CN109420590B - 涂敷处理装置和涂敷液捕集构件 - Google Patents

涂敷处理装置和涂敷液捕集构件 Download PDF

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Publication number
CN109420590B
CN109420590B CN201810998096.3A CN201810998096A CN109420590B CN 109420590 B CN109420590 B CN 109420590B CN 201810998096 A CN201810998096 A CN 201810998096A CN 109420590 B CN109420590 B CN 109420590B
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China
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solvent
coating liquid
coating
substrate
wafer
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CN201810998096.3A
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Chinese (zh)
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CN109420590A (zh
Inventor
上村良一
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
    • B05B14/30—Arrangements for collecting, re-using or eliminating excess spraying material comprising enclosures close to, or in contact with, the object to be sprayed and surrounding or confining the discharged spray or jet but not the object to be sprayed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201810998096.3A 2017-08-29 2018-08-29 涂敷处理装置和涂敷液捕集构件 Active CN109420590B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-164762 2017-08-29
JP2017164762A JP6841188B2 (ja) 2017-08-29 2017-08-29 塗布処理装置及び塗布液捕集部材

Publications (2)

Publication Number Publication Date
CN109420590A CN109420590A (zh) 2019-03-05
CN109420590B true CN109420590B (zh) 2021-05-28

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CN201810998096.3A Active CN109420590B (zh) 2017-08-29 2018-08-29 涂敷处理装置和涂敷液捕集构件
CN201821405221.7U Active CN209020671U (zh) 2017-08-29 2018-08-29 涂敷处理装置和涂敷液捕集构件

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Country Status (5)

Country Link
US (1) US10699919B2 (https=)
JP (1) JP6841188B2 (https=)
KR (1) KR102195652B1 (https=)
CN (2) CN109420590B (https=)
TW (1) TWI791039B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7462503B2 (ja) 2019-08-30 2024-04-05 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置
JP7426808B2 (ja) 2019-11-27 2024-02-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7339150B2 (ja) * 2019-12-20 2023-09-05 ラピスセミコンダクタ株式会社 基板処理装置、基板処理方法
JP7525363B2 (ja) 2020-10-08 2024-07-30 東京エレクトロン株式会社 液処理装置及び洗浄方法
JP7546461B2 (ja) * 2020-12-01 2024-09-06 東京エレクトロン株式会社 液処理方法及び液処理装置
CN113058791B (zh) * 2021-04-06 2022-04-19 黄河科技学院 一种汽车喷漆装置
CN116072565B (zh) * 2021-10-29 2025-09-23 弘塑科技股份有限公司 单晶圆湿处理设备
JP2023167537A (ja) * 2022-05-12 2023-11-24 新電元工業株式会社 レジスト塗布装置
CN115871089B (zh) * 2022-12-07 2024-07-23 江西唯美陶瓷有限公司 一种静电喷涂设备及静电喷涂方法
CN115662937B (zh) * 2022-12-29 2023-03-17 四川晶辉半导体有限公司 一种芯片安装设备
KR102819948B1 (ko) * 2023-06-15 2025-06-13 세메스 주식회사 기판 처리 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151376A (ja) * 2000-11-07 2002-05-24 Tokyo Electron Ltd 現像処理方法及び現像処理装置
CN102059197A (zh) * 2009-11-13 2011-05-18 采钰科技股份有限公司 喷涂系统及方法
JP3175893U (ja) * 2012-03-15 2012-06-07 東京エレクトロン株式会社 液処理装置
CN104425235A (zh) * 2013-08-30 2015-03-18 芝浦机械电子株式会社 自旋处理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5705223A (en) * 1994-07-26 1998-01-06 International Business Machine Corp. Method and apparatus for coating a semiconductor wafer
JPH10296162A (ja) * 1997-04-24 1998-11-10 Dainippon Screen Mfg Co Ltd 回転式基板処理装置および回転式基板処理装置用カップ
JP2001176767A (ja) 1999-12-08 2001-06-29 Lsi Logic Corp フォトレジスト塗布装置
JP2004050054A (ja) 2002-07-19 2004-02-19 Dainippon Screen Mfg Co Ltd 基板処理装置の洗浄方法および基板処理装置
JP2006086204A (ja) * 2004-09-14 2006-03-30 Tokyo Ohka Kogyo Co Ltd 塗布装置
JP6045357B2 (ja) * 2013-01-16 2016-12-14 キヤノン株式会社 薬液層の形成方法
JP6119293B2 (ja) * 2013-02-18 2017-04-26 株式会社リコー 回転塗布装置および回転塗布装置の洗浄方法
JP6020271B2 (ja) * 2013-03-18 2016-11-02 東京エレクトロン株式会社 液処理装置
JP6482348B2 (ja) * 2015-03-26 2019-03-13 株式会社テックインテック 回転式塗布装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151376A (ja) * 2000-11-07 2002-05-24 Tokyo Electron Ltd 現像処理方法及び現像処理装置
CN102059197A (zh) * 2009-11-13 2011-05-18 采钰科技股份有限公司 喷涂系统及方法
JP3175893U (ja) * 2012-03-15 2012-06-07 東京エレクトロン株式会社 液処理装置
CN104425235A (zh) * 2013-08-30 2015-03-18 芝浦机械电子株式会社 自旋处理装置

Also Published As

Publication number Publication date
US20190067043A1 (en) 2019-02-28
TW201919771A (zh) 2019-06-01
CN209020671U (zh) 2019-06-25
JP2019046833A (ja) 2019-03-22
KR102195652B1 (ko) 2020-12-28
TWI791039B (zh) 2023-02-01
US10699919B2 (en) 2020-06-30
CN109420590A (zh) 2019-03-05
JP6841188B2 (ja) 2021-03-10
KR20190024725A (ko) 2019-03-08

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