WO2024067061A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2024067061A1
WO2024067061A1 PCT/CN2023/118215 CN2023118215W WO2024067061A1 WO 2024067061 A1 WO2024067061 A1 WO 2024067061A1 CN 2023118215 W CN2023118215 W CN 2023118215W WO 2024067061 A1 WO2024067061 A1 WO 2024067061A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
layer
electronic device
middle frame
door panel
Prior art date
Application number
PCT/CN2023/118215
Other languages
English (en)
French (fr)
Inventor
李鹏
靳林芳
倪晶
毛维华
毛永海
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024067061A1 publication Critical patent/WO2024067061A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular to an electronic equipment.
  • the foldable screens cannot effectively dissipate heat across the axis, which will cause large temperature differences at different positions of the upper and lower shells or flexible screen modules, affecting display color difference and screen reliability, and affecting user experience.
  • the purpose of the present application is to provide an electronic device to solve the problem in the above-mentioned prior art that the folding screen cannot effectively dissipate heat across the axis.
  • the present application provides an electronic device, comprising:
  • a flexible screen module wherein the flexible screen module is connected to the main middle frame and the sub-middle frame;
  • a rotating shaft assembly through which the main middle frame and the sub-middle frame are rotatably connected;
  • a flexible heat dissipation module one end of which is connected to the main middle frame or the flexible screen module, the other end of which is connected to the sub-middle frame or the flexible screen module, and the flexible heat dissipation module is provided with at least one folding portion.
  • the present application provides at least one crease portion on the flexible heat dissipation module, so that when the electronic product is folded, the flexible heat dissipation module can bend preferentially at the position of the crease portion.
  • the crease portion can partially absorb the redundancy caused by the tensile deformation, so that wrinkles are less likely to occur at other positions of the flexible heat dissipation module, and can ensure that the flexible heat dissipation module still has a stable shape after long-term use and is not easily clamped in the seam of the moving door panel during long-term use.
  • the central area of the hinge assembly includes a first door panel
  • the fold portion includes at least one first fold portion
  • the projection of the first fold portion coincides with the projection of the first door panel
  • the flexible heat dissipation module can be bent at a position relative to the first door panel instead of at a position relative to the door panel gap, thereby preventing the crease portion from being clamped in the door panel gap and preventing the flexible heat dissipation module from being clamped off.
  • the hinge assembly also includes a second door panel and a third door panel, the second door panel and the third door panel are respectively arranged on opposite sides of the first door panel, and a first gap is provided between the second door panel and the main middle frame;
  • the folding portion also includes at least one second folding portion, along the thickness direction of the electronic device, the second folding portion coincides with the projection of the first gap, and the first gap is used to accommodate the second folding portion when the electronic device is in an unfolded state.
  • the flexible heat dissipation module can be bent at the second fold portion, and the redundant deformation absorbed by the second fold portion can be accommodated in the first gap, thereby avoiding the problem of an arched screen caused by excessive redundancy.
  • the fold portion also includes at least one third fold portion, and along the thickness direction of the electronic device, the third fold portion coincides with the projection of the second gap, and the second gap is used to accommodate the third fold portion when the electronic device is in an unfolded state.
  • the flexible heat dissipation module can bend at the third crease portion, and the redundant deformation absorbed by the third crease portion can be accommodated in the second gap, thereby avoiding the problem of arched screen caused by excessive redundancy.
  • the flexible heat dissipation module includes a heat dissipation layer, and the fold portion is formed on the heat dissipation layer.
  • the heat dissipation layer can have good thermal conductivity and heat dissipation, and the heat in the main middle frame and the sub-middle frame can be absorbed and dissipated by the heat dissipation layer, thereby ensuring that the heat in the main middle frame and the sub-middle frame is balanced, avoiding heat accumulation or local excessive heat.
  • the heat dissipation layer is a graphite layer or a graphene layer.
  • Graphite or graphene materials have good thermal conductivity and Flexibility can quickly dissipate the heat in the main middle frame and sub-middle frame to the outside of the electronic device.
  • the flexible heat dissipation module further includes a hardening layer, which is disposed on the heat dissipation layer.
  • the hardness of the hardening layer is greater than the hardness of the heat dissipation layer.
  • the hardening layer is disposed on at least one side of the first fold portion.
  • the hardened layer can be arranged on the side of the heat dissipation layer facing the flexible screen module. Since the hardness of the hardened layer is relatively large, the flexible heat dissipation module is relatively not easy to deform in the area with the hardened layer, which is beneficial to the flexible heat dissipation module to bend and deform at the crease position, so that the redundant energy generated by the deformation can be absorbed by the crease, and no deformation such as wrinkles will be generated at other positions, thereby ensuring the overall shape of the flexible heat dissipation module and avoiding the problem of redundant parts being pinched off by the door panel seam or the generation of an arched screen.
  • the hardened layer is a polyimide layer.
  • the polyimide material has excellent mechanical properties, and the tensile strength of the unreinforced base material can reach more than 100 MPa, so that the part of the flexible heat dissipation module with the hardened layer is less likely to deform than other parts, which is conducive to bending and deformation at the fold.
  • the heat dissipation layer and the hardening layer are connected via a glue layer, so as to facilitate the connection between the hardening layer and the heat dissipation layer and ensure the reliability of the connection between the hardening layer and the heat dissipation layer.
  • the hardening layer overlaps with the projection of the third gap and/or the fourth gap.
  • the hardening layer can be used to strengthen the portion of the flexible heat dissipation module aligned with the third gap and the fourth gap, to prevent the portion of the flexible heat dissipation module aligned with the third gap and the fourth gap from deforming, so that the portion of the flexible heat dissipation module that can be deformed only occurs at the location of the fold, thereby ensuring the overall shape of the flexible heat dissipation module and preventing the local redundant portion from extending into the third gap or the fourth gap and being pinched off.
  • the first fold is parallel to the third slit and the fourth slit, and the distance between the first fold and the third slit and the fourth slit is greater than or equal to 1 mm.
  • the flexible heat dissipation module can be bent at the first fold without bending at the position corresponding to the third slit or the fourth slit, thereby avoiding being clamped in the third slit or the fourth slit.
  • the flexible heat dissipation module further includes a lubricating layer, and the lubricating layer is arranged on the outer side of the heat dissipation layer.
  • the friction between the flexible heat dissipation module and the contacted parts can be reduced, the wear can be reduced, and the service life of the flexible heat dissipation module and the contacted parts can be increased.
  • the lubricating layer is a polytetrafluoroethylene layer or lubricating grease.
  • the flexible heat dissipation module further includes a protective layer, which is arranged on the outside of the heat dissipation layer, so as to ensure the reliability of the connection between the protective layer and the heat dissipation layer.
  • the protective layer is polyethylene glycol terephthalate (PET).
  • PET polyethylene glycol terephthalate
  • the PET layer has good creep resistance, fatigue resistance, friction resistance and dimensional stability.
  • the flexible heat dissipation module further includes a metal layer, which is arranged on the outside of the heat dissipation layer.
  • the grounding can be achieved through the metal layer in the flexible heat dissipation module.
  • the heat dissipation layer is provided with at least two layers, thereby effectively improving the heat dissipation performance.
  • the height of the fold is less than or equal to 0.2 mm.
  • the fold is arched toward one side of the flexible heat dissipation module, and the height of the arch does not exceed 0.2 mm, thereby ensuring that the flexible heat dissipation module can bend along the fold, and the fold will not cause the flexible screen module to bend due to the fold being too large.
  • the cross-sectional shape of the fold portion is U-shaped, V-shaped or W-shaped, so that the flexible heat dissipation module can be bent at the fold portion without generating wrinkles at other positions, which would cause the wrinkles to be cut off by the door panel seam or cause the screen to bend.
  • FIG1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.
  • FIG2 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application (with a hidden flexible screen module);
  • FIG3 is an exploded view of an electronic device provided in an embodiment of the present application.
  • FIG4 is a front view of the flexible heat dissipation module (I);
  • FIG5 is a side view of the flexible heat dissipation module
  • FIG6 is a schematic diagram of the rotating shaft assembly in the unfolded state of the electronic device
  • FIG7 is a schematic diagram of the distribution position of the hardened layer
  • FIG8 is a front view of the flexible heat dissipation module (II);
  • Fig. 9 is a cross-sectional view (i) at A-A in Fig. 8;
  • FIG10 is a schematic diagram of the second fold portion and the third fold portion being retracted into the first slit and the second slit;
  • FIG11 is a schematic diagram showing a first fold portion located between a third slit and a fourth slit
  • Fig. 12 is a cross-sectional view (II) at A-A in Fig. 8;
  • Fig. 13 is a cross-sectional view (III) at A-A in Fig. 8;
  • Fig. 14 is a cross-sectional view taken along line B-B in Fig. 8;
  • Figure 15 is a cross-sectional view (four) at A-A in Figure 8.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term “plurality” refers to two or more; the terms “connected” and “fixed” should be understood in a broad sense, for example, “connected” can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
  • folding screens such as foldable phones
  • many components are integrated in the middle frame of the foldable phone, which will generate a lot of heat.
  • the folding screen cannot effectively dissipate heat across the axis, which will cause large temperature differences at different positions of the middle frame or flexible screen module, affecting the screen display color difference and screen reliability, and affecting the user experience.
  • the embodiment of the present application provides an electronic device, which may be a mobile phone, a tablet computer, etc. with a folding function, and this embodiment does not specifically limit this.
  • this embodiment takes the electronic device as a folding mobile phone as an example for description.
  • the electronic device specifically includes a main middle frame 2, a sub-middle frame 3, a flexible screen module 1, a hinge assembly 5 and a flexible heat dissipation module 4.
  • the flexible screen module 1 is connected to the main middle frame 2 and the sub-middle frame 3.
  • the flexible screen module 1 can cover the main middle frame 2 and the sub-middle frame 3 as a whole to display content and pictures.
  • the main middle frame 2 and the sub-middle frame 3 are rotatably connected by the hinge assembly 5.
  • the main middle frame 2 and the sub-middle frame 3 can be rotated and flattened by the hinge assembly 5, so that the flexible screen module 1 can be flattened accordingly, which is convenient for users to use.
  • the main middle frame 2 and the sub-middle frame 3 can also be rotated and folded by the hinge assembly 5, so that the flexible screen module 1 can be folded corresponding to the two parts of the main middle frame 2 and the sub-middle frame 3, so that it can be convenient for the storage of electronic devices such as foldable mobile phones.
  • the flexible heat dissipation module 4 is located between the flexible screen module 1 and the middle frame, one end of the flexible heat dissipation module 4 can be connected to the main middle frame 2 or the flexible screen module 1, and the other end of the flexible heat dissipation module 4 is connected to the sub-middle frame 3 or the flexible screen module 1, and the flexible heat dissipation module 4 is provided with at least one fold portion 41.
  • the flexible heat dissipation module 4 is relatively thin and flexible, so that it can cross the hinge assembly 5 to connect the corresponding parts in the main middle frame 2 and the sub-middle frame 3 respectively without occupying the Z-direction space of the electronic device. It can also bend with the relative rotation of the main middle frame 2 and the sub-middle frame 3.
  • the heat generated by the electronic components in the main middle frame 2 and the sub-middle frame 3 can be dissipated through the flexible heat dissipation module 4, ensuring the temperature balance of each area of the main middle frame 2, the sub-middle frame 3 and the flexible screen module 1, and preventing the problem of local excessive heating due to poor local heat dissipation effect.
  • the flexible heat dissipation module 4 will be repeatedly stretched as the electronic device is folded or unfolded, and will show a certain plastic deformation after long-term repeated stretching or compression, causing the flexible heat dissipation module 4 to be gradually elongated, resulting in redundant parts of the flexible heat dissipation module 4.
  • the hinge assembly 5 includes various door panels, there are door panel gaps between the door panels, and there is no support for the flexible heat dissipation module 4 at the door panel gaps, these redundant parts of the flexible heat dissipation module 4 will mainly be concentrated at the position opposite to the door panel gaps, causing the redundant parts to be clamped in the door panel gaps, which will further cause the flexible heat dissipation module 4 to be pulled apart and arched.
  • the flexible heat dissipation module 4 is provided with at least one folding portion 41, which can be pre-formed before the flexible heat dissipation module 4 is applied to the electronic device, so that after the flexible heat dissipation module 4 is applied to the electronic product, when the electronic product is folded, the flexible heat dissipation module 4 is easy to bend at the position of the folding portion 41, and the folding portion 41 can partially absorb the redundancy generated by the tensile deformation, so that other positions of the flexible heat dissipation module 4 are not easy to wrinkle, and the flexible heat dissipation module 4 can be ensured to still have a stable shape after long-term use.
  • the folding portion 41 can be parallel to the above-mentioned door panel seam, and can be staggered with the door panel seam position, so as to avoid the folding portion 41 being clamped into the door panel seam, and avoid the problem of the flexible heat dissipation module 4 being clamped off.
  • the central area of the hinge assembly 5 includes a first door panel 51
  • the fold portion 41 includes at least one first fold portion 41 a , and along the thickness direction of the electronic device, the projection of the first fold portion 41 a coincides with the projection of the first door panel 51 .
  • the first door panel 51 is located between the main middle frame 2 and the sub-middle frame 3. When the main middle frame 2 and the sub-middle frame 3 rotate relative to each other, the first door panel 51 remains stationary. By aligning the position of the folding portion 41 with the first door panel 51, the flexible heat dissipation module 4 can be bent at a position relative to the first door panel 51, but not easily bend at a position relative to the door panel gap, thereby preventing the folding portion 41 from being clamped in the door panel gap and preventing the flexible heat dissipation module 4 from being clamped off.
  • the hinge assembly 5 further includes a second door panel 52 and a third door panel 53, which are respectively arranged on opposite sides of the first door panel 51, and a first gap 54 is provided between the second door panel 52 and the main middle frame 2.
  • the active frame can drive the second door panel 52 to rotate, and the sub-middle frame 3 can drive the third door panel 53 to rotate, wherein the main middle frame 2 and the second door panel 52 can have a first gap 54, and the sub-middle frame 3 and the third door panel 53 can have a second gap 55, so that the main middle frame 2 and the sub-middle frame 3 can form a "water drop" shape when folded, and at the same time, it can ensure that there is no interference between the various components in the unfolded state, and ensure that the flexible screen module 1 is unfolded smoothly.
  • the fold portion 41 further includes at least one second fold portion 41 b .
  • the second fold portion 41 b coincides with the projection of the first slit 54 .
  • the first slit 54 is used to accommodate the second fold portion 41 b when the electronic device is unfolded.
  • the width of the first slit 54 is relatively large, so that even when the electronic device is in the unfolded state, the second The second crease portion 41b is pinched off, thereby allowing the flexible heat dissipation module 4 to be provided with a second crease portion 41b at a position corresponding to the first gap 54, so that the flexible heat dissipation module 4 can be easily bent at the second crease portion 41b, and the redundant deformation absorbed by the second crease portion 41b can be accommodated in the first gap 54, as shown in FIG9 , thereby avoiding the problem of an arched screen caused by excessive redundancy.
  • the fold portion 41 also includes at least one third fold portion 41c.
  • the third fold portion 41c coincides with the projection of the second gap 55, and the second gap 55 is used to accommodate the third fold portion 41c when the electronic device is in the unfolded state.
  • the width of the second slit 55 is also relatively large and can be the same as the width of the first slit 54. Even when the electronic device is in the unfolded state, the third fold portion 41c extending into the second slit 55 will not be pinched off. Therefore, the flexible heat dissipation module 4 can be provided with a second fold portion 41b at a position corresponding to the second slit 55, so that the flexible heat dissipation module 4 can be easily bent at the third fold portion 41c, and the redundant deformation absorbed by the third fold portion 41c can be accommodated in the second slit 55, as shown in FIG9 , thereby avoiding the problem of an arched screen caused by excessive redundancy.
  • the flexible heat dissipation module 4 includes a heat dissipation layer 42, and the fold portion 41 is formed on the heat dissipation layer 42.
  • the heat dissipation layer 42 can have good thermal conductivity and heat dissipation, and the heat in the main middle frame 2 and the sub-middle frame 3 can be absorbed and dissipated by the heat dissipation layer 42, so as to ensure that the heat in the main middle frame 2 and the sub-middle frame 3 is balanced, and the problem of heat accumulation or excessive local heat can be avoided.
  • the heat dissipation layer 42 may be a flexible graphite layer or a graphene film layer.
  • the graphite or graphene material has good thermal conductivity and flexibility, and can quickly dissipate the heat in the main middle frame 2 and the sub-middle frame 3 to the outside of the electronic device.
  • the graphite layer or graphene layer does not need to be thick to achieve a good heat dissipation effect, and will not occupy too much Z-direction space in the electronic device, which is conducive to achieving a thin and light electronic device.
  • the flexible heat dissipation module 4 further includes a hardening layer 43 , which is disposed on the heat dissipation layer 42 , and is disposed on at least one side of the first fold portion 41 a .
  • the hardened layer 43 is disposed on the heat dissipation layer 42 , the hardness of the hardened layer 43 is greater than the hardness of the heat dissipation layer 42 , and the hardened layer 43 is disposed on at least one side of the first fold portion 41 a .
  • the hardening layer 43 can be arranged on the side of the heat dissipation layer 42 facing the flexible screen module 1. Since the hardness of the hardening layer 43 is relatively large, the flexible heat dissipation module 4 is relatively difficult to deform in the area with the hardening layer 43, which is beneficial for the flexible heat dissipation module 4 to bend and deform at the crease portion 41, so that the redundant amount generated by the deformation can be absorbed by the crease portion 41, and it is not easy to generate deformation such as wrinkles at other positions, thereby ensuring the overall shape of the flexible heat dissipation module 4 and avoiding the problem of redundant parts being pinched off by the door panel seam or generating an arched screen.
  • the hardening layer 43 can be a polyimide layer (Polyimide, PI).
  • the polyimide material has excellent mechanical properties, and the tensile strength of the unreinforced base material can reach more than 100 MPa, so that the part of the flexible heat dissipation module 4 with the hardening layer 43 is less likely to deform than other parts, which is conducive to bending and deformation at the crease portion 41.
  • the heat dissipation layer 42 and the hardening layer 43 may be connected by a glue layer 44 .
  • the third gap 56 and the fourth gap 57 are moving door panel gaps, which means that during the relative rotation of the first door panel and the second door panel, or during the relative rotation of the first door panel and the third door panel, the width of the third gap 56 and the fourth gap 57 will change.
  • the second door panel 52 and the third door panel 53 rotate relative to the first door panel 51.
  • a certain gap is maintained between the second door panel 52 and the third door panel 53 and the first door panel 51, namely, the third gap 56 and the fourth gap 57.
  • the widths of the third gap 56 and the fourth gap 57 are both smaller than the first gap 54 and the second gap 55.
  • the redundant parts generated by the flexible heat dissipation module 4 extend into the third gap 56 and the fourth gap 57, the redundant parts extending into the third gap 56 and the fourth gap 57 will be pinched off when the electronic device is unfolded.
  • the first gap 54 and the second gap 55 are static door panel gaps, which means that when the second door panel 52 rotates relative to the main middle frame 2, or when the third door panel 53 rotates relative to the sub-middle frame 3, the widths of the first gap 54 and the second gap 55 will not change.
  • the third slit and the fourth slit are not completely straight lines, but are generally straight lines.
  • the first door panel 51 has a cross-shaped or other shaped top plate, but is generally straight.
  • the folded portion 41 is straight and generally parallel to the above-mentioned door panel seam that is generally straight, that is, the third slit and the fourth slit are not completely straight lines.
  • the third gap and the fourth gap can be generally staggered with the position of the door panel gap, thereby preventing the fold portion 41 from being clamped into the door panel gap, and avoiding the problem of the flexible heat dissipation module 4 being clamped off.
  • the first fold portion 41a can be located between the third gap 56 and the fourth gap 57, so that the portion with the hardening layer 43 is aligned with the third gap 56 and the fourth gap 57 in the thickness direction of the electronic device, so that the portion of the flexible heat dissipation module 4 aligned with the third gap 56 and the fourth gap 57 can be strengthened by the hardening layer 43 to prevent the portion of the flexible heat dissipation module 4 aligned with the third gap 56 and the fourth gap 57 from being deformed, so that the portion of the flexible heat dissipation module 4 that can be deformed only occurs at the position of the fold portion 41, thereby ensuring the overall shape of the flexible heat dissipation module 4 and preventing local redundant portions from extending into the third gap 56 or the fourth gap 57 and being pinched off.
  • the first folding portion 41a is parallel to the third slit 56 and the fourth slit 57, and the distance between the first folding portion 41a and the third slit 56 and the fourth slit 57 is greater than or equal to 1 mm.
  • the flexible heat dissipation module can be bent at the first folding portion 41a without being bent at the position corresponding to the third slit 56 and the fourth slit 57, thereby avoiding being clamped in the third slit 56 or the fourth slit 57.
  • the flexible heat dissipation module 4 further includes a lubricating layer 45, which is disposed on the outside of the heat dissipation layer 42. Since friction is generated when the flexible heat dissipation module 4 contacts the components on the side of each door panel or the flexible screen module 1, the flexible heat dissipation module 4 and the components in contact will be worn when repeatedly rotated and folded. Therefore, in this embodiment, a lubricating layer 45 is disposed on the outer surface of the heat dissipation layer 42, which can reduce the friction between the flexible heat dissipation module 4 and the components in contact, reduce wear, and increase the service life of the flexible heat dissipation module 4 and the components in contact.
  • the lubricating layer 45 may be a polytetrafluoroethylene layer (PTFE) or a lubricating grease.
  • the polytetrafluoroethylene layer may be a Teflon layer, and both the Teflon layer and the lubricating grease have excellent lubricating effects.
  • the Teflon layer and the lubricating grease may be used interchangeably or in combination.
  • a Teflon layer may be provided on both sides of the heat dissipation layer 42 in the thickness direction; a Teflon layer may be provided on one side of the heat dissipation layer 42 and a lubricating grease may be provided on the other side; or a lubricating grease may be provided on both sides of the heat dissipation layer 42 in the thickness direction. Since the cost of the Teflon layer is generally higher than the cost of the lubricating grease, when considering a low-cost solution, only the lubricating grease may be used as the lubricating layer 45, or a combination of the lubricating grease and the Teflon layer may be used as the lubricating layer 45. However, the lubricating effect of the Teflon layer is better than that of the lubricating grease. Therefore, when considering a high-performance solution, only the Teflon layer may be used as the lubricating layer 45.
  • the flexible heat dissipation module 4 has parts for connecting to the main middle frame 2, the sub-middle frame 3 or the flexible screen module 1, and these parts do not need to be provided with a lubricating layer 45.
  • the lubricating layer 45 only needs to be provided at the parts where relative movement occurs between the flexible heat dissipation module 4 and the contacted parts.
  • the lubricating layer 45 can be connected and fixed to the heat dissipation layer 42 through the adhesive layer 44.
  • part of the lubricating layer 45 can also be arranged on the outside of the hardening layer 43, and can also be connected and fixed to the hardening layer 43 through the adhesive layer 44.
  • the flexible heat dissipation module 4 also includes a protective layer 46, and the protective layer 46 is arranged on the outside of the heat dissipation layer 42.
  • the protective layer 46 can be arranged on the opposite sides of the heat dissipation layer 42 in the thickness direction, so that the heat dissipation layer 42 can be covered to prevent the heat dissipation layer 42 from delamination or slag.
  • the protective layer 46 can be arranged at a position opposite to each door panel, and can also be arranged at a position on the flexible heat dissipation module 4 for connecting the middle frame or the flexible screen module 1. As shown in Figure 14, Figure 14 shows the state where the protective layer 46 is located at a position on the flexible heat dissipation module 4 for connecting the middle frame or the flexible screen module 1.
  • the protection layer 46 and the heat dissipation layer 42 may be bonded and fixed by an adhesive layer 44 .
  • the protective layer 46 can also cooperate with the lubricating layer 45 to cover the heat dissipation layer 42.
  • a protective layer 46 is set on one side of the heat dissipation layer 42, and a lubricating layer 45 is set on the other side of the heat dissipation layer 42.
  • the lubricating layer 45 can not only realize the lubrication function, but also prevent the heat dissipation layer 42 from being delaminated or falling off; or a protective layer 46 can be set on one side of the heat dissipation layer 42, and a lubricating layer 45 and a protective layer 46 are sequentially set on the other side of the heat dissipation layer 42; or a protective layer 46 can be set on one side of the heat dissipation layer 42, and a hardening layer 43, a protective layer 46 and a lubricating layer 45 are sequentially set on the other side of the heat dissipation layer 42.
  • the protective layer 46 may be polyethylene glycol terephthalate (PET).
  • PET polyethylene glycol terephthalate
  • the PET layer has good creep resistance, fatigue resistance, friction resistance and dimensional stability.
  • the flexible heat dissipation module 4 further includes a metal layer 47, which is disposed on the outside of the heat dissipation layer 42.
  • a metal layer 47 which is disposed on the outside of the heat dissipation layer 42.
  • the grounding can be achieved through the metal layer 47 in the flexible heat dissipation module 4.
  • the metal layer 47 can be copper foil, silver foil, etc., and the metal layer 47 can also be connected to the heat dissipation layer 42 through the adhesive layer 44. connect.
  • the heat dissipation layer 42 can be provided with at least two layers, so that the heat dissipation performance can be effectively improved.
  • the thickness of only one layer of the heat dissipation layer 42 is increased, for graphite or graphene materials, this will increase the risk of material stratification, and the problem of slag falling will be aggravated.
  • the thickness of each heat dissipation layer 42 will not be very large, thereby avoiding the problem of stratification and slag falling of the heat dissipation layer 42.
  • the heat dissipation layers 42 of two adjacent layers can be connected and fixed by a glue layer 44, which can ensure the reliable connection between each heat dissipation layer 42 on the one hand, and avoid the problem of stratification and slag falling of each heat dissipation layer 42 on the other hand.
  • the thickness of each heat dissipation layer 42 can be the same or different, which is not limited in this embodiment.
  • the height of the fold 41 is less than or equal to 0.2 mm. It is understandable that the fold 41 is arched toward one side of the flexible heat dissipation module 4, and the height of the arch does not exceed 0.2 mm, so that the flexible heat dissipation module 4 can be bent along the fold 41, and the fold 41 is too large to cause the flexible screen module 1 to bend.
  • the cross-sectional shape of the crease portion 41 can be U-shaped, V-shaped or W-shaped, which can facilitate the flexible heat dissipation module 4 to bend at the position of the crease portion 41 without generating wrinkles at other positions, which would cause the wrinkles to be pinched off by the door panel seam or cause the screen to arch.
  • the flexible heat dissipation module can be large-area cross-axis or symmetrical cross-axis, and is not limited to the partial cross-axis or small-part asymmetrical cross-axis shown in the figure of the present application. Accordingly, the fold portion can be set on the large-area cross-axis or symmetrical cross-axis flexible heat dissipation module.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
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Abstract

一种电子设备，其包括主中框（2）、副中框（3）、柔性屏模组（1）、转轴组件（5）和柔性散热模组（4），柔性屏模组（1）连接于主中框（2）和副中框（3），主中框（2）和副中框（3）通过转轴组件（5）转动连接，柔性散热模组（4）的一端连接于主中框（2）或柔性屏模组（1），柔性散热模组（4）的另一端连接于副中框（3）或柔性屏模组（1），柔性散热模组（4）设置有至少一条的折痕部（41）。通过在柔性散热模组（4）设置有至少一条的折痕部（41），从而在电子产品折叠时，柔性散热模组（4）能够在折痕部（41）的位置处优先发生弯曲，折痕部（41）能够部分吸收拉伸变形产生的冗余量，使柔性散热模组（4）的其它位置处不易发生褶皱，能够保证柔性散热模组（4）在长期使用后仍然具有稳定的形态。

Description

电子设备
本发明要求于2022年09月30日提交中国专利局、申请号为202222636736.0、申请名称为“电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种电子设备。
背景技术
对于如折叠手机等采用折叠屏的可折叠电子设备而言，折叠屏无法有效跨轴散热，会导致上下壳体或柔性屏模组不同位置处的温差较大，影响显示色差和屏幕可靠性，影响用户体验。
发明内容
本申请的目的在于提供一种电子设备，以解决上述现有技术中折叠屏无法有效跨轴散热的问题。
本申请提供了一种电子设备，其中，包括：
主中框；
副中框；
柔性屏模组，所述柔性屏模组连接于所述主中框和所述副中框；
转轴组件，所述主中框和所述副中框通过所述转轴组件转动连接；
柔性散热模组，所述柔性散热模组的一端连接于所述主中框或所述柔性屏模组，所述柔性散热模组的另一端连接于所述副中框或所述柔性屏模组，所述柔性散热模组设置有至少一条的折痕部。
本申请通过在柔性散热模组设置有至少一条的折痕部，从而在电子产品折叠时，柔性散热模组能够在该折痕部的位置处优先发生弯曲，该折痕部能够部分吸收拉伸变形产生的冗余量，使柔性散热模组的其它位置处不易发生褶皱，能够保证该柔性散热模组在长期使用后仍然具有稳定的形态，长期使用中不易被夹入运动门板缝。
在一种具体地设计中，所述转轴组件的中心区域包括第一门板，所述折痕部包括至少一条第一折痕部，沿所述电子设备的厚度方向，所述第一折痕部的投影与所述第一门板的投影重合。
其中，通过使折痕部的位置与第一门板对齐，可以使该柔性散热模组在与第一门板相对的位置处弯曲，而不会在与门板缝相对的位置处弯曲，从而可以避免折痕部夹入至门板缝中，避免柔性散热模组被夹断。
在一种具体地设计中，所述转轴组件还包括第二门板和第三门板，所述第二门板和所述第三门板分别设置于所述第一门板相对的两侧，所述第二门板与所述主中框之间具有第一缝隙；所述折痕部还包括至少一条第二折痕部，沿所述电子设备的厚度方向上，所述第二折痕部与所述第一缝隙的投影重合，所述第一缝隙用于在所述电子设备展开状态下收容所述第二折痕部。
其中，使柔性散热模组能够在第二折痕部发生弯曲，第二折痕部吸收的冗余变形量可以收容至第一缝隙中，从而可以避免冗余量过大而产生拱屏的问题。
在一种具体地设计中，所述第三门板与所述副中框之间具有第二缝隙；所述折痕部还包括至少一条的第三折痕部，沿所述电子设备的厚度方向上，所述第三折痕部与所述第二缝隙的投影重合，所述第二缝隙用于在所述电子设备展开状态下收容所述第三折痕部。
其中，使该柔性散热模组在与第二缝隙对应的位置处设置第二折痕部，可以使柔性散热模组能够在第三折痕部发生弯曲，第三折痕部吸收的冗余变形量可以收容至第二缝隙中，从而可以避免冗余量过大而产生拱屏的问题。
在一种具体地设计中，所述柔性散热模组包括散热层，所述折痕部形成于所述散热层。该散热层可以具有良好的导热、散热性，主中框、副中框内的热量可以被散热层吸收和散发，从而能够保证主中框和副中框内的热量均衡，避免热量累积或局部热量过高的问题。
在一种具体地设计中，所述散热层为石墨层或石墨烯层。石墨或石墨烯材料具有良好的热传导性和 柔韧性，能够快速地将主中框、副中框内的热量发散至电子设备外。
在一种具体地设计中，所述柔性散热模组还包括硬化层，所述硬化层设置于所述散热层，所述硬化层的硬度大于所述散热层的硬度，所述硬化层设置于所述第一折痕部的至少一侧。
其中，该硬化层可以设置于散热层朝向柔性屏模组的一侧，由于该硬化层的硬度相对较大，该柔性散热模组在具有硬化层的区域相对不易变形，从而有利于该柔性散热模组在折痕部位置处发生弯曲变形，使变形产生的冗余量能被折痕部吸收，而不会在其它位置处产生褶皱等变形，从而保证了柔性散热模组的整体形态，避免出现冗余部位被门板缝夹断，或产生拱屏的问题。
在一种具体地设计中，所述硬化层为聚酰亚胺层。聚酰亚胺材料具有优秀的机械性能，未增强的基体材料的抗张强度可达到100MPa以上，从而使柔性散热模组具有该硬化层的部位相对于其它部位更不容易变形，有利于在折痕部弯曲变形。
在一种具体地设计中，所述散热层和所述硬化层通过胶层连接。从而可以便于该硬化层与散热层的连接，同时保证硬化层与散热层连接的可靠性。
在一种具体地设计中，所述第一门板与所述第二门板之间具有第三缝隙，所述第一门板与所述第三门板之间具有第四缝隙；沿所述电子设备的厚度方向上，所述硬化层与所述第三缝隙和/或所述第四缝隙的投影重合。从而可以通过硬化层对柔性散热模组上与第三缝隙和第四缝隙位置对齐的部位进行加强，防止柔性散热模组上与第三缝隙和第四缝隙对齐的部位发生变形，使柔性散热模组上能够变形的部位仅发生在折痕部所在位置处，从而可以保证柔性散热模组的整体形态，避免局部冗余的部位伸入至第三缝隙或第四缝隙中而被夹断。
在一种具体地设计中，所述第一折痕部平行于所述第三缝隙和所述第四缝隙，且所述第一折痕部与所述第三缝隙和所述第四缝隙之间的距离大于或等于1mm。从而可以使柔性散热模组能够在第一折痕部弯折，而不会在与第三缝隙、第四缝隙对应位置处发生弯折，从而避免被夹入至第三缝隙或第四缝隙中。
在一种具体地设计中，所述柔性散热模组还包括润滑层，所述润滑层设置于所述散热层的外侧。
其中，通过在散热层的外侧表面设置润滑层，可以减小该柔性散热模组与所接触的部件之间的摩擦，降低磨损，提升柔性散热模组及所接触的部件的使用寿命。
在一种具体地设计中，所述润滑层为聚四氟乙烯层或润滑脂。
在一种具体地设计中，所述柔性散热模组还包括保护层，所述保护层设置于所述散热层的外侧。从而可以保证保护层和散热层连接的可靠性。
在一种具体地设计中，所述保护层为聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate，PET)。该PET层具有良好的抗蠕变性、耐疲劳性、耐摩擦性和尺寸稳定性。
在一种具体地设计中，所述柔性散热模组还包括金属层，所述金属层设置于所述散热层的外侧。其中，当电子设备内的某些元器件之间需要通过该柔性散热模组接地时，可以通过该柔性散热模组中的金属层实现接地。
在一种具体地设计中，所述散热层设置有至少两层，从而可以有效提升散热性能。
在一种具体地设计中，所述折痕部的高度小于或等于0.2mm。其中，折痕部向该柔性散热模组的一侧拱起，该拱起的高度不超过0.2mm，从而既可以保证该柔性散热模组能够沿折痕部弯曲，又不会因折痕部过大而造成对柔性屏模组的拱屏问题。
在一种具体地设计中，所述折痕部的截面形状为U形、V形或W形。从而可以有利于柔性散热模组在折痕部的位置处发生弯折，而不会在其它位置处产生褶皱，而造成褶皱处被门板缝夹断，或者拱屏的问题。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
附图说明
图1为本申请实施例提供的电子设备的结构示意图；
图2为本申请实施例提供的电子设备的结构示意图(隐藏柔性屏模组)；
图3为本申请实施例提供的电子设备的分解图；
图4为柔性散热模组的正视图(一)；
图5为柔性散热模组的侧视图；
图6为转轴组件在电子设备展开状态下的示意图；
图7为硬化层分布位置的示意图；
图8为柔性散热模组的正视图(二)；
图9为图8中在A-A处的断面图(一)；
图10为第二折痕部和第三折痕部收入至第一缝隙和第二缝隙中的示意图；
图11为第一折痕部位于第三缝隙和第四缝隙之间的示意图；
图12为图8中在A-A处的断面图(二)；
图13为图8中在A-A处的断面图(三)；
图14为图8中在B-B处的断面图；
图15为图8中在A-A处的断面图(四)。
附图标记：
1-柔性屏模组；
2-主中框；
3-副中框；
4-柔性散热模组；
41-折痕部；
41a-第一折痕部；
41b-第二折痕部；
41c-第三折痕部；
42-散热层；
43-硬化层；
44-胶层；
45-润滑层；
46-保护层；
47-金属层；
5-转轴组件；
51-第一门板；
52-第二门板；
53-第三门板；
54-第一缝隙；
55-第二缝隙；
56-第三缝隙；
57-第四缝隙。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
在本申请的描述中，除非另有明确的规定和限定，术语“第一”、“第二”仅用于描述的目的，而不能理解为指示或暗示相对重要性；除非另有规定或说明，术语“多个”是指两个或两个以上；术语“连接”、“固定”等均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接，或电连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
本说明书的描述中，需要理解的是，本申请实施例所描述的“上”、“下”等方位词是以附图所示的角度来进行描述的，不应理解为对本申请实施例的限定。此外，在上下文中，还需要理解的是，当提到一个元件连接在另一个元件“上”或者“下”时，其不仅能够直接连接在另一个元件“上”或者“下”， 也可以通过中间元件间接连接在另一个元件“上”或者“下”。
对于如折叠手机等采用折叠屏的可折叠电子设备而言，折叠手机的中框内集成有众多元器件，会产生较多热量，折叠屏无法有效跨轴散热，会导致中框或柔性屏模组不同位置处的温差较大，影响屏幕显示色差和屏幕可靠性，影响用户体验。
如图1至图3所示，本申请实施例提供了一种电子设备，该电子设备可以为具有折叠功能的手机、平板电脑等，对此本实施例不做具体限定。为了便于说明，本实施例以电子设备为折叠手机为例进行说明。
如图1至图3所示，该电子设备具体包括主中框2、副中框3、柔性屏模组1、转轴组件5和柔性散热模组4，柔性屏模组1连接于主中框2和副中框3，柔性屏模组1可以将主中框2和副中框3整体覆盖，用于显示内容和画面。主中框2和副中框3通过转轴组件5转动连接，在使用时，可以将主中框2和副中框3通过转轴组件5转动展平，使柔性屏模组1可以随之展平，从而便于用户使用。在不需要使用时，也可以将主中框2和副中框3通过转轴组件5转动折叠，使柔性屏模组1对应于主中框2和副中框3的两部分折叠，从而可以便于折叠手机等电子设备的收纳。
如图3至图5所示，柔性屏模组在电子设备的厚度方向上，柔性散热模组4位于柔性屏模组1和中框之间，柔性散热模组4的一端可以连接于主中框2或柔性屏模组1，柔性散热模组4的另一端连接于副中框3或柔性屏模组1，柔性散热模组4设置有至少一条的折痕部41。
该柔性散热模组4厚度较薄，具有柔性，从而能够跨越转轴组件5分别连接主中框2和副中框3内相应的部位，而不会占用电子设备的Z向空间，还能够随着主中框2和副中框3的相对转动而发生弯曲，主中框2和副中框3内的电子元器件产生的热量均可以通过该柔性散热模组4进行散热，保证了主中框2、副中框3以及柔性屏模组1各个区域的温度均衡，不会出现局部散热效果差而导致局部发热过高的问题。
此外，该柔性散热模组4在实际应用过程中，由于其会随着电子设备的折叠或展开反复拉伸，而在长期反复拉伸或压缩后会呈现出一定的塑形变形，导致该柔性散热模组4被逐渐拉长，使该柔性散热模组4产生冗余部分，而由于转轴组件5包括各个门板，门板之间存在门板缝，在门板缝位置处没有对柔性散热模组4的支撑作用，柔性散热模组4的这些冗余部分会主要集中在与门板缝相对的位置处，导致冗余部分被夹入至门板缝中，进而会导致该柔性散热模组4被拉断、拱屏的问题。
为此，本实施例中，柔性散热模组4设置有至少一条的折痕部41，该折痕部41可以在柔性散热模组4应用到电子设备之前预先形成，从而在该柔性散热模组4应用到电子产品中后，在电子产品折叠时，柔性散热模组4易在该折痕部41的位置处发生弯曲，该折痕部41能够部分吸收拉伸变形产生的冗余量，使柔性散热模组4的其它位置处不易发生褶皱，能够保证该柔性散热模组4在长期使用后仍然具有稳定的形态。其中，该折痕部41可以平行于上述门板缝，且能够与门板缝位置错开，从而可以避免折痕部41被夹入至门板缝中，避免了该柔性散热模组4被夹断等问题。
具体地，如图6所示，转轴组件5的中心区域包括第一门板51，折痕部41包括至少一条第一折痕部41a，沿电子设备的厚度方向，第一折痕部41a的投影与第一门板51的投影重合。
该第一门板51位于主中框2和副中框3之间，在主中框2和副中框3相对转动时，第一门板51保持不动。通过使折痕部41的位置与第一门板51对齐，可以使该柔性散热模组4在与第一门板51相对的位置处弯曲，而不易在与门板缝相对的位置处弯曲，从而可以避免折痕部41夹入至门板缝中，避免柔性散热模组4被夹断。
具体地，如图6所示，转轴组件5还包括第二门板52和第三门板53，第二门板52和第三门板53分别设置于第一门板51相对的两侧，第二门板52与主中框2之间具有第一缝隙54。在主中框2和副中框3相对转动时，主动框可以带动第二门板52转动，副中框3可以带动第三门板53转动，其中，主中框2和第二门板52之间可以具有第一缝隙54，副中框3和第三门板53之间可以具有第二缝隙55，从而可以使主中框2和副中框3在折叠时能够形成“水滴”状，同时还能够在展开状态下保证各个部件间不会发生干涉，保证柔性屏模组1平整展开。
其中，如图7所示，折痕部41还包括至少一条第二折痕部41b，沿电子设备的厚度方向上，第二折痕部41b与第一缝隙54的投影重合，第一缝隙54用于在电子设备展开状态下收容第二折痕部41b。
该第一缝隙54的宽度尺寸较大，即使电子设备在展开状态下，也不会将伸入至第一缝隙54中的第 二折痕部41b夹断，由此，可以使该柔性散热模组4在与第一缝隙54对应的位置处设置第二折痕部41b，使柔性散热模组4易在第二折痕部41b发生弯曲，第二折痕部41b吸收的冗余变形量可以收容至第一缝隙54中，如图9所示，从而可以避免冗余量过大而产生拱屏的问题。
具体地，如图6和图7所示，第三门板53与副中框3之间具有第二缝隙55，折痕部41还包括至少一条的第三折痕部41c，沿电子设备的厚度方向上，第三折痕部41c与第二缝隙55的投影重合，第二缝隙55用于在电子设备展开状态下收容第三折痕部41c。
该第二缝隙55的宽度尺寸也较大，可以与第一缝隙54的宽度尺寸相同，即使电子设备在展开状态下，也不会将伸入至第二缝隙55中的第三折痕部41c夹断，由此，可以使该柔性散热模组4在与第二缝隙55对应的位置处设置第二折痕部41b，使柔性散热模组4易在第三折痕部41c发生弯曲，第三折痕部41c吸收的冗余变形量可以收容至第二缝隙55中，如图9所示，从而可以避免冗余量过大而产生拱屏的问题。
具体地，柔性散热模组4包括散热层42，折痕部41形成于散热层42。该散热层42可以具有良好的导热、散热性，主中框2、副中框3内的热量可以被散热层42吸收和散发，从而能够保证主中框2和副中框3内的热量均衡，避免热量累积或局部热量过高的问题。
其中，该散热层42具体可以为柔性石墨层或石墨烯膜层，石墨或石墨烯材料具有良好的热传导性和柔韧性，能够快速地将主中框2、副中框3内的热量发散至电子设备外。且石墨层或石墨烯层的厚度无需较厚，即可达到良好的散热效果，不会占用电子设备内过大的Z向空间，有利于实现电子设备的轻薄化。
具体地，柔性散热模组4还包括硬化层43，硬化层43设置于散热层42，硬化层43设置于第一折痕部41a的至少一侧。
其中，该硬化层43设置于散热层42，硬化层43的硬度大于散热层42的硬度，硬化层43设置于第一折痕部41a的至少一侧。
该硬化层43可以设置于散热层42朝向柔性屏模组1的一侧，由于该硬化层43的硬度相对较大，该柔性散热模组4在具有硬化层43的区域相对不易变形，从而有利于该柔性散热模组4在折痕部41位置处发生弯曲变形，使变形产生的冗余量能被折痕部41吸收，而不易在其它位置处产生褶皱等变形，从而保证了柔性散热模组4的整体形态，避免出现冗余部位被门板缝夹断，或产生拱屏的问题。
其中，硬化层43可以为聚酰亚胺层(Polyimide，PI)，聚酰亚胺材料具有优秀的机械性能，未增强的基体材料的抗张强度可达到100MPa以上，从而使柔性散热模组4具有该硬化层43的部位相对于其它部位更不容易变形，有利于在折痕部41弯曲变形。
为了便于该硬化层43与散热层42的连接，同时保证硬化层43与散热层42连接的可靠性，散热层42和硬化层43可以通过胶层44连接。
具体地，如图6和图7所示，第一门板51与第二门板52之间具有第三缝隙56，第一门板51与第三门板53之间具有第四缝隙57。沿电子设备的厚度方向上，硬化层43与第三缝隙56和/或第四缝隙57的投影重合。第三缝隙56和第四缝隙57为运动门板缝，运动门板缝是指在第一门板和第二门板相对转动过程中，或者是第一门板与第三门板相对转动过程，第三缝隙56和第四缝隙57的宽度会发生改变，当第三缝隙56和第四缝隙57较小时，如果柔性散热模组出现折痕的部位伸入至第三缝隙56或第四缝隙57中，则会有被第三缝隙56或第四缝隙57夹断的风险。
在主中框2和副中框3相对转动时，第二门板52和第三门板53均相对第一门板51转动，为了保证第二门板52和第三门板53能够正常转动，而不会与第一门板51发生干涉，第二门板52和第三门板53均与第一门板51之间保持有一定的间隙，即第三缝隙56和第四缝隙57。该第三缝隙56和第四缝隙57的宽度均小于第一缝隙54和第二缝隙55，如果柔性散热模组4产生的冗余部位伸入至该第三缝隙56和第四缝隙57中时，则在电子设备展开状态下，伸入至第三缝隙56和第四缝隙57中的冗余部位会被夹断。其中，第一缝隙54和第二缝隙55为静止门板缝，静止门板缝是指在第二门板52相对于主中框2转动时，或第三门板53相对于副中框3转动时，第一缝隙54和第二缝隙55的宽度均不会发生变化。
需要指出的是，在第一门板51、第二门板52和第三门板53为非完美平行四边形的情况下，第三缝隙和第四缝隙也非完全直线，但总体呈直线状。如图3所示，局部看，第一门板51局部有十字状或其他形状的顶板，但总体呈直线状。折痕部41成直线状，总体平行于上述总体呈直线状的门板缝，即第 三缝隙和第四缝隙，且能够与门板缝位置总体错开，从而可以避免折痕部41被夹入至门板缝中，避免了该柔性散热模组4被夹断等问题。
为了避免柔性散热模组4的部分部位伸入至第三缝隙56或第四缝隙57中，如图11所示，可以使第一折痕部41a位于第三缝隙56和第四缝隙57之间，使具有硬化层43的部位在电子设备的厚度方向与第三缝隙56和第四缝隙57位置对齐，从而可以通过硬化层43对柔性散热模组4上与第三缝隙56和第四缝隙57位置对齐的部位进行加强，防止柔性散热模组4上与第三缝隙56和第四缝隙57对齐的部位发生变形，使柔性散热模组4上能够变形的部位仅发生在折痕部41所在位置处，从而可以保证柔性散热模组4的整体形态，避免局部冗余的部位伸入至第三缝隙56或第四缝隙57中而被夹断。
具体地，第一折痕部41a平行于第三缝隙56和第四缝隙57，且第一折痕部41a与第三缝隙56和第四缝隙57之间的距离大于或等于1mm。从而可以使柔性散热模组能够在第一折痕部41a弯折，而不会在与第三缝隙56、第四缝隙57对应位置处发生弯折，从而避免被夹入至第三缝隙56或第四缝隙57中。
具体地，如图12所示，柔性散热模组4还包括润滑层45，润滑层45设置于散热层42的外侧。由于柔性散热模组4与各个门板或柔性屏模组1侧的部件接触时，会产生摩擦，在反复转动折叠时会对该柔性散热模组4及其接触的部件造成磨损，为此，本实施例在散热层42的外侧表面设置润滑层45，可以减小该柔性散热模组4与所接触的部件之间的摩擦，降低磨损，提升柔性散热模组4及所接触的部件的使用寿命。
其中，润滑层45可以为聚四氟乙烯层(Poly tetra fluoroethylene，PTFE)或润滑脂。该聚四氟乙烯层可以是铁氟龙层，铁氟龙层和润滑脂均具有优秀的润滑效果。铁氟龙层和润滑脂可以相互替代使用，也可以组合使用。例如，在散热层42厚度方向上的两侧均可以设置铁氟龙层；也可以在散热层42的一侧设置铁氟龙层，而另一侧设置润滑脂；还可以在散热层42厚度方向上的两侧均设置润滑脂。其中，由于铁氟龙层的成本一般高于润滑脂的成本，在考虑低成本方案时，可以仅采用润滑脂作为润滑层45，也可以采用润滑脂和铁氟龙层的组合作为润滑层45。但铁氟龙层的润滑效果优于润滑脂，因此，在考虑高性能方案时，可以仅采用铁氟龙层作为润滑层45。
可以理解的是，该柔性散热模组4具有用于连接主中框2、副中框3或柔性屏模组1的部位，这些部位可以无需设置润滑层45，仅在该柔性散热模组4与所接触的部件之间发生相对运动的部位设置润滑层45即可。
为了保证润滑层45与散热层42连接的可靠性，润滑层45可以通过胶层44与散热层42连接固定。此外，在散热层42上具有硬化层43的情况下，部分润滑层45也可以设置于硬化层43的外侧，具体也可以通过胶层44实现与硬化层43的连接固定。
当散热层42采用石墨或石墨烯材料时，由于石墨或石墨烯在长期反复弯折后会产生分层、掉渣等问题。为此，本实施例中，如图13所示，柔性散热模组4还包括保护层46，保护层46设置于散热层42的外侧。该保护层46可以设置在散热层42在厚度方向上相对的两侧，从而可以对散热层42进行覆盖，防止了散热层42分层或掉渣的问题发生。其中，该保护层46既可以设置在与各门板相对的位置处，也可以设置在柔性散热模组4上用于连接中框或柔性屏模组1的位置处。如图14所示，图14示出了保护层46位于柔性散热模组4上用于连接中框或柔性屏模组1的位置处的状态。
为了保证保护层46和散热层42连接的可靠性，保护层46和散热层42之间可以通过胶层44粘接固定。
此外，该保护层46也可以配合润滑层45来覆盖散热层42，例如，在散热层42的一侧设置保护层46，在散热层42的另一层设置润滑层45，此时润滑层45既可以实现润滑的功能，又可以实现防止散热层42分层或掉渣的功能；或者也可以在散热层42的一侧设置保护层46，在散热层42的另一侧依次设置润滑层45和保护层46；或者也可以在散热层42的一侧设置一层保护层46，在散热层42的另一侧依次设置硬化层43、保护层46和润滑层45。
其中，保护层46可以为聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate，PET)。该PET层具有良好的抗蠕变性、耐疲劳性、耐摩擦性和尺寸稳定性。
具体地，如图15所示，柔性散热模组4还包括金属层47，金属层47设置于散热层42的外侧。当电子设备内的某些元器件之间需要通过该柔性散热模组4接地时，可以通过该柔性散热模组4中的金属层47实现接地。其中，该金属层47可以为铜箔、银箔等，该金属层47也可以通过胶层44与散热层42 连接。
具体地，散热层42可以设置有至少两层，从而可以有效提升散热性能。但是，如果仅仅将一层的散热层42的厚度增大，对于石墨或石墨烯材料而言，这会增大材料分层的风险，且掉渣的问题加剧。而通过采用多层散热层42组合叠层的形式，每一层散热层42的厚度不会很大，从而可以避免散热层42分层、掉渣的问题。其中，相邻两层的散热层42之间可以通过胶层44连接固定，一方面可以保证各个散热层42之间的可靠连接，另一方面也可以避免各层散热层42出现分层、掉渣的问题。其中，各层散热层42的厚度可以相同，也可以不同，对此本实施例不做限定。
具体地，折痕部41的高度小于或等于0.2mm。可以理解的是，折痕部41向该柔性散热模组4的一侧拱起，该拱起的高度不超过0.2mm，从而既可以保证该柔性散热模组4能够沿折痕部41弯曲，又不会因折痕部41过大而造成对柔性屏模组1的拱屏问题。
具体地，折痕部41的截面形状可以为U形、V形或W形，从而可以有利于柔性散热模组4在折痕部41的位置处发生弯折，而不会在其它位置处产生褶皱，而造成褶皱处被门板缝夹断，或者拱屏的问题。
设计上，柔性散热模组可大面积跨轴或对称跨轴，不局限于本申请图示的部分跨轴或小部分不对称跨轴。相应地，折痕部可设置在大面积跨轴或对称跨轴柔性散热模组上。
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (19)

  1. 一种电子设备，其特征在于，包括：
    主中框；
    副中框；
    柔性屏模组，所述柔性屏模组连接于所述主中框和所述副中框；
    转轴组件，所述主中框和所述副中框通过所述转轴组件转动连接；
    柔性散热模组，所述柔性散热模组的一端连接于所述主中框或所述柔性屏模组，所述柔性散热模组的另一端连接于所述副中框或所述柔性屏模组，所述柔性散热模组设置有至少一条的折痕部。
  2. 根据权利要求1所述的电子设备，其特征在于，所述转轴组件的中心区域包括第一门板，所述折痕部包括至少一条第一折痕部，沿所述电子设备的厚度方向，所述第一折痕部的投影与所述第一门板的投影重合。
  3. 根据权利要求1或2所述的电子设备，其特征在于，所述转轴组件还包括第二门板和第三门板，所述第二门板和所述第三门板分别设置于所述第一门板相对的两侧，所述第二门板与所述主中框之间具有第一缝隙；
    所述折痕部还包括至少一条第二折痕部，沿所述电子设备的厚度方向上，所述第二折痕部与所述第一缝隙的投影重合，所述第一缝隙用于在所述电子设备展开状态下收容所述第二折痕部。
  4. 根据权利要求1-3任一项所述的电子设备，其特征在于，所述第三门板与所述副中框之间具有第二缝隙；
    所述折痕部还包括至少一条的第三折痕部，沿所述电子设备的厚度方向上，所述第三折痕部与所述第二缝隙的投影重合，所述第二缝隙用于在所述电子设备展开状态下收容所述第三折痕部。
  5. 根据权利要求2-4任一项所述的电子设备，其特征在于，所述柔性散热模组包括散热层，所述折痕部形成于所述散热层。
  6. 根据权利要求5所述的电子设备，其特征在于，所述散热层为石墨层或石墨烯层。
  7. 根据权利要求5所述的电子设备，其特征在于，所述柔性散热模组还包括硬化层，所述硬化层设置于所述散热层，所述硬化层的硬度大于所述散热层的硬度，所述硬化层设置于所述第一折痕部的至少一侧。
  8. 根据权利要求7所述的电子设备，其特征在于，所述硬化层为聚酰亚胺层。
  9. 根据权利要求7所述的电子设备，其特征在于，所述散热层和所述硬化层通过胶层连接。
  10. 根据权利要求7所述的电子设备，其特征在于，所述第一门板与所述第二门板之间具有第三缝隙，所述第一门板与所述第三门板之间具有第四缝隙；
    沿所述电子设备的厚度方向上，所述硬化层与所述第三缝隙和/或所述第四缝隙的投影重合。
  11. 根据权利要求10所述的电子设备，其特征在于，所述第一折痕部平行于所述第三缝隙和所述第四缝隙，且所述第一折痕部与所述第三缝隙和所述第四缝隙之间的距离大于或等于1mm。
  12. 根据权利要求5所述的电子设备，其特征在于，所述柔性散热模组还包括润滑层，所述润滑层设置于所述散热层的外侧。
  13. 根据权利要求12所述的电子设备，其特征在于，所述润滑层为聚四氟乙烯层或润滑脂。
  14. 根据权利要求5所述的电子设备，其特征在于，所述柔性散热模组还包括保护层，所述保护层设置于所述散热层的外侧。
  15. 根据权利要求14所述的电子设备，其特征在于，所述保护层为聚对苯二甲酸乙二醇酯。
  16. 根据权利要求5所述的电子设备，其特征在于，所述柔性散热模组还包括金属层，所述金属层设置于所述散热层的外侧。
  17. 根据权利要求5所述的电子设备，其特征在于，所述散热层设置有至少两层。
  18. 根据权利要求1-17任一项所述的电子设备，其特征在于，所述折痕部的高度小于或等于0.2mm。
  19. 根据权利要求1-17任一项所述的电子设备，其特征在于，所述折痕部的截面形状为U形、V形或W形。
PCT/CN2023/118215 2022-09-30 2023-09-12 电子设备 WO2024067061A1 (zh)

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