에서의 정렬 방법
WO2022073613A1 (en) * 2020-10-08 2022-04-14 Applied Materials, Inc. Carrier transport system, carrier therefor, vacuum processing apparatus, and method of transportation of a carrier in a vacuum chamber
CN112103231B (zh) * 2020-11-17 2021-03-02 西安奕斯伟硅片技术有限公司 一种晶圆盒装载装置和晶圆盒装载方法
JP7216752B2 (ja) 2021-02-08 2023-02-01 キヤノントッキ株式会社 計測装置、インライン型蒸着装置および調整方法
JP7491870B2 (ja) 2021-06-22 2024-05-28 キヤノントッキ株式会社 計測装置、およびインライン型蒸着装置
WO2023118929A1 (en) * 2021-12-21 2023-06-29 Applied Materials, Inc. Method of inspecting a carrier transport system, vacuum processing apparatus, computer program, and computer-readable storage medium
CN115009857B (zh) * 2022-04-22 2023-07-25 江苏匠准数控机床有限公司 一种工件运载输送方法及装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07435Y2 (ja) * 1988-10-11 1995-01-11 旭硝子株式会社 真空処理炉の搬送装置
JPH0712335U (ja) * 1993-07-23 1995-02-28 神鋼電機株式会社 磁気懸垂式搬送装置
US8960099B2 (en) * 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
JP4543181B2 (ja) * 2004-12-20 2010-09-15 国立大学法人九州工業大学 超電導磁気浮上による非接触搬送装置
JP5058546B2 (ja) * 2006-09-27 2012-10-24 キヤノン株式会社 力発生装置およびこれを用いたステージ装置ならびに露光装置
JP4451901B2 (ja) * 2007-08-27 2010-04-14 キヤノンアネルバ株式会社 搬送装置
US7770714B2 (en) * 2007-08-27 2010-08-10 Canon Anelva Corporation Transfer apparatus
JP2012055063A (ja) * 2010-08-31 2012-03-15 Nikon Corp 移動体装置、露光装置、及びデバイス製造方法
KR20150087296A (ko) * 2012-11-20 2015-07-29 가부시키가이샤 니콘 노광 장치, 이동체 장치, 및 디바이스 제조 방법
DE102014005547B4 (de) * 2014-04-16 2016-09-15 Mecatronix Ag Vorrichtung und Verfahren zum Halten, Positionieren und/oder Bewegen eines Objekts

Also Published As

Publication number Publication date
WO2019052657A1 (en) 2019-03-21
TW201923943A (zh) 2019-06-16
CN109791905A (zh) 2019-05-21
JP2019533896A (ja) 2019-11-21
JP6704059B2 (ja) 2020-06-03

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