CN109324480A - 感光性树脂组合物、感光性元件、抗蚀图案的形成方法、印刷线路板的制造方法 - Google Patents

感光性树脂组合物、感光性元件、抗蚀图案的形成方法、印刷线路板的制造方法 Download PDF

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Publication number
CN109324480A
CN109324480A CN201811138918.7A CN201811138918A CN109324480A CN 109324480 A CN109324480 A CN 109324480A CN 201811138918 A CN201811138918 A CN 201811138918A CN 109324480 A CN109324480 A CN 109324480A
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CN
China
Prior art keywords
polymer combination
photosensitive polymer
methyl
mass
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811138918.7A
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English (en)
Chinese (zh)
Inventor
深谷雄大
宫坂昌宏
矶纯
矶纯一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN109324480A publication Critical patent/CN109324480A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G03F7/0022—Devices or apparatus
    • G03F7/003—Devices or apparatus characterised by storage means for the light sensitive material, e.g. cartridges
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
    • G03F7/0212—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymerisation Methods In General (AREA)
CN201811138918.7A 2011-05-10 2012-05-09 感光性树脂组合物、感光性元件、抗蚀图案的形成方法、印刷线路板的制造方法 Pending CN109324480A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011105441 2011-05-10
JP2011-105441 2011-05-10
CN2012101416585A CN102778815A (zh) 2011-05-10 2012-05-09 感光性树脂组合物、感光性元件、抗蚀图案的形成方法、印刷线路板的制造方法

Related Parent Applications (1)

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CN2012101416585A Division CN102778815A (zh) 2011-05-10 2012-05-09 感光性树脂组合物、感光性元件、抗蚀图案的形成方法、印刷线路板的制造方法

Publications (1)

Publication Number Publication Date
CN109324480A true CN109324480A (zh) 2019-02-12

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CN201811138918.7A Pending CN109324480A (zh) 2011-05-10 2012-05-09 感光性树脂组合物、感光性元件、抗蚀图案的形成方法、印刷线路板的制造方法
CN2012101416585A Pending CN102778815A (zh) 2011-05-10 2012-05-09 感光性树脂组合物、感光性元件、抗蚀图案的形成方法、印刷线路板的制造方法

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Country Status (4)

Country Link
JP (2) JP5935462B2 (ko)
KR (1) KR101935609B1 (ko)
CN (2) CN109324480A (ko)
TW (2) TWI670568B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110531583A (zh) * 2019-09-14 2019-12-03 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层
CN110632825A (zh) * 2019-09-14 2019-12-31 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀剂

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CN103028842B (zh) * 2012-12-28 2014-12-31 苏州德龙激光股份有限公司 激光直接成像加工装置及其方法
JP6023010B2 (ja) * 2013-06-26 2016-11-09 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
JP6318484B2 (ja) * 2013-07-09 2018-05-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN106462066A (zh) * 2014-05-13 2017-02-22 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷布线板的制造方法

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JP2006234995A (ja) * 2005-02-23 2006-09-07 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
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JP4635935B2 (ja) * 2006-03-29 2011-02-23 Ｊｓｒ株式会社 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子
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JP2006234995A (ja) * 2005-02-23 2006-09-07 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
CN1892424A (zh) * 2005-06-28 2007-01-10 旭化成电子材料元件株式会社 感光性树脂组合物及层合体
CN101278235A (zh) * 2005-10-04 2008-10-01 日立化成工业株式会社 感光性树脂组合物、感光性元件及印刷电路板的制造方法
CN101405656A (zh) * 2006-04-04 2009-04-08 日立化成工业株式会社 感光性树脂组合物、以及使用其的感光性元件、抗蚀图案的形成方法及印刷电路板的制造方法
CN101568883A (zh) * 2006-12-27 2009-10-28 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法
CN101971097A (zh) * 2008-03-21 2011-02-09 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷配线板的制造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110531583A (zh) * 2019-09-14 2019-12-03 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层
CN110632825A (zh) * 2019-09-14 2019-12-31 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀剂
CN110531583B (zh) * 2019-09-14 2023-09-29 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层

Also Published As

Publication number Publication date
TW201839511A (zh) 2018-11-01
JP5935462B2 (ja) 2016-06-15
KR20120126013A (ko) 2012-11-20
TWI670568B (zh) 2019-09-01
TW201303493A (zh) 2013-01-16
JP6052440B2 (ja) 2016-12-27
KR101935609B1 (ko) 2019-01-04
CN102778815A (zh) 2012-11-14
JP2012252320A (ja) 2012-12-20
JP2016118793A (ja) 2016-06-30
TWI644171B (zh) 2018-12-11

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Application publication date: 20190212