JP2003321594A - Epoxy resin molding material for sealing and electronic part device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin molding material which is used for sealing, has an excellent property for preventing insulation failures caused by conductive substances, and can correspond to the narrow pad pitch, multi-pins, and the like of semiconductor devices, and to provide an electronic part device, such as semiconductor device, which is sealed with the material and hardly causes the failures of electric characteristics. <P>SOLUTION: This epoxy resin molding material which is used for the sealing comprises (A) an epoxy resin, (B) a curing agent, (C) carbon black and (D) inorganic particles, wherein (C) the carbon black is partially or wholly immobilized on (D) the inorganic particles. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material and an electronic component device sealed by the same. More specifically, the present invention provides a molding epoxy resin molding material having excellent moldability and reliability suitable for an electronic component device such as a semiconductor device and the occurrence of defective electrical characteristics due to carbon, which is sealed by the molding resin. The present invention relates to an electronic component device.

[0002]

2. Description of the Related Art In recent years, high density mounting of electronic parts on a printed wiring board has been advanced. Along with this, surface mount type packages have become the mainstream for electronic component devices such as semiconductor devices, instead of the conventional pin insertion type packages. Surface-mount type ICs, LSIs, etc. are thin and small packages in order to increase the mounting density and lower the mounting height.
The device occupies a large volume in the package, and the thickness of the package has become very thin. Moreover, the chip area and the number of pins are increasing due to the multi-functionalization and large-capacity of the element, and further, the pad pitch and the pad size are reduced due to the increase in the number of pads (electrodes), so-called narrow pad pitch. The number of semiconductor elements having a pad pitch of 60 μm or less has recently been developed.

Further, in order to cope with further reduction in size and weight,
The form of the package is QFP (Quad Flat Package), S
From OP (Small Outline Package), CSP (Chip Size Package) and BGA (Ball Grid A) that can easily support higher pin counts and enable higher density mounting.
rray) is moving. These packages have been
In order to realize higher speed and more functions, new structures such as face-down type, stacked type, flip chip type, wafer level type have been developed. Among them, the stacked type has a structure in which multiple chips are stacked inside the package and connected by wire bonding, and multiple chips with different functions can be mounted in one package, enabling multiple functions. Becomes

In these semiconductor devices, a large number of gold wires are arranged in a complicated manner in a narrow area. Therefore, when the sealing material contains conductive particles of a certain size or larger, there is a high probability that the gold wires will have a high probability. It will be caught between them and a short circuit defect will occur. In particular, when an organic substrate having a narrow wiring interval or a mounting substrate such as an organic film is used, a leak defect is likely to occur due to an aggregate of a conductive substance bridging between the wirings on the substrate.

On the other hand, the encapsulating material has a high level of reflow resistance, which is a matter of concern when surface-mounting a semiconductor device on a printed circuit board, and temperature cycle property required for reliability after mounting. It has been sought to meet such demands by reducing the resin viscosity and thereby increasing the filling amount of the filler, thereby providing the sealing material with low moisture absorption and low expansion. Further, carbon black is generally used as a coloring agent in the encapsulating material for the purpose of protecting the semiconductor element from light and imparting a laser mark property. Since carbon black is conductive, the presence of coarse particles of carbon black causes the above-mentioned poor electrical characteristics. However, lowering the viscosity of the resin reduces the shear stress applied to the carbon black at the time of manufacturing the encapsulant and hinders the crushing of aggregates of the carbon black. As a result, the thinner and more pin-filled encapsulant with a high filling material for semiconductor devices, the more likely the carbon black coarse particles remain, the higher the possibility of defective electrical characteristics occurring in combination with the package structure. On the other hand, for example, at least 50% by weight or more of the inorganic filler is mixed with carbon black in advance, and the maximum particle size of the aggregate of carbon black is 100.
A method for producing an epoxy resin molding material for semiconductor encapsulation, in which the compound is dispersed to have a particle size of less than or equal to μm, and then other compounds are mixed and then melt-kneaded (JP 2000-169676 A), or an average particle diameter of 10 to 50 nm and Brunauer. -E
The specific surface area by the Mmett-Teller method is 80 to 4
Reduction of aggregates by using carbon black of 00 m ² / g as an essential component (Japanese Patent Laid-Open No. 2000-169).
675), the specific surface area of the carbon black, the DBP oil absorption, the pH, etc. are specified to reduce the aggregates (JP 2001-302885, 2001-30288).
6) etc. are proposed.

[0006]

However, in these methods, although the aggregate of carbon black can be made small and small at the production stage of the epoxy resin molding material for semiconductor encapsulation, it is possible to reduce the production of the semiconductor device. It was difficult to prevent re-aggregation of carbon black in the transfer molding process. Further, the maximum particle size of the aggregate that can be achieved is limited to about several tens of μm or less, which is an insufficient level for the present progress. In order to deal with this, the sealing material has been attempted to be improved by further reducing aggregates and changing manufacturing conditions, but has not yet obtained sufficient results.

Further, in the above-mentioned aggregation of the conductive substance, not only the secondary particles are formed but also the conductive fine particles form a connection like a chain, and the chain bridges between the wirings. It has been found that such aggregation due to chain formation of fine particles is particularly likely to occur when fine particles are dispersed in a resin having a low viscosity and the fine particles can easily move in the resin.

Therefore, an object of the present invention is to prevent the defective insulation due to the conductive material and to cope with the narrowing of the pad pitch and the increase in the number of pins of electronic component devices such as semiconductor devices. The present invention aims to provide an electronic component device which is sealed by the above, and in which the occurrence of defective electrical characteristics is small.

[0009]

That is, the first invention of the present invention comprises (A) an epoxy resin, (B) a curing agent, (C) carbon black and (D) inorganic particles, and (C).
The gist is a sealing epoxy resin molding material in which a part or all of carbon black is fixed to (D) inorganic particles.

The first invention preferably further comprises (E) an inorganic filler. Further, in the first invention, it is preferable to use a part or all of the (E) inorganic filler as the (D) inorganic particles. Further, in the first invention, it is preferable that a part or all of the carbon black (C) is fixed to the inorganic particles (D) through the binder (F).
Furthermore, in the first invention, (C) the carbon black-fixed (D) inorganic particles has an average particle diameter of 10 μm.
m or less, (C) carbon black fixed (D) the specific surface area of the inorganic particles is 3 m ² / g or more, (C) carbon black fixed (D) inorganic particles Preference is given to silica or iron oxide, respectively. The first invention is that the compounding amount of (C) carbon black is 5 to 50% by weight based on (D) inorganic particles, and the compounding amount of (C) carbon black is 0 relative to the epoxy resin molding material for sealing. It is preferably each 0.1% to 1.0% by weight. The first invention is that the viscosity of the (A) epoxy resin at 150 ° C. is 2 poise or less, and the (A) epoxy resin is a biphenyl type epoxy resin,
Each contains at least one of bisphenol F type epoxy resin, stilbene type epoxy resin, sulfur atom-containing epoxy resin, novolac type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin and triphenylmethane type epoxy resin. preferable. In the first invention, (B) the curing agent preferably contains at least one of a biphenyl type phenol resin, an aralkyl type phenol resin, a triphenylmethane type phenol resin, a dicyclopentadiene type phenol resin and a novolac type phenol resin. . Further, the first invention preferably contains 80 to 95% by weight of the inorganic filler (E).

Further, a second invention of the present invention is summarized as an electronic component device comprising an element encapsulated by the encapsulating epoxy resin molding material according to any one of the above-mentioned first invention. .

In one preferred embodiment, the present invention provides a thin, multi-pin, long wire, narrow pad pitch,
Alternatively, an encapsulating epoxy resin molding material suitable for encapsulating a semiconductor device in which a semiconductor chip is placed on a mounting substrate such as an organic substrate or an organic film is provided. In another preferred aspect, according to the present invention, a thin, multi-pin, encapsulated with the epoxy resin molding material for encapsulation according to the present invention,
Provided is a semiconductor device in which a semiconductor chip is arranged on a mounting substrate such as a long wire, a narrow pad pitch, or an organic substrate or an organic film.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION (A) Used in the Present Invention
The component epoxy resin is generally used as an epoxy resin molding material for sealing and is not particularly limited. For example, phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, phenol such as epoxy resin having a triphenylmethane skeleton,
Cresol, xylenol, resorcin, catechol,
Phenols such as bisphenol A and bisphenol F and / or naphthols such as α-naphthol, β-naphthol and dihydroxynaphthalene, and formaldehyde,
Novolak type epoxy resin obtained by epoxidizing novolak resin obtained by condensation or co-condensation with a compound having an aldehyde group such as acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde; bisphenol A, bisphenol F, bisphenol S, etc. Diglycidyl ether of bisphenol (bisphenol type epoxy resin); Diglycidyl ether of alkyl-substituted or unsubstituted biphenol (biphenyl type epoxy resin); Stilbene type epoxy resin;
Hydroquinone type epoxy resin; glycidyl ester type epoxy resin obtained by reaction of polybasic acid such as phthalic acid and dimer acid with epichlorohydrin; glycidyl amine type epoxy resin obtained by reaction of polyamine such as diaminodiphenylmethane, isocyanuric acid and epichlorohydrin; di Epoxidized products of co-condensed resin of cyclopentadiene and phenols (dicyclopentadiene type epoxy resin); epoxy resin having naphthalene ring (naphthalene type epoxy resin); aralkyl type phenol resin such as phenol / aralkyl resin and naphthol / aralkyl resin Epoxy compound; trimethylolpropane type epoxy resin; terpene-modified epoxy resin; linear aliphatic epoxy resin obtained by oxidizing olefin bond with peracid such as peracetic acid; alicyclic Epoxy resins; sulfur atom-containing epoxy resins. These may be used alone or in combination of two or more.

Above all, from the viewpoint of fluidity, 150 ° C.
An epoxy resin having a viscosity of 2 poises or less is preferable, an epoxy resin having a viscosity of 1 poise or less is more preferable, and a viscosity of 0.
An epoxy resin of 5 poise or less is more preferable. Here, the viscosity at 150 ° C. refers to the melt viscosity measured with an ICI cone and plate viscometer.

From the viewpoint of reflow resistance, biphenyl type epoxy resin, bisphenol F type epoxy resin,
Sulfur atom-containing epoxy resin and stilbene type epoxy resin are preferable, novolac type epoxy resin is preferable from the viewpoint of curability, dicyclopentadiene type epoxy resin is preferable from the viewpoint of low hygroscopicity, and heat resistance and low warp viewpoint From the above, naphthalene type epoxy resin and triphenylmethane type epoxy resin are preferable, and it is preferable to contain at least one of these epoxy resins.

Examples of the biphenyl type epoxy resin include an epoxy resin represented by the following general formula (I), and examples of the bisphenol F type epoxy resin include an epoxy resin represented by the following general formula (II). Examples of the stilbene type epoxy resin include epoxy resins represented by the following general formula (III), and examples of sulfur atom-containing epoxy resins include epoxy resins represented by the following general formula (IV).

[Chemical 1] (Here, R ^{1 to} R ⁸ are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different. N is 0 to 3 Indicates an integer.)

[Chemical 2] (Here, R ^{1 to} R ⁸ are a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, and 6 to 6 carbon atoms.
It is selected from an aryl group having 10 and an aralkyl group having 6 to 10 carbon atoms, all of which may be the same or different. n shows the integer of 0-3. )

[Chemical 3] (Here, R ^{1 to} R ⁸ are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 5 carbon atoms, and all may be the same or different. N is 0 to 10). Indicates an integer.)

[Chemical 4] (Here, R ^{1 to} R ⁸ are a hydrogen atom, a substituted or unsubstituted C 1-10 alkyl group, and a substituted or unsubstituted C 1
Selected from alkoxy groups of 10 to 10, all of which may be the same or different. n shows the integer of 0-3. )

The biphenyl type epoxy resin represented by the above general formula (I) is, for example, 4,4'-bis (2,3-epoxypropoxy) biphenyl or 4,4 '.
′ -Bis (2,3-epoxypropoxy) -3,3 ′,
Epoxy resin containing 5,5'-tetramethylbiphenyl as a main component, epichlorohydrin and 4,4'-biphenol or 4,4 '-(3,3', 5,5'-tetramethyl) biphenol are reacted. The epoxy resin etc. which are obtained are mentioned. Among them, an epoxy resin containing 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl as a main component is preferable.

Examples of the bisphenol F type epoxy resin represented by the above general formula (II) include R ¹ , R ³ and R ⁶
And R ⁸ is a methyl group, R ² , R ⁴ , R ⁵ and R ⁷ are hydrogen atoms, and n = 0 is a main component YSLV-80XY
(Trade name, manufactured by Nippon Steel Chemical Co., Ltd.) is available as a commercial product.

The stilbene type epoxy resin represented by the above general formula (III) can be obtained by reacting the starting stilbene phenols with epichlorohydrin in the presence of a basic substance. Examples of the stilbene-based phenols as the raw material include 3-t-butyl-4,
4'-dihydroxy-3 ', 5,5'-trimethylstilbene, 3-t-butyl-4,4'-dihydroxy-
3 ', 5', 6-trimethylstilbene, 4,4'-dihydroxy-3,3 ', 5,5'-tetramethylstilbene, 4,4'-dihydroxy-3,3'-di-t-butyl- 5,5'-dimethylstilbene, 4,4'-dihydroxy-3,3'-di-t-butyl-6,6'-dimethylstilbene and the like can be mentioned, among which 3-t-butyl-4,4 '. -Dihydroxy-3 ', 5,5'-trimethylstilbene, and 4,4'-dihydroxy-3,3
′, 5,5′-Tetramethylstilbene is preferred. These stilbene type phenols may be used alone or in combination of two or more kinds.

Among the sulfur atom-containing epoxy resins represented by the above general formula (IV), R ² , R ³ , R ⁶ and R ⁷ are hydrogen atoms and R ¹ , R ⁴ , R ⁵ and R ⁸ are alkyl. More preferred is an epoxy resin in which R ² , R ³ , R ⁶ and R ⁷ are hydrogen atoms, R ¹ and R ⁸ are t-butyl groups, and R ⁴ and R ⁵ are methyl groups. preferable. As such a compound, YSLV-120TE (trade name, manufactured by Nippon Steel Chemical Co., Ltd.) or the like is available as a commercial product. These epoxy resins may be used alone or in combination of two or more, but their compounding amount is 20% by weight in total with respect to the total amount of the epoxy resin in order to exert their performance. The above content is preferable, and 30% by weight or more is more preferable.

Examples of the novolac type epoxy resin include epoxy resins represented by the following general formula (V).

[Chemical 5] (Here, R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 0 to 10.) Represented by the general formula (V). The novolac type epoxy resin is easily obtained by reacting novolac type phenol resin with epichlorohydrin. Above all,
R in the general formula (V) is an alkyl group having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group, a methoxy group, an ethoxy group, a propoxy group, and a butoxy group. And the like, an alkoxyl group having 1 to 10 carbon atoms is preferable, and a hydrogen atom or a methyl group is more preferable. n is preferably an integer of 0 to 3. Among the novolac type epoxy resins represented by the general formula (V), orthocresol novolac type epoxy resins are preferable. When a novolac type epoxy resin is used, its content is preferably 20% by weight or more, more preferably 30% by weight or more based on the total amount of the epoxy resin in order to exert its performance.

Examples of the dicyclopentadiene type epoxy resin include epoxy resins represented by the following general formula (VI).

[Chemical 6] (Here, R ¹ and R ² are independently selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, n is an integer of 0 to 10, and m is It represents an integer of 0 to 6.) As R ¹ in the above formula (VI), for example, a hydrogen atom,
Alkyl group such as methyl group, ethyl group, propyl group, butyl group, isopropyl group, t-butyl group, alkenyl group such as vinyl group, allyl group, butenyl group, halogenated alkyl group, amino group-substituted alkyl group, mercapto group Examples thereof include a substituted or unsubstituted monovalent hydrocarbon group having 1 to 5 carbon atoms such as a substituted alkyl group, and among them, an alkyl group such as a methyl group and an ethyl group and a hydrogen atom are preferable, and a methyl group and a hydrogen atom are more preferable. preferable. Examples of R ² include a hydrogen atom, an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, and a t-butyl group, a vinyl group,
Alkyl groups such as allyl group and butenyl group, halogenated alkyl groups, amino group-substituted alkyl groups, mercapto group-substituted alkyl groups and other substituted or unsubstituted monovalent hydrocarbon groups having 1 to 5 carbon atoms. However, a hydrogen atom is preferable. When a dicyclopentadiene type epoxy resin is used, its content is preferably 20% by weight or more, and more preferably 30% by weight or more based on the total amount of the epoxy resin in order to exert its performance.

The naphthalene type epoxy resin includes, for example, an epoxy resin represented by the following general formula (VII), and the triphenylmethane type epoxy resin includes, for example, an epoxy resin represented by the following general formula (VIII). .

[Chemical 7] (Here, R ^{1 to} R ³ are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, and all may be the same or different. P is 1 or 0. so,
l and m are each an integer of 0 to 11, and (l + m)
Is an integer from 1 to 11 and (l + p) is an integer from 1 to 12. i is an integer of 0 to 3, j is an integer of 0 to 2, and k is an integer of 0 to 4. ) The naphthalene-type epoxy resin represented by the general formula (VII) includes a random copolymer containing 1 constitutional unit and m constitutional units at random, an alternating copolymer containing alternating constitutional units, and a copolymer containing regular constitutional units. Examples thereof include polymers and block copolymers contained in a block form, and any one of these may be used alone or in combination of two or more.

[Chemical 8] (Here, R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 1 to 10.) One of these epoxy resins is used. May be used alone or in combination, but the compounding amount is 2 in total with respect to the total amount of epoxy resin in order to exert its performance.
It is preferably 0% by weight or more, and more preferably 30% by weight or more.

The above-mentioned biphenyl type epoxy resin, bisphenol F type, stilbene type epoxy resin, sulfur atom-containing epoxy resin, novolac type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin and triphenylmethane type epoxy resin are Any one kind may be used alone or two or more kinds may be used in combination, but the blending amount is preferably 50% by weight or more in total with respect to the total amount of the epoxy resin, and 60% by weight or more is preferable. More preferably, 80% by weight or more is further preferable.

The (B) curing agent used in the present invention is not particularly limited, since it is generally used for epoxy resin molding materials for sealing. For example, phenol, cresol, resorcin, catechol, bisphenol A,
Phenols such as bisphenol F, phenylphenol, aminophenol and / or α-naphthol, β-
Novolac phenolic resins obtained by condensing or co-condensing naphthols such as naphthol and dihydroxynaphthalene with compounds having an aldehyde group such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde under an acidic catalyst; phenols and / Or an aralkyl type phenol resin such as a phenol / aralkyl resin or a naphthol / aralkyl resin synthesized from naphthols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl; synthesized by copolymerization from phenols and / or naphthols and cyclopentadiene Dicyclopentadiene type phenol resin, dicyclopentadiene type naphthol resin;
Examples thereof include terpene-modified phenol resin; biphenyl type phenol resin; triphenylmethane type phenol resin and the like, and these may be used alone or in combination of two or more kinds. Among them, a biphenyl type phenol resin is preferable from the viewpoint of flame retardancy, and an aralkyl type phenol resin is preferable from the viewpoint of reflow resistance and curability,
Dicyclopentadiene type phenolic resin is preferable from the viewpoint of low hygroscopicity, heat resistance, triphenylmethane type phenolic resin is preferable from the viewpoint of low expansion coefficient and low warpage, and novolac type phenolic resin is preferable from the viewpoint of curability. Preferably, it contains at least one of these phenolic resins.

Examples of the biphenyl type phenol resin include a phenol resin represented by the following general formula (IX).

[Chemical 9] R in the above formula (IX)¹~ R⁹Are all the same or different
Also, hydrogen atom, methyl group, ethyl group, propyl group,
Carbon number 1 such as butyl, isopropyl, and isobutyl groups
-10 alkyl group, methoxy group, ethoxy group, propoxy group
Alkoxy having 1 to 10 carbon atoms such as xy group and butoxy group
6 to 6 carbon atoms such as groups, phenyl groups, tolyl groups, xylyl groups, etc.
10 aryl groups, benzyl groups, phenethyl groups, etc.
Selected from aralkyl groups having 6 to 10 carbon atoms, among which
A hydrogen atom and a methyl group are preferred. n is an integer from 0 to 10
Show. Biphenyl-type pheno represented by the above general formula (IX)
Examples of the resin include R ¹~ R⁹Are all hydrogen atoms
Compounds and the like, among them, from the viewpoint of melt viscosity,
Mixture of condensate containing 50% by weight or more of condensate in which n is 1 or more
The thing is preferable. Such compounds include MEH-7
851 (Meiwa Kasei Co., Ltd. product name) entered as a commercial product
It is possible. Use biphenyl type phenolic resin
In that case, the amount of the curing agent is set in order to exert its performance.
It is preferably 30% by weight or more based on the total amount, and 5
0 wt% or more is more preferable, and 60 wt% or more is further
preferable.

Examples of the aralkyl type phenol resin include phenol / aralkyl resin and naphthol / aralkyl resin. Phenol / aralkyl resin represented by the following general formula (X) is preferable, and R in the general formula (X) is Phenol-aralkyl resins having a hydrogen atom and an average value of n of 0 to 8 are more preferable. As a specific example, p
Examples thereof include xylylene type phenol / aralkyl resin and m-xylylene type phenol / aralkyl resin.
When these aralkyl type phenol resins are used, the content thereof is preferably 30% by weight or more, and 50% by weight, based on the total amount of the curing agent in order to exert its performance.
The above is more preferable.

[Chemical 10] (Here, R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n represents an integer of 0 to 10.)

Examples of the dicyclopentadiene type phenol resin include phenol resins represented by the following general formula (XI).

[Chemical 11] (Here, R ¹ and R ² are independently selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, n is an integer of 0 to 10, and m is Indicates an integer of 0 to 6.) When using a dicyclopentadiene type phenol resin,
The blending amount thereof is preferably 30% by weight or more and more preferably 50% by weight or more based on the total amount of the curing agent in order to exert its performance.

Examples of the triphenylmethane type phenol resin include phenol resins represented by the following general formula (XII).

[Chemical 12] (Here, R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 1 to 10.) When using a triphenylmethane type phenol resin In order to exert its performance, its content is preferably 30% by weight or more, and 50% by weight based on the total amount of the curing agent.
The above is more preferable. Examples of the novolac type phenolic resin include phenol novolac resin, cresol novolac resin, naphthol novolac resin, and the like, of which phenol novolac resin is preferable. When using a novolac type phenolic resin, its compounding amount is 30 with respect to the total amount of the curing agent in order to exert its performance.
It is preferably at least 50% by weight, more preferably at least 50% by weight. These curing agents can be used alone or in combination of two or more.

Further, the component (A) epoxy resin and the component (B)
The equivalent ratio of the curing agent as a component, that is, the ratio of the number of epoxy groups in the epoxy resin / the number of hydroxyl groups in the curing agent is not particularly limited, but is 0.7 to 1.3 in order to suppress the unreacted amount of each. It is preferable to set in the range of 0.8, and it is particularly preferable to set in the range of 0.8 to 1.2 in order to obtain a molding material excellent in moldability and reflow resistance.

If desired, the epoxy resin molding material for sealing of the present invention may contain an inorganic filler (E). (E) The inorganic filler is hygroscopic, has a reduced linear expansion coefficient,
It is added to a molding material for improving thermal conductivity and strength, and is not particularly limited, but for example, fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, aluminum nitride, Powders of boron nitride, beryllia, zirconia, etc., or spherical beads of these, single crystal fibers of potassium titanate, silicon carbide, silicon nitride, alumina, etc., glass fibers, etc. can be mixed and used in one or more kinds. . Further, examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate and the like, and these may be used alone or in combination. Among the above-mentioned inorganic fillers, fused silica is preferable from the viewpoint of reducing the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity. The shape of the filler is
From the viewpoint of fluidity at the time of molding and wear of the mold, a spherical shape or a shape close to a spherical shape is preferable, and 50% by weight or more is particularly preferable. The average particle size of the filler is 15 μm or less (50% by weight of the filler) from the viewpoints of moisture shielding property, mold wear, etc.
The above is preferably a particle size of 15 μm or less), and 1
It is particularly preferable that the thickness is 0 μm or less.

From the viewpoint of hygroscopicity, reduction of linear expansion coefficient and improvement of strength, the amount of the inorganic filler (E) is preferably 70% by weight or more, and 80 to 95% by weight based on the whole molding material.
Is more preferable. If it is less than 70% by weight, the strength tends to decrease, and if it exceeds 95% by weight, the fluidity tends to be insufficient. Above all, the range of 80 to 90% by weight is more preferable.

The carbon black as the component (C) in the present invention is not particularly limited, and commercially available furnace blacks,
Channel black etc. can be used. As a specific example, Mitsubishi Chemical Co., Ltd., trade name MA-100,
MA-100R, MA-600, # 25, # 3230,
33250, Asahi Carbon Co., Ltd. product name Asahi Thermal,
Cabot's product name REGAL99R, Columbian Chemicals' product name Raven860U, Raven
780 ULTRA, product name Prix25 manufactured by Degussa, and product name HTC # 100 manufactured by Nippon Steel Chemical Co., Ltd. can be used. The carbon black may be used in the form of powder or beads, but powder is more preferably used because it is easily fixed to (D) inorganic particles described later.

In the present invention, a part or all of (C) carbon black is fixed to (D) inorganic particles. The method of fixing the carbon black to the inorganic particles is not particularly limited, but it can be achieved by using the following method, for example. The inorganic particles and carbon black are put into a kneader and mixed and stirred. As the kneading machine used at this time,
For example, a crusher, an extruder, a twin-screw co-rotating extruder, a Henschel mixer, an edge runner, etc. may be mentioned. At the time of mixing and stirring, a binder (F) may be used in order to increase the fixing ratio of carbon black to the inorganic particles. (F) As the binder, for example, PMM
Examples thereof include A (polymethylmethacrylate) and organic silicon compounds. The organosilicon compound used as the binder is not particularly limited, and examples thereof include polysiloxane, polyorganosilane, polyorganosilazane, and organosilane that is a monomer. Both ends, one end, or a side chain is an amine or epoxy. It is also possible to use an organic silicon compound modified with a reactive group such as carboxy, methacryl and the like, an alkyl group, a polyether group, a fatty acid or the like. For example, alkoxysilane, silazane, silane compounds such as silane coupling agents, dimethyl silicone,
Examples thereof include silicone oils such as methylphenyl silicone and methyl hydrogen silicone. Among them,
Silicone oil is preferable, and silicone oil having one or more of Si-H group, polyether group and carboxyl group is more preferable.

By fixing and kneading these binders with the (D) inorganic particles in advance, and then adding carbon black and further mixing and kneading, the fixing rate of carbon black on the surface of the inorganic particles is improved. The blending amount of (C) carbon black is 5 to 50% by weight based on (D) inorganic particles.
And the compounding amount of carbon black (C) is 0.1 with respect to the epoxy resin molding material for sealing.
It is preferably about 1.0% by weight. When the (F) binder is used, its addition amount is preferably 0.1 to 20% by weight, and more preferably 1 to 20% by weight based on the inorganic particles.
It is 10% by weight. If the amount is less than 0.1% by weight, the surface of the inorganic particles cannot be sufficiently coated, and the carbon fixation rate is lowered. On the other hand, when the amount of the binder exceeds 20% by weight, the workability is likely to be deteriorated due to the seepage to the surface of the molded product.

The inorganic particles (D) are not particularly limited as long as they can be fixed to carbon black, but the fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide and aluminum nitride mentioned in the filler (E) are used. , Powders of boron nitride, beryllia, zirconia, etc., or spherical beads of these, single crystal fibers of potassium titanate, silicon carbide, silicon nitride, alumina, etc., glass fibers, aluminum hydroxide, magnesium hydroxide, zinc borate Of course, antimony compounds such as antimony trioxide and antimony tetroxide, iron oxide, zinc oxide and the like can be used. Among them, particle size, specific surface area, cost,
Silica (particularly fused silica) and iron (III) oxide are preferably used from the viewpoint of environmental load and the like.

The average particle size of the inorganic particles to which carbon black is fixed is preferably 10 μm or less, more preferably 5 μm or less, still more preferably 1 μm or less. The maximum particle size of the inorganic particles to which carbon black is fixed is preferably 50 μm or less, more preferably 30 μm or less, and further preferably 10 μm or less. The maximum particle size referred to here is the maximum particle size at which the cumulative fraction of larger particles is 0.5% or more. If the maximum particle size of the inorganic particles to which carbon black is fixed exceeds 50 μm, the occurrence rate of defective electrical characteristics of the semiconductor device increases, which is not preferable. The specific surface area of the inorganic particles to which the carbon black is fixed is preferably 3 m ² / g or more. It is more preferably 10 m ² / g or more, and particularly preferably 50 m ² / g or more. The average particle diameter can be measured by a laser diffraction type particle size distribution meter, and the specific surface area can be measured by a general method such as measurement of BET nitrogen specific surface area.

A specific example of a method for fixing carbon black to inorganic particles is as follows. 1.5μ average particle size in Ishikawa type stirring crusher manufactured by Ishikawa factory
1000 g of silica having m and a specific surface area of 4 m ² / g and 10 g of dimethyl silicone oil are put and mixed by stirring for 60 minutes. Then, 100 g of carbon black is added, and the mixture is stirred for 60 minutes to obtain carbon black fixed on the silica surface.

Components other than the components (A) to (F), for example, a coupling agent may be used in the encapsulating epoxy resin molding material of the present invention. For example, vinyltrichlorosilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- Glycidoxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-
[Bis (β-hydroxyethyl)] aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, γ- (β-aminoethyl) aminopropyldimethoxymethylsilane, N- (tri Methoxysilylpropyl) ethylenediamine, N-
(Dimethoxymethylsilylisopropyl) ethylenediamine, methyltrimethoxysilane, methyltriethoxysilane, N-β- (N-vinylbenzylaminoethyl)
-Γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane,
Silane coupling agents such as γ-anilinopropyltrimethoxysilane, vinyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, or isopropyltriisostearoyl titanate, isopropyltris (dioctylpyrophosphate) titanate, isopropyltri (N- Aminoethyl-aminoethyl) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctyl pyrophosphate) oxyacetate titanate , Bis (dioctyl pyrophosphate) ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacryl isostearoyl ti One or more titanate coupling agents such as tannate, isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearoyldiacrylic titanate, isopropyltri (dioctylphosphate) titanate, isopropyltricumylphenyltitanate, tetraisopropylbis (dioctylphosphite) titanate. Can be used together.

In addition to the above-mentioned silane coupling agent, the epoxy resin molding material for sealing of the present invention has the following general formula (XI
The silane compounds of II) can be used. _{^{(R 1) 2 -Si- (OR}} 2) 2 ......... (XIII) ( wherein, R ¹ represents an alkyl group or phenyl group having 1 to 10 carbon atoms, R ² represents a methyl group or an ethyl group. The silane compound represented by the general formula (XIII) contributes to the improvement of the adhesion to the lead frame and is effective in preventing the infiltration of water from the interface between the epoxy resin molding material for encapsulation and the lead frame. Examples thereof include dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, methylphenyldimethoxysilane, and methylphenyldiethoxysilane. Among them, dimethyldimethoxysilane is particularly preferable.

A curing accelerator can also be used in the encapsulating epoxy resin molding material of the present invention. For example, 1,
8-diaza-bicyclo (5,4,0) undecene-7,
1,5-diaza-bicyclo (4,3,0) nonene, 5,
6-dibutylamino-1,8-diaza-bicyclo (5,5
4,0) tertiary amines such as undecene-7, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol and their derivatives, 2-methylimidazole, 2-
Imidazoles such as phenylimidazole and 2-phenyl-4-methylimidazole and their derivatives, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine and phenylphosphine, and maleic anhydride to these phosphines. Compounds having an intramolecular polarization formed by adding a compound having a π bond such as benzoquinone and diazophenylmethane, tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, 2-ethyl-4-methylimidazole tetraphenyl Examples thereof include borates, tetraphenylboron salts such as N-methylmorpholine tetraphenylborate, and derivatives thereof. These may be used alone or in combination of two or more.

The epoxy resin molding material of the present invention may optionally contain a conventionally known flame retardant. For example, aluminum hydroxide, magnesium hydroxide, zinc borate, zinc oxide, zinc stannate, iron oxide, antimony oxide,
Inorganic compounds containing metal elements such as molybdenum oxide and zinc molybdate; phosphorus compounds such as red phosphorus, phosphoric acid esters and phosphine oxides; melamine, melamine derivatives, melamine modified phenolic resins, compounds having triazine ring, cyanuric acid derivatives, Nitrogen-containing compounds such as isocyanuric acid derivatives; phosphorus- and nitrogen-containing compounds such as cyclophosphazenes; flame-retardant halides such as brominated epoxy resins and brominated phenol resins; organometallic compounds such as dicyclopentadienyl iron; Can be mentioned. These 1 type may be used individually or may be used in combination of 2 or more type. Further, among the flame retardants shown above, inorganic ones are coated with an organic substance for the purpose of increasing dispersibility in an epoxy resin molding material, preventing decomposition due to moisture absorption, and increasing curability. May be. Further, as other additives, natural wax, synthetic wax, release agent such as oxidized or non-oxidized polyolefin, coloring agent other than carbon black, stress relaxation agent such as silicone oil or silicone rubber powder, hydrotalcite, antimony. -An ion trap agent such as bismuth can be used if necessary.

The encapsulating epoxy resin molding material of the present invention may be any one if various raw materials can be uniformly dispersed and mixed.
Although it can be prepared by any method, as a general method, a method of sufficiently mixing raw materials of a predetermined amount by a mixer or the like, melt-kneading with a mixing roll, an extruder or the like, followed by cooling and pulverizing can be mentioned. be able to. It is easy to use if it is made into a tablet with dimensions and weight that match the molding conditions.

The electronic component device provided with the element encapsulated by the encapsulating epoxy resin molding material obtained in the present invention can be used as a supporting member such as a lead frame, a wired tape carrier, a wiring board, a glass, a silicon wafer and the like. , Semiconductor chips, transistors, diodes, active elements such as thyristors, capacitors, resistors, elements such as passive elements such as coils are mounted, and necessary parts are sealed with the epoxy resin molding material for sealing of the present invention, Examples include electronic component devices.
As such an electronic component device, for example, after fixing a semiconductor element on a lead frame and connecting the terminal portion of the element such as a bonding pad and the lead portion by wire bonding or bump, the sealing epoxy resin of the present invention is used. DI formed by transfer molding using a molding material
P (Dual Inline Package), PLCC (Plastic Leade)
d Chip Carrier), QFP (Quad Flat Package), S
OP (Small Outline Package), SOJ (Small Outli
ne J-lead package), TSOP (Thin Small Outline)
Package), TQFP (Thin Quad Flat Package), and other general resin-sealed ICs, TCP (Tape Carrier) in which a semiconductor chip connected to a tape carrier by bumps is encapsulated with the encapsulating epoxy resin molding material of the present invention. Package), active elements such as semiconductor chips, transistors, diodes, thyristors, etc. that are connected to wiring formed on a wiring board or glass by wire bonding, flip chip bonding, solder, etc. and / or passive elements such as capacitors, resistors and coils. A device is formed on the surface of a COB (Chip On Board) module, a hybrid IC, a multi-chip module in which an element is encapsulated with the encapsulating epoxy resin molding material of the present invention, and an organic substrate on which terminals for connecting wiring boards are formed on the back surface. Equipped with,
BGA (Ball Grid Ar) in which the element and the wiring formed on the organic substrate are connected by bumps or wire bonding and then the element is encapsulated by the encapsulating epoxy resin molding material of the present invention.
ray), CSP (Chip Size Package), and the like. Further, the epoxy resin molding material for sealing of the present invention can be effectively used for printed circuit boards. The low-pressure transfer molding method is the most general method for sealing an element using the sealing epoxy resin molding material of the present invention, but an injection molding method, a compression molding method or the like may be used.

[0045]

EXAMPLES Examples of the present invention will be shown below, but the scope of the present invention is not limited to these examples. (Inorganic particle-fixed carbon production examples 1 to 5) (C) Carbon blacks A to E shown in Table 1 as carbon black,
(D) Fused silicas A to D and iron oxide (Fe ₂ O ₃ ) (reagent deer grade 1) were prepared as inorganic particles. In addition, dimethyl silicone oil (product name KF96L, Shin-Etsu Chemical Co., Ltd.) was prepared as the (F) binder.

[0046]

[Table 1]

The above carbon blacks A to E were prepared under the following conditions.
Were fixed to fused silica A to D and iron oxide. [Silica-immobilized carbon 1] 1000 g of fused silica A having an average particle size of 7 μm and a specific surface area of 4 m ² / g and 10 g of dimethyl silicone oil were put into an Ishikawa type stirring and crushing machine manufactured by Ishikawa Factory Co., Ltd. and stirred and mixed for 60 minutes. Thereafter, 50 g of carbon black A was added, and the mixture was further stirred for 60 minutes to obtain silica-fixed carbon 1. [Silica-fixed carbon 2] fused silica B having an average particle size of 1.5 μm and a specific surface area of 4 m ² / g, and carbon black B
Silica fixed carbon 2 was obtained in the same manner as silica fixed carbon 1 except that 100 g was used. [Silica-immobilized carbon 3] Fused silica C having an average particle size of 0.2 μm and a specific surface area of 15 m ² / g, and carbon black C
Silica-fixed carbon 3 was obtained in the same manner as silica-fixed carbon 1 except that 200 g was used. [Silica-fixed carbon 4] Silica-fixed carbon 1 except that fused silica D having an average particle diameter of 0.02 μm and a specific surface area of 200 m ² / g and 500 g of carbon black D were used.
Silica-fixed carbon 4 was obtained in the same manner as in. [Iron oxide (III) fixed carbon] Iron oxide similarly to the silica fixed carbon 1 except that 1000 g of iron (III) oxide (Fe ₂ O ₃ ) having an average particle size of 0.3 μm and 100 g of carbon black E were used. Fixed carbon was obtained.

(Examples 1 to 18, Comparative Examples 1 to 18) Table 2
Each of the raw materials was premixed (dry blended) with the compounding composition (parts by weight) shown in FIGS.
-18 and the epoxy resin molding material for sealing of Comparative Examples 1-18 were manufactured. As the colorant, the inorganic particle-fixed carbon prepared above was used in Examples 1 to 18, and the carbon blacks A to E were used in Comparative Examples 1 to 18. Using the transfer molding machine, a total of 36 kinds of molding materials thus prepared were used, with a mold temperature of 180 ° C. and a molding pressure of 6.9 MPa (7
It was molded under the conditions of 0 kgf / cm ² ) and a curing time of 90 seconds, and the following tests were carried out for evaluation. (1) Spiral flow (index of fluidity) Molding was performed using a spiral flow measurement mold according to EMMI-1-66, and the flow distance was determined. (2) Hardness when heated The hardness of the molded product immediately after opening the mold was measured using a Shore-D type hardness meter. (3) Volume resistivity Diameter of 100 m using the epoxy resin molding material for sealing
A disc having a thickness of 3 mm and a thickness of 3 mm is formed, and a concentric electrode having a diameter of 50 mm, an inner diameter of 70 mm and a width of 5 mm is formed on the surface of the disc using conductive silver paint, and an electrode having a diameter of 80 mm is formed on the back surface. Using this test piece, the volume resistivity at 150 ° C. was measured with a volume resistance meter TR-8601 manufactured by Takeda Riken Kogyo Co., Ltd. (4) Color tone 100m in diameter using the epoxy resin molding material for sealing
m, 2 mm thick surface-finished satin disc was molded and manufactured by Suga Test Instruments Co., Ltd. SM color computer (model number SM-5-1
The color tone (L ^* ) was measured using S2B). (5) YAG mark property A YAG laser marker model number SL478B manufactured by NEC Corporation is formed by molding a mirror-finished disc having a diameter of 100 mm and a thickness of 2 mm.
Was printed at an output of 5J. The printing depth was measured with a surface roughness meter, and 5 μm or less was judged as NG. (6) Number of carbon black agglomerates and maximum diameter 10 discs each having a diameter of 50 were molded using the epoxy resin molding material for sealing, and the surface was polished with sandpaper # 1500. This disk was observed with a metallurgical microscope at a magnification of 125 times, and the total number of aggregates of 30 μm or more and the maximum diameter of the largest particles were measured. (7) Insulation reliability A TEG chip with a pad pitch of 80 μm is Ag paste (product name: EN-400, Hitachi Chemical Co., Ltd.) on a lead frame.
0) and it is adhered, and Tanaka Kikinzoku Kogyo Co., Ltd. φ30
Wire bonding was performed using a μm gold wire. This was molded into a QFP1420 2mmt package by transfer molding, and after confirming that there was no short circuit due to wire deformation with a soft X-ray device, the presence or absence of continuity between the leads was measured. It was judged. (8) Insulation reliability B Line / space = 20 μm / on glass epoxy substrate
A 20 μm comb-shaped wiring and electrode portions were formed on both ends by etching. After measuring the resistance value between the electrodes of this substrate, the electrode part was removed and sealing was performed by transfer molding, and the resistance value between the electrodes was measured again. A sample whose resistance value was reduced by two digits or more as compared with that before molding was determined to be NG.

The evaluation results are also shown in Tables 2-9. Specific examples of the raw materials shown in Tables 2 to 9 are as follows. (1) Epoxy resin Biphenyl type epoxy resin: Japan Epoxy Resin Co., Ltd. product name YX-4000H Bisphenol F type epoxy resin: Nippon Steel Chemical Co., Ltd. product name YSLV-80XY Sulfur atom-containing epoxy resin: Nippon Steel Chemical Co., Ltd. Company name YSLV-120TE Stilbene type epoxy resin: Sumitomo Chemical Co., Ltd. product name ESLV-210 Novolac type epoxy resin: Sumitomo Chemical Co., Ltd. product name ESCN-190 dicyclopentadiene type epoxy resin: Dainippon Ink and Chemicals Kogyo Co., Ltd. product name MP-7200 Triphenylmethane type epoxy resin: Nippon Kayaku Co., Ltd. product name EPPN-502 Brominated epoxy resin (* 1): Sumitomo Chemical Co., Ltd. product name ESB-400

(2) Hardener Aralkyl type phenol resin: Mitsui Chemicals, Inc. trade name XL-225-3L Biphenyl type phenolic resin: Meiwa Kasei Co., Ltd. trade name MEH-7851 Dicyclopentadiene type phenol resin: Nippon Petrochemical Product name DPP-L triphenylmethane type phenolic resin manufactured by: Meiwa Kasei Co., Ltd. Product name MEH-7500 novolac type phenolic resin: Hitachi Chemical Co., Ltd. product name HP-850N (3) Release agent polyethylene wax: Product name PED-191 manufactured by Clariant Japan Co., Ltd. (4) Coupling agent Epoxysilane (* 2): Product name A-187 manufactured by Nippon Unicar Co., Ltd. (5) Inorganic filler spherical silica (* 3): Product manufactured by Micron Corporation Product name S-
CO

The compounding units in the table are parts by weight, and the other compounding amounts and the like are as follows. Addition amount of carbon (* 4): Addition amount of carbon black (% by weight) to epoxy resin molding material for encapsulation Carbon treatment rate (* 5): Inorganic particles (fused silica A to
Amount of carbon black treated (D or iron oxide) (% by weight) Amount of filler (* 6): Amount of silica added (% by weight) to the epoxy resin molding material for encapsulation (including silica used as inorganic particles).

[0052]

[Table 2]

[0053]

[Table 3]

[0054]

[Table 4]

[0055]

[Table 5]

[0056]

[Table 6]

[0057]

[Table 7]

[0058]

[Table 8]

[0059]

[Table 9]

As shown in Tables 2 to 9, the comparative examples to which the inorganic particle-immobilized carbon of the present invention is not applied are remarkably inferior in insulation reliability. Only Comparative Example 16 in which the amount of carbon black added was significantly reduced passed the insulation reliability evaluation, but the YAG laser mark property was remarkably inferior, making it difficult to apply in mass production. On the other hand, in Examples 1 to 18 in which the inorganic particle-fixed carbon was applied, all evaluations were good.

[0061]

The encapsulating epoxy resin molding material of the present invention is excellent in reliability and moldability, and contributes to the reduction of electrical characteristic defects due to carbon in electronic component devices such as semiconductor devices. And, this molding material, especially narrow pad pitch, multi-pin,
When used in semiconductor devices having characteristics such as stacked chips, thin type, and long wires, insulation reliability, moldability, and productivity are improved, and the industrial value is great.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takatoshi Ikeuchi             Hitachi Chemical Co., Ltd. 1772, Kagoku, Yuki City, Ibaraki Prefecture             Shimodate Office of Industry Co., Ltd. F-term (reference) 4J002 CC032 CC042 CC052 CC062                       CC072 CD011 CD021 CD031                       CD041 CD051 CD061 CD101                       CD111 CD131 CD141 CE002                       DA036 DE077 DE097 DE147                       DE187 DE237 DF017 DJ007                       DJ017 DK007 DL007 FA047                       FA067 FA087 FB076 FD017                       FD120 FD126 FD130 FD142                       FD150 GQ05                 4M109 AA01 BA01 CA21 EA02 EB02                       EB08 EB12 EB17 EC07

Claims (14)

[Claims] 1. An epoxy resin (A), a curing agent (B),
(C) carbon black and (D) inorganic particles are contained, and part or all of (C) carbon black is (D)
An epoxy resin molding material for sealing fixed to inorganic particles. 2. The epoxy resin molding material for sealing according to claim 1, further comprising (E) an inorganic filler. 3. The epoxy resin molding material for encapsulation according to claim 1, wherein a part or all of the inorganic filler (E) is used as the inorganic particles (D). 4. The epoxy resin molding for encapsulation according to claim 1, wherein (C) carbon black is partially or wholly fixed to (D) inorganic particles through (F) binder. material. 5. The epoxy resin molding material for encapsulation according to claim 1, wherein (C) the carbon black-fixed (D) inorganic particles has an average particle diameter of 10 μm or less. 6. The encapsulating epoxy resin molding material according to claim 1, wherein (C) the carbon black-fixed (D) inorganic particles has a specific surface area of 3 m ² / g or more. 7. The blending amount of (C) carbon black is 5 to 50% by weight based on (D) inorganic particles.
7. The epoxy resin molding material for sealing according to any one of to 6. 8. The encapsulating epoxy resin according to claim 1, wherein the compounding amount of (C) carbon black is 0.1 to 1.0% by weight based on the encapsulating epoxy resin molding material. Molding material. 9. The epoxy resin molding material for encapsulation according to claim 1, wherein the inorganic particles to which (C) carbon black is fixed are silica or iron oxide. 10. The epoxy resin molding material for encapsulation according to claim 1, wherein the epoxy resin (A) has a viscosity at 150 ° C. of 2 poise or less. 11. The (A) epoxy resin is a biphenyl type epoxy resin, a bisphenol F type epoxy resin, a stilbene type epoxy resin, a sulfur atom-containing epoxy resin, a novolac type epoxy resin, a dicyclopentadiene type epoxy resin, a naphthalene type epoxy resin, and The encapsulating epoxy resin molding material according to any one of claims 1 to 10, which contains at least one triphenylmethane type epoxy resin. 12. The curing agent (B) contains at least one selected from a biphenyl type phenol resin, an aralkyl type phenol resin, a triphenylmethane type phenol resin, a dicyclopentadiene type phenol resin and a novolac type phenol resin. The epoxy resin molding material for encapsulation according to any one of 11 above. 13. (E) 80 to 95% by weight of an inorganic filler
The epoxy resin molding material for sealing according to any one of claims 1 to 12, which contains. 14. An electronic component device comprising an element encapsulated with the epoxy resin molding material for encapsulation according to any one of claims 1 to 13.