CN109473393A - The processing method of chip - Google Patents

The processing method of chip Download PDF

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Publication number
CN109473393A
CN109473393A CN201811035748.XA CN201811035748A CN109473393A CN 109473393 A CN109473393 A CN 109473393A CN 201811035748 A CN201811035748 A CN 201811035748A CN 109473393 A CN109473393 A CN 109473393A
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CN
China
Prior art keywords
chip
sealing material
preset lines
sealing
cutting slot
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Granted
Application number
CN201811035748.XA
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Chinese (zh)
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CN109473393B (en
Inventor
铃木克彦
伴祐人
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Disco Corp
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Disco Corp
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Publication of CN109473393A publication Critical patent/CN109473393A/en
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Publication of CN109473393B publication Critical patent/CN109473393B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
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    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The processing method of chip is provided.Chip is respectively formed with device in the positive each region divided by a plurality of segmentation preset lines intersected to form, this method includes: the 1st cutting slot formation process, forms the 1st cutting slot that depth is equivalent to the completion thickness of device chip by the 1st cutting tool along segmentation preset lines from the face side of chip；Sealing process is sealed the front of chip using sealing material；The completion thickness of grinding wafer to device chip exposes the sealing material in the 1st cutting slot by grinding process from the back side of chip；Alignment process shoots component by infrared ray and detects alignment mark from the face side that the face side of chip shoots chip through sealing material, according to the segmentation preset lines that alignment mark detection is to be cut；And segmentation process, the sealing material in the 1st cutting slot is cut by the 2nd cutting tool along segmentation preset lines from the face side of chip, divides the wafer into each device chip that front and 4 sides are surrounded by sealing material.

Description

The processing method of chip
Technical field
The present invention relates to the processing methods of chip, are processed to chip and form 5S molded package.
Background technique
As the construction for the miniaturization and high-density installation for realizing the various devices such as LSI or NAND-type flash memory, for example, right Chip size packages obtained by device chip is packaged according to chip size (CSP) have been used for actual in use, simultaneously quilt It is widely used for mobile phone, smart phone etc..In addition, in recent years, in the CSP, develop and it is practical not merely with The CSP that entire side is also sealed the front sealing of chip by sealing material, that is, so-called 5S molded package.
Previous 5S molded package is made by following process.
(1) on the front of semiconductor wafer (hereinafter, being referred to generally as chip sometimes) formed be referred to as device (circuit) and The external connection terminals of convex block.
(2) chip is cut from the face side of chip along segmentation preset lines, forms depth and is equivalent to device chip Completion thickness cutting slot.
(3) front of chip is sealed using the sealing material containing carbon black.
(4) back side of chip is ground to the completion thickness of device chip and exposes the sealing material in cutting slot.
(5) since the front of chip is sealed by the sealing material containing carbon black, so by the outer peripheral portion of front wafer surface Sealing material removes and exposes the alignment marks such as target pattern, and it is pre- that implementation detects segmentation to be cut according to the alignment mark The alignment of alignment.
(6) according to alignment, chip is cut along segmentation preset lines from the face side of chip, to be divided into front The 5S molded package sealed with entire side by sealing material.
As described above, since the front of chip is sealed by the sealing material comprising carbon black, so being formed in front wafer surface Device etc. can not visually see completely.In order to solve this problem so as to be aligned, such as documented by above-mentioned (5) that Sample, the applicant develop following technology: the outer peripheral portion of the sealing material of front wafer surface is removed and makes target pattern etc. Alignment mark exposes, and segmentation preset lines to be cut are detected according to the alignment mark, thereby executing alignment (referring to Japanese Unexamined Patent Publication 2013-074021 bulletin and Japanese Unexamined Patent Publication 2016-015438 bulletin).
Patent document 1: Japanese Unexamined Patent Publication 2013-074021 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2016-015438 bulletin
However, in alignment methods described in above bulletin, need to replace incisory cutting tool and by side The work that the cutting tool of the wider width of edge finishing is installed on main shaft to remove the sealing material of the outer peripheral portion of chip Sequence, the replacement of cutting tool and the sealing material that outer peripheral portion is removed by edge trimming need to spend time and labor, deposit In the problem that productivity is poor.
Summary of the invention
The present invention is completed in view of the point, it is intended that providing can include through be coated on front wafer surface The sealing material of carbon black implements the processing method of the chip of alignment process.
According to the present invention, the processing method of chip is provided, which divides in a plurality of segmentation preset lines by intersecting to form Positive each region in be respectively formed with device, which has multiple convex blocks, and the processing method of the chip is characterized in that, With following process: the 1st cutting slot formation process passes through along the segmentation preset lines with the 1st from the face side of the chip 1st cutting tool of thickness come formed depth be equivalent to device chip completion thickness the 1st cutting slot；Sealing process, in reality After having applied the 1st cutting slot formation process, the front comprising the 1st cutting slot of the chip is sealed using sealing material； Grinding process, after implementing the sealing process, from the back side of the chip by the complete of the grinding wafer to the device chip Work thickness and expose the sealing material in the 1st cutting slot；Alignment process passes through after implementing the grinding process Infrared ray shoots component and is shot from the face side of the chip through the sealing material to the face side of chip and detect alignment Label, the segmentation preset lines to be cut are detected according to the alignment mark；And segmentation process, implementing the alignment process Later, pass through from the face side of the chip along the segmentation preset lines with smaller than the 1st thickness of the 1st cutting tool by the 2nd cutting tool of 2 thickness cuts the sealing material in the 1st cutting slot, which is divided into front and 4 Each device chip that side is surrounded by the sealing material makes the infrared ray shoot component in the sealing process by having The sealing material for the permeability that the infrared ray received penetrates is sealed the front of the chip.
It is preferred that the shooting component of the infrared ray used in alignment process includes InGaAs capturing element.
The processing method of chip according to the present invention is penetrated close using the infrared ray for receiving infrared ray shooting component Closure material by chip front seal, by infrared ray shoot component through sealing material come detect be formed in chip to fiducial mark Note, can implement to be aligned, therefore can simply implement alignment process according to alignment mark, without as in the past by chip Positive outer peripheral portion sealing material removal.Therefore, from the face side of chip by cutting tool to segmentation preset lines into Row cutting, so as to divide the wafer into each device chip.
Detailed description of the invention
Fig. 1 is the perspective view of semiconductor wafer.
Fig. 2 is the perspective view for showing the 1st cutting slot formation process.
Fig. 3 is the perspective view for showing sealing process.
Fig. 4 is the side elevation in partial section for showing grinding process.
Fig. 5 is the cross-sectional view for showing alignment process.
(A) of Fig. 6 is the cross-sectional view for showing segmentation process, and (B) of Fig. 6 is the enlarged cross-sectional view for showing segmentation process.
Label declaration
10: cutting unit；11: semiconductor wafer；13: segmentation preset lines；14,14A: cutting tool；15: device；16: right Quasi- unit；17: electrode bumps；18: shooting unit；20: sealing material；23: the 1 cutting slots；25: the 2 cutting slots；26: grinding Unit；27: device chip；34: grinding emery wheel；38: grinding grinding tool.
Specific embodiment
Hereinafter, referring to attached drawing, detailed description of embodiments of the present invention.Referring to Fig.1, it shows and fits through this The processing method of invention is come the face side perspective view for the semiconductor wafer (hereinafter, sometimes referred to simply as chip) 11 processed.
It is clathrate on the positive 11a of semiconductor wafer 11 to be formed with a plurality of segmentation preset lines (spacing track) 13.By The devices such as IC, LSI 15 are formed in each region that vertical segmentation preset lines 13 mark off.
There is multiple electrodes convex block (hereinafter, sometimes referred to simply as convex block) 17 on the front of each device 15, chip 11 is at it Device area 19 is included on front, is formed with the multiple devices 15 for being respectively provided with multiple convex blocks 17；And periphery remaining area 21, surround device area 19.
In the processing method of the chip of embodiment of the present invention, firstly, implementing the 1st cutting slot as the 1st process and being formed Process forms depth phase by the 1st cutting tool with the 1st thickness along segmentation preset lines 13 from the face side of chip 11 When the 1st cutting slot of the completion thickness in device chip.The 1st cutting slot formation process is illustrated referring to Fig. 2.
Cutting unit 10 includes cutting tool 14, and the front end of main shaft 12 is installed in a manner of assemble and unassemble；And Aligned units 16 have shooting component (shooting unit) 18.Shooting unit 18 is shot in addition to having using visible light Except microscope and camera, also there is the infrared ray capturing element shot to infrared view.In the present embodiment, Using InGaAs capturing element as infrared ray capturing element.
Before implementing the 1st cutting slot formation process, firstly, implementing following alignment: shooting unit 18 using visible light come The front of chip 11 is shot, detection is formed in the alignment marks such as the target pattern of each device 15, detects according to the alignment mark Segmentation preset lines 13 to be cut.
After implementing alignment, implements the 1st cutting slot formation process, make the high-speed rotating bite on the direction arrow R1 Have (the 1st cutting tool) 14 from the positive 11a lateral edge of chip 11 segmentation preset lines 13 according to the completion for being equivalent to device chip The depth of thickness is cut, and is processed on the direction arrow X1 to the chuck table (not shown) of attracting holding chip 11 Feeding, to form the 1st cutting slot 23 along segmentation preset lines 13.
One side is according to the spacing of segmentation preset lines 13 by cutting unit 10 on the direction vertical with processing direction of feed X1 Index feed is carried out, successively implements the 1st cutting slot along the segmentation preset lines 13 upwardly extended in the 1st side on one side and forms work Sequence.
Then, after being rotated by 90 ° chuck table (not shown), along on 2nd direction vertical with the 1st direction The segmentation preset lines 13 of extension successively implement same 1st cutting slot formation process.
After implementing the 1st cutting slot formation process, implement sealing process, as shown in figure 3, to the front of chip 11 11a is coated with sealing material 20, is sealed the positive 11a of the chip 11 comprising the 1st cutting slot 23 using sealing material.Due to sealing Material 20 has mobility, so sealing material 20 is filled into the 1st cutting slot 23 when implementing sealing process.
As sealing material 20, composition includes epoxy resin or epoxy resin+phenolic resin 10.3%, two by quality % Cilicon oxide filler 85.3%, carbon black 0.1~0.2%, other compositions 4.2~4.3%.As other compositions, for example, including metal Hydroxide, antimony trioxide, silica etc..
When the sealing material 20 using this composition come the positive 11a of coating wafer 11 to by the positive 11a of chip 11 When sealing, sealing material 20 is in black because including the minimal amount of carbon black in sealing material 20, therefore is generally difficult to penetrate Sealing material 20 sees the positive 11a of chip 11.
Here, carbon black is mixed into sealing material 20 primarily to the electrostatic breakdown of device 15 is prevented, at present in market Upper sale not yet is free of the sealing material of carbon black.
The coating method of sealing material 20 is not particularly limited, but sealing material 20 is preferably applied to the height of convex block 17 Until degree, sealing material 20 is etched followed by etching, convex block 17 is made to emerge.
After implementing sealing process, implements grinding process, chip 11 is ground to device from the back side side 11b of chip 11 The completion thickness of part chip exposes the sealing material 20 in the 1st cutting slot 23.
The grinding process is illustrated referring to Fig. 4.Front protecting band 22 is pasted on the positive 11a of chip 11, is utilized The chuck table 24 of grinding attachment carries out attracting holding to chip 11 across front protecting band 22.
Grinding unit 26 includes: main shaft 30 is accommodated in main shaft shell 28, by not shown in a manner of it can rotate Motor carry out rotation driving；Emery wheel mounting base 32 is fixed on the front end of main shaft 30；And grinding emery wheel 34, with Assemble and unassemble mode is installed on emery wheel mounting base 32.Grinding emery wheel 34 is by cricoid emery wheel base station 36 and cements in emery wheel base station Multiple grinding grinding tools 38 of 36 lower end periphery are constituted.
In grinding process, carry out chuck table 24 for example according to 300rpm on the direction shown in arrow a Rotation rotates grinding emery wheel 34 for example according to 6000rpm on the direction shown in arrow b, and to not shown Grinding unit feed mechanism driven and make be ground emery wheel 34 grinding grinding tool 38 contacted with the back side 11b of chip 11.
Then, emery wheel 34 will be ground on one side to measure as defined in grinding and feeding downwards according to the grinding and feeding speed of regulation, one While the back side 11b to chip 11 is ground.Chip 11 is measured using contact or contactless thickness measurement equipment on one side Thickness, on one side by chip 11 be ground to as defined in such as 100 μm of thickness, make the sealing material being embedded in the 1st cutting slot 23 20 expose.
After implementing grinding process, implement following alignment process: passing through infrared ray from the positive side 11a of chip 11 Shooting component shoots the positive 11a of chip 11 in a manner of through sealing material 20, and detection is being formed in chip 11 just The alignment marks such as at least two target patterns in face detect segmentation preset lines 13 to be cut according to these alignment marks.
The alignment process is described in detail referring to Fig. 5.Before implementing alignment process, by the back side 11b of chip 11 Side is pasted onto peripheral part and is installed on the dicing tape T of ring-shaped frame F.
In alignment process, as shown in figure 5, across dicing tape T using the chuck table 40 of cutting apparatus to chip 11 Attracting holding is carried out, exposes the sealing material 20 for sealing the positive 11a of chip 11 upwards.Then, right using fixture 42 Ring-shaped frame F is clamped and is fixed.
In alignment process, the positive 11a of chip 11 is shot using the infrared ray capturing element of shooting unit 18. Sealing material 20 is made of the sealing material that the infrared ray for receiving the infrared ray capturing element of shooting unit 18 penetrates, because This, can be detected by infrared ray capturing element and be formed in the alignment such as at least two target patterns of positive 11a of chip 11 Label.
As infrared ray capturing element, it is preferred to use with higher sensitivity InGaAs capturing element.It is preferred that shooting unit 18 With can be to the exposure device (exposure) that time for exposure etc. is adjusted.
Then, make chuck table 40 carry out θ rotation so as to make to connect straight line obtained by these alignment marks and process into It is parallel to direction, then make cutting unit 10 shown in Fig. 2 according to alignment mark and divide preset lines 13 center between away from It is moved from the direction vertical with processing direction of feed X1, to detect segmentation preset lines 13 to be cut.
After implementing alignment process, implement segmentation process, as shown in (A) of Fig. 6, from the positive side 11a of chip 11 Pass through the 2nd cutting tool 14A with the width smaller than the width of the 1st cutting tool 14 to front along segmentation preset lines 13 11a be cut to until reaching dicing tape T by the chip 11 that sealing material 20 seals, and forms shown in (B) of Fig. 6 the 2nd and cuts Slot 25 is cut, each device chip 27 for being divided into positive 11a and 4 side to be surrounded by sealing material 20 chip 11.
After successively implementing the segmentation process along the segmentation preset lines 13 upwardly extended in the 1st side, make chuck work Make platform 40 to be rotated by 90 °, successively implements the segmentation along the segmentation preset lines 13 upwardly extended in 2nd side vertical with the 1st direction Chip 11 can be divided into positive 11a and 4 side to be sealed by sealing material 20 by process as a result, as shown in (B) of Fig. 6 Each device chip 27.
About the width of the cutting tool 14A used in segmentation process, due to having than in the 1st cutting slot formation process Used in cutting tool 14 the narrow width of width, so when 2 cutting slot 25 shown in (B) that forms Fig. 6, device core The side of piece 27 is sealed by sealing material 20.
The device chip 27 produced in this way can be mounted on mainboard by flip-chip bond, which connects It closes and the positive back side of device chip 27 is inverted and connect convex block 17 with the conductive welding disk of mainboard.

Claims (2)

1. a kind of processing method of chip, the chip is in the positive each region divided by a plurality of segmentation preset lines intersected to form It is inside respectively formed with device, which has multiple convex blocks,
The processing method of the chip is characterized in that thering is following process:
1st cutting slot formation process is cut along the segmentation preset lines by the 1st with the 1st thickness from the face side of the chip Cutting knife tool come formed depth be equivalent to device chip completion thickness the 1st cutting slot；
The chip is included the 1st using sealing material after implementing the 1st cutting slot formation process by sealing process The front sealing of cutting slot；
Grinding process, after implementing the sealing process, from the back side of the chip by the grinding wafer to the device chip Completion thickness and expose the sealing material in the 1st cutting slot；
Alignment process, after implementing the grinding process, being penetrated by infrared ray shooting component from the face side of the chip should Sealing material shoots the face side of chip and detects alignment mark, this point to be cut is detected according to the alignment mark Cut preset lines；And
Segmentation process, after implementing the alignment process, passing through from the face side of the chip along the segmentation preset lines has 2nd cutting tool of 2nd thickness smaller than the 1st thickness of the 1st cutting tool is to the sealing material in the 1st cutting slot It is cut, each device chip for being divided into front and 4 sides to be surrounded by the sealing material chip,
In the sealing process, by having the sealing for making the infrared ray shoot the permeability that the infrared ray that component is received penetrates Material is sealed the front of the chip.
2. the processing method of chip according to claim 1, wherein
The infrared ray shooting component used in the alignment process includes InGaAs capturing element.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015023078A (en) * 2013-07-17 2015-02-02 株式会社ディスコ Method of processing wafer
CN205004319U (en) * 2014-06-04 2016-01-27 菲力尔系统公司 Semiconductor device , infrared detector , camera, electronic equipment and system
CN106252281A (en) * 2015-06-08 2016-12-21 株式会社迪思科 The processing method of wafer
JP2017022280A (en) * 2015-07-13 2017-01-26 株式会社ディスコ Wafer processing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3516592B2 (en) * 1998-08-18 2004-04-05 沖電気工業株式会社 Semiconductor device and manufacturing method thereof
JP2001127206A (en) * 1999-08-13 2001-05-11 Citizen Watch Co Ltd Manufacturing method of chip-scale package and manufacturing method of ic chip
JP2003165893A (en) * 2001-11-30 2003-06-10 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
US6822315B2 (en) * 2002-02-14 2004-11-23 National Semiconductor Corporation Apparatus and method for scribing semiconductor wafers using vision recognition
JP2003321594A (en) * 2002-04-26 2003-11-14 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic part device
JP5948034B2 (en) 2011-09-27 2016-07-06 株式会社ディスコ Alignment method
JP6066854B2 (en) * 2013-07-30 2017-01-25 株式会社ディスコ Wafer processing method
JP2016015438A (en) 2014-07-03 2016-01-28 株式会社ディスコ Alignment method
JP6531345B2 (en) * 2015-09-29 2019-06-19 株式会社東京精密 Laser processing apparatus and laser processing method
JP2017108089A (en) * 2015-12-04 2017-06-15 株式会社東京精密 Laser processing apparatus and laser processing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015023078A (en) * 2013-07-17 2015-02-02 株式会社ディスコ Method of processing wafer
CN205004319U (en) * 2014-06-04 2016-01-27 菲力尔系统公司 Semiconductor device , infrared detector , camera, electronic equipment and system
CN106252281A (en) * 2015-06-08 2016-12-21 株式会社迪思科 The processing method of wafer
JP2017022280A (en) * 2015-07-13 2017-01-26 株式会社ディスコ Wafer processing method

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