CN109076720A - 散热板、散热装置和电子设备 - Google Patents

散热板、散热装置和电子设备 Download PDF

Info

Publication number
CN109076720A
CN109076720A CN201780024563.6A CN201780024563A CN109076720A CN 109076720 A CN109076720 A CN 109076720A CN 201780024563 A CN201780024563 A CN 201780024563A CN 109076720 A CN109076720 A CN 109076720A
Authority
CN
China
Prior art keywords
heat
heat sink
conducting layer
region
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201780024563.6A
Other languages
English (en)
Other versions
CN109076720B (zh
Inventor
杨果
李泉明
刘小虎
李伟
张治国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN109076720A publication Critical patent/CN109076720A/zh
Application granted granted Critical
Publication of CN109076720B publication Critical patent/CN109076720B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1615Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本申请提供了一种散热板、散热装置和电子设备,能够应用于可折叠或可弯曲的电子设备中。该散热装置包括内嵌于该电子设备中的散热板(10),该散热板(10)至少包括:第一导热层(11),包括第一表面和第二表面,该第一表面是该第一导热层弯折时暴露在外部的面,该第二表面是与该第一表面相背的表面,该第一导热层(11)的第一区域用于吸收发热部件释放的热量,并将该热量传导至该第一导热层(11)的第二区域,以将该热量释放出去;第一柔性层(12),包括第三区域,该第三区域贴合在该第一导热层(11)的该第二表面上与弯折区域对应的位置。

Description

PCT国内申请,说明书已公开。

Claims (21)

  1. PCT国内申请,权利要求书已公开。
CN201780024563.6A 2016-11-25 2017-02-07 散热板、散热装置和电子设备 Active CN109076720B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201611053761 2016-11-25
CN2016110537619 2016-11-25
PCT/CN2017/073037 WO2018094877A1 (zh) 2016-11-25 2017-02-07 散热板、散热装置和电子设备

Publications (2)

Publication Number Publication Date
CN109076720A true CN109076720A (zh) 2018-12-21
CN109076720B CN109076720B (zh) 2020-01-03

Family

ID=62194755

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780024563.6A Active CN109076720B (zh) 2016-11-25 2017-02-07 散热板、散热装置和电子设备

Country Status (5)

Country Link
US (1) US11272639B2 (zh)
EP (1) EP3531811A4 (zh)
JP (1) JP6890180B2 (zh)
CN (1) CN109076720B (zh)
WO (1) WO2018094877A1 (zh)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109814693A (zh) * 2019-02-28 2019-05-28 华为技术有限公司 电子装置
CN111243202A (zh) * 2020-01-15 2020-06-05 王芳 一种多功能金融电子装置
CN112595155A (zh) * 2019-11-28 2021-04-02 华为技术有限公司 可折叠均温板和可折叠电子设备
CN112767838A (zh) * 2021-01-19 2021-05-07 Oppo(重庆)智能科技有限公司 柔性显示屏和电子设备
CN115241624A (zh) * 2022-07-29 2022-10-25 沈阳航盛科技有限责任公司 一种高散热小型化的卫星通信天线主承结构件
WO2022262373A1 (zh) * 2021-06-17 2022-12-22 华为技术有限公司 折叠屏设备
CN116627225A (zh) * 2022-12-02 2023-08-22 荣耀终端有限公司 电子设备
WO2024067061A1 (zh) * 2022-09-30 2024-04-04 华为技术有限公司 电子设备
WO2024092973A1 (zh) * 2022-10-31 2024-05-10 华为技术有限公司 传热装置和电子设备

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109699151B (zh) * 2017-10-20 2020-02-14 华为技术有限公司 膜状散热构件、可折弯显示装置以及终端设备
CN112673717A (zh) * 2018-09-14 2021-04-16 深圳市柔宇科技股份有限公司 可折叠电子装置
CN109348008A (zh) * 2018-11-05 2019-02-15 北京小米移动软件有限公司 显示装置
JPWO2020230745A1 (zh) * 2019-05-16 2020-11-19
CN114073174A (zh) * 2019-06-28 2022-02-18 Lg电子株式会社 Avn装置
CN110544431B (zh) * 2019-07-25 2021-02-12 华为技术有限公司 一种复合结构、柔性屏组件及折叠显示终端
CN111564677A (zh) * 2020-05-25 2020-08-21 京东方科技集团股份有限公司 柔性显示装置
JP2022078601A (ja) * 2020-11-13 2022-05-25 レノボ・シンガポール・プライベート・リミテッド 情報機器
CN112804385A (zh) * 2021-02-09 2021-05-14 青岛海信移动通信技术股份有限公司 手机及其制造方法、用于电子设备的散热装置
CN115151076A (zh) * 2021-03-29 2022-10-04 北京小米移动软件有限公司 电子设备
US11899506B2 (en) * 2021-03-31 2024-02-13 Motorola Mobility Llc Electronic device having thermal spreading through a hinge of a configurable housing that supports a front flexible display
US11592878B2 (en) 2021-03-31 2023-02-28 Motorola Mobility Llc Electronic device having thermal spreading through a hinge of a configurable housing that supports a back flexible display
CN113311923B (zh) * 2021-04-21 2023-12-01 北京字节跳动网络技术有限公司 一种温度控制方法、装置及设备
CN113568483B (zh) * 2021-07-26 2023-07-14 南昌华勤电子科技有限公司 一种散热组件及一种服务器
CN113645332A (zh) * 2021-08-13 2021-11-12 维沃移动通信有限公司 电子设备
CN114035664B (zh) * 2021-10-26 2022-10-25 荣耀终端有限公司 散热系统及设备
US20230200019A1 (en) * 2021-12-20 2023-06-22 Meta Platforms Technologies, Llc Thermal conduit for electronic device
CN114415801B (zh) * 2022-03-22 2022-07-08 深圳市信步科技有限公司 一种集成散热的计算机主板
CN114915330A (zh) * 2022-03-31 2022-08-16 航天恒星科技有限公司 一种基带射频一体化的卫星终端

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1508865A (zh) * 2002-12-16 2004-06-30 ͬ�Ϳ�ҵ��ʽ���� 散热片
US20100101763A1 (en) * 2008-10-27 2010-04-29 Meng-Cheng Huang Thin heat dissipating apparatus
CN105159421A (zh) * 2015-07-27 2015-12-16 电子科技大学 笔记本电脑配套用水冷散热装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10262719A (ja) * 1997-03-27 1998-10-06 Mitsubishi Electric Corp ノートパソコン収納ケース
US6075696A (en) 1997-11-06 2000-06-13 Compaq Computer Corporation Portable computer with flexible heat spreader plate structure therein
JP2000010661A (ja) * 1998-06-18 2000-01-14 Mitsubishi Electric Corp 携帯型情報処理装置および携帯型情報処理装置用カバー、卓上型情報処理装置
US6052280A (en) * 1999-01-19 2000-04-18 Alliedsignal Inc. Carbon/carbon heat spreader
US7095309B1 (en) 2000-10-20 2006-08-22 Silverbrook Research Pty Ltd Thermoelastic actuator design
JP4459470B2 (ja) * 2001-04-06 2010-04-28 信越化学工業株式会社 電子部品の放熱構造体及びそれに用いる放熱シート
JP2005057088A (ja) * 2003-08-05 2005-03-03 Agilent Technol Inc 多層構造の熱伝導部材、および、それを用いた電子機器
JP2005321287A (ja) 2004-05-07 2005-11-17 Sony Corp 冷却装置、電子機器、ヒートシンクおよび放熱フィン
JP2006093546A (ja) 2004-09-27 2006-04-06 Oki Electric Ind Co Ltd 放熱シート、放熱筒状体およびそれらを用いた放熱構造
CN2762514Y (zh) * 2004-12-22 2006-03-01 珍通科技股份有限公司 弯折式均温板散热结构
JP2006216878A (ja) * 2005-02-07 2006-08-17 Ricoh Co Ltd 電子機器
JP2008305284A (ja) * 2007-06-11 2008-12-18 Lenovo Singapore Pte Ltd 携帯式コンピュータ
JP4888413B2 (ja) * 2008-02-14 2012-02-29 富士通株式会社 携帯型電子装置
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
CN101901036A (zh) * 2010-07-02 2010-12-01 华南理工大学 一种用于笔记本电脑的散热装置
JP2012164852A (ja) * 2011-02-08 2012-08-30 Murata Mfg Co Ltd 半導体パッケージのシールド構造
US8395898B1 (en) 2011-03-14 2013-03-12 Dell Products, Lp System, apparatus and method for cooling electronic components
US8675363B2 (en) * 2011-07-26 2014-03-18 Hewlett-Packard Development Company, L.P. Thermal conductors in electronic devices
US9127898B2 (en) * 2013-08-04 2015-09-08 Chih-Juh Wong Heat dissipation case
CN103576779A (zh) * 2013-10-29 2014-02-12 昆山市大久电子有限公司 一种柔性电脑外壳
CN103984398A (zh) * 2014-05-30 2014-08-13 夏维 用上盖传导散热的笔记本电脑结构
US9600041B2 (en) * 2014-07-28 2017-03-21 Google Technology Holdings LLC Heat management apparatus for an electronic device
US9490860B2 (en) * 2014-12-17 2016-11-08 Asia Vital Components Co., Ltd. Protective device capable of dissipating heat
JP6360198B2 (ja) * 2014-12-18 2018-07-18 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
US10488898B2 (en) * 2017-03-31 2019-11-26 Microsoft Technology Licensing, Llc Flexible heat spreader
CN109699151B (zh) * 2017-10-20 2020-02-14 华为技术有限公司 膜状散热构件、可折弯显示装置以及终端设备

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1508865A (zh) * 2002-12-16 2004-06-30 ͬ�Ϳ�ҵ��ʽ���� 散热片
US20100101763A1 (en) * 2008-10-27 2010-04-29 Meng-Cheng Huang Thin heat dissipating apparatus
CN105159421A (zh) * 2015-07-27 2015-12-16 电子科技大学 笔记本电脑配套用水冷散热装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109814693A (zh) * 2019-02-28 2019-05-28 华为技术有限公司 电子装置
CN112595155A (zh) * 2019-11-28 2021-04-02 华为技术有限公司 可折叠均温板和可折叠电子设备
CN111243202A (zh) * 2020-01-15 2020-06-05 王芳 一种多功能金融电子装置
CN112767838A (zh) * 2021-01-19 2021-05-07 Oppo(重庆)智能科技有限公司 柔性显示屏和电子设备
WO2022262373A1 (zh) * 2021-06-17 2022-12-22 华为技术有限公司 折叠屏设备
CN115241624A (zh) * 2022-07-29 2022-10-25 沈阳航盛科技有限责任公司 一种高散热小型化的卫星通信天线主承结构件
CN115241624B (zh) * 2022-07-29 2023-07-04 沈阳航盛科技有限责任公司 一种高散热小型化的卫星通信天线主承结构件
WO2024067061A1 (zh) * 2022-09-30 2024-04-04 华为技术有限公司 电子设备
WO2024092973A1 (zh) * 2022-10-31 2024-05-10 华为技术有限公司 传热装置和电子设备
CN116627225A (zh) * 2022-12-02 2023-08-22 荣耀终端有限公司 电子设备
CN116627225B (zh) * 2022-12-02 2024-04-19 荣耀终端有限公司 电子设备

Also Published As

Publication number Publication date
JP2019536293A (ja) 2019-12-12
JP6890180B2 (ja) 2021-06-18
CN109076720B (zh) 2020-01-03
WO2018094877A1 (zh) 2018-05-31
EP3531811A4 (en) 2019-10-30
US11272639B2 (en) 2022-03-08
EP3531811A1 (en) 2019-08-28
US20210185852A1 (en) 2021-06-17

Similar Documents

Publication Publication Date Title
CN109076720A (zh) 散热板、散热装置和电子设备
US7480145B2 (en) Thin, passive cooling system
JP3725106B2 (ja) 電子機器
US7688586B2 (en) Electronic device and heat conduction member
CN112198942B (zh) 散热模块、电子设备、散热模块用散热板
JP2000010661A (ja) 携帯型情報処理装置および携帯型情報処理装置用カバー、卓上型情報処理装置
CN111654996B (zh) 终端设备
US9179576B2 (en) Computer power supply
WO2004082349A1 (ja) 電子機器の冷却構造
CN205902314U (zh) 一种复合型石墨散热片
CN109152273A (zh) 电子装置
JP2006053914A (ja) 電子機器
US9030821B2 (en) Electronic device
CN209488908U (zh) 一种具有防水散热功能的双面线路板
JP2006216878A (ja) 電子機器
CN108347857B (zh) 双面显示装置
CN105555107A (zh) 无风扇散热系统及电子设备
US20060038285A1 (en) Electronic apparatus
CN101453861A (zh) 散热模块
CN206322100U (zh) 散热器的固定架
US9335801B2 (en) Frame and electronic device having the same
JPH11110084A (ja) 情報処理装置
CN212484268U (zh) 一种物联网电脑的散热机箱
CN106535554B (zh) 石墨热导体、电子装置及石墨热导体制造方法
CN207663380U (zh) 一种笔记本型计算机主机板的散热结构

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant