CN109690367A - 波长转换片材、层叠体及发光装置、以及波长转换片材的制造方法 - Google Patents

波长转换片材、层叠体及发光装置、以及波长转换片材的制造方法 Download PDF

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Publication number
CN109690367A
CN109690367A CN201780054505.8A CN201780054505A CN109690367A CN 109690367 A CN109690367 A CN 109690367A CN 201780054505 A CN201780054505 A CN 201780054505A CN 109690367 A CN109690367 A CN 109690367A
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silicone resin
wavelength conversion
formula
structural unit
unit represented
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Pending
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CN201780054505.8A
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English (en)
Chinese (zh)
Inventor
增井建太朗
土居笃典
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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Publication of CN109690367A publication Critical patent/CN109690367A/zh
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774Aluminates
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02Use of particular materials as binders, particle coatings or suspension media therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/04Optical design
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30Elements containing photoluminescent material distinct from or spaced from the light source
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0008Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optical Filters (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201780054505.8A 2016-09-07 2017-09-04 波长转换片材、层叠体及发光装置、以及波长转换片材的制造方法 Pending CN109690367A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-175093 2016-09-07
JP2016175093 2016-09-07
PCT/JP2017/031730 WO2018047758A1 (ja) 2016-09-07 2017-09-04 波長変換シート、積層体および発光装置、並びに、波長変換シートの製造方法

Publications (1)

Publication Number Publication Date
CN109690367A true CN109690367A (zh) 2019-04-26

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Application Number Title Priority Date Filing Date
CN201780054505.8A Pending CN109690367A (zh) 2016-09-07 2017-09-04 波长转换片材、层叠体及发光装置、以及波长转换片材的制造方法

Country Status (7)

Country Link
US (1) US20210284903A1 (enExample)
EP (1) EP3511611A4 (enExample)
JP (1) JP6410903B2 (enExample)
KR (1) KR20190041020A (enExample)
CN (1) CN109690367A (enExample)
TW (1) TW201819488A (enExample)
WO (1) WO2018047758A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115103891A (zh) * 2020-02-14 2022-09-23 艾迈斯-欧司朗国际有限责任公司 波长转换器、其制备方法和包括该元件的发光装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7842647B2 (en) 2006-02-03 2010-11-30 Bayer Cropscience Lp Stable, concentrated herbicidal compositions
WO2019186729A1 (ja) * 2018-03-27 2019-10-03 日立化成株式会社 波長変換部材、バックライトユニット、画像表示装置及び硬化性組成物
TWI808178B (zh) * 2019-05-21 2023-07-11 隆達電子股份有限公司 波長轉換物質及發光裝置
TWI705123B (zh) * 2019-10-29 2020-09-21 隆達電子股份有限公司 波長轉換物質以及發光裝置
EP4574920A1 (fr) * 2023-12-21 2025-06-25 The Swatch Group Research and Development Ltd Matériau photoluminescent plus performant

Citations (7)

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JP2001152020A (ja) * 1999-11-29 2001-06-05 Dow Corning Toray Silicone Co Ltd 室温硬化性シリコーンゴム組成物
JP2003095899A (ja) * 2001-09-27 2003-04-03 Hoyu Co Ltd ヘアマスカラ
US20110186792A1 (en) * 2010-02-01 2011-08-04 Nitto Denko Corporation Silicone resin composition
CN102791801A (zh) * 2010-02-19 2012-11-21 东丽株式会社 含有荧光体的硅氧烷固化物、其制造方法、含有荧光体的硅氧烷组合物、其组合物前体、片状成型物、led封装、发光装置及led安装基板的制造方法
JP2012230309A (ja) * 2011-04-27 2012-11-22 Kaneka Corp 貼り合せ光学部品
JP2012255125A (ja) * 2011-05-17 2012-12-27 Mitsubishi Chemicals Corp 熱硬化性樹脂組成物、半導体デバイス用部材、及びそれを用いた半導体デバイス
CN103094460A (zh) * 2011-11-07 2013-05-08 信越化学工业株式会社 荧光体高填充波长变换片、使用该波长变换片的发光半导体装置的制造方法及该发光半导体装置

Family Cites Families (9)

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JP5552748B2 (ja) * 2008-03-28 2014-07-16 三菱化学株式会社 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置
JP5566785B2 (ja) * 2010-06-22 2014-08-06 日東電工株式会社 複合シート
WO2012081411A1 (ja) * 2010-12-13 2012-06-21 東レ株式会社 蛍光体シート、これを用いたledおよび発光装置ならびにledの製造方法
JP2012233118A (ja) * 2011-05-06 2012-11-29 Kaneka Corp 硬化性組成物
JP5862066B2 (ja) 2011-06-16 2016-02-16 東レ株式会社 蛍光体含有シート、それを用いたled発光装置およびその製造方法
JP6309898B2 (ja) * 2012-01-16 2018-04-11 ダウ シリコーンズ コーポレーション 光学物品及び形成方法
JP5819774B2 (ja) * 2012-05-01 2015-11-24 株式会社ニューギン 遊技機
JP2014116587A (ja) * 2012-11-16 2014-06-26 Toray Ind Inc 蛍光体含有樹脂シート、これを用いたled素子およびその製造方法
CN105705599B (zh) * 2013-09-18 2018-10-23 美国陶氏有机硅公司 树脂-线性有机硅氧烷嵌段共聚物的组合物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001152020A (ja) * 1999-11-29 2001-06-05 Dow Corning Toray Silicone Co Ltd 室温硬化性シリコーンゴム組成物
JP2003095899A (ja) * 2001-09-27 2003-04-03 Hoyu Co Ltd ヘアマスカラ
US20110186792A1 (en) * 2010-02-01 2011-08-04 Nitto Denko Corporation Silicone resin composition
CN102791801A (zh) * 2010-02-19 2012-11-21 东丽株式会社 含有荧光体的硅氧烷固化物、其制造方法、含有荧光体的硅氧烷组合物、其组合物前体、片状成型物、led封装、发光装置及led安装基板的制造方法
JP2012230309A (ja) * 2011-04-27 2012-11-22 Kaneka Corp 貼り合せ光学部品
JP2012255125A (ja) * 2011-05-17 2012-12-27 Mitsubishi Chemicals Corp 熱硬化性樹脂組成物、半導体デバイス用部材、及びそれを用いた半導体デバイス
CN103094460A (zh) * 2011-11-07 2013-05-08 信越化学工业株式会社 荧光体高填充波长变换片、使用该波长变换片的发光半导体装置的制造方法及该发光半导体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115103891A (zh) * 2020-02-14 2022-09-23 艾迈斯-欧司朗国际有限责任公司 波长转换器、其制备方法和包括该元件的发光装置

Also Published As

Publication number Publication date
KR20190041020A (ko) 2019-04-19
WO2018047758A1 (ja) 2018-03-15
US20210284903A1 (en) 2021-09-16
JP6410903B2 (ja) 2018-10-24
EP3511611A4 (en) 2020-03-25
TW201819488A (zh) 2018-06-01
JP2018044158A (ja) 2018-03-22
EP3511611A1 (en) 2019-07-17

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