CN109103146B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN109103146B
CN109103146B CN201810642931.XA CN201810642931A CN109103146B CN 109103146 B CN109103146 B CN 109103146B CN 201810642931 A CN201810642931 A CN 201810642931A CN 109103146 B CN109103146 B CN 109103146B
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housing
semiconductor device
end portion
connecting portion
control substrate
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Chinese (zh)
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CN109103146A (zh
Inventor
江口佳佑
木村义孝
山下秋彦
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Inverter Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201810642931.XA 2017-06-21 2018-06-21 半导体装置 Active CN109103146B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-121516 2017-06-21
JP2017121516A JP6753364B2 (ja) 2017-06-21 2017-06-21 半導体装置

Publications (2)

Publication Number Publication Date
CN109103146A CN109103146A (zh) 2018-12-28
CN109103146B true CN109103146B (zh) 2021-09-21

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Country Status (4)

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US (1) US10468372B2 (enExample)
JP (1) JP6753364B2 (enExample)
CN (1) CN109103146B (enExample)
DE (1) DE102018204473B4 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7014012B2 (ja) * 2018-03-30 2022-02-01 三菱電機株式会社 半導体装置、半導体装置の製造方法および電力変換装置
JP7244339B2 (ja) * 2019-04-19 2023-03-22 株式会社三社電機製作所 半導体モジュール用外部端子
DE102020104723B4 (de) 2020-02-24 2025-03-27 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches Submodul zur Montage auf einer Kühleinrichtung
JP7337027B2 (ja) * 2020-05-20 2023-09-01 三菱電機株式会社 半導体装置
JP2023094275A (ja) * 2021-12-23 2023-07-05 富士電機株式会社 半導体装置及びその製造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183276A (ja) * 1998-12-15 2000-06-30 Mitsubishi Electric Corp 半導体パワーモジュール
JP2001189416A (ja) * 1999-12-28 2001-07-10 Mitsubishi Electric Corp パワーモジュール
US6791170B1 (en) * 1999-04-22 2004-09-14 Mitsubishi Denki Kabushiki Kaisha Onboard semiconductor device
JP2006295158A (ja) * 2005-04-12 2006-10-26 Semikron Elektronik Gmbh & Co Kg 材料結合式で配設された端子要素を有するパワー半導体モジュール
DE102008012570A1 (de) * 2008-03-04 2009-09-17 Infineon Technologies Ag Leistungshalbleitermodul-System
CN102163580A (zh) * 2011-03-15 2011-08-24 上海凯虹电子有限公司 一种薄型封装体及其制作方法
CN104425399A (zh) * 2013-09-05 2015-03-18 富士电机株式会社 半导体模块
CN106158761A (zh) * 2015-05-15 2016-11-23 三菱电机株式会社 电力用半导体装置
CN106257660A (zh) * 2015-06-18 2016-12-28 富士电机株式会社 半导体装置及半导体装置的制造方法
CN106796934A (zh) * 2015-04-10 2017-05-31 富士电机株式会社 半导体装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2812A (en) * 1842-10-12 Hydrant
JPS61157290U (enExample) * 1985-03-22 1986-09-29
JPS62191174U (enExample) * 1986-05-27 1987-12-04
US4729739A (en) * 1986-09-15 1988-03-08 Texas Instruments Incorporated Connector for a chip carrier unit
JPH0612795B2 (ja) * 1989-11-07 1994-02-16 株式会社日立製作所 マルチチップモジュールの冷却構造
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
JPH0982854A (ja) 1995-09-20 1997-03-28 Sumitomo Metal Ind Ltd 電子部品用パッケージ
JP3501685B2 (ja) * 1999-06-04 2004-03-02 三菱電機株式会社 電力変換装置
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6439448B1 (en) * 1999-11-05 2002-08-27 Orthodyne Electronics Corporation Large wire bonder head
DE102007006212B4 (de) 2007-02-08 2012-09-13 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Kontaktfedern
JP4523632B2 (ja) 2007-12-11 2010-08-11 三菱電機株式会社 半導体装置
KR200473330Y1 (ko) 2010-04-07 2014-07-02 엘에스산전 주식회사 전력용 반도체 모듈
US8772920B2 (en) * 2011-07-13 2014-07-08 Oracle International Corporation Interconnection and assembly of three-dimensional chip packages
JP2013048031A (ja) * 2011-08-29 2013-03-07 Shinko Electric Ind Co Ltd スプリング端子付き基板及びその製造方法
JP6046392B2 (ja) * 2012-06-22 2016-12-14 新光電気工業株式会社 接続端子構造、インターポーザ、及びソケット
JP2014049582A (ja) * 2012-08-31 2014-03-17 Mitsubishi Electric Corp 半導体装置
JP6016611B2 (ja) 2012-12-20 2016-10-26 三菱電機株式会社 半導体モジュール、その製造方法およびその接続方法
JP6513519B2 (ja) * 2015-07-17 2019-05-15 株式会社日立製作所 物理量センサ
CN108352379B (zh) * 2015-12-21 2022-05-17 英特尔公司 系统级封装装置以及用于形成系统级封装装置的方法
DE102016119631B4 (de) * 2016-02-01 2021-11-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Druckeinleitkörper und Anordnung hiermit
JP6500925B2 (ja) 2017-03-03 2019-04-17 サミー株式会社 弾球遊技機

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183276A (ja) * 1998-12-15 2000-06-30 Mitsubishi Electric Corp 半導体パワーモジュール
US6791170B1 (en) * 1999-04-22 2004-09-14 Mitsubishi Denki Kabushiki Kaisha Onboard semiconductor device
JP2001189416A (ja) * 1999-12-28 2001-07-10 Mitsubishi Electric Corp パワーモジュール
JP2006295158A (ja) * 2005-04-12 2006-10-26 Semikron Elektronik Gmbh & Co Kg 材料結合式で配設された端子要素を有するパワー半導体モジュール
DE102008012570A1 (de) * 2008-03-04 2009-09-17 Infineon Technologies Ag Leistungshalbleitermodul-System
CN101577262A (zh) * 2008-03-04 2009-11-11 英飞凌科技股份有限公司 功率半导体模块系统
CN102163580A (zh) * 2011-03-15 2011-08-24 上海凯虹电子有限公司 一种薄型封装体及其制作方法
CN104425399A (zh) * 2013-09-05 2015-03-18 富士电机株式会社 半导体模块
CN106796934A (zh) * 2015-04-10 2017-05-31 富士电机株式会社 半导体装置
CN106158761A (zh) * 2015-05-15 2016-11-23 三菱电机株式会社 电力用半导体装置
CN106257660A (zh) * 2015-06-18 2016-12-28 富士电机株式会社 半导体装置及半导体装置的制造方法

Also Published As

Publication number Publication date
JP2019009183A (ja) 2019-01-17
US10468372B2 (en) 2019-11-05
JP6753364B2 (ja) 2020-09-09
DE102018204473A1 (de) 2018-12-27
DE102018204473B4 (de) 2022-06-09
CN109103146A (zh) 2018-12-28
US20180374817A1 (en) 2018-12-27

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