CN1096112C - 晶片支承和/或输送机 - Google Patents

晶片支承和/或输送机 Download PDF

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CN1096112C
CN1096112C CN97125551A CN97125551A CN1096112C CN 1096112 C CN1096112 C CN 1096112C CN 97125551 A CN97125551 A CN 97125551A CN 97125551 A CN97125551 A CN 97125551A CN 1096112 C CN1096112 C CN 1096112C
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wafer
pitman
support
supporting
conveyer
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CN1187031A (zh
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韩石彬
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SK Hynix Inc
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LG Semicon Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

一种晶片支承和/或输送机，包括至少一个设置有多个用于插入晶片边缘的槽的支架，从晶片下部支承插入槽内的晶片，把支架连到传动机构用的第一连接棒；有多个用于插入晶片边缘的槽的至少两个固定棒，从晶片两边的顶固定晶片；把固定棒连到传动机构用的第二连接棒。第一或第二连接棒与支架之间设置的连接板，由此提高机器的稳定性。

Description

晶片支承和/或输送机
                             技术领域：
本发明涉及半导体器件湿式清洗机中用的晶片支承和/或输送机。
                             背景技术：
清洗晶片用的常规晶片湿式清洗机的构成方式是，使晶片放在处于外槽里的内洗槽中，清洗溶液从底部流入洗槽，溢流过槽，之后从外槽排出或在槽内循环，由此清洗晶片。这里，晶片放在支承多个晶片的晶片支架上，并把晶片支架输送进洗槽。上述的晶片清洗机中用的常规洗槽已由美国专利5071776公开，晶片支架已由美国专利5011041公开，它有U形边。
常规的晶片湿式清洗机中，清洗溶液经设置于清洗处理槽底的流控板流进洗槽，清洗放在晶片支架中的晶片，之后，溢流过洗槽到排放槽。经排放槽排放出的清洗溶液废弃或循环。
由于半导体器件是高度集成的，因而，晶片清洗技术和设备变得很重要。这是因为晶片清洗机造成的轻微污染都会对器件的可靠性造成影响。这降低了晶片清洗效果，而造成低质芯片。而且，随着晶片直径越大，就需要大尺寸的洗槽。因此，为了降低清洗机的尺寸，则需把清洗机的洗槽和其它部件做得最好。
为此，把支承和输送晶片的支承形状如图1所示盒形变成图2所示船形21。由此，把晶片支架在洗槽中占据的面积和晶片与支架的接触部分变成最小，以消除从洗槽引入的微小外部污染源。
图1所示盒由侧壁11和12相距规定的距离而相互面对的方式构成，晶片10由按规定间隔设置在侧壁上的多个凸台13，14，15和16支承。图2中的船，卡盘24和25固定晶片的侧边缘，并将其输送到洗槽。卡盘24和25也可以固定船21，或只固定晶片。
按所述的常规方法，支承晶片的盒或船，或洗槽中固定晶片的卡盘均可能是外部污染源。例如，晶片会因与船接触而被污染。用上述的溢流系统的洗槽，由于污染源在晶片下面，污染材料从源沿清洗溶液在洗槽中流动时的流路而到达晶片的整个表面。这些污物在晶片上，因支承位于晶片下，或卡盘卡住晶片的边和底，因而，造成质量低劣的半导体器件。
                      发明内容：
本发明涉及晶片支承和/或输送机。它基本上克服了现有技术中存在的局限性和缺陷造成的几个问题。
本发明的目的是，提供晶片支承和/或输送机，它支承晶片的侧边顶部而在晶片底的支承面积最小，以减小污染源，改变晶片的支承位置，减小污染，由此防止晶片被污染。
与晶片底支承面积较宽，晶片底的大部分被支承的常规清洗机不同，本发明是在晶片侧边顶部支承晶片，而在晶片底只有一个支承点，在晶片顶构成卡盘系统以牢固地固定晶片。
按本发明的晶片支承和/或输送机包括至少一个支架，支架有多个槽，晶片边缘插入这些槽中，在晶片下部支承插入槽内的晶片；把支架连到传动机构用的第一连接棒；至少两个固定棒，它们有多个插入晶片边缘用的槽，从晶片两边的顶上固定晶片；把固定棒连到传动机构用的第二连接棒。设在第一连接棒与支架之间，或第二连接棒与支架之间的连接板，以此增加机器的稳定性。最好在第一、第二连接棒与传动机构之间加连接件，使连接棒弯曲。
应该明白，已做的一般性说明和以下的详细说明均是为了进一步说明本发明要求保护的典型例和说明例。
                        附图说明：
为进一步了解发明而提供的附图是本说明书的一个构成部分，它们与本发明的实施例一起用于说明发明的原理。
图1是常规的晶片支架；
图2是常规的晶片船；
图3是按本发明的晶片支承和/或输送机说明图；
图4是按本发明的晶片支架的透视图；
图5A是按本发明的晶片固定棒的透视图；
图5B是按本发明的晶片固定棒的横载面图；
图6是用按本发明的晶片支承和/或输送机固定晶片的操作说明图；
图7和8是用按本发明的晶片支承和/或输送机固定的晶片状态图；
图9是用按本发明的晶片支承和/或输送机的晶片固定在洗槽中的状态图。
                         具体实施方式：
现在参见附图说明本发明的实施例。
图3是按本发明的晶片支承和/或输送机的基本结构说明图。参见图3，按本发明的晶片支承和/或输送机包括：用于在晶片底部支承要输送的晶片的支架30，和在晶片侧边部分的顶支承和固定晶片的至少两个固定棒40。图3展示出用四个固定棒的例子。
图4是按本发明的晶片支架的透视图。参见图4，在支架体31上构成多个固定晶片的槽32，和一连接棒33连接到支架体的一边，按此方式构成支架。如图6所示，按两个棒61和62搭接到支架体一边而成为三脚架的两条腿的形式构成第一连接棒。而且，最好在连接棒61和62中间构成可弯曲的连接件82和83，使连接棒按合适的角度弯曲。由第一连接棒33使支架30移动到预定的位置。
图5A和5B分别是按本发明的晶片固定棒40的透视图和横截面图。参见图5A和5B，在棒体41上按与支架体31的槽32相同的间隔构成固定晶片的多个槽42，并使第二连接棒43搭接到棒体41的一边，按此方式构成晶片固定棒40。用第二连接棒43移动固定棒40。如图6所示，首先，固定棒体41可以连接到连接板65，之后，连接到第二连接棒67的68。最好是用连接件85和86连接第二连接棒和连接板65以按规定的角度弯曲。
第一和第二连接棒连到机器人手臂(未示出)或自动控制器(未示出)的传动机构，以便对其精确控制。它们也可以相互控制。构成机器的上述零部件的材料最好是石英，因为石英强度高不会产生微粒。而且，在第二连接棒与支架之间可以加连接板使其互连。在第一、第二连接棒与传动机构之间设置将它们固定用的中间连接板。
图6是用按本发明的晶片支承和/或输送机固定晶片的操作说明图。参见图6，自动或相互控制连接了四根固定棒66的连接板65，使连接棒向下旋转，把晶片1插入四个固定棒66上构成的槽中，使其设置成一行。移动连接到支架63上的两个连接棒61和62，使支架体上构成的槽与每个晶片1的顶对应。之后，固定棒和支架把晶片固定成图7和图8所示状态，图7所示的晶片支承和输送机的上边放下。
图9展示出用所述晶片支承和/或输送机固定的晶片放入溢流型洗槽的内槽中的状态。用其中已放置有晶片的晶片清洗机时，清洗溶液从内槽底供给，清洗晶片，并溢流过槽，溢流清洗溶液收集到外槽里，之后废弃或循环。
如上所述，如果晶片清洗工艺采用按本发明的晶片支承和/或输送机，当晶片在洗槽中清洗时，能减小微粒产生而提高清洗效果，因为，支架的尺寸较小。
本领域的技术人员应了解，本发明还会有各种改型和变化，但它们均不脱离本发明的精神和范围而属于本发明要求保护的范围。

Claims (2)

1.一种晶片支承和/或输送机，包括：
至少一个支架，它有插入晶片边缘用的多个槽，用于支承插入槽内的晶片的下部；
第一连接棒，用于把支架连接到传动结构；
至少两个固定棒，它们有用于插入晶片边缘的多个槽，在晶片两边的顶固定晶片；和
第二连接棒，用于把固定棒连接到传动机构，
其中，在第一连接棒和支架之间加有使其互连的连接板，
其中，在第二连接棒与支架之间加有使其互连的连接板，
在第一、第二连接棒和传动机构之间加有使其互连的连接板。
2.按权利要求1的晶片支承和/或输送机，其中，在第一、第二连接棒和传动机构之间加有使连接棒弯曲的连接件。
CN97125551A 1996-12-28 1997-12-19 晶片支承和/或输送机 Expired - Fee Related CN1096112C (zh)

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KR1019960075706A KR100226489B1 (ko) 1996-12-28 1996-12-28 웨이퍼 지지 및 이송 기구
KR75706/96 1996-12-28

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CN1096112C true CN1096112C (zh) 2002-12-11

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JP (1) JP4332867B2 (zh)
KR (1) KR100226489B1 (zh)
CN (1) CN1096112C (zh)
DE (1) DE19753471C2 (zh)

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JP4332867B2 (ja) 2009-09-16
US5913429A (en) 1999-06-22
JPH10194453A (ja) 1998-07-28
CN1187031A (zh) 1998-07-08
DE19753471C2 (de) 2003-03-13
KR19980056436A (ko) 1998-09-25
KR100226489B1 (ko) 1999-10-15
DE19753471A1 (de) 1998-07-02

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