JPS62191174U - - Google Patents
Info
- Publication number
- JPS62191174U JPS62191174U JP1986080499U JP8049986U JPS62191174U JP S62191174 U JPS62191174 U JP S62191174U JP 1986080499 U JP1986080499 U JP 1986080499U JP 8049986 U JP8049986 U JP 8049986U JP S62191174 U JPS62191174 U JP S62191174U
- Authority
- JP
- Japan
- Prior art keywords
- package
- lead terminal
- board
- wide
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986080499U JPS62191174U (enExample) | 1986-05-27 | 1986-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986080499U JPS62191174U (enExample) | 1986-05-27 | 1986-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62191174U true JPS62191174U (enExample) | 1987-12-04 |
Family
ID=30931357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986080499U Pending JPS62191174U (enExample) | 1986-05-27 | 1986-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62191174U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009183A (ja) * | 2017-06-21 | 2019-01-17 | 三菱電機株式会社 | 半導体装置 |
-
1986
- 1986-05-27 JP JP1986080499U patent/JPS62191174U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009183A (ja) * | 2017-06-21 | 2019-01-17 | 三菱電機株式会社 | 半導体装置 |
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