CN109761038B - 工件输送系统及其控制方法 - Google Patents

工件输送系统及其控制方法 Download PDF

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Publication number
CN109761038B
CN109761038B CN201811252731.XA CN201811252731A CN109761038B CN 109761038 B CN109761038 B CN 109761038B CN 201811252731 A CN201811252731 A CN 201811252731A CN 109761038 B CN109761038 B CN 109761038B
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CN
China
Prior art keywords
quadrant
point
arm
articulated robot
workpiece
Prior art date
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Active
Application number
CN201811252731.XA
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English (en)
Chinese (zh)
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CN109761038A (zh
Inventor
猪股徹也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
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Nidec Sankyo Corp
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Publication of CN109761038A publication Critical patent/CN109761038A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/905—Control arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0241—One-dimensional joints
    • B25J17/025—One-dimensional joints mounted in series
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1656—Program controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Program controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/904—Devices for picking-up and depositing articles or materials provided with rotary movements only
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40476—Collision, planning for collision free path

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Data Mining & Analysis (AREA)
  • Physics & Mathematics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201811252731.XA 2017-11-09 2018-10-25 工件输送系统及其控制方法 Active CN109761038B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-216580 2017-11-09
JP2017216580A JP6962790B2 (ja) 2017-11-09 2017-11-09 ワーク搬送システム及びその制御方法

Publications (2)

Publication Number Publication Date
CN109761038A CN109761038A (zh) 2019-05-17
CN109761038B true CN109761038B (zh) 2021-02-19

Family

ID=66326824

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811252731.XA Active CN109761038B (zh) 2017-11-09 2018-10-25 工件输送系统及其控制方法

Country Status (3)

Country Link
US (1) US10875726B2 (https=)
JP (1) JP6962790B2 (https=)
CN (1) CN109761038B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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US10919153B2 (en) * 2017-03-06 2021-02-16 Canon Kabushiki Kaisha Teaching method for teaching operations to a plurality of robots and teaching system used therefor
JP7400300B2 (ja) * 2019-09-27 2023-12-19 ブラザー工業株式会社 搬送装置と工作機械
JP7404797B2 (ja) * 2019-11-15 2023-12-26 セイコーエプソン株式会社 ロボットシステムの制御方法
WO2021220931A1 (ja) * 2020-04-27 2021-11-04 ファナック株式会社 処理ツールのマスタリング方法
JP7245198B2 (ja) * 2020-06-09 2023-03-23 アイダエンジニアリング株式会社 トランスファフィーダ装置及びトランスファフィーダ装置の制御方法
US11731282B2 (en) * 2021-03-03 2023-08-22 Dishcare Inc. Dish handling robot
JP7628048B2 (ja) * 2021-04-01 2025-02-07 ニデックインスツルメンツ株式会社 ワーク搬送システム及びその制御方法
JP2024042320A (ja) * 2022-09-15 2024-03-28 ニデックインスツルメンツ株式会社 ロボットの制御方法及び制御装置
CN116270109A (zh) * 2023-03-06 2023-06-23 上海力申科学仪器有限公司 综合手术台姿态确定及水平复位的方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63301305A (ja) 1987-06-01 1988-12-08 Fujitsu Ltd マニピュレ−タ型ロボットの軌道制御方法
JPH08106319A (ja) 1994-10-05 1996-04-23 Ricoh Co Ltd ロボットの制御方法
TW444275B (en) * 1998-01-13 2001-07-01 Toshiba Corp Processing device, laser annealing device, laser annealing method, manufacturing device and substrate manufacturing device for panel display
JP2003170384A (ja) * 2001-12-04 2003-06-17 Rorze Corp 平板状物の搬送用スカラ型ロボットおよび平板状物の処理システム
CN100342519C (zh) * 2003-07-16 2007-10-10 东京毅力科创株式会社 搬送装置及驱动机构
WO2006109791A1 (ja) * 2005-04-11 2006-10-19 Nidec Sankyo Corporation 多関節型ロボット
JP4595053B2 (ja) * 2005-04-11 2010-12-08 日本電産サンキョー株式会社 多関節型ロボット
JP2007005435A (ja) * 2005-06-22 2007-01-11 Rorze Corp 処理装置
US20070018469A1 (en) * 2005-07-25 2007-01-25 Multimetrixs, Llc Contamination-free edge gripping mechanism with withdrawable pads and method for loading/unloading and transferring flat objects
TWI398335B (zh) * 2006-11-27 2013-06-11 日本電產三協股份有限公司 Workpiece conveying system
JP4970128B2 (ja) * 2007-04-27 2012-07-04 日本電産サンキョー株式会社 産業用ロボット及び集合処理装置
JP5017076B2 (ja) * 2007-12-21 2012-09-05 テルモ株式会社 マニピュレータシステム及びマニピュレータの制御方法
JP5504641B2 (ja) * 2009-02-13 2014-05-28 株式会社安川電機 基板搬送用ロボット及びそれを備えた基板搬送装置、半導体製造装置
JP5610952B2 (ja) * 2010-09-24 2014-10-22 日本電産サンキョー株式会社 産業用ロボット
JP5541299B2 (ja) * 2012-01-31 2014-07-09 株式会社安川電機 搬送システム
US9742250B2 (en) * 2012-11-30 2017-08-22 Applied Materials, Inc. Motor modules, multi-axis motor drive assemblies, multi-axis robot apparatus, and electronic device manufacturing systems and methods
JP6710518B2 (ja) * 2015-12-03 2020-06-17 東京エレクトロン株式会社 搬送装置及び補正方法
JP6914811B2 (ja) * 2017-11-09 2021-08-04 日本電産サンキョー株式会社 水平多関節型ロボット及びその原点復帰方法

Also Published As

Publication number Publication date
US20190135556A1 (en) 2019-05-09
JP2019084651A (ja) 2019-06-06
US10875726B2 (en) 2020-12-29
JP6962790B2 (ja) 2021-11-05
CN109761038A (zh) 2019-05-17

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