CN109576666B - 基板支承构造体和包括其的真空蒸镀装置及蒸镀方法 - Google Patents

基板支承构造体和包括其的真空蒸镀装置及蒸镀方法 Download PDF

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Publication number
CN109576666B
CN109576666B CN201810859502.8A CN201810859502A CN109576666B CN 109576666 B CN109576666 B CN 109576666B CN 201810859502 A CN201810859502 A CN 201810859502A CN 109576666 B CN109576666 B CN 109576666B
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Prior art keywords
substrate
support
support structure
vapor deposition
substrate support
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CN201810859502.8A
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Chinese (zh)
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CN109576666A (zh
Inventor
大谷启介
相泽雄树
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Canon Tokki Corp
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Canon Tokki Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201810859502.8A 2017-09-29 2018-07-31 基板支承构造体和包括其的真空蒸镀装置及蒸镀方法 Active CN109576666B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0127182 2017-09-29
KR1020170127182A KR101904671B1 (ko) 2017-09-29 2017-09-29 기판지지구조체와, 이를 포함하는 진공 증착 장치 및 증착 방법

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Publication Number Publication Date
CN109576666A CN109576666A (zh) 2019-04-05
CN109576666B true CN109576666B (zh) 2021-07-06

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Country Status (3)

Country Link
JP (2) JP6700361B2 (ja)
KR (1) KR101904671B1 (ja)
CN (1) CN109576666B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021175824A (ja) 2020-03-13 2021-11-04 大日本印刷株式会社 有機デバイスの製造装置の蒸着室の評価方法、評価方法で用いられる標準マスク装置及び標準基板、標準マスク装置の製造方法、評価方法で評価された蒸着室を備える有機デバイスの製造装置、評価方法で評価された蒸着室において形成された蒸着層を備える有機デバイス、並びに有機デバイスの製造装置の蒸着室のメンテナンス方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1477693A (zh) * 2002-07-15 2004-02-25 夏普株式会社 基板用框架
CN100456446C (zh) * 2005-07-18 2009-01-28 三星Sdi株式会社 用于制造有机发光显示器的夹持器
KR20120006748A (ko) * 2010-07-13 2012-01-19 삼성전기주식회사 박판 이송용 매거진
CN103124803A (zh) * 2010-09-27 2013-05-29 夏普株式会社 蒸镀方法、蒸镀装置和有机el显示装置
CN106148901A (zh) * 2015-05-15 2016-11-23 株式会社达文希斯 有机膜蒸镀装置、方法及有机膜装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6508883B1 (en) * 2000-04-29 2003-01-21 Advanced Technology Materials, Inc. Throughput enhancement for single wafer reactor
JP4328496B2 (ja) * 2001-06-26 2009-09-09 株式会社日立プラントテクノロジー 枚葉基板の移載装置
JP2004042984A (ja) * 2002-07-15 2004-02-12 Sharp Corp 超大型基板用カセット
JP2005340357A (ja) * 2004-05-25 2005-12-08 Shinko Electric Co Ltd 基板収納容器、基板移載装置及び基板移載方法
TWM258968U (en) * 2004-07-22 2005-03-11 Au Optronics Corp Cassette
JP4553124B2 (ja) * 2004-12-16 2010-09-29 株式会社日立ハイテクノロジーズ 真空蒸着方法及びｅｌディスプレイ用パネル
US20070274809A1 (en) * 2006-05-26 2007-11-29 Hsien-Chang Kao Substrate cassette and transport system thereof
JP2009071041A (ja) * 2007-09-13 2009-04-02 Canon Anelva Corp 真空処理装置
JP5169738B2 (ja) * 2008-10-29 2013-03-27 凸版印刷株式会社 基板用カセット
KR20110102678A (ko) * 2010-03-11 2011-09-19 엘지디스플레이 주식회사 기판 저장용 카세트
JP2013247302A (ja) * 2012-05-29 2013-12-09 Hitachi High-Technologies Corp 基板バッファ並びに有機ｅｌデバイス製造装置及び同製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1477693A (zh) * 2002-07-15 2004-02-25 夏普株式会社 基板用框架
CN100456446C (zh) * 2005-07-18 2009-01-28 三星Sdi株式会社 用于制造有机发光显示器的夹持器
KR20120006748A (ko) * 2010-07-13 2012-01-19 삼성전기주식회사 박판 이송용 매거진
CN103124803A (zh) * 2010-09-27 2013-05-29 夏普株式会社 蒸镀方法、蒸镀装置和有机el显示装置
CN106148901A (zh) * 2015-05-15 2016-11-23 株式会社达文希斯 有机膜蒸镀装置、方法及有机膜装置

Also Published As

Publication number Publication date
CN109576666A (zh) 2019-04-05
JP7221238B2 (ja) 2023-02-13
JP6700361B2 (ja) 2020-05-27
JP2019065393A (ja) 2019-04-25
JP2020122221A (ja) 2020-08-13
KR101904671B1 (ko) 2018-10-04

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