CN109148310B - 包括堆叠的芯片的电子器件 - Google Patents

包括堆叠的芯片的电子器件 Download PDF

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CN109148310B
CN109148310B CN201810941470.6A CN201810941470A CN109148310B CN 109148310 B CN109148310 B CN 109148310B CN 201810941470 A CN201810941470 A CN 201810941470A CN 109148310 B CN109148310 B CN 109148310B
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integrated circuit
circuit chip
electronic device
electrical connection
protective
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CN109148310A (zh
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R·科菲
J·普吕沃
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STMicroelectronics Grenoble 2 SAS
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Abstract

本公开的实施方式涉及一种用于制造电子器件的方法以及电子器件，其中第一和第二集成电路芯片(2，5)被面对地并且彼此相距一定距离堆叠，多个电连接柱(11)和至少一个保护性阻挡件(7，28，29，35)介于所述芯片之间，从而在所述芯片的相互相对的局部区域(9，10)之间界定自由空间(8)，并且包封块(12)在具有较小的安装面的芯片(2)周围以及在另一芯片(5)的安装面的外围之上延伸；并且其中所述电连接柱以及所述保护性阻挡件出于同步制造的目的而由至少一种相同的金属材料制成。

Description

包括堆叠的芯片的电子器件
本申请是于2015年9月16日提交的、申请号为201510591151.3、发明名称为“包括堆叠的芯片的电子器件”的中国发明专利申请的分案申请。
技术领域
本发明涉及包括彼此堆叠的集成电路芯片的电子器件领域。
背景技术
根据一个已知的实施例，电子器件包括由键合到具有更大尺寸的第二芯片上的第一芯片组成的堆叠，以及电连接晶片，第二芯片被键合到电连接晶片上并且电连接晶片具有大于该第二芯片的尺寸。
第一芯片的正面焊盘通过第一弯曲的电连接线连接到第二芯片的正面焊盘。
第二芯片的其他正面焊盘通过第二弯曲的电连接线连接到电连接晶片的正面焊盘。
通常，第一芯片包含传感器，例如微机电系统，一般被称为MEMS，并且第二芯片包含用于处理来自传感器的信号的电子电路，并且经过处理的信号经由电连接晶片被传输至印刷电路板。
第一和第二芯片以及第一和第二电连接线被嵌入到形成在电连接晶片的正面的包封块中，以保护电连接线以及传感器，特别是防护湿气。
电子器件之后借助电连接珠或电连接柱固定在印刷电路板上。
这样的电子器件具有的缺点在于体积庞大并且昂贵，这是由于其存在三个堆叠的元件、存在一般由金制成的电连接线、以及大量的操作被执行以便实施组装。
发明内容
本发明的目的在于产生一种具有较小的体积并且更易于制造的电子器件，使得其能够造价较低。
一个实施例提供一种用于制造至少一个电子器件的方法，该电子器件包括彼此堆叠的第一和第二集成电路芯片。
所述方法包括：
通过至少一种金属的生长或电沉积在第一芯片的安装面的安装区上同时产生围绕所述安装面的区域的多个金属电连接柱以及至少一个保护性金属阻挡件，所述保护性金属阻挡件包括不连续的保护性环；
将第二芯片在如下位置处放置在所述第一芯片上方，使得所述第二芯片的安装面面对所述第一芯片的所述安装面，并且所述电连接柱和所述保护性阻挡件的端部与所述第二芯片的安装区发生接触；
通过焊接将所述电连接柱和所述保护性阻挡件的端部固定至所述第二芯片的安装区，使得所述保护性阻挡件界定在所述芯片之间的密封的自由空间；以及
在具有较小的安装面的芯片周围以及在另一芯片的安装面的外围上添加涂层材料，并且使所述涂层材料固化以便产生包封块。
所述方法可以包括：产生至少部分地为至少一个开口环形式的所述保护性阻挡件。
所述方法可以包括：产生至少部分地为彼此相距一定距离的柱形式的所述保护性阻挡件。
所述方法可以包括：产生所述包封块，使得所述包封块到达所述保护性阻挡件。
另一个实施例提供了一种电子器件，包括：
第一和第二集成电路芯片，被彼此堆叠，并且具有彼此面对且彼此相距一定距离的安装面，
多个电连接柱以及至少一个保护性阻挡件，介于所述芯片的所述安装面之间并且被固定到所述芯片的所述安装面，从而界定在所述安装面的相互相对的局部区域之间的自由空间，
以及包封块，在具有较小的安装面的芯片周围以及在另一芯片的安装面的外围之上延伸；
所述电连接柱以及所述保护性阻挡件由至少一种相同的金属材料制成。
所述保护性阻挡件可以至少部分地包括至少一个闭合环。
所述保护性阻挡件可以至少部分地包括至少一个开口环。
所述保护性阻挡件至少部分地包括彼此相距一定距离的柱。
所述芯片中的一个芯片可以包括传感器，并且另一芯片可以包括用于处理由所述传感器递送的信号的电子电路。
附图说明
现在，电子器件将通过由附图示出的非限定示例来描述，其中：
图1表示包括两个芯片的电子器件的横截面图；
图2表示电子器件的沿图1的II-II线的经过所述芯片之间的平面截面图；
图3和图4表示对应于电子器件的制造步骤的组件的横截面图；
图5和图6呈现对应于电子器件的其它制造步骤的组件的横截面图；
图7至图9表示电子器件的备选实施例的平面截面图。
具体实施方式
如图1和图2所示，电子器件1包括第一集成电路芯片2，第一集成电路芯片2具有例如正方形的安装面3，并且包含在该安装面3的中心部分之下的传感器4，例如微机电系统，一般涉及MEMS。
电子器件1包括第二集成电路芯片5，其具有例如正方形的安装面6，并且包含在该安装面6之下的集成电子电路5a。芯片2的安装面3的表面区域小于芯片5的安装面6的表面区域。
芯片2和5在如下位置处被彼此堆叠，使得安装面3和6彼此相距一定距离平行地彼此面对，芯片2在芯片5的中间并且它们外围边缘分别平行地布置。
电子器件1包括为闭合的保护性环7的形式的保护性金属阻挡件，闭合的保护性环7介于安装面3和6的局部安装区之间并固定到这些局部区，从而围绕芯片2和5的安装面3和6的彼此相对的局部区域9和10并且界定在这些局部区域的之间的密封的自由空间8。
保护性环7例如以正方形的形式延伸，正方形的侧边平行于芯片2和5的外围边缘。传感器4被包括在芯片2的局部区域9中并且与保护性环7相距一定距离。
电子器件1包括多个金属电连接柱11，金属电连接柱11介于安装面3和6之间并固定到安装面3和6，并且金属电连接柱11位于保护性环7的外部，也就是在保护性环7和芯片2的外围边缘之间并且与它们相距一定距离。例如，金属电连接元件11被设置在沿着保护性环7的两个平行分支布置的两个平行相对的线上。
电连接柱11被布置在由芯片2和5的安装面3和6的电连接焊盘组成的局部安装区上。
电子器件1还包括例如由环氧树脂制成的包封块12，其形成在芯片5的安装面6的外围部分上以便围绕芯片2，并且包封块在芯片2和5的安装面3和6之间延伸，这时包封块12在电连接柱11之间穿过，直到保护性环7。借助于该保护性环7，包封块12的材料未达到自由空间8，使得自由空间8在抵抗湿气以及抵抗任何固体颗粒的侵入方面特别地被保护，并且进而使得传感器4受到保护。
包封块12的厚度使得其具有与芯片2的外部面14在相同的平面内延伸的外部面13，芯片2的外部面14与芯片2的安装面3相对并且平行。
芯片5和包封块12的外围侧边被对准并且与安装面6垂直地延伸，使得电子器件1为平行六面体的形状。
芯片5具有多个金属电连接过孔15，金属电连接过孔15连接集成电子电路5a以及布置在芯片5的外部面17上的连接网络16，芯片5的外部面17与芯片5的安装面6在相对侧上。
电子器件1可以通过例如珠或电连接柱的连接元件19安装在印刷电路板18上，连接元件19介于该印刷电路板18和电连接网络16之间。
从电子学的角度上看，选择性地借助电连接柱11、金属电连接过孔15以及电连接珠19，传感器4和电子电路5a能够被供应电能并且来自传感器4的信号能够至少部分地由该电子电路5a处理，以便被递送到印刷电路板18。
参考图3至图6，将要描述一种制造电子器件1的方式。
如图3所示，为了集中制造的目的，提供了面板2A，其包括以基体的形式彼此相邻的多个第一芯片2，并且具有包括这些芯片2的安装面3的面20，在这些面的部位上，金属保护性环7以及对应的金属电连接柱11将通过采用用于微电子中的手段被同时产生。
掩模21形成在面20上，并且对应于待产生的保护性环7的贯通开口22和对应于待产生在对应的局部区上的电连接元件11的贯通开口23通过该掩模21在每个位置处形成。
之后，特别地，金属保护性环7和金属电连接柱11的基部7a和11a通过开口22和23借助在例如来自铜的合适的镀液中生长沉积或电沉积而被同时产生，接着端部7b和11b由焊接材料(例如锡和银的合金)形成。可以设置中间层以便促进连接或以构成扩散阻挡件。
接下来，如图4所示，移除掩模21。接着面板2A通过烘箱以使得端部7b和11b呈现拱形的形状。
之后通过沿着相应的部位的基体的线24切割面板2A来分隔芯片2。
如图5所示，为了集中制造的目的，提供面板5A，其包括以基体的形式彼此相邻的多个第二芯片5，并且具有包括这些芯片5的安装面6的面25，在这些面的部位上预产生的芯片2将被安装。
通过转移，芯片2分别地放置在结合图1描述的位置中的这些部位上。之后在烘箱中实施将端部7a和11a同时焊接到芯片5的对应区。
在之后涂敷并且散布液体包封材料的公共层26，公共层26预期用于在对应的部位处制造包封块12，并且填充转移的以及焊接的芯片2之间的空间，该材料在电连接柱11之间通过毛细管作用流动并且由于保护性环7的存在而被阻止到达自由空间8。依据备选的实施例，公共层26能够通过将液体包封材料注入模具的空腔的剩余空间来获得，该剩余空间由与芯片2的面14接触的模具板来界定，之后固化该包封材料。
接着，公共层26在烘箱中固化，接下来，电连接珠19被放置在部位的每一个处。
在每一个部位处获得的电子器件1最终通过沿着在对应的部位上的基体的线来切割面板2A和层26来分割。
依据在图7中示出的备选的实施例，构成保护性阻挡件的闭合的保护性环7可以由具有彼此紧邻地延伸的端部28a和28b的连续的开口保护性环28来替代，其构成不连续的保护性环。
这些端部28a和28b之间的距离使得在前述的液体包封材料的层26的形成期间，如果这些材料在这些端部28a和28b之间穿过，这些材料也不会到达自由空间8。
依据在图8示出的备选实施例，保护性阻挡件可以由不连续的开口保护性环29组成。该保护性环29包括以C形延伸、对称的并且朝向彼此开口的两个部分30和31，以及在分离部分30和31的分支的端部的空间前面延伸的直线部分32和33。
在部分30和31的分支和直线部分32和33之间的距离使得在前述的液体包封材料的层26的形成期间，如果这些材料穿过这些部分之间，这些材料也不会到达自由空间8。
依据在图9示出的备选实施例，保护性阻挡件可以由不连续的保护性环组成，在这里其包括多个隔开的金属柱34，它们中的一些由金属电连接柱11组成，并且另一些由非电连接的金属柱35组成。
金属柱34之间的距离使得在前述的液体包封材料的层26的形成期间，如果这些材料在这些柱34之间穿过，这些材料也不会到达自由空间8。
本发明并非仅限于上面描述的实施例。特别地，金属电连接柱和金属保护阻挡件能够在包括电子电路的芯片上被同时产生，并且包括传感器的芯片能够被放置在这些柱和这个阻挡件上。在不偏离本发明的范围的情况下，其他备选实施例也是可能的。

Claims (13)

1.一种用于制造至少一个电子器件的方法，所述至少一个电子器件包括彼此堆叠的第一集成电路芯片和第二集成电路芯片，所述方法包括：
通过至少一种金属的生长或电沉积在第一集成电路芯片的安装面的安装区上同时产生围绕所述安装面的区域的多个金属电连接柱以及至少一个保护性金属阻挡件；
将第二集成电路芯片放置在所述第一集成电路芯片上，使得所述第二集成电路芯片的安装面面对所述第一集成电路芯片的所述安装面，并且所述金属电连接柱和所述保护性金属阻挡件与所述第二集成电路芯片的安装区接触；
将所述金属电连接柱和所述保护性金属阻挡件焊接至所述第二集成电路芯片的所述安装区，使得所述保护性金属阻挡件界定在所述第一集成电路芯片与所述第二集成电路芯片之间的密封的自由空间；以及
在所述第一集成电路芯片周围以及在所述第二集成电路芯片的所述安装面的外围上施加涂层材料，并且使所述涂层材料固化以便产生包封块；
其中所述保护性金属阻挡件为至少一个开口环的形式，所述至少一个开口环限定进入所述安装面的所述区域中的开口以及与所述至少一个开口环的端部和所述开口重叠的至少一个直线部分。
2.根据权利要求1所述的方法，包括：产生所述包封块使得所述包封块到达所述保护性金属阻挡件。
3.根据权利要求1所述的方法，所述同时产生的步骤进一步包括：
在所述第一集成电路芯片的所述安装面上形成掩模；
通过所述掩模形成多个贯通开口；
在所述多个贯通开口中产生所述多个金属电连接柱和所述至少一个保护性金属阻挡件；
将焊接材料施加到所述电连接柱和所述至少一个保护性金属阻挡件；以及
移除所述掩模。
4.根据权利要求1所述的方法，其中所述至少一个开口环是连续的开口环。
5.根据权利要求1所述的方法，其中所述至少一个开口环包括朝向彼此开口设置的一对C形部分。
6.一种电子器件，包括：
第一集成电路芯片，被堆叠在第二集成电路芯片上，所述第一集成电路芯片的安装面朝向所述第二集成电路芯片的安装面并且与所述第二集成电路芯片的安装面相距一定距离设置；
多个电连接柱以及至少一个保护性阻挡件，介于所述第一集成电路芯片的安装面与所述第二集成电路芯片的安装面之间，并且被固定到所述第一集成电路芯片的安装面和所述第二集成电路芯片的安装面，所述至少一个保护性阻挡件界定在所述安装面的相互相对的局部区域之间的自由空间；
包封块，在所述第一集成电路芯片周围以及在所述第二集成电路芯片的所述安装面的外围之上延伸；以及
其中所述电连接柱以及所述保护性阻挡件由至少一种相同的金属材料制成；
其中所述保护性阻挡件为至少一个开口环的形式，所述至少一个开口环限定进入所述自由空间中的开口以及与所述至少一个开口环的端部和所述开口重叠的至少一个直线部分。
7.根据权利要求6所述的电子器件，其中所述集成电路芯片中的一个集成电路芯片包括传感器，并且另一集成电路芯片包括用于处理由所述传感器递送的信号的电子电路。
8.根据权利要求6所述的电子器件，其中所述至少一个开口环是连续的开口环。
9.根据权利要求6所述的电子器件，其中所述至少一个开口环包括朝向彼此开口设置的一对C形部分。
10.一种电子器件，包括：
第一集成电路芯片；
第二集成电路芯片，被堆叠在所述第一集成电路芯片上，所述第一集成电路芯片的安装面朝向所述第二集成电路芯片的安装面并且与所述第二集成电路芯片的安装面相距一定距离设置；
多个电连接柱，介于所述第一集成电路芯片的安装面与所述第二集成电路芯片的安装面之间，并且被固定到所述第一集成电路芯片的安装面和所述第二集成电路芯片的安装面；
至少一个金属保护性阻挡件，介于所述第一集成电路芯片的安装面与所述第二集成电路芯片的安装面之间，并且被固定到所述第一集成电路芯片的安装面和所述第二集成电路芯片的安装面，所述至少一个金属保护性阻挡件界定在所述第一集成电路芯片的安装面与所述第二集成电路芯片的安装面之间的自由空间；以及
包封块，在所述第一集成电路芯片周围以及在所述第二集成电路芯片的所述安装面的外围之上延伸；
其中所述至少一个金属保护性阻挡件为至少一个开口环的形式，所述至少一个开口环限定进入所述自由空间中的开口以及与所述至少一个开口环的端部和所述开口重叠的至少一个直线部分。
11.根据权利要求10所述的电子器件，还包括：在所述第一集成电路芯片上的传感器，以及在所述第二集成电路芯片上的电子电路，所述电子电路可操作用于处理来自所述传感器的信号。
12.根据权利要求10所述的电子器件，其中所述至少一个开口环是连续的开口环。
13.根据权利要求10所述的电子器件，其中所述至少一个开口环包括朝向彼此开口设置的一对C形部分。
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