CN109536125A - 一种有机硅led封装胶及其制备方法 - Google Patents
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Abstract
本发明涉及一种有机硅LED封装硅胶,包含A、B两个组分,A组分、B组分重量比为1:1:A组分包括:乙烯基硅树脂50~60份,增韧剂30~40份、催化剂0.1~0.3份;B组分包括:含氢硅树脂50~60份,含氢硅油30~40份,抑制剂0.4~0.5份,粘接剂4~5份;本发明制备的有机硅LED封装胶具有光衰性能好,耐硫化性能强,密封性能、耐老性能好,耐候性能好,抗黄变,易脱泡,便于操作等优点。
Description
技术领域
本发明涉及一种有机硅LED封装胶及其制备方法,属于封装材料领域。
技术背景
LED作为绿色照明能源,已经进入一个蓬勃发展的时期。对LED的要求也随之不断地提升,封装胶水作为保护芯片的最后一道防线,也面临着越来越多的挑战。光学性能(透光率、折射率)、耐硫化性能、粘接性能、高温光衰等、冷热冲击性能等各个方面的性能,需要做很大的突破才能适应LED行业的飞速发展。
有机硅封装胶的结构直接影响其光学性能及其它老化性能,通过对结构的调整,新型粘接剂的合成,新型增韧剂的加入,才能使胶水的性能有比较大的提升。
发明内容
本发明旨在合成一种有机硅LED封装硅胶,旨在提高对金属、SMC、EMC等新型材料的粘接性,本发明制备的封装胶具有热稳定性高、较好的粘接强度,低光衰等优点。本发明解决上述技术问题的技术方案如下:本发明分为A、B两个组分,A组分、B组分重量比为1:1:A组分为乙烯基硅树脂、催化剂、增韧剂等为主的组合物;B组分为含氢硅树脂、含氢硅树脂、抑制剂、粘接剂为主的组合物;
进一步其特征在于A组分中的乙烯基硅树脂,其分子结构中由M、D、T链节选择性的组合构成主链,其结构如下:(Me3SiO0.5)a(Ph2SiO1)b(ViSiO1.5)c,其中a:(b+c)=1:3~1:5、c=1~1.5;
进一步其特征在于A组分中的催化剂,特征在于所述的催化剂是铂系催化剂;所述铂系催化剂为铂~乙烯基硅氧烷配合物、铂烯烃配合物中的任意一种,其中铂含量为10000~15000ppm。
进一步,A组分中的增韧剂,其特征在于苯基乙烯基硅油,其结构分子结构式为:
其中:e=20-40,f=4-8,j=10-20;
进一步,B组分中含氢硅树脂的结构为:MT型(一),MDT(二)型两种结构中的一种或两种,其分子式分别为:
(HMe2SiO0.5)k(PhSiO1.5)l,其中k:l=1:1.5~1:2
(HMe2SiO0.5)m(PhMeSiO)n(PhSiO1.5)o,其中m:(n+o)=1:1.5~1:2;
进一步,B组分中的含氢硅油的结构为:
其中r=4n,n=1-2;S=10-20;t=10-20;
进一步,B组分的粘接剂,其结构为以下结构中的一种
其中x=5-10,y=10-20;
其中l=10-20,m=10-20。
进一步,B组分中的抑制剂为炔醇类物质、含烯烃基的化合物;
进一步,一种有机硅LED封装胶用粘接剂,按重量份计,制备步骤如下:
所述A组分的制备步骤如下:乙烯基硅树脂50~60份,增韧剂30~40份、催化剂0.1~0.3份,依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述A组分;
所述B组分的制备步骤如下:含氢硅树脂50~60份,含氢硅油30~40份,抑制剂0.4~0.5份,粘接剂4~5份;依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述B组分。
与现有技术相比,本发明提供的有机硅LED封装胶具有光衰性能好,耐硫化性能强,密封性能、耐老性能好,耐候性能好,抗黄变,易脱泡,便于操作等优点。
具体实施方式
实施例1
A组分的制备步骤如下:乙烯基硅树脂,50份乙烯基硅树脂其结构如下:(Me3SiO0.5)a(Ph2SiO1)b(ViSiO1.5)c,其中a:(b+c)=1:3c=1;0.1份铂系催化剂为铂~乙烯基硅氧烷配合物10000ppm;30份增韧剂,其结构分子结构式为:
其中:e=20,f=4,j=10;依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述A组分;
B组分的制备步骤如下:50份含氢硅树脂的结构为:MT型(一),
(HMe2SiO0.5)k(PhSiO1.5)l,其中k:l=1:1.5;30份含氢硅油的结构为:
其中r=4,S=10;t=10;4份粘接剂,结构
其中x=5,y=10;
0.4份抑制剂,乙炔醇;依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述B组分。
实施例2
A组分的制备步骤如下:乙烯基硅树脂,50份乙烯基硅树脂其结构如下:(Me3SiO0.5)a(Ph2SiO1)b(ViSiO1.5)c,其中a:(b+c)=1:5c=1.5;0.3份铂系催化剂为铂~乙烯基硅氧烷配合物10000ppm;40份增韧剂,其结构分子结构式为:
其中:e=40,f=8,j=20;依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述A组分;
B组分的制备步骤如下:50份含氢硅树脂的结构为:MT型(一),
(HMe2SiO0.5)k(PhSiO1.5)l,其中k:l=1:1.5;30份含氢硅油的结构为:
其中r=8,s=20;t=20;4份粘接剂,结构
其中l=10,m=10;
0.5份抑制剂,乙炔醇;依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述B组分。
实施例3
A组分的制备步骤如下:乙烯基硅树脂,60份乙烯基硅树脂其结构如下:(Me3SiO0.5)a(Ph2SiO1)b(ViSiO1.5)c,其中a:(b+c)=1:4c=1.3;0.1份铂系催化剂为铂~乙烯基硅氧烷配合物15000ppm;35份增韧剂,其结构分子结构式为:
其中:e=35,f=8,j=20;依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述A组分;
B组分的制备步骤如下:50份含氢硅树脂的结构为:MDT(二)型两种结构中的一种或两种,其分子式分别为:
(HMe2SiO0.5)m(PhMeSiO)n(PhSiO1.5)o,其中m:(n+o)=1:1.5;
2份粘接剂,结构
其中l=15,m=15;
3份粘接剂,结构
其中x=5,y=10
0.45份抑制剂,乙炔醇;依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述B组分。
实施例4
A组分的制备步骤如下:乙烯基硅树脂,60份乙烯基硅树脂其结构如下:(Me3SiO0.5)a(Ph2SiO1)b(ViSiO1.5)c,其中a:(b+c)=1:4c=1.3;0.1份铂系催化剂为铂~乙烯基硅氧烷配合物15000ppm;35份增韧剂,其结构分子结构式为:
其中:e=30,f=4,j=150;依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述A组分;
B组分的制备步骤如下:30份含氢硅树脂的结构为:MT型(一),
(HMe2SiO0.5)k(PhSiO1.5)l,其中k:l=1:1.5;30份含氢硅油的结构为:
其中r=4,s=10;t=10;
20份含氢硅树脂的结构为:MDT(二)型两种结构中的一种或两种,其分子式分别为:
(HMe2SiO0.5)m(PhMeSiO)n(PhSiO1.5)o,其中m:(n+o)=1:1.5;
2.5份粘接剂,结构
其中l=15,m=15;
2.5份粘接剂,结构
其中x=10,y=20
0.45份抑制剂,乙炔醇;依次加入搅拌机内,并充入氮气,混合搅拌均匀,即得所述B组分。
使用时,将所述A组分、B组分按重量比为1:1的配比混合均匀,真空脱泡20分钟,测试粘度和触变指数,随后点胶于待封装件上,先在90℃加热1.5小时,再在150℃加热2.5小时,即可。
本发明考察了硅胶的各种性能,光学性能(透光率、折射率)、耐硫化性能、粘接性能、高温光衰等、冷热冲击性能。
采用紫外可见分光光度计仪按GB/T2410-80测定透光率;
硫化实验的测试方法是:将封装的好的元件,放在封闭的硫化瓶80℃烘烤3-4小时硫化过程中,测试记录数据。
粘接性测试方法是:市售水性红墨水:酒精=1:1,固化后的支架放入其中,120℃,6小时观察有无渗透;
冷热冲击:-65℃~150℃,各15min,为一个循环;结果如下表1
表1
通过数据可以说明,通过本发明在光学性能(透光率、折射率)、耐硫化性能、粘接性能、高温光衰等、冷热冲击性能等各个性能方面都超过了现有的市售胶水,作为新一代的胶水有着很好的性能提升。
本发明制备的有机硅LED封装胶属于以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (6)
1.一种有机硅LED封装硅胶,其特征在于,包含A、B两个组分,A组分、B组分重量比为1:1:A组分包括:乙烯基硅树脂50~60份,增韧剂30~40份、催化剂0.1~0.3份;B组分包括:含氢硅树脂50~60份,含氢硅油30~40份,抑制剂0.4~0.5份,粘接剂4~5份;所述粘结剂其结构为以下结构中的一种,
其中x=5-10,y=10-20;
其中l=10-20,m=10-20。
2.根据权利要求1所述的有机硅LED封装硅胶,其特征在于,所述乙烯基硅树脂结构如下:(Me3SiO0.5)a(Ph2SiO1)b(ViSiO1.5)c,其中a:(b+c)=1:3~1:5、c=1~1.5。
3.根据权利要求1所述的有机硅LED封装硅胶,其特征在于,所述增韧剂为苯基乙烯基硅油,其结构分子结构式为:
其中:e=20-40,f=4-8,j=10-20。
4.根据权利要求1所述的有机硅LED封装硅胶,其特征在于,所述含氢硅树脂的结构为:MT型(一),MDT(二)型两种结构中的一种或两种,其分子式分别为:
(HMe2SiO0.5)k(PhSiO1.5)l,其中k:l=1:1.5~1:2
(HMe2SiO0.5)m(PhMeSiO)n(PhSiO1.5)o,其中m:(n+o)=1:1.5~1:2。
5.根据权利要求1所述的有机硅LED封装硅胶,其特征在于,所述含氢硅油的结构为:
其中r=4n,n=1-2;S=10-20;t=10-20。
6.根据权利要求1所述的有机硅LED封装硅胶,其特征在于,所述催化剂为铂~乙烯基硅氧烷配合物、铂烯烃配合物中的任意一种,其中铂含量为10000~15000ppm,抑制剂为炔醇类物质、含烯烃基的化合物。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111234772A (zh) * | 2020-01-16 | 2020-06-05 | 东莞市派乐玛新材料技术开发有限公司 | 一种有机硅液态光学胶及其使用方法 |
CN111647385A (zh) * | 2020-07-03 | 2020-09-11 | 昆明耐维科技有限公司 | 一种用于超声波实时断轨监测系统的耦合胶及其制备方法和使用方法 |
CN113025054A (zh) * | 2019-12-25 | 2021-06-25 | 新特能源股份有限公司 | 硅橡胶组合物、其制备方法以及封装胶 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105176483A (zh) * | 2015-08-14 | 2015-12-23 | 烟台德邦先进硅材料有限公司 | 一种高折射率高韧性的耐硫化led封装硅胶 |
CN107083231A (zh) * | 2016-09-01 | 2017-08-22 | 深圳市新纶科技股份有限公司 | 一种有机硅凝胶组合物及其制备方法 |
WO2017191789A1 (ja) * | 2016-05-02 | 2017-11-09 | 横浜ゴム株式会社 | 密着付与剤及び硬化性樹脂組成物 |
-
2018
- 2018-12-07 CN CN201811491341.8A patent/CN109536125B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105176483A (zh) * | 2015-08-14 | 2015-12-23 | 烟台德邦先进硅材料有限公司 | 一种高折射率高韧性的耐硫化led封装硅胶 |
WO2017191789A1 (ja) * | 2016-05-02 | 2017-11-09 | 横浜ゴム株式会社 | 密着付与剤及び硬化性樹脂組成物 |
CN107083231A (zh) * | 2016-09-01 | 2017-08-22 | 深圳市新纶科技股份有限公司 | 一种有机硅凝胶组合物及其制备方法 |
Non-Patent Citations (1)
Title |
---|
张震乾 等: "苯乙烯和乙烯基三甲氧基硅烷嵌段共聚物的制备及表征", 《高分子通报》 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113025054A (zh) * | 2019-12-25 | 2021-06-25 | 新特能源股份有限公司 | 硅橡胶组合物、其制备方法以及封装胶 |
CN111234772A (zh) * | 2020-01-16 | 2020-06-05 | 东莞市派乐玛新材料技术开发有限公司 | 一种有机硅液态光学胶及其使用方法 |
CN111234772B (zh) * | 2020-01-16 | 2022-04-05 | 东莞市派乐玛新材料技术开发有限公司 | 一种有机硅液态光学胶及其使用方法 |
CN111647385A (zh) * | 2020-07-03 | 2020-09-11 | 昆明耐维科技有限公司 | 一种用于超声波实时断轨监测系统的耦合胶及其制备方法和使用方法 |
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