WO2024067215A1 - 可折叠电子设备 - Google Patents

可折叠电子设备 Download PDF

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Publication number
WO2024067215A1
WO2024067215A1 PCT/CN2023/119444 CN2023119444W WO2024067215A1 WO 2024067215 A1 WO2024067215 A1 WO 2024067215A1 CN 2023119444 W CN2023119444 W CN 2023119444W WO 2024067215 A1 WO2024067215 A1 WO 2024067215A1
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WO
WIPO (PCT)
Prior art keywords
conductive
shell
support sheet
grounding
electronic device
Prior art date
Application number
PCT/CN2023/119444
Other languages
English (en)
French (fr)
Other versions
WO2024067215A9 (zh
Inventor
石聪
朱辰
严斌
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Publication of WO2024067215A1 publication Critical patent/WO2024067215A1/zh
Publication of WO2024067215A9 publication Critical patent/WO2024067215A9/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present application relates to the field of electronic devices, and in particular to a foldable electronic device.
  • foldable electronic devices such as foldable mobile phones
  • electronic devices equipped with foldable screens are increasingly favored by consumers because they can switch between an unfolded state and a folded state, can achieve a larger display area, and are easy to carry.
  • the first shell and the second shell of the mobile phone are connected by a hinge mechanism, and the devices in the first shell and the devices in the second shell are electrically connected using a flexible printed circuit (FPC) passing through the hinge mechanism.
  • FPC flexible printed circuit
  • the flexible printed circuit is also used as a grounding line to achieve common grounding of the devices in the first shell and the devices in the second shell.
  • the flexible circuit board is required to occupy a larger space, which will compress the structural space of the shaft and affect the reliability of the shaft mechanism.
  • the present application provides a foldable electronic device, the grounding structure of the foldable electronic device can ensure the reliability of the hinge mechanism while ensuring a smaller grounding impedance and a smaller space occupied by the grounding structure.
  • the present application provides a foldable electronic device, comprising: a first housing, a second housing, a rotating shaft and a folding screen, wherein the rotating shaft is connected between the first housing and the second housing, and the folding screen is supported and connected to one side surface of the first housing and the second housing; wherein the folding screen comprises a screen body and a conductive support sheet, wherein the support sheet is attached to a side of the screen body facing the rotating shaft and is arranged corresponding to the rotating shaft, and the support sheet is bent or unfolded along with the screen body;
  • the foldable electronic device also includes: devices and conductive structures, the devices include a first device arranged in a first shell and a second device arranged in a second shell, and conductive structures are connected between the grounding part and the supporting sheet of the first device and between the grounding part and the supporting sheet of the second device.
  • the foldable electronic device has a foldable screen including a screen body and a support sheet connected to the side of the screen body facing the rotating shaft, and the support sheet corresponds to the rotating shaft.
  • the support sheet is used as a grounding line to connect the first device in the first shell to the support sheet through a conductive structure, and the second device in the second shell is also connected to the support sheet through a conductive structure, and the first device and the second device are grounded together through the support sheet. Since the support sheet is fixedly connected to the part of the foldable screen corresponding to the rotating shaft, a stable connection with the first device and the second device can be achieved through the conductive structure, and the support sheet itself can be used to connect the first device and the second device.
  • the low impedance characteristic can achieve good common grounding between the first device and the second device, thereby ensuring stable and reliable operation of the device in the first shell and the device in the second shell.
  • two sides of the support sheet in the width direction extend beyond two sides of the rotating shaft
  • the orthographic projection of the support sheet on the first shell has an overlapping area with the grounding portion of the first device
  • the orthographic projection of the support sheet on the second shell also has an overlapping area with the grounding portion of the second device.
  • the conductive structure is located in the overlapping area between the support sheet and the grounding portion of the corresponding device.
  • the two sides of the support sheet in the width direction can be supported on the middle frame of the first shell and the middle frame of the second shell respectively.
  • one side of the support sheet has an overlapping area with the grounding part of the first device in the first shell, which is convenient for setting the conductive structure between the grounding part of the first device and the support sheet in the overlapping area; similarly, the other side of the support sheet has an overlapping area with the grounding part of the second device in the second shell, which is convenient for setting the conductive structure between the grounding part of the second device and the support sheet in the overlapping area.
  • the conductive structure is a conductive layer attached between the support sheet and the grounding portion of the corresponding device.
  • the two side surfaces of the conductive layer are respectively connected to the support sheet and the grounding part of the corresponding device, and electrical conduction between the grounding part of the corresponding device and the support sheet is achieved through the conductive layer.
  • the conductive layer is a long strip structure.
  • the conductive layer extends along the length direction of the support sheet.
  • the entire conductive layer can be located in the area where the support sheet does not bend, so as to ensure the reliability of the conductive layer.
  • the length direction of the conductive layer is perpendicular (or close to perpendicular) to the current direction, and the conductive layer has a large flow area, which can reduce the contact impedance of the conductive layer and improve the grounding effect of the common grounding structure.
  • the conductive layer corresponding to the first device and the conductive layer corresponding to the second device are arranged on two sides of the rotating shaft opposite to each other.
  • the conductive layer extends from the edge of the support sheet to the center of the support sheet.
  • the conductive layer By attaching the conductive layer along the edge of the support sheet, the connection of the conductive layer is facilitated, and the conductive layer can be ensured to extend along the length direction of the support sheet.
  • the conductive layer extends from the edge of the support sheet to the center of the support sheet, which can increase the width of the conductive layer, reduce the contact resistance of the conductive layer, and improve the grounding effect of the common grounding structure.
  • the conductive layer includes conductive foam.
  • the conductive layer can have good conductive properties.
  • the conductive foam has good elasticity and fast rebound. It is squeezed between the support sheet and the corresponding device and is in close contact with both, which can ensure stable conduction between the support sheet and the corresponding device.
  • the conductive layer further includes a conductive medium layer
  • the conductive medium layer at least covers a side surface of the conductive foam facing the support sheet and a side surface of the conductive foam facing the grounding portion of the corresponding device.
  • the surface conductivity of the conductive foam can be enhanced to ensure good electrical conduction between the support sheet and the corresponding device.
  • the conductive medium layer includes a gold layer or a copper layer.
  • the conductive layer is a conductive adhesive layer.
  • the support sheet includes a flat plate portion and a raised portion, a first end of the raised portion is integrally connected to the flat plate portion, and a second end of the raised portion is raised toward a grounding portion of a corresponding device;
  • the raised portion constitutes at least a part of the conductive structure, and the raised portion is electrically connected to the ground portion of the corresponding device.
  • the warping portion is formed by making grooves on the flat plate portions on both sides of the hollow portion of the support sheet, the first end of the warping portion is integrally connected to the flat plate portion, and the second end of the warping portion is warped toward the grounding portion of the corresponding device by bending.
  • the warping portion is used to achieve electrical connection with the grounding portion of the corresponding device, and the elasticity of the warping portion itself can ensure that the support sheet is stably electrically connected to the grounding portion of the corresponding device.
  • a plurality of openings are distributed on the warped portion.
  • the bending of the warping portion is facilitated, and the heat conduction effect of the warping portion can be effectively weakened through the multiple openings.
  • the welding process can be prevented from causing damage to the screen body.
  • the bending arc of the lift portion is less than 90°
  • the conductive structure also includes a conductive gasket, which is connected to the second end of the lift portion and extends to the side where the lift portion is located, and the conductive gasket is attached to and connected to the grounding portion of the corresponding device.
  • the curvature of the lifting portion can be controlled to be less than 90 degrees, and the end surface of the second end of the lifting portion faces the grounding portion of the corresponding device.
  • the conductive gasket includes a fixed section, a bending section and a connecting section connected in sequence, the fixed section is adhered to the surface of the lift portion and extends toward the grounding portion, the bending section is bent toward the side where the first end of the lift portion is located, and the connecting section is adhered to the grounding portion.
  • the conductive gasket is formed into a fixed section, a bending section and a connecting section in sequence.
  • the fixed section is attached to the second end of the lift portion and extends toward the grounding portion of the device.
  • the bending section is bent from the second end of the lift portion to the first end so that the connecting section is located on the side where the lift portion is located.
  • the connecting section can be attached and connected to the grounding portion of the device.
  • the connecting section has a mounting hole, a locking piece is inserted into the mounting hole, and the conductive gasket is connected to the grounding portion through the locking piece.
  • the bending arc of the warped portion is greater than 90° and less than 180°
  • the warped portion has a fitting section, which covers from the second end of the warped portion to the curved top near the warped portion, and the fitting section is fitted with the grounding portion of the corresponding device.
  • the warping portion By making the bending arc of the warping portion greater than 90° and less than 180°, the warping portion forms a "U"-shaped structure, the second end and the first end of the warping portion are both located on the same side of the top of the curve, and the warping portion forms a fitting section from the second end to the portion close to the top of the curve.
  • the warping portion relies on its own elastic force to tightly fit with the grounding portion of the corresponding device through the fitting section.
  • the conductive structure is a conductive spring sheet, which is connected between the support sheet and a grounding portion of a corresponding device, and the conductive spring sheet is in a compressed state.
  • the middle area of the support sheet in the width direction is a hollow portion, and the conductive structure corresponding to the ground portion of the first device and the conductive structure corresponding to the ground portion of the second device are respectively located on both sides of the hollow portion.
  • the elastic deformation capacity of the support sheet can be enhanced to prevent the support sheet from hindering the folding of the folding screen.
  • the conductive structures corresponding to the grounding part of the first device and the grounding part of the second device in the solid areas of the support sheet located on both sides of the hollow part, it is convenient to connect the conductive structure with the support sheet, and the stability of the electrical conduction between the grounding part of the first device and the grounding part of the second device and the support sheet can be ensured.
  • the area located in the hollow portion is the first area, and the area in the hollow portion outside the first area is the second area;
  • the hollow area of the first region is smaller than the hollow area of the second region.
  • the first area corresponds to the area surrounded by the conductive structures on both sides, and by reducing the hollowed-out area of the first area, the hollowed-out area of the first area is made smaller than the hollowed-out area of the second area, thereby increasing the flow area in the first area, reducing the impedance of the support sheet, and facilitating improving the grounding effect of the common grounding structure.
  • the second area maintains a larger hollowed-out area to ensure the bendability of the support sheet.
  • FIG1 is a structural diagram of a foldable electronic device provided by an embodiment of the present application when in an unfolded state
  • FIG2 is a structural diagram of the foldable electronic device shown in FIG1 in a folded state
  • FIG3 is a schematic structural diagram of a housing assembly of the foldable electronic device shown in FIG1 ;
  • FIG4 is an exploded view of a portion of the structure of the housing assembly shown in FIG3 ;
  • FIG5 is a design structure diagram of a common ground structure of a foldable electronic device provided in an embodiment of the present application.
  • FIG6 is a schematic diagram of a conductive structure used in the common ground structure shown in FIG5 ;
  • FIG7 is a cross-sectional view of a common ground structure using a conductive layer as a conductive structure corresponding to the A-A section in FIG5 ;
  • FIG8 a is a schematic diagram of another conductive structure used in the common grounding structure shown in FIG5 ;
  • FIG8b is another layout structure diagram of the conductive structure shown in FIG8a on the support sheet;
  • FIG9 is a cross-sectional view of a common ground structure using the conductive structure in FIG8 corresponding to the A-A section in FIG5;
  • FIG10 is a schematic diagram of a third conductive structure used in the common ground structure shown in FIG5 ;
  • FIG. 11 is a schematic structural diagram of a common grounding structure using another supporting sheet provided in an embodiment of the present application.
  • the present application provides a foldable electronic device, which includes but is not limited to foldable electronic products such as mobile phones, tablet computers (tablet personal computers), laptop computers, notebook computers, personal digital assistants (PDAs), personal computers, multimedia players, e-book readers, vehicle-mounted devices or wearable devices.
  • foldable electronic products such as mobile phones, tablet computers (tablet personal computers), laptop computers, notebook computers, personal digital assistants (PDAs), personal computers, multimedia players, e-book readers, vehicle-mounted devices or wearable devices.
  • wearable devices include but are not limited to smart bracelets, smart watches, smart head-mounted displays, smart glasses, etc.
  • FIG1 is a structural diagram of a foldable electronic device provided in an embodiment of the present application when it is in an unfolded state
  • FIG2 is a structural diagram of the foldable electronic device shown in FIG1 when it is in a folded state.
  • this embodiment takes the foldable electronic device 1 as a foldable mobile phone as an example for explanation.
  • the foldable electronic device 1 in different usage scenarios, the foldable electronic device 1 can be unfolded to an unfolded state (as shown in FIG1), and the unfolding angle of the foldable electronic device 1 is, for example, 180°.
  • the foldable electronic device 1 can achieve a large-screen display; the foldable electronic device 1 can also be folded to a folded state (as shown in FIG2).
  • the volume of the foldable electronic device 1 is small and easy to carry.
  • the foldable electronic device 1 can also stay in a semi-expanded state (hovering state).
  • the hovering angle of the foldable electronic device 1 can be 120°.
  • the angles illustrated in this embodiment are all allowed to have a slight deviation.
  • the unfolding angle of the foldable electronic device 1 shown in FIG. 1 is 180°, which means that the unfolding angle can be 180°, or about 180°, such as 170°, 175°, 185° or 190°.
  • the angles illustrated in the following text can be understood in the same way.
  • the foldable electronic device 1 includes a foldable screen 100 and a shell assembly 200, and the foldable screen 100 is supported and connected to a side surface of the shell assembly 200.
  • the side surface of the foldable screen 100 used for displaying information is defined as its front side
  • the other side surface of the foldable screen 100 opposite to the front side is defined as its back side.
  • the side surface of the shell assembly 200 supporting the foldable screen 100 is defined as its front side
  • the other side surface of the shell assembly 200 opposite to its front side is defined as its back side.
  • the front side of the foldable screen 100 is exposed outside the shell assembly 200, and is used to display information and provide an interactive interface for the user.
  • the back side of the foldable screen 100 faces the shell assembly 200 and is connected to the front side of the shell assembly 200.
  • the appearance effect of the foldable electronic device 1 is mainly reflected through the side and back sides of the shell.
  • the folding screen 100 can be, but is not limited to, an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (mini organic light-emitting diode) display, a micro organic light-emitting diode (micro organic light-emitting diode) display, a micro organic light-emitting diode (micro organic light-emitting diode) display, or a quantum dot light-emitting diode (QLED) display, etc.
  • OLED organic light-emitting diode
  • AMOLED active-matrix organic light-emitting diode
  • mini organic light-emitting diode mini organic light-emitting diode
  • micro organic light-emitting diode micro organic light-emitting diode
  • the foldable screen 100 may include a first portion 101, a second portion 102, and a foldable portion 103, wherein the foldable portion 103 is located between the first portion 101 and the second portion 102.
  • the first portion 101 and the second portion 102 remain in a planar state, while the foldable portion 103 may be bent to change the angle between the first portion 101 and the second portion 102.
  • the first part 101 and the second part 102 can be made of flexible materials or rigid materials, or can be made of partly rigid materials and partly flexible materials, which is not limited in this embodiment.
  • the folding screen 100 can switch between the unfolded state and the folded state.
  • the first part 101 and the second part 102 are in a relatively far unfolded state
  • the foldable part 103 is in a flattened state without bending
  • the first part 101, the second part 102 and the third part are in the same direction and in a coplanar state.
  • the angle between the first part 101 and the second part 102 is 180°, and the folding screen 100 can achieve a large-screen display, which can provide users with richer information and bring users a better user experience.
  • the folding screen 100 when the folding screen 100 is in a folded state, the first part (not shown in the figure) and the second part (not shown in the figure) are stacked relative to each other, and the foldable part 103 is in a bent state.
  • the foldable part 103 can be in a teardrop shape, for example.
  • the folding screen 100 is invisible to the user, and the housing assembly 200 protects the folding screen 100 from being scratched by hard objects.
  • This foldable electronic device 1 is an inward-folding electronic device.
  • the foldable electronic device 1 may also be an outward-folding electronic device.
  • the first part 101 and the second part 102 of the folding screen 100 face each other, and the housing assembly 200 is located between the first part 101 and the second part 102. It can be understood that, whether it is an inward-folding electronic device or an outward-folding electronic device, the foldable electronic device 1 is small in size when in the folded state, and is easy to carry and store.
  • the foldable screen 100 can also stay between the unfolded state and the folded state, for example, the foldable screen 100 can stay in a semi-expanded state (hovering state).
  • the foldable portion 103 of the foldable screen 100 is also in a bent state, and the degree of bending is less than that in the folded state, and the angle between the first portion 101 and the second portion 102 of the foldable screen 100 is, for example, 120°.
  • the shell assembly 200 is used to support and fix the folding screen 100, and drive the folding screen 100 to switch between the unfolded state and the folded state.
  • Figure 3 is a schematic diagram of the structure of the shell assembly of the foldable electronic device shown in Figure 1.
  • the shell assembly 200 includes a first shell 200a, a second shell 200b and a rotating shaft 200c, and the rotating shaft 200c is connected between the first shell 200a and the second shell 200b.
  • the first shell 200a and the second shell 200b are rotatably connected through the rotating shaft 200c, thereby realizing relative rotation between the first shell 200a and the second shell 200b.
  • the first shell 200a supports the first part 101 of the folding screen 100
  • the second shell 200b supports the second part 102 of the folding screen 100.
  • the first part 101 of the folding screen 100 is connected to the first shell 200a
  • the second part 102 of the folding screen 100 is connected to the second shell 200b.
  • the foldable part 103 of the folding screen 100 is arranged corresponding to the rotating shaft 200c, and the foldable part 103 can be fixedly connected to the rotating shaft 200c, for example.
  • the first shell 200a and the second shell 200b are driven to rotate relative to each other by the rotating shaft 200c, so that the foldable electronic device 1 is switched between the unfolded state and the folded state.
  • the first shell 200a and the second shell 200b can be rotated in the direction away from each other and unfolded until the two are coplanar.
  • the shell assembly 200 is in the unfolded state, and the folding screen 100 is in the unfolded state as the shell assembly 200 is unfolded, as shown in Figure 1; the first shell 200a and the second shell 200b can also be rotated in the direction close to each other and folded until the two are relatively stacked.
  • the shell assembly 200 is in the folded state, and the folding screen 100 is in the folded state as the shell assembly 200 is folded; or, the first shell 200a and the second shell 200b can also be relatively rotated to a semi-expanded state (hovering state) in which the two remain between the unfolded state and the folded state.
  • the angle between the first shell 200a and the second shell 200b is, for example, 120°
  • the folding screen 100 is in the hovering state with the shell assembly 200
  • the angle between the first part 101 and the second part 102 of the folding screen 100 is, for example, 120°.
  • the first housing 200a is used to support and fix the first part 101 of the folding screen 100 in FIG. 1.
  • the first housing 200a has a supporting surface M1
  • the first part 101 of the folding screen 100 is attached to the first housing 200a.
  • the first shell 200a supports and fixes the first part 101 of the folding screen 100 through the supporting surface M1, and the connection relationship between the supporting surface M1 and the first part 101 includes but is not limited to gluing.
  • the second shell 200b is used to support and fix the second part 102 of the folding screen 100 in Figure 1.
  • the second shell 200b has a supporting surface M2, and the second part 102 of the folding screen 100 is mounted on the supporting surface M2 of the second shell 200b.
  • the second shell 200b supports and fixes the second part 102 of the folding screen 100 through the supporting surface M2, and the connection relationship between the supporting surface M2 and the second part 102 includes but is not limited to gluing.
  • the structures of the first shell 200a and the second shell 200b can be the same, and the first shell 200a and the second shell 200b are mirror-symmetrical with the center line of the rotating shaft 200c as the axis of symmetry.
  • the first shell 200a and the second shell 200b can be provided with a receiving groove 201 on one side facing each other, and the opening a of the receiving groove 201 is, for example, located on the side surface of the first shell 200a (second shell 200b) facing the folding screen 100, and the receiving groove 201 is recessed from the side surface toward the back cover 220, and the two sides of the rotating shaft 200c extend into the receiving groove 201 of the first shell 200a and the receiving groove 201 of the second shell 200b respectively, and the two sides of the rotating shaft 200c can be fixedly connected to the first shell 200a and the second shell 200b respectively, so as to drive the first shell 200a and the second shell 200b to rotate relative to each other through the rotating shaft 200c.
  • Fig. 4 is an exploded view of a part of the structure of the housing assembly shown in Fig. 3.
  • the first housing 200a and the second housing 200b may both include a middle frame 210 and a back cover 220.
  • the middle frame 210 is connected between the folding screen 100 and the back cover 220.
  • the side surface of the middle frame 210 facing the folding screen 100 forms the above-mentioned support surface M1 (support surface M2).
  • the side surface of the middle frame 210 is used to support and fix the folding screen 100.
  • the back cover 220 is connected to the side surface of the middle frame 210 facing away from the folding screen 100.
  • An installation space is enclosed between the middle frame 210 and the back cover 220, and the installation space is used to accommodate some devices 300 of the foldable electronic device 1.
  • the figure shows that a mainboard 301, a battery 302 and a speaker 303 module are arranged in the installation space.
  • the devices 300 arranged in the installation space may not be limited to the devices 300 shown in the figure, but may also include camera modules, microphones and other devices 300 not shown in the figure.
  • a circuit board may be disposed in both the first shell 200a and the second shell 200b, and the number of circuit boards in the first shell 200a (the second shell 200b) may be one or more than two, wherein the circuit board disposed in the first shell 200a (the second shell 200b) includes a mainboard 301 that plays a core control role, and the substrate of the mainboard 301 is, for example, a printed circuit board (PCB).
  • PCB printed circuit board
  • One of the mainboards 301 in the first shell 200a and the mainboards 301 in the second shell 200b is a core circuit board for controlling the entire machine, and a central processing unit (CPU) is usually integrated on the core circuit board.
  • a battery 302 may also be disposed in the first shell 200a and the second shell 200b, and the battery 302 is electrically connected to the circuit board, and the battery 302 provides power to the folding screen 100 and the speaker 303 through the circuit board.
  • other components 300 such as the speaker 303 module, camera module and microphone, they can be concentrated in the first shell 200a, or concentrated in the second shell 200b, or some components 300 can be set in the first shell 200a and some components 300 can be set in the second shell 200b.
  • the devices 300 in the first shell 200a and the second shell 200b are usually electrically connected together.
  • a flexible circuit board can be provided that passes through the rotating shaft 200c, one end of the flexible circuit board is connected to the main board 301 in the first shell 200a, and the other end of the flexible circuit board is connected to the main board 301 in the second shell 200b.
  • the devices 300 in the first shell 200a and the devices 300 in the second shell 200b are electrically connected together.
  • the device 300 in the first shell 200a and the device 300 in the second shell 200b usually need to be designed with a common ground.
  • the common ground means that the device 300 in the first shell 200a and the device 300 in the second shell 200b have a common ground terminal (referred to as the common terminal).
  • the common terminal is, for example, the negative electrode of the battery 302. In this way, the first shell 200a and the second shell 200b are connected to the ground terminal. All devices 300 (voltages) in the second housing 200 b use the common terminal (zero potential) as a reference to ensure the normal working state of each device 300 and prevent the device 300 from being disturbed.
  • the flexible circuit board passing through the rotating shaft 200c is used to connect the main board 301 in the first shell 200a and the main board 301 in the second shell 200b, and the flexible circuit board can also be used to realize the common grounding of the device 300 in the first shell 200a and the device 300 in the second shell 200b.
  • a part of the flexible circuit board can be used as a grounding line, and the grounding impedance of the grounding line needs to be made very small, so as to connect the main board 301 in the first shell 200a and the main board 301 in the second shell 200b, so that the common grounding part of the two maintains a small resistance; or, the grounding can also be realized by the flexible circuit board as a whole.
  • a grounding layer with low impedance (for example, a metal layer) can be set on the two sides of the flexible circuit board, and the main board 301 in the first shell 200a and the main board 301 in the second shell 200b are connected through the grounding layer to reduce the resistance of the common grounding part of the two.
  • the impedance of the part of the flexible circuit board used as the grounding line is high, it is equivalent to that there is actually no common ground between the mainboard 301 in the first shell 200a and the mainboard 301 in the second shell 200b. Because the impedance of the grounding line is high, a voltage drop will occur when the current is transmitted between the mainboard 301 in the first shell 200a and the mainboard 301 in the second shell 200b. Taking the mainboard 301 in the first shell 200a as an example, the mainboard 301 in the first shell 200a transmits the voltage V to the mainboard 301 in the second shell 200b through the flexible circuit board.
  • the impedance of the part of the flexible circuit board used as the grounding line is high, a voltage drop will occur on the grounding line, which will cause the voltage received by the mainboard 301 in the second shell 200b to be actually less than V.
  • the voltage received by the mainboard 301 in the second shell 200b is V- ⁇ V. In this way, the stability of the operation of the foldable electronic device 1 will be affected, and it may cause the phenomenon of being unable to send and receive high levels.
  • the length of the flexible circuit board is constant.
  • the impedance of the grounding circuit portion of the flexible circuit board is usually reduced by increasing the width of the flexible circuit board.
  • the space reserved for the flexible circuit board by the shaft 200c is limited.
  • the space of the connection portion between the shaft 200c and the first shell 200a (second shell 200b) must be compressed, which will affect the reliability of the shaft 200c, resulting in the shaft 200c being difficult to stably drive the first shell 200a (second shell 200b) to rotate and difficult to stably support the suspended state of the shell assembly 200.
  • the rotating shaft 200c is a moving structure, and the rotating shaft 200c usually includes a base support part and a transition part movably connected to both sides of the base support part.
  • the transition parts on both sides are respectively connected to the first shell 200a and the second shell 200b.
  • the contact impedance of the rotating shaft 200c itself is in an unstable state, and it cannot be used as a common grounding structure to stably realize the common grounding of the components in the first shell 200a and the components in the second shell 200b.
  • the embodiment of the present application improves the common grounding structure between the device 300 in the first shell 200a and the device 300 in the second shell 200b, and uses the conductive support sheet 120 of the folding screen 100 itself as the grounding line, and connects the first device 310 in the first shell 200a to the support sheet 120 through the conductive structure 400, and connects the second device 320 in the second shell 200b to the support sheet 120 through the conductive structure 400.
  • the support sheet 120 is fixedly connected to the part of the folding screen 100 corresponding to the rotating shaft 200c, a stable connection with the first device 310 and the second device 320 can be achieved through the conductive structure 400, and the low impedance characteristics of the support sheet 120 itself can be used to achieve good common grounding between the first device 310 and the second device 320, thereby ensuring stable and Reliable operation.
  • the common grounding structure between the device 300 in the first housing 200a and the device 300 in the second housing 200b in the foldable electronic device 1 of this embodiment is described in detail below.
  • FIG5 is a design structure diagram of a common ground structure of a foldable electronic device provided in an embodiment of the present application.
  • FIG5 in order to facilitate the illustration of the common ground structure of the device 300 in the first shell 200a and the device 300 in the second shell 200b, only the first shell 200a and the first device 310 located in the first shell 200a, the second shell 200b and the second device 320 located in the second shell 200b are illustrated, and the folding screen 100 as a whole is not shown in the figure, but only the support sheet 120 in the folding screen 100 is shown.
  • a conductive structure 400 is connected between the grounding portion of the first device 310 and the support sheet 120, and a conductive structure 400 is connected between the grounding portion of the second device 320 and the support sheet 120.
  • the support sheet 120 is used as a common grounding terminal of the first device 310 and the second device 320 to achieve common grounding of the first device 310 and the second device 320, and further, to achieve common grounding between the device 300 in the first shell 200a and the device 300 in the second shell 200b.
  • the device 300 disposed in the first housing 200a includes not only the first device 310 but also other devices 300, and the first device 310 and other devices 300 in the first housing 200a are electrically connected to each other; similarly, the device 300 disposed in the second housing 200b includes not only the second device 320 but also other devices 300, and the second device 320 and other devices 300 in the second housing 200b are electrically connected to each other.
  • the first housing 200a may be provided with a mainboard 301, other circuit boards, a battery 302 and other devices 300
  • the second housing 200b may be provided with a mainboard 301, other circuit boards, a battery 302 and other devices 300.
  • these devices 300 may all be located in the first housing 200a, or all be located in the second housing 200b, or partly located in the first housing 200a and partly located in the second housing 200b.
  • the first device 310 may be the mainboard 301 in the first shell 200a
  • the second device 320 may be the mainboard 301 in the second shell 200b.
  • the mainboard 301 in the first shell 200a and the mainboard 301 in the second shell 200b are both connected to the support sheet 120 through the conductive structure 400, so as to realize the common grounding between the device 300 in the first shell 200a and the device 300 in the second shell 200b.
  • the battery 302 in the first shell 200a may be used as the first device 310
  • the battery 302 in the second shell 200b may be used as the second device 320.
  • the battery 302 in the first shell 200a and the battery 302 in the second shell 200b are both connected to the support sheet 120 through the conductive structure 400, so as to realize the common grounding between the device 300 in the first shell 200a and the device 300 in the second shell 200b.
  • the first device 310 may also be other devices 300 disposed in the first housing 200a, and the second device 320 may also be other devices 300 disposed in the second housing 200b, and this embodiment does not limit this.
  • the first device 310 may be the motherboard 301
  • the second device 320 may be the battery 302 disposed in the second housing 200b.
  • the grounding portion of the mainboard 301 may be a grounding layer (e.g., a metal layer) provided on the mainboard 301; when the battery 302 is used as a grounding structure connected to the support sheet 120, the grounding portion of the battery 302 may be a negative electrode of the battery 302.
  • the following description is made by taking the first device 310 as the mainboard 301 in the first housing 200a and the second device 320 as the mainboard 301 in the second housing 200b as an example.
  • the folding screen 100 of the present embodiment can be composed of a screen body 110 (not shown in FIG. 1 ) and a support sheet 120 (not shown in FIG. 1 ).
  • the screen body 110 is the main structure of the folding screen 100.
  • the support sheet 120 is usually fixedly connected to a surface of the screen body 110 on one side facing the shell assembly 200.
  • the support sheet 120 is located at a position corresponding to the rotating shaft 200c of the screen body 110.
  • the support sheet 120 is an elastic sheet structure.
  • the support sheet 120 can be a metal
  • the support sheet 120 is synchronously bent and flattened with the foldable portion 103 of the screen body 110, and the support sheet 120 can enhance the strength and stability of the foldable portion 103 of the screen body 110.
  • the flatness of the folding screen 100 can be improved through the support of the support sheet 120; when the folding screen 100 is in the folded state, the support of the support sheet 120 can also ensure that the foldable portion 103 of the folding screen 100 is stably in a teardrop shape, avoiding creases on the foldable portion 103.
  • a mounting groove may be opened in the foldable portion 103 of the screen body 110 , with the opening of the mounting groove facing the shell assembly 200 , and the support sheet 120 may be connected to the mounting groove by bonding or the like, and the surface of the support sheet 120 may be flush with the surface of the screen body 110 .
  • the support sheet 120 is fixedly connected to the screen body 110, and the support sheet 120 is an integral structure, even if the foldable electronic device 1 switches between the unfolded state and the folded state, the support sheet 120 switches between the bent state and the flattened state along with the screen body 110, and the area of the support sheet 120 does not change, and the support sheet 120 can maintain a fixed impedance.
  • the support sheet 120 is usually made of a material with good conductive properties.
  • the support sheet 120 is made of materials such as titanium alloy or copper alloy, and the impedance of the support sheet 120 is very small.
  • the first device 310 in the first shell 200a and the second device 320 in the second shell 200b are commonly grounded through the support sheet 120, and the support sheet 120 provides a fixed and small impedance, which can ensure the grounding effect of the device 300 in the first shell 200a and the device 300 in the second shell 200b.
  • the support sheet 120 is extended along the length direction of the rotating shaft 200c, and in order to facilitate the connection with the first device 310 in the first shell 200a and the second device 320 in the second shell 200b, both sides of the width direction of the support sheet 120 can extend beyond the two sides of the rotating shaft 200c.
  • the width of the support sheet 120 can be greater than the width of the rotating shaft 200c, and the support sheet 120 extends to both sides of the rotating shaft 200c in the width direction. Both sides of the width direction of the support sheet 120 can be supported on the first shell 200a and the second shell 200b, respectively.
  • the grounding part of the main board 301 in the first shell 200a can be a grounding layer set on the side of the main board 301 facing the support sheet 120; similarly, taking the second device 320 as the main board 301 in the second shell 200b as an example, the grounding part of the main board 301 in the second shell 200b can also be a grounding layer set on the side of the main board 301 facing the support sheet 120.
  • the middle area of the width direction of the support sheet 120 is generally a hollow portion 121, and the hollow portion 121 corresponds to the rotation axis 200c.
  • the hollow portion 121 corresponds to the foldable portion 103 of the folding screen 100.
  • the opening a is a strip-shaped opening extending along the length direction of the support sheet 120 as an example.
  • the strip-shaped openings are staggered front and back in the width direction of the support sheet 120.
  • the strip-shaped openings may include a closed portion that is completely located in the support sheet 120. shaped strip-shaped hole and a strip-shaped recess connected to the side of the supporting sheet 120.
  • the extension direction of the strip opening is perpendicular to the bending direction (width direction) of the support sheet 120, which is more conducive to the bending of the support sheet 120.
  • the strip opening provided in the hollow portion 121 of the support sheet 120 can also be extended in other directions, or the opening a in the hollow portion 121 can also be other shapes other than the strip opening, and the hollow portion 121 can have an opening a of a single shape and size, or can have openings a of different shapes and sizes, and this embodiment does not impose specific restrictions on this.
  • the two side areas where the support sheet 120 overlaps with the grounding part of the first device 310 and the grounding part of the second device 320 can be a solid flat plate area without an opening a.
  • the parts on the support sheet 120 located on both sides of the hollow part 121 are defined as flat plate parts 122.
  • the flat plate part 122 In the process of bending and flattening the support sheet 120 with the screen body 110, the flat plate part 122 only rotates in angle, and its flat plate shape does not change.
  • the grounding part of the first device 310 and the grounding part of the second device 320 correspond to the flat plate parts 122 on both sides of the hollow part 121 of the support sheet 120, respectively.
  • FIG6 is a schematic diagram of a conductive structure used in the common ground structure shown in FIG5.
  • the conductive structure 400 connected between the support sheet 120 and the grounding portion of the corresponding device 300 may be a conductive layer 410, that is, the conductive structure 400 connected between the grounding portion of the first device 310 and the corresponding side of the support sheet 120 is the conductive layer 410, and the conductive structure 400 connected between the grounding portion of the second device 320 and the corresponding side of the support sheet 120 is also the conductive layer 410.
  • the two side surfaces of the conductive layer 410 are respectively attached to the grounding portion of the corresponding device 300 and the support sheet 120.
  • the two side surfaces of the conductive layer 410 may be respectively bonded to the support sheet 120 and the grounding portion of the corresponding device 300, and electrical conduction between the support sheet 120 and the grounding portion of the corresponding device 300 is achieved through the conductive layer 410.
  • the conductive layer 410 can be designed as a long strip structure, and the long strip conductive layer 410 has a sufficient size in its length direction, which can ensure that there is a sufficient contact area between the conductive layer 410 and the support sheet 120 (and the grounding portion of the corresponding device 300), and ensure that the conductive layer 410 is stably and firmly connected between the support sheet 120 and the grounding portion of the corresponding device 300.
  • the size of the long strip conductive layer 410 in its width direction is very small, and the placement direction of the conductive layer 410 can be designed to avoid affecting the reliability of the connection of the conductive layer 410 during the long-term repeated switching between bending and flattening of the support sheet 120.
  • the length direction of the long strip of conductive layer 410 may correspond to the length direction of the support sheet 120.
  • the long strip of conductive layer 410 may be extended along the length direction of the support sheet 120.
  • the support sheet 120 corresponds to the hollow portion 121 in the middle area of the foldable portion 103 of the folding screen 100 in the width direction, and the conductive layer 410 is connected to the area close to the edge in the width direction of the support sheet 120.
  • the area where the entire conductive layer 410 is located is located on the flat plate portion 122 of the support sheet 120 where no bending occurs, which can ensure the reliability of the connection between the conductive layer 410 and the support sheet 120 (corresponding to the device 300), and ensure the reliability of the connection of the conductive layer 410.
  • the current flows from the first device 310 in the first housing 200a through the conductive layer 410 on that side to the support sheet 120, and then flows from the support sheet 120 through the conductive layer 410 on the side of the second housing 200b to the second device 320; or the current flows from the second device 320 in the second housing 200b through the conductive layer 410 on that side to the support sheet 120, and then flows from the support sheet 120 through the conductive layer 410 on the side of the first housing 200a to the first device 310.
  • the current flows between the first device 310 and the second device 320 through the support sheet 120, during which, The general direction of the current flow is along the width direction of the support sheet 120 .
  • the conductive layer 410 is arranged along the length direction of the support sheet 120.
  • the length direction of the conductive layer 410 is perpendicular to the direction of current flow.
  • the conductive layer 410 has a larger flow area (the area where current flows) and can reduce the contact impedance between the conductive layer 410 and the grounding part (support sheet 120) of the corresponding device 300, thereby improving the grounding effect of the common grounding structure.
  • the conductive layer 410 may extend in a direction inclined to the length direction of the support sheet 120. In other words, there is an angle between the length direction of the conductive layer 410 and the length direction of the support sheet 120, and the angle is, for example, in the range of 0° to 40°, which is not limited in this embodiment.
  • the conductive layer 410 in order to facilitate the connection of the conductive layer 410, the conductive layer 410 can be arranged at the edge of the support sheet 120. In this way, by arranging the conductive layer 410 along the edge of the support sheet 120, it can be ensured that the length direction of the conductive layer 410 is the length direction of the support sheet 120, and the connection efficiency of the conductive layer 410 can be improved.
  • the width direction of the conductive layer 410 extends from the edge of the support sheet 120 to the center of the support sheet 120, the width of the conductive layer 410 can be increased, thereby reducing the contact resistance between the conductive layer 410 and the support sheet 120 (corresponding to the device 300), and improving the grounding effect of the common grounding structure.
  • the conductive layer 410 can extend from one end of the grounding portion of the corresponding device 300 to the other end, that is, the conductive layer 410 covers all areas of the corresponding device 300 in the length direction of the support sheet 120.
  • the flow area of the conductive layer 410 is maximized, and the contact impedance between the conductive layer 410 and the grounding portion (support sheet 120) of the corresponding device 300 is minimized.
  • the conductive layer 410 corresponding to the first device 310 and the conductive layer 410 corresponding to the second device 320 can be extended to the two ends of the corresponding device 300; for the case where the overlapping length between the grounding portion of the first device 310 and the support sheet 120 is different from the overlapping length between the grounding portion of the second device 320 and the support sheet 120, the conductive layer 410 connected to the one with the shorter overlapping length with the support sheet 120 can be extended to its two ends, and the length of the conductive layer 410 connected to the other can be reasonably designed accordingly.
  • the first device 310 and the second device 320 can be arranged on both sides of the rotating shaft 200c as relatively as possible by reasonably arranging the device 300 in the first shell 200a and the device 300 in the second shell 200b.
  • the conductive layer 410 connected to the first device 310 and the conductive layer 410 connected to the second device 320 can also be relatively arranged on both sides of the rotating shaft 200c.
  • the conductive layer 410 not only has a larger flow area, but also the current path between the conductive layers 410 on both sides is shorter, which can effectively reduce the impedance of the common grounding structure.
  • the layout structure of the first device 310 and the second device 320 makes it impossible for the conductive layers 410 on both sides to be arranged completely opposite to each other, the offset distance between the conductive layers 410 on both sides can be minimized, the overlapping length of the conductive layers 410 on both sides in the length direction of the supporting sheet 120 can be increased, and the current path between the conductive layers 410 on both sides can be shortened to reduce the impedance of the common grounding structure.
  • FIG7 is a cross-sectional view of a common ground structure using a conductive layer as a conductive structure corresponding to the AA in FIG5.
  • the main structure of the conductive layer 410 can be a conductive foam 411
  • the base material of the conductive foam 411 is mainly polyethylene or modified polyethylene, and the base material is also mixed with conductive fillers and antistatic agents, so that the conductive foam 411 has good conductive properties.
  • the conductive foam 411 is filled with fillers in a loose and porous matrix, and has good elasticity and fast rebound.
  • the conductive foam 411 is squeezed between the support sheet 120 and the corresponding device 300, and the conductive foam 411 is in close contact with the support sheet 120 and the corresponding device 300, which can ensure stable conduction between the support sheet 120 and the corresponding device 300.
  • a conductive dielectric layer 412 is further provided on the outer surface of the conductive foam 411.
  • the conductive foam 411 and the conductive dielectric layer 412 together constitute a conductive layer 410.
  • the conductive dielectric layer 412 is, for example, a gold layer or a copper layer.
  • the conductive dielectric layer 412 enhances the surface conductivity of the conductive foam 411.
  • the conductive dielectric layer 412 at least covers the surface of the conductive foam 411 facing the support sheet 120 and the surface of the conductive foam 411 facing the grounding portion of the corresponding device 300. That is, the conductive foam 411 contacts the support sheet 120 and the grounding portion of the corresponding device 300 through the outer conductive dielectric layer 412.
  • the conductive layer 410 provides good electrical conductivity between the support sheet 120 and the corresponding device 300.
  • the conductive medium layer 412 is usually a conductive cloth disposed outside the conductive foam 411.
  • the conductive cloth can be bonded to the surface of the conductive foam 411 by conductive adhesive, and the surface of the conductive cloth is plated with conductive materials such as gold or copper.
  • the conductive cloth can be attached only to the two side surfaces of the conductive foam 411 corresponding to the support sheet 120 and the device 300, or, as shown in FIG. 7 , the conductive cloth can be wrapped all around the outer surface of the conductive foam 411.
  • the conductive layer 410 disposed between the support sheet 120 and the grounding portion of the corresponding device 300 may also be a conductive adhesive layer, which can directly bond the support sheet 120 and the corresponding device 300 together by relying on its own viscosity without the need for other adhesive materials.
  • the conductive adhesive layer has many conductive particles distributed in the adhesive, and after the conductive adhesive is cured or dried, the conductive particles contact each other to form a connection, so that the conductive adhesive has good conductive properties and can achieve stable electrical conduction between the support sheet 120 and the corresponding device 300.
  • FIG. 7 shows that the main board 301 in the first shell 200a and the main board 301 in the second shell 200b are both installed on the back cover 220 on the corresponding sides through the bracket 304.
  • the main board 301 can also be locked to the middle frame 210 or the back cover 220 by screws, bolts and other locking parts, or the main board 301 can also be connected to the middle frame 210 or the back cover 220 by gluing, welding and the like.
  • FIG8a is a schematic diagram of another conductive structure used in the common ground structure shown in FIG5.
  • FIG8b is another layout structure diagram of the conductive structure shown in FIG8a on the support sheet.
  • the support sheet 120 in addition to attaching a conductive layer 410 between the support sheet 120 and the grounding portion of the corresponding device 300, as another implementation, the support sheet 120 itself can also be used to form the conductive structure 400.
  • a raised portion 1221 that is raised toward the grounding part of the corresponding device 300 can be formed in the flat plate portion 122 located on both sides of the hollow portion 121 on the support sheet 120 and in the area overlapping with the grounding part of the corresponding device 300, and an electrical connection with the grounding part of the corresponding device 300 is achieved through the raised portion 1221.
  • the warped portion 1221 can be formed by cutting a groove on the flat portion 122, the grooved area is located in the area corresponding to the grounding portion of the corresponding device 300, and the cut groove extends less than one circle in the circumferential direction, so that the material located in the grooved area forms a structure in which one end is still connected to the flat portion 122, and the rest of the material is separated from the flat portion 122.
  • the structure in the grooved area is bent toward the direction of the corresponding device 300 by using the end completely separated from the flat portion 122, thereby forming the warped portion 1221 with a first end integrally connected to the flat portion 122 and a second end opposite to the first end warping toward the grounding portion of the corresponding device 300.
  • the supporting sheet 120 itself forms a warping portion 1221 that warps toward the grounding portion of the corresponding device 300. Electrically connected to the grounding part of the corresponding device 300, the lift portion 1221 is bent toward the corresponding device 300 and is in a lifted state, which also makes the lift portion 1221 have good elasticity. Relying on the elasticity of the lift portion 1221, it can ensure that the support sheet 120 and the grounding part of the corresponding device 300 are well and stably electrically connected.
  • the warped portion 1221 can be set in the middle area of the flat portion 122 of the supporting sheet 120.
  • the warped portion 1221 can be formed by cutting a groove in the middle area of the flat portion 122. In this way, the distance between the warped portions 1221 of the flat portion 122 on both sides is shorter, and the current path between the grounding portion of the first device 310 and the grounding portion of the second device 320 connected by the warped portions 1221 on both sides is shorter, which can reduce the common grounding impedance of the first device 310 and the second device 320.
  • the warping portion 1221 may also be arranged at the edge region of the flat plate portion 122 of the support sheet 120.
  • the warping portion 1221 may be formed by cutting a groove inward from the edge of the flat plate portion 122, and the formed warping portion 122 extends from the portion of the flat plate portion 122 close to the edge to the grounding portion of the corresponding device 300.
  • the warping portion 1221 may be arranged at the upper edge or the lower edge of the corresponding rotating shaft of the flat plate portion 122 in the longitudinal direction, and the warping portion 1221 may be located in the middle region of the upper edge or the lower edge of the flat plate portion 122.
  • the distance between the warping portions 1221 on both sides is also short, which can reduce the common ground impedance of the first device 310 and the second device 320.
  • at least one of the warping portions 1221 of the flat plate portions 122 on both sides may be arranged on one long side of the support sheet 120.
  • the size of the warping portion 1221 can be controlled to be maintained small.
  • the groove cut on the flat portion 122 only occupies a small area, so as not to affect the strength and flatness of the folding screen 100 in the grooved area, and ensure the performance of the folding screen 100.
  • the curvature of the warping portion 1221 can be less than 90°, and the warping portion 1221 mainly relies on the end surface of its second end to face the grounding portion of the corresponding device 300. There is not enough contact area between the warping portion 1221 and the grounding portion of the corresponding device 300 to ensure stable connection with the device 300.
  • a conductive gasket 420 can be connected to the second end of the warping portion 1221, and the conductive gasket 420 is connected to the grounding portion of the device 300 to achieve electrical connection between the warping portion 1221 and the grounding portion of the device 300.
  • FIG. 9 is a cross-sectional view of the common grounding structure corresponding to the A-A in FIG. 5 using the conductive structure in FIG. 8. As shown in Figures 8 and 9, the conductive gasket 420 can extend to the side where the warping portion 1221 is located. On the one hand, there is a large contact area between the conductive gasket 420 and the grounding portion of the corresponding device 300, which can ensure that the conductive gasket 420 and the corresponding device 300 are stably connected.
  • the pressure of the grounding portion of the device 300 on the conductive gasket 420 acts on the warping portion 1221, which can cause the second end of the warping portion 1221 to move toward the flat portion 122 of the support sheet 120, and the warping portion 1221 produces an elastic deformation from the original warped state to a flattened state, so that the warping portion 1221 tends to return to its original state, and the contact area between the warping portion 1221 and the screen body 110 is increased, which can improve the strength and flatness of the folding screen 100 in this area.
  • the elastic force generated by the elastic deformation acts on the conductive gasket 420, which can make the conductive gasket 420 and the grounding portion of the corresponding device 300 in close contact.
  • the conductive gasket 420 may include a fixed section 421, a bent section 422, and a connecting section 423 connected in sequence.
  • the conductive gasket 420 may be an integrally formed part.
  • the fixed section 421, the bent section 422, and the connecting section 423 correspond to the parts of the conductive gasket 420 formed in sequence.
  • the fixed section 421 is connected to the second end of the lifting portion 1221.
  • the fixed section 421 may be attached to the surface of the lifting portion 1221 by welding or conductive adhesive bonding, for example.
  • the fixed section 421 extends toward the grounding portion.
  • the bent section 422 is bent from the second end of the lifting portion 1221 toward the first end of the lifting portion 1221, so that the connecting section 423 is located on the side where the lifting portion 1221 is located.
  • the connecting section 423 may be attached to the surface of the grounding portion of the corresponding device 300, so as to achieve the connection between the conductive gasket 420 and the grounding portion of the corresponding device 300.
  • the connecting section 423 of the conductive gasket 420 that is in contact with the grounding portion of the device 300 can be set to a ring structure.
  • a mounting hole 4231 is formed in the central area of the device 300, as shown in FIG9, a locking member b is inserted into the mounting hole 4231, and the locking member b is, for example, a screw, a bolt or a rivet, etc.
  • the locking member b passes through at least a portion of the thickness of the device 300 (for example, the mainboard 301), so that the conductive gasket 420 is locked on the device 300 through the locking member b.
  • the conductive gasket 420 can also be welded to the surface of the device 300 by welding the side surface of the connecting section 423 of the conductive gasket 420 facing the grounding portion of the device 300 or bonding it to the surface of the device 300 by conductive adhesive.
  • FIG10 is a schematic diagram of a third conductive structure used in the common grounding structure shown in FIG5 .
  • the area surrounded by the slot cut on the flat plate portion 122 of the support sheet 120 can also be slightly increased to slightly increase the size of the formed warping portion 1221.
  • the bending degree of the warping portion 1221 can be increased accordingly.
  • the curvature of the warping portion 1221 can be greater than 90° and less than 180°.
  • the curvature of the warping portion 1221 can be 120°, 130°, 140°, 150°, etc.
  • the tilting portion 1221 forms a "U"-shaped structure, the tilting portion 1221 has a curved top, the second end and the first end of the tilting portion 1221 are both located on the same side of the curved top, and the tilting portion 1221 forms a fitting section 1221a from the second end to the portion close to the curved top.
  • the tilting portion 1221 can fit with the grounding portion of the corresponding device 300 by relying on the fitting section 1221a formed by itself, without the need to add an additional conductive member (such as a conductive gasket 420) to connect with the device 300.
  • the portions of the tilting portion 1221 located on both sides of the curved top form elastic arms arranged opposite to each other, and the elastic force of the elastic arms can ensure that the tilting portion 1221 fits tightly with the grounding portion of the device 300.
  • the bonding section 1221a can be connected to the grounding part of the device 300 by welding or conductive adhesive bonding, or, similar to the connection method of the aforementioned conductive gasket 420, the bonding section 1221a can be locked on the device 300 by connecting parts such as screws, bolts or rivets, which will not be repeated here.
  • the warped portion 1221 can be set in the middle area of the flat plate portion 122, or the warped portion 1221 can also be set in the edge area of the flat plate portion 122, which will not be repeated here.
  • the lifting portion 1221 and the grounding portion of the corresponding device 300 can also be connected by other connecting structures.
  • the lifting portion 1221 and the grounding portion of the corresponding device 300 can be snapped together, a snap portion can be integrally formed on the lifting portion 1221 or a separate snap portion can be connected, and a slot is opened on the grounding portion of the corresponding device 300, and the snap portion is snapped into the slot to achieve electrical connection between the lifting portion 1221 and the grounding portion of the corresponding device 300.
  • a plurality of openings a may be distributed on the warping portion 1221, similar to the hollow portion 121 of the support sheet 120.
  • the warping portion 1221 is easy to bend and is conducive to forming the warping portion 1221 that is warped toward the grounding portion of the device 300.
  • the plurality of openings a is equivalent to forming a plurality of air dielectric layers on the warping portion 1221, which can effectively weaken the heat conduction effect of the warping portion 1221.
  • the welding process is prevented from causing damage to the screen body 110.
  • the bonding section 1221a of the raised portion 1221 may not be provided with an opening a to ensure the contact area between the bonding section 1221a and the grounding portion of the corresponding device 300, thereby ensuring a stable connection between the bonding section 1221a and the grounding portion of the device 300.
  • the conductive structure 400 may be, for example, a conductive spring sheet disposed between the support sheet 120 and the grounding portion of the corresponding device 300, one side of the conductive spring sheet being in contact with the support sheet 120, and the other side of the conductive spring sheet being in contact with the grounding portion of the corresponding device 300, so as to realize electrical connection between the support sheet 120 and the grounding portion of the corresponding device 300 through the conductive spring sheet.
  • the conductive spring sheet located between the support sheet 120 and the grounding portion of the device 300 is in a compressed state, and the elastic force generated by the conductive spring sheet is The two sides of the support sheet 120 and the grounding part of the corresponding device 300 can be respectively pressed against the support sheet 120 and the grounding part of the corresponding device 300 to ensure stable electrical conduction between the support sheet 120 and the grounding part of the corresponding device 300.
  • the conductive spring sheet can be set to a "U"-shaped structure similar to the raised portion 1221 in Figure 10, or the conductive spring sheet can also be set to a different form such as an "S"-shaped structure, a frame-shaped structure, etc., which is not limited in this embodiment.
  • FIG11 is a schematic diagram of the structure of a common grounding structure using another support sheet provided in an embodiment of the present application.
  • the area enclosed between the conductive structures 400 on both sides of the hollow portion 121 of the support sheet 120 is defined as a first area 1211, and the area outside the first area 1211 in the hollow portion 121 is defined as a second area 1212.
  • the area enclosed between the conductive structures 400 on both sides is the area enclosed by the lines between the edges of the opposite sides of the conductive structures 400 on both sides.
  • the area enclosed by the conductive structures 400 on both sides is the rectangular area enclosed by the lines between the opposite ends of the conductive structures 400 on both sides and their respective side edges.
  • the size of the opening a (for example, a strip-shaped hole) in the first area 1211 of the hollow portion 121 can be designed to reduce the size of the opening a and reduce the coverage area of the opening a in the first area 1211.
  • the hollow area of the first area 1211 is reduced so that the hollow area of the first area 1211 is smaller than the hollow area of the second area 1212.
  • the flow area in the first area 1211 is increased by reducing the hollow area in the first area 1211, the density of the current flowing through the first area 1211 is increased, and the impedance of the support sheet 120 is reduced, which is conducive to improving the grounding effect of the common grounding structure.
  • the opening a in the second area 1212 still maintains a relatively large size, so that the second area 1212 maintains a relatively large hollow area to ensure the bendability of the support sheet 120, and to ensure that the support sheet 120, while enhancing the strength of the foldable part 103 of the folding screen 100, does not affect the bending and flattening of the foldable part 103.

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Abstract

本申请提供的可折叠电子设备，折叠屏包括屏体和连接在屏体朝向转轴的一侧的支撑片，且支撑片与转轴对应，利用支撑片作为接地线路，将第一壳体内的第一器件通过导电结构与支撑片连接，将第二壳体内的第二器件也通过导电结构与支撑片连接，通过支撑片实现第一器件和第二器件的共同接地。由于支撑片固定连接在折叠屏对应转轴的部分，因而，可以通过导电结构实现与第一器件及第二器件的稳定连接，并且，利用支撑片自身的低阻抗特性，可以实现第一器件和第二器件之间良好的公共接地，进而，保障第一壳体内的器件和第二壳体内的器件稳定、可靠运行。

Description

可折叠电子设备
本申请要求于2022年09月28日提交中国国家知识产权局、申请号为202211193457.X、申请名称为“可折叠电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备领域，特别涉及一种可折叠电子设备。
背景技术
随着5G时代的到来，电子设备(例如手机)的工作频段不断增多，射频对屏幕接地保护的要求越来越高，所需要的接地阻抗也越来越小。
在一众电子设备中，可折叠的电子设备(例如可折叠手机)，即搭载折叠屏的电子设备，由于能够在展开状态和折叠状态之间切换，可实现较大显示面积，且携带方便，愈发受到消费者的青睐。以可折叠手机为例，手机的第一壳体和第二壳体之间通过转轴机构连接，第一壳体内的器件和第二壳体内的器件利用穿过转轴机构的柔性电路板(Flexible Printed Circuit，FPC)实现电连接，目前，也同时通过该柔性电路板作为接地线路，实现第一壳体内的器件和第二壳体内的器件的公共接地。
然而，为了实现较小的接地阻抗，对柔性电路板提出更大的占用空间需求，会压缩转轴的架构空间，影响转轴机构的可靠性。
发明内容
本申请提供一种可折叠电子设备，可折叠电子设备的接地结构能够在保证较小的接地阻抗的基础上，较小接地结构占据的空间，保证转轴机构的可靠性。
本申请提供一种可折叠电子设备，包括：第一壳体、第二壳体、转轴和折叠屏，转轴连接在第一壳体和第二壳体之间，折叠屏支撑并连接在第一壳体和第二壳体的一侧表面；其中，折叠屏包括屏体和导电的支撑片，支撑片贴设在屏体朝向转轴的一侧并对应转轴设置，支撑片随屏体弯折或展开；
可折叠电子设备还包括：器件和导电结构，器件包括设于第一壳体内的第一器件和设于第二壳体内的第二器件，第一器件的接地部和支撑片之间及第二器件的接地部和支撑片之间均连接有导电结构。
本申请提供的可折叠电子设备，折叠屏包括屏体和连接在屏体朝向转轴的一侧的支撑片，且支撑片与转轴对应，利用支撑片作为接地线路，将第一壳体内的第一器件通过导电结构与支撑片连接，将第二壳体内的第二器件也通过导电结构与支撑片连接，通过支撑片实现第一器件和第二器件的共同接地。由于支撑片固定连接在折叠屏对应转轴的部分，因而，可以通过导电结构实现与第一器件及第二器件的稳定连接，并且，利用支撑片自身的 低阻抗特性，可以实现第一器件和第二器件之间良好的公共接地，进而，保障第一壳体内的器件和第二壳体内的器件稳定、可靠运行。
在一种可能的实施方式中，支撑片宽度方向的两侧伸出至转轴的两侧之外；
支撑片在第一壳体上的正投影与第一器件的接地部具有重叠区域，支撑片在第二壳体上的正投影与第二器件的接地部也具有重叠区域，导电结构位于支撑片与对应器件的接地部之间的重叠区域内。
通过使支撑片宽度方向的两侧伸出至转轴的两侧之外，支撑片的宽度方向的两侧可以分别支撑在第一壳体的中框及第二壳体的中框上。并且，支撑片的一侧与第一壳体内的第一器件的接地部具有重叠区域，便于在该重叠区域内设置位于第一器件的接地部和支撑片之间的导电结构；同样的，支撑片的另一侧与第二壳体内的第二器件的接地部之间具有重叠区域，便于在该重叠区域内设置位于第二器件的接地部和支撑片之间的导电结构。
在一种可能的实施方式中，导电结构为贴合在支撑片与对应器件的接地部之间的导电层。
通过在对应器件的接地部与支撑片之间设置导电层，导电层的两侧表面分别与支撑片及对应器件的接地部贴合连接，通过导电层实现对应器件的接地部与支撑片之间的电导通。
在一种可能的实施方式中，导电层为长条状结构。
在一种可能的实施方式中，导电层沿支撑片的长度方向延长。
通过沿支撑片的长度方向布设导电层，整个导电层所在的区域均可以位于支撑片不发生折弯的区域内，以保证导电层的可靠性。并且，导电层的长度方向垂直(或趋近于垂直)于电流方向，导电层的过流面积大，可以减小导电层的接触阻抗，提升公共接地结构的接地效果。
在一种可能的实施方式中，对应第一器件的导电层与对应第二器件的导电层相对设置在转轴的两侧。
通过使连接在支撑片两侧的导电层相对设置在转轴的两侧，以使两侧的导电层之间保持较短的电流路径，以降低公共接地结构的阻抗，提升公共接地结构的接地效果。
在一种可能的实施方式中，导电层由支撑片的边缘向支撑片的中心延伸。
通过沿支撑片的边缘贴设导电层，便于导电层的连接，可确保导电层沿支撑片的长度方向延长。并且，导电层由支撑片的边缘向支撑片的中心延伸，可增大导电层的宽度，降低导电层的接触电阻，提升公共接地结构的接地效果。
在一种可能的实施方式中，导电层包括导电泡棉。
通过设置导电泡棉作为导电层的基体材料，可使得导电层具备良好的导电性能。并且，导电泡棉的弹性好、回弹快，其被挤压在支撑片与对应器件之间，与两者紧密接触，可确保稳定导通支撑片与对应器件。
在一种可能的实施方式中，导电层还包括导电介质层；
导电介质层至少覆盖导电泡棉朝向支撑片的一侧表面及导电泡棉朝向对应器件的接地部的一侧表面。
通过在导电泡棉的至少对应支撑片及器件的表面上贴附导电介质层，可以增强导电泡棉的表面导电性，确保支撑片与对应器件之间电导通良好。
在一种可能的实施方式中，导电介质层包括金层或铜层。
在一种可能的实施方式中，导电层为导电胶层。
在一种可能的实施方式中，支撑片包括平板部和起翘部，起翘部的第一端一体连接于平板部，起翘部的第二端朝向对应器件的接地部翘起；
起翘部构成至少部分导电结构，起翘部与对应器件的接地部电连接。
通过在支撑片上位于镂空部两侧的平板部上划槽的方式，形成起翘部，起翘部的第一端一体连接在平板部上，通过折弯的方式，使起翘部的第二端向对应器件的接地部翘起。通过起翘部实现与对应器件的接地部的电连接，起翘部自身的弹性可确保支撑片与对应器件的接地部稳定电连接。
在一种可能的实施方式中，起翘部分布有多个开口。
通过在起翘部上设置多个开口，便于起翘部的折弯，并且，通过该多个开口，可以有效减弱起翘部的热传导作用，对于起翘部通过焊接方式与导电垫片或器件的接地部连接的情况，可以防止焊接过程对屏体造成损伤。
在一种可能的实施方式中，起翘部的弯曲弧度小于90°，导电结构还包括导电垫片，导电垫片连接于起翘部的第二端，且导电垫片伸向起翘部所在的一侧，导电垫片与对应器件的接地部贴合并连接。
当为了保证折叠屏的使用效果而在支撑片上设置较小尺寸的起翘部时，起翘部的弯曲弧度可以控制在小于90度°，起翘部的第二端的端面朝向对应器件的接地部。通过在起翘部的第二端连接导电垫片，使导电垫片伸向起翘部所在的一侧，可保证导电垫片与器件的接地部之间具有足够的接触面积而与器件连接稳定，并且，器件对导电垫片的压力传递至起翘部，使起翘部产生趋向于回复原状的弹性形变，可提升折叠屏在起翘部的强度和平整度，且起翘部产生的弹性力作用于导电垫片，可保证导电垫片与器件连接稳固。
在一种可能的实施方式中，导电垫片包括依次连接的固定段、弯折段及连接段，固定段贴合在起翘部的表面并朝向接地部伸出，弯折段朝向起翘部的第一端所在的一侧弯折，连接段与接地部贴合。
导电垫片通过依次形成固定段、弯折段及连接段，通过固定段贴装在起翘部的第二端并向器件的接地部伸出，通过弯折段由起翘部的第二端向第一端弯折，以使连接段位于起翘部所在的一侧，连接段可与器件的接地部贴合连接。
在一种可能的实施方式中，连接段具有安装孔，安装孔内穿设有锁紧件，导电垫片通过锁紧件与接地部连接。
在一种可能的实施方式中，起翘部的弯曲弧度大于90°且小于180°，起翘部具有贴合段，贴合段由起翘部的第二端覆盖至靠近起翘部的弯曲顶部，贴合段与对应器件的接地部贴合。
通过使起翘部的弯曲弧度大于90°且小于180°，起翘部形成类似“U”型结构，起翘部的第二端和第一端均位于其弯曲顶部的同侧，起翘部由其第二端至靠近其弯曲顶部之间的部位形成贴合段，起翘部依靠自身的弹性力、通过贴合段与对应器件的接地部紧密贴合。
在一种可能的实施方式中，导电结构为导电弹片，导电弹片连接在支撑片与对应器件的接地部之间，且导电弹片处于被压缩的状态。
在一种可能的实施方式中，支撑片的宽度方向的中间区域为镂空部，对应第一器件的接地部的导电结构及对应第二器件的接地部的导电结构分别位于镂空部的两侧。
通过将支撑片的宽度方向的中间区域设置为镂空部，可增强支撑片的弹性形变能力，以免支撑片阻碍折叠屏折叠。并且，通过将对应第一器件的接地部及第二器件的接地部的导电结构，分别设置在支撑片的位于镂空部两侧的实体区域，便于导电结构与支撑片的连接，且能够保证第一器件的接地部及第二器件的接地部与支撑片之间电导通的稳定性。
在一种可能的实施方式中，两侧的导电结构之间围成的区域中，位于镂空部内的区域为第一区域，镂空部中位于第一区域以外的区域为第二区域；
其中，第一区域的镂空面积小于第二区域的镂空面积。
通过将支撑片的镂空部分为第一区域和第二区域，第一区域对应两侧的导电结构围成的区域，并通过减小第一区域的镂空面积，使第一区域的镂空面积小于第二区域的镂空面积，增大第一区域内的过流面积，降低了支撑片的阻抗，有利于提升公共接地结构的接地效果。同时，第二区域维持较大镂空面积，以保证支撑片的可弯折性能。
附图说明
图1为本申请实施例提供的可折叠电子设备处于展开状态时的结构图；
图2为图1所示的可折叠电子设备处于折叠状态时的结构图；
图3为图1所示的可折叠电子设备的壳体组件的结构示意图；
图4为图3所示的壳体组件的部分结构的爆炸图；
图5为本申请实施例提供的可折叠电子设备的公共接地结构的设计结构图；
图6为图5所示的公共接地结构中应用的一种导电结构的示意图；
图7为以导电层作为导电结构的公共接地结构对应图5中A-A处的截面图；
图8a为图5所示的公共接地结构中应用的另一种导电结构的示意图；
图8b为图8a所示的导电结构在支撑片上的另一种布设结构图；
图9为应用图8中的导电结构的公共接地结构对应图5中A-A处的截面图；
图10为图5所示的公共接地结构中应用的第三种导电结构的示意图；
图11为本申请实施例提供的应用另一种支撑片的公共接地结构的结构示意图。
附图标记说明：
1-可折叠电子设备；
100-折叠屏；101-第一部分；102-第二部分；103-可折叠部分；
110-屏体；120-支撑片；
121-镂空部；122-平板部；
1211-第一区域；1212-第二区域；1221-起翘部；1221a-贴合段；
200-壳体组件；
200a-第一壳体；200b-第二壳体；200c-转轴；201-收容槽；
210-中框；220-后盖；
300-器件；301-主板；302-电池；303-扬声器；304-支架；
310-第一器件；320-第二器件；
400-导电结构；
410-导电层；420-导电垫片；
411-导电泡棉；412-导电介质层；421-固定段；422-弯折段；423-连接段；
4231-安装孔；
a-开口；b-锁紧件。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请。
本申请提供一种可折叠电子设备，该可折叠电子设备包括但不限于为手机、平板电脑(tablet personal computer)、膝上型电脑(laptop computer)、笔记本电脑、个人数码助理(personal digital assistant，PDA)、个人计算机、多媒体播放器、电子书阅读器、车载设备或可穿戴设备等可折叠的电子产品。其中，可穿戴设备包括但不限于智能手环、智能手表、智能头戴显示器、智能眼镜等。
图1为本申请实施例提供的可折叠电子设备处于展开状态时的结构图；图2为图1所示的可折叠电子设备处于折叠状态时的结构图。参照图1和图2所示，本实施例以可折叠电子设备1为折叠手机为例，进行说明。对于可折叠电子设备1而言，在不同的使用场景下，可折叠电子设备1可以展开至展开状态(如图1所示)，可折叠电子设备1的展开角度例如为180°，此时，可折叠电子设备1可以实现大屏显示；可折叠电子设备1也可以折叠至折叠状态(如图2所示)，此时，可折叠电子设备1的体积较小，便于携带。并且，根据实际需要，可折叠电子设备1还可以停留在半展开状态(悬停状态)，示例性的，可折叠电子设备1的悬停角度可以为120°。
需要说明的是，本实施例举例说明的角度均允许存在少许偏差。例如，图1所示的可折叠电子设备1的展开角度为180°是指，展开角度可以为180°，也可以为大约180°，比如170°、175°、185°或190°等。后文中举例说明的角度可做相同理解。
参照图1和图2所示，可折叠电子设备1包括折叠屏100和壳体组件200，折叠屏100支撑并连接在壳体组件200的一侧表面。本实施例将折叠屏100的用于显示信息定义为其正面，将折叠屏100的与正面相背的另一侧表面定义为其背面，相应的，将壳体组件200的支撑折叠屏100的一侧表面定义为其正面，将壳体组件200的与其正面相背的另一侧表面定义为其背面。也就是说，折叠屏100的正面暴露在壳体组件200外，用于显示信息并为用户提供交互界面，折叠屏100的背面朝向壳体组件200并连接在壳体组件200的正面，可折叠电子设备1的外观效果主要通过壳体的侧面及背面体现。
本实施例中，折叠屏100可以但不限于为有机发光二极管(organic light-emitting diode，OLED)显示屏，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light-emitting diode，AMOLED)显示屏，迷你发光二极管(mini organic light-emitting diode)显示屏，微型发光二极管(micro organic light-emitting diode)显示屏，微型有机发光二极管(micro organic light-emitting diode)显示屏，或量子点发光二极管(quantum dot light emitting diodes，QLED)显示屏等。
参照图1所示，折叠屏100可以包括第一部分101、第二部分102和可折叠部分103，可折叠部分103位于第一部分101和第二部分102之间。可折叠电子设备1在使用过程中，第一部分101和第二部分102始终保持平面状态，而可折叠部分103可以发生弯折，以改变第一部分101和第二部分102之间的夹角。示例性的，折叠屏100中，至少可折叠部分103采用柔 性材料制作，第一部分101和第二部分102可以采用柔性材料制作，也可以采用刚性材料制作，还可以部分采用刚性材料、部分采用柔性材料制作，本实施例对此不作限制。
在壳体组件200的带动下，折叠屏100能够在展开状态与折叠状态之间切换。参照图1所示，当折叠屏100处于展开状态时，第一部分101和第二部分102处于相对远离的展开状态，可折叠部分103处于不发生弯折的展平状态，第一部分101、第二部分102和第三部分朝向相同，处于共平面的状态。此时，第一部分101和第二部分102之间的夹角为180°，折叠屏100能够实现大屏显示，可以给用于提供更丰富的信息，带给用户更好的使用体验。
参照图2所示，当折叠屏100处于折叠状态时，第一部分(图中未示出)与第二部分(图中未示出)相对层叠，可折叠部分103处于折弯状态，可折叠部分103例如可以呈水滴形。此时，折叠屏100对用户不可见，壳体组件200保护在折叠屏100外，可以防止折叠屏100被硬物刮伤，此种可折叠电子设备1为内折式电子设备。
当然，在其他示例中，可折叠电子设备1还可以是外折式电子设备，处于折叠状态时，折叠屏100的第一部分101和第二部分102相背，壳体组件200位于第一部分101和第二部分102之间。可以理解的是，无论是内折式电子设备还是外折式电子设备，可折叠电子设备1处于折叠状态时，体积较小，便于携带和收纳。
另外，折叠屏100除了能够处于展开状态和折叠状态之外，折叠屏100还可以停留在展开状态和折叠状态之间，例如，折叠屏100可以停留在半展开状态(悬停状态)。此时，折叠屏100的可折叠部分103也处于折弯状态，并且，折弯程度小于处于折叠状态时的折弯程度，折叠屏100的第一部分101和第二部分102之间的夹角例如为120°。
壳体组件200用于支撑和固定折叠屏100，并带动折叠屏100在展开状态与折叠状态之间切换。图3为图1所示的可折叠电子设备的壳体组件的结构示意图。参照图3所示，壳体组件200包括第一壳体200a、第二壳体200b和转轴200c，转轴200c连接在第一壳体200a和第二壳体200b之间，第一壳体200a和第二壳体200b通过转轴200c实现可转动连接，从而，实现第一壳体200a和第二壳体200b之间的相对转动。结合图1和图2所示，第一壳体200a支撑折叠屏100的第一部分101，第二壳体200b支撑折叠屏100的第二部分102，换言之，折叠屏100的第一部分101连接于第一壳体200a，折叠屏100的第二部分102连接于第二壳体200b，折叠屏100的可折叠部分103对应转轴200c设置，可折叠部分103例如可以和转轴200c固定连接。
通过转轴200c带动第一壳体200a和第二壳体200b相对转动，使得可折叠电子设备1在展开状态与折叠状态之间切换。其中，第一壳体200a和第二壳体200b可向相互远离的方向转动，展开至两者共面，此时，壳体组件200处于展开状态，折叠屏100随壳体组件200的展开而处于展开状态，如图1所示；第一壳体200a和第二壳体200b也可以向相互靠近的方向转动，折叠至两者相对层叠，此时，壳体组件200处于折叠状态，折叠屏100随壳体组件200的折叠而处于折叠状态；或者，第一壳体200a和第二壳体200b也可以相对转动至两者停留在展开状态与折叠状态之间的半展开状态(悬停状态)，此时，第一壳体200a与第二壳体200b之间的夹角例如为120°，折叠屏100随壳体组件200处于悬停状态，折叠屏100的第一部分101和第二部分102之间的夹角例如为120°。
其中，参照图3所示，第一壳体200a用于支撑并固定图1中折叠屏100的第一部分101，示例性的，第一壳体200a具有支撑面M1，折叠屏100的第一部分101贴装在第一壳体200a 的支撑面M1上，第一壳体200a通过支撑面M1支撑并固定折叠屏100的第一部分101，支撑面M1与第一部分101之间的连接关系包括但不限于胶粘。类似的，第二壳体200b用于支撑并固定图1中折叠屏100的第二部分102，示例性的，第二壳体200b具有支撑面M2，折叠屏100的第二部分102贴装在第二壳体200b的支撑面M2上，第二壳体200b通过支撑面M2支撑并固定折叠屏100的第二部分102，支撑面M2与第二部分102的连接关系包括但不限于胶粘。
示例性的，第一壳体200a和第二壳体200b的结构可以相同，并且，第一壳体200a和第二壳体200b以转轴200c的中心线为对称轴而镜像对称。另外，第一壳体200a和第二壳体200b的朝向对方的一侧均可以设有收容槽201，收容槽201的开口a例如位于第一壳体200a(第二壳体200b)朝向折叠屏100的一侧表面，收容槽201自该侧表面向后盖220凹陷，转轴200c的两侧分别伸入第一壳体200a的收容槽201和第二壳体200b的收容槽201内，且转轴200c的两侧可以分别和第一壳体200a及第二壳体200b固定连接，以通过转轴200c带动第一壳体200a和第二壳体200b相对转动。
图4为图3所示的壳体组件的部分结构的爆炸图。参照图4所示，图中示出了壳体组件200的第一壳体200a或第二壳体200b的分解结构，第一壳体200a和第二壳体200b均可以包括中框210和后盖220，中框210连接在折叠屏100和后盖220之间，中框210朝向折叠屏100的一侧表面形成上述支撑面M1(支撑面M2)，中框210的该侧表面用来支撑和固定折叠屏100，后盖220连接在中框210背离折叠屏100的一侧表面。中框210和后盖220之间围合形成安装空间，安装空间内用于容纳可折叠电子设备1的一些器件300，例如，图中示出了安装空间内设置有主板301、电池302和扬声器303模组，当然，安装空间内设置的器件300可以不仅限于图中示出的器件300，还可以包括摄像模组、麦克风等其他图中未示出的器件300。
在实际应用中，第一壳体200a内和第二壳体200b内设置的器件300的种类、数量及布局结构通常不相同。示例性的，第一壳体200a内和第二壳体200b内可以均设置有电路板，第一壳体200a(第二壳体200b)内的电路板的数量可以为一个或两个以上，其中，第一壳体200a(第二壳体200b)内设置的电路板中包括起到核心控制作用的主板301，主板301的基材例如为印制电路板(Printed Circuit Board，PCB)，第一壳体200a内的主板301和第二壳体200b内的主板301中的一者为控制整机的核心电路板，该核心电路板上通常集成有中央处理器(central processing unit，CPU)。第一壳体200a内和第二壳体200b内还可以设置有电池302，电池302与电路板电连接，电池302通过电路板向折叠屏100和扬声器303等提供电量。至于扬声器303模组、摄像模组和麦克风等其他器件300，可以集中设置在第一壳体200a中，或集中设置在第二壳体200b中，或者部分器件300设置在第一壳体200a中、部分器件300设置在第二壳体200b中。
另外，第一壳体200a和第二壳体200b内的器件300之间通常电连接在一起，例如，可以通过设置穿过转轴200c的柔性电路板，柔性电路板的一端与第一壳体200a内的主板301连接，柔性电路板的另一端与第二壳体200b内的主板301连接，通过电连接第一壳体200a内的主板301和第二壳体200b内的主板301，将第一壳体200a内的器件300和第二壳体200b内的器件300电连接在一起。
并且，第一壳体200a内的器件300与第二壳体200b内的器件300通常需要进行公共接地设计，公共接地，顾名思义，即是使第一壳体200a内的器件300和第二壳体200b内的器件300具有公共的接地端(简称公共端)，公共端例如为电池302的负极，如此，第一壳体200a和 第二壳体200b内的所有器件300(的电压)均以公共端(零电位)作为参考，以保障各器件300的正常工作状态，避免器件300受到干扰。
相关技术中，穿过转轴200c的柔性电路板在用于连接第一壳体200a内的主板301和第二壳体200b内的主板301的基础上，也可以利用该柔性电路板实现第一壳体200a内的器件300和第二壳体200b内的器件300的公共接地。例如，可以通过该柔性电路板中的一部分作为接地线路，接地线路的接地阻抗需要做的非常小，以此连接第一壳体200a内的主板301和第二壳体200b内的主板301，使两者的公共接地部分保持微小电阻；或者，也可以通过柔性电路板整体实现接地，此时，可以通过在柔性电路板的两侧表面设置阻抗较小的接地层(例如为金属层)，通过接地层连接第一壳体200a内的主板301和第二壳体200b内的主板301，减小两者的公共接地部分的电阻。
应说明，若柔性电路板用来作为接地线路的部分阻抗高，相当于第一壳体200a内的主板301和第二壳体200b内的主板301之间实际上没有公共接地，因为接地线路阻抗较高，在第一壳体200a内的主板301和第二壳体200b内的主板301之间传输电流时，会出现压降。以第一壳体200a内的主板301为例，第一壳体200a内的主板301将电压V通过柔性电路板向第二壳体200b内的主板301传输，由于柔性电路板上作为接地线路的部分阻抗较高，在接地线路上出现压降，会导致第二壳体200b内的主板301收到的电压实际上小于V，例如，第二壳体200b内的主板301收到的电压为V-δV。如此，会影响可折叠电子设备1工作的稳定性，有可能造成无法收发高电平的现象。
而为了减小柔性电路板中作为接地线路的部分的阻抗，在第一壳体200a内的主板301和第二壳体200b内的主板301之间的间距一定的情况下，柔性电路板的长度一定，相关技术中，通常是通过增大柔性电路板的宽度，来减小柔性电路板中接地线路部分的阻抗。然而，对于穿过转轴200c的柔性电路板，转轴200c为柔性电路板预留的空间有限，为了增大柔性电路板的宽度，就必须压缩转轴200c与第一壳体200a(第二壳体200b)的连接部分的空间，这会影响转轴200c的可靠性，导致转轴200c难以稳定带动第一壳体200a(第二壳体200b)转动、难以稳定支撑壳体组件200的悬停状态等问题。
另外，对于连接在第一壳体200a和第二壳体200b之间的转轴200c，转轴200c为运动结构，转轴200c通常包括基础支撑部分和活动连接在基础支撑部分两侧的转接部分，两侧的转接部分分别与第一壳体200a和第二壳体200b连接，随着第一壳体200a和第二壳体200b之间的相对转动，两侧的转接部分与基础支撑之间的转动角度、距离均会产生变化。因此，受可折叠电子设备1的转动状态、环境温度、外力积压等因素影响，转轴200c自身的接触阻抗处于不稳定的状态，无法作为公共接地结构，来稳定的实现第一壳体200a内的器件和第二壳体200b内的器件的公共接地。
有鉴于此，本申请实施例对第一壳体200a内的器件300和第二壳体200b内的器件300之间的公共接地结构进行改进，利用折叠屏100自身的导电的支撑片120作为接地线路，将第一壳体200a内的第一器件310通过导电结构400与支撑片120连接，将第二壳体200b内的第二器件320也通过导电结构400与支撑片120连接，由于支撑片120固定连接在折叠屏100对应转轴200c的部分，因而，可以通过导电结构400实现与第一器件310及第二器件320的稳定连接，并且，利用支撑片120自身的低阻抗特性，可以实现第一器件310和第二器件320之间良好的公共接地，进而，保障第一壳体200a内的器件300和第二壳体200b内的器件300稳定、 可靠运行。
以下对本实施例的可折叠电子设备1中，第一壳体200a内的器件300和第二壳体200b内的器件300之间的公共接地结构，进行详细说明。
图5为本申请实施例提供的可折叠电子设备的公共接地结构的设计结构图。参照图5所示，为便于示出第一壳体200a内的器件300和第二壳体200b内的器件300的公共接地结构，仅示意出了第一壳体200a以及位于第一壳体200a内的第一器件310、第二壳体200b以及位于第二壳体200b内的第二器件320，并且，图中未示出折叠屏100整体，而仅示出了折叠屏100中的支撑片120。
参照图5所示，第一器件310的接地部和支撑片120之间连接有导电结构400，第二器件320的接地部和支撑片120之间连接有导电结构400，利用支撑片120作为第一器件310和第二器件320的公共接地端，实现第一器件310和第二器件320的公共接地，进而，实现第一壳体200a内的器件300和第二壳体200b内的器件300之间的公共接地。
需要说明的是，第一壳体200a内设置的器件300不仅包括第一器件310，还可以包括其他器件300，第一器件310和第一壳体200a内的其他器件300之间相互电连接；同样的，第二壳体200b内设置的器件300不仅包括第二器件320，还可以包括其他器件300，第二器件320和第二壳体200b内的其他器件300之间相互电连接。例如，第一壳体200a内可以设置有主板301、其他电路板、电池302等器件300，第二壳体200b内可以设置有主板301、其他电路板、电池302等器件300，对于如前所述的扬声器303模组、摄像模组、麦克风等其他器件300，这些器件300可以均位于第一壳体200a内，或者均位于第二壳体200b内，或者，部分位于第一壳体200a内、部分位于第二壳体200b内。
作为一种示例，第一器件310可以为第一壳体200a内的主板301，第二器件320可以为第二壳体200b内的主板301，第一壳体200a内的主板301及第二壳体200b内的主板301均通过导电结构400与支撑片120连接，实现第一壳体200a内的器件300与第二壳体200b内的器件300之间的公共接地。作为另一种示例，也可以将第一壳体200a内的电池302作为第一器件310，将第二壳体200b内的电池302作为第二器件320，第一壳体200a内的电池302及第二壳体200b内的电池302均通过导电结构400与支撑片120连接，实现第一壳体200a内的器件300与第二壳体200b内的器件300之间的公共接地。
当然，在其他示例中，第一器件310也可以为第一壳体200a内设置的其他器件300，第二器件320也可以为第二壳体200b内设置的其他器件300，本实施例对此不作限制。例如，当仅第一壳体200a内设置有主板301时，第一器件310可以为主板301，而第二器件320可以为第二壳体200b内设置的电池302。
其中，以主板301作为与支撑片120连接的接地结构时，主板301的接地部可以为主板301上设置的接地层(例如为金属层)；以电池302作为与支撑片120连接的接地结构时，电池302的接地部可以为电池302的负极。以下均以第一器件310为第一壳体200a内的主板301、第二器件320为第二壳体200b内的主板301为例，进行说明。
另外，结合图1所示，需要说明的是，本实施例的折叠屏100可以由屏体110(图1中未示出)和支撑片120(图1中未示出)共同构成，屏体110为折叠屏100的主要结构，支撑片120通常固定连接在屏体110的朝向壳体组件200的一侧表面，并且，支撑片120位于屏体110的对应转轴200c的部位，支撑片120为具有弹性的片状结构，例如，支撑片120可以为金属 片。壳体组件200带动屏体110折叠和展开的过程中，支撑片120随屏体110的可折叠部分103同步折弯和展平，支撑片120可以增强屏体110的可折叠部分103的强度和稳定性。例如，在折叠屏100处于展开状态时，通过支撑片120的支撑作用，可以提升折叠屏100的平整度；在折叠屏100处于折叠状态时，同样通过支撑片120的支撑作用，可以保证折叠屏100的可折叠部分103稳定的呈水滴形，避免可折叠部分103产生折痕。
示例性的，可以在屏体110的可折叠部分103开设安装槽，安装槽的槽口朝向壳体组件200，将支撑片120通过粘接等方式连接在安装槽内，支撑片120的表面可以与屏体110的表面平齐。
由于支撑片120固定连接在屏体110上，且支撑片120为整体式结构，即使可折叠电子设备1在展开状态和折叠状态之间切换，支撑片120随屏体110在折弯与展平状态之间切换，支撑片120的面积也不发生改变，支撑片120能够维持固定的阻抗。并且，支撑片120通常采用导电性能良好的材质制作而成，例如，支撑片120采用钛合金或铜合金等材料制成，支撑片120的阻抗很小。如此，将第一壳体200a内的第一器件310与第二壳体200b内的第二器件320通过支撑片120进行公共接地，通过支撑片120提供固定且微小的阻抗，能够保证第一壳体200a内的器件300和第二壳体200b内的器件300的接地效果。
继续参照图5所示，支撑片120沿转轴200c的长度方向延长，且为了便于和第一壳体200a内的第一器件310及第二壳体200b内的第二器件320连接，支撑片120的宽度方向的两侧可以伸出至转轴200c的两侧之外，换言之，支撑片120的宽度可以大于转轴200c的宽度，支撑片120在宽度方向上伸出至转轴200c的两侧，支撑片120的宽度方向的两侧可以分别支撑在第一壳体200a及第二壳体200b上。其中，支撑片120的一侧与第一器件310的接地部之间，在第一壳体200a的平面方向具有重叠区域，即，支撑片120在第一壳体200a上的正投影与第一器件310的接地部具有重叠区域，连接在第一器件310的接地部及支撑片120之间的导电结构400位于两者的重叠区域内；同样的，支撑片120的另一侧与第二器件320的接地部之间，在第二壳体200b的平面方向也具有重叠区域，即，支撑片120在第二壳体200b上的正投影与第二器件320的接地部具有重叠区域，连接在第二器件320的接地部及支撑片120之间的导电结构400位于两者的重叠区域内。
也就是说，位于第一壳体200a内的第一器件310的接地部与支撑片120之间具有重叠区域，且第一器件310的接地部与支撑片120之间具有间隙，相应的导电结构400位于该间隙内并连接第一器件310的接地部与支撑片120；位于第二壳体200b内的第二器件320的接地部与支撑片120之间具有重叠区域，且第二器件320的接地部与支撑片120之间具有间隙，相应的导电结构400位于该间隙内并连接第二器件320的接地部与支撑片120。以第一器件310为第一壳体200a内的主板301为例，第一壳体200a内的主板301的接地部可以为主板301朝向支撑片120的一侧设置的接地层；同样的，以第二器件320为第二壳体200b内的主板301为例，第二壳体200b内的主板301的接地部也可以为主板301朝向支撑片120的一侧设置的接地层。
另外，参照图5所示，支撑片120的宽度方向的中间区域通常为镂空部121，镂空部121与转轴200c对应，换言之，镂空部121对应位于折叠屏100的可折叠部分103。镂空部121内分布有多个开口a，图中以开口a为沿支撑片120的长度方向延长的条形开口为例，条形开口在支撑片120的宽度方向上前后错开设置，条形开口可以包括完全位于支撑片120内的封闭 形的条形孔和与支撑片120的侧边连通的条形凹口。
通过使支撑片120的宽度方向的中间区域形成镂空部121，有助于减弱支撑片120的刚性，增强支撑片120的弹性形变能力，以免支撑片120阻碍折叠屏100折叠。其中，通过设置沿支撑片120的长度方向延长的条形开口，条形开口的延长方向垂直于支撑片120的折弯方向(宽度方向)，更有利于支撑片120的折弯。当然，在其他示例中，支撑片120的镂空部121内设置的条形开口也可以沿其他方向延长，或者，镂空部121内的开口a也可以为条形开口之外的其他形状，镂空部121内可以具有单一形状尺寸的开口a，也可以具有不同形状尺寸的开口a，本实施例对此不作具体限制。
其中，支撑片120与第一器件310的接地部及第二器件320的接地部重叠的两侧区域，可以为未设开口a的实体平板区域，本实施例将支撑片120上位于镂空部121两侧的部分定义为平板部122，在支撑片120随屏体110折弯和展平的过程中，平板部122仅有角度上的转动，其平板状的形态不发生改变。也就是说，第一器件310的接地部及第二器件320的接地部分别与支撑片120的镂空部121两侧的平板部122对应。如此，便于在支撑片120的两侧的平板部122上连接导电结构400，有助于实现第一器件310的接地部与支撑片120之间及第二器件320的接地部与支撑片120之间的稳定电连接。
图6为图5所示的公共接地结构中应用的一种导电结构的示意图。参照图6所示，作为一种实施方式，连接在支撑片120和对应器件300的接地部之间的导电结构400可以为导电层410，也就是说，连接在第一器件310的接地部和支撑片120的相应侧之间的导电结构400为导电层410，连接在第二器件320的接地部和支撑片120的相应侧之间的导电结构400也为导电层410。导电层410的两侧表面分别与对应器件300的接地部及支撑片120贴合，例如，导电层410的两侧表面可以分别与支撑片120及对应器件300的接地部粘接，通过导电层410实现支撑片120与对应器件300的接地部之间的电导通。
其中，导电层410可以设计为长条状结构，长条状的导电层410在其长度方向上具有足够的尺寸，可以保证导电层410与支撑片120之间(与对应器件300的接地部之间)具有足够的接触面积，保证导电层410稳定且牢固的连接在支撑片120与对应器件300的接地部之间。并且，长条状的导电层410在其宽度方向上的尺寸很小，可以通过对导电层410的摆放方向进行设计，避免支撑片120在长期反复的折弯与展平之间切换的过程中，影响导电层410连接的可靠性。
示例性的，长条状的导电层410的长度方向可以对应支撑片120的长度方向，换言之，长条状的导电层410可以沿支撑片120的长度方向延长。支撑片120对应折叠屏100的可折叠部分103的是位于其宽度方向的中间区域的镂空部121，而导电层410连接在支撑片120的宽度方向上靠近边缘的区域，通过使导电层410沿支撑片120的长度方向延长，整个导电层410所在的区域均位于支撑片120不会发生折弯的平板部122上，可保证导电层410与支撑片120(对应器件300)连接的可靠性，保证导电层410连接的可靠性。
并且，对于电流在公共接地结构中的流动，要么是电流从第一壳体200a内的第一器件310经该侧的导电层410流动至支撑片120，再从支撑片120经第二壳体200b所在侧的导电层410，流动至第二器件320；要么是电流从第二壳体200b内的第二器件320经该侧的导电层410流动至支撑片120，再从支撑片120经第一壳体200a所在侧的导电层410，流动至第一器件310。也就是说，电流都是经支撑片120在第一器件310和第二器件320之间流动，其间， 电流的大致流向是沿支撑片120的宽度方向。
在支撑片120自身的低阻抗性能的基础上，通过沿支撑片120的长度方向布设导电层410，导电层410的长度方向垂直于电流流过的方向，导电层410的过流面积(电流流过的面积)较大，可以减小导电层410与对应器件300的接地部(支撑片120)之间的接触阻抗，提升公共接地结构的接地效果。
在其他示例中，在确保导电层410整体均连接在支撑片120不发生折弯的平板部122所在区域内，保证了导电层410的可靠性的基础上，导电层410也可以以倾斜于支撑片120的长度方向的方向延伸，换言之，导电层410的长度方向与支撑片120的长度方向之间具有夹角，夹角例如在0°～40°之间的范围内，本实施例对此不作限制。
对于导电层410沿支撑片120的长度方向延长的情况，为了便于连接导电层410，可以将导电层410对应支撑片120的边缘设置，如此，沿着支撑片120的边缘布设导电层410，可确保导电层410的长度方向即为支撑片120的长度方向，可提高导电层410的连接效率。并且，对于不发生形变(折弯)的平板部122的宽度有限的支撑片120，通过沿着支撑片120的边缘设置导电层410，导电层410的宽度方向由支撑片120的边缘向支撑片120的中心延伸，可以增大导电层410的宽度，进而，降低导电层410与支撑片120(对应器件300)之间的接触电阻，提升公共接地结构的接地效果。
另外，在导电层410沿支撑片120的长度方向(或趋近于支撑片120的长度方向)延长的基础上，导电层410可以从对应器件300的接地部的一端延伸至另一端，即，导电层410覆盖对应器件300在支撑片120的长度方向上的所有区域，此时，对应于对应器件300的接地部，在导电层410的宽度保持不变的基础上，导电层410的过流面积达到最大化，导电层410与对应器件300的接地部(支撑片120)之间的接触阻抗最小。
示例性的，在支撑片120的长度方向上，对于第一器件310的接地部和支撑片120之间的重叠长度与第二器件320的接地部和支撑片120之间的重叠长度相同的情况，对应第一器件310的导电层410和对应第二器件320的导电层410均可以延长至对应器件300的两端；对于第一器件310的接地部和支撑片120之间的重叠长度与第二器件320的接地部和支撑片120之间的重叠长度不相同的情况，第一器件310的接地部和第二器件320的接地部中与支撑片120的重叠长度较短的一者，与其连接的导电层410可以延长至其两端，另一者上连接的导电层410的长度可以据此合理设计。
在实际应用中，可以通过对第一壳体200a内的器件300和第二壳体200b内的器件300进行合理布局设计，使第一器件310和第二器件320尽可能的相对设置在转轴200c的两侧，这样，在沿支撑片120的长度方向(或趋近于支撑片120的长度方向)设置导电层410的基础上，与第一器件310连接的导电层410和与第二器件320连接的导电层410还可以相对设置在转轴200c的两侧，导电层410不仅具有较大的过流面积，并且，两侧的导电层410之间的电流路径较短，可有效降低公共接地结构的阻抗。
即使受限于第一器件310和第二器件320的布局结构，使得两侧的导电层410无法完全相对设置，也可以尽量减小两侧的导电层410的错开距离，增大两侧的导电层410在支撑片120的长度方向上的重叠长度，缩短两侧的导电层410之间的电流路径，以降低公共接地结构的阻抗。
图7为以导电层作为导电结构的公共接地结构对应图5中A-A处的截面图。参照图7所示， 至于导电层410的具体结构形式，在一些实施例中，导电层410的主体结构可以为导电泡棉411，导电泡棉411的基体材料主要为聚乙烯或改性聚乙烯，基体材料中还混合有导电填料和抗静电剂，使得导电泡棉411具有良好的导电性能。并且，导电泡棉411在疏松多孔的基体中填充了填料，其弹性好、回弹快，设置好导电层410之后，导电泡棉411被挤压在支撑片120与对应器件300之间，导电泡棉411与支撑片120及对应器件300接触紧密，可确保稳定导通支撑片120与对应器件300。
并且，为了增强导电泡棉411的导电性能，在导电泡棉411的外表面还设置有导电介质层412，导电泡棉411和导电介质层412共同构成导电层410，导电介质层412例如为金层或铜层，导电介质层412增强了导电泡棉411的表面导电性。其中，导电介质层412至少覆盖在导电泡棉411朝向支撑片120的一侧表面及导电泡棉411朝向对应器件300的接地部的一侧表面，即，导电泡棉411通过外层的导电介质层412与支撑片120及对应器件300的接地部接触，如此，通过导电层410使得支撑片120与对应器件300之间具有良好的电导通性能。
示例性的，导电介质层412通常为导电泡棉411外设置的导电布，导电布例如可以通过导电胶粘接在导电泡棉411表面，导电布的表面镀金或铜等导电材料。其中，可以仅在导电泡棉411对应支撑片120和器件300的两侧表面贴设导电布，或者，如图7中所示，可以在导电泡棉411的外表面全方位包裹导电布。
在另一些实施方式中，设置在在支撑片120和对应器件300的接地部之间的导电层410还可以为导电胶层，导电胶层依靠自身的粘性，无须借助其他粘接材料，可直接将支撑片120和对应器件300粘接在一起。并且，导电胶层在胶粘剂中分布有许多导电粒子，导电胶固化或干燥后，导电粒子相互接触，形成到店通力，使得导电胶具备良好的导电性能，能够实现支撑片120与对应器件300之间的稳定电导通。
另外，图7中示出了第一壳体200a内的主板301和第二壳体200b内的主板301均通过支架304安装在相应侧的后盖220上的情况，应理解，除了依靠支架304固定的方式外，主板301还可以通过螺钉、螺栓等锁紧件锁固在中框210或后盖220上，或者，主板301还可以通过胶粘、焊接等方式连接在中框210或后盖220上。
图8a为图5所示的公共接地结构中应用的另一种导电结构的示意图。图8b为图8a所示的导电结构在支撑片上的另一种布设结构图。参照图8a和图8b所示，除了在支撑片120与对应器件300的接地部之间贴设导电层410之外，作为另一种实施方式，还可以利用支撑片120自身来形成导电结构400。
其中，可以在支撑片120上位于镂空部121两侧的平板部122，且与对应器件300的接地部相重叠的区域内，形成朝向对应器件300的接地部翘起的起翘部1221，通过起翘部1221实现与对应器件300的接地部之间的电连接。
具体的，可以通过在平板部122上划切开槽的方式形成起翘部1221，开槽的区域位于对应器件300的接地部所对应的区域内，并且划切的槽周向延伸不到一周，使得位于开槽区域内的材料形成一端仍连接在平板部122上、而其余部位与平板部122分离的结构。并且，利用与平板部122完全分离的一端，将开槽区域内的结构向对应器件300的方向弯折，从而，形成第一端一体连接在平板部122、与第一端相对的第二端向对应器件300的接地部翘起的起翘部1221。
通过支撑片120自身形成向对应器件300的接地部翘起的起翘部1221，利用起翘部1221 与对应器件300的接地部电连接，起翘部1221向对应器件300弯折而呈现翘起的状态，这也使得起翘部1221具有较好的弹性，依靠起翘部1221的弹性，可以确保支撑片120与对应器件300的接地部电连接良好、稳定。
其中，参照图8a所示，在一些示例中，起翘部1221可以设置在支撑片120的平板部122上的中间区域，换言之，可以通过在平板部122的中间区域划切开槽以形成起翘部1221，如此，位于两侧的平板部122的起翘部1221之间的距离较短，通过两侧的起翘部1221相连接的第一器件310的接地部与第二器件320的接地部之间的电流路径较短，可以减小第一器件310和第二器件320的公共接地阻抗。
参照图8b所示，在另一些示例中，起翘部1221也可以设置在支撑片120的平板部122的边缘区域，如此，可以由平板部122的边缘向内划切开槽形成起翘部1221，形成的起翘部122由平板部122靠近边缘的部位伸向对应器件300的接地部。此时，可以将起翘部1221设置在平板部122的对应转轴的长度方向的上侧边缘或下侧边缘，起翘部1221可以位于平板部122的上侧边缘或下侧边缘的中间区域，这样，两侧的起翘部1221之间的距离也较短，可以减小第一器件310和第二器件320的公共接地阻抗。当然，在满足公共接地阻抗要求的基础上，两侧的平板部122的起翘部1221中的至少一者可以设置在支撑片120的一侧长边上。
参照图8a或图8b所示，作为一种实施方式，可以控制起翘部1221的维持较小尺寸，换言之，平板部122上划切的槽仅占据微小区域，以免影响折叠屏100在开槽区域内的强度和平整度，确保折叠屏100的使用性能。在此情况下，对于尺寸微小的起翘部1221，起翘部1221的弯曲弧度可以小于90°，起翘部1221主要依靠其第二端的端面朝向对应器件300的接地部，起翘部1221与对应器件300的接地部之间没有足够的接触面积以保证与器件300稳定连接。此时，可以在起翘部1221的第二端连接导电垫片420，通过导电垫片420与器件300的接地部连接，以实现起翘部1221与器件300的接地部之间的电连接。图9为应用图8中的导电结构的公共接地结构对应图5中A-A处的截面图。结合图8和图9所示，导电垫片420可以伸向起翘部1221所在的一侧，一方面，导电垫片420与对应器件300的接地部之间具有较大的接触面积，可以保证导电垫片420与对应器件300连接稳定，另一方面，器件300的接地部对导电垫片420的压力作用于起翘部1221，可以使起翘部1221的第二端产生朝向支撑片120的平板部122移动，起翘部1221产生由原来的翘起的状态转变为趋向展平状态的弹性形变，使得起翘部1221趋向于回复原状，起翘部1221与屏体110之间的接触面积增大，可提升折叠屏100在该区域的强度和平整度，并且，该弹性形变所产生的弹性力作用于导电垫片420，可使得导电垫片420与对应器件300的接地部接触紧密。
示例性的，导电垫片420可以包括依次连接的固定段421、弯折段422及连接段423，导电垫片420可以为一体成型件，固定段421、弯折段422及连接段423分别对应导电垫片420依次形成的各部位。其中，固定段421连接在起翘部1221的第二端，固定段421例如可以通过焊接或导电胶粘接等方式贴合在起翘部1221的表面，固定段421朝向接地部伸出，弯折段422由起翘部1221的第二端朝向起翘部1221的第一端弯折，以使连接段423位于起翘部1221所在的一侧，且连接段423可贴合在对应器件300的接地部的表面，以实现导电垫片420与对应器件300的接地部的连接。
至于导电垫片420与器件300的接地部的连接，参照图8所示，可以将导电垫片420的与器件300的接地部贴合的连接段423设置为环状结构，环状的连接段423相当于在连接段423 的中心区域形成安装孔4231，参照图9所示，通过在安装孔4231内穿设锁紧件b，锁紧件b例如为螺钉、螺栓或铆钉等，锁紧件b穿过器件300(例如主板301)的至少部分厚度，以通过锁紧件b将导电垫片420锁固在器件300上。或者，在其他示例中，也可以通过将导电垫片420的连接段423朝向器件300的接地部的一侧表面焊接或通过导电胶粘接在器件300表面。
图10为图5所示的公共接地结构中应用的第三种导电结构的示意图。参照图10所示，在折叠屏100在开槽区域的强度和平整度得以保障的前提下，也可以略微增大支撑片120的平板部122上划切的槽围成的区域，以略微增大形成的起翘部1221的尺寸。对于尺寸略微增大的起翘部1221，可以相应增大起翘部1221的折弯程度，此时，起翘部1221的弯曲弧度可以大于90°且小于180°，例如，起翘部1221的弯曲弧度可以为120°、130°、140°、150°等。
通过使起翘部1221的弯曲弧度大于90°且小于180°，起翘部1221形成类似“U”型结构，起翘部1221具有弯曲顶部，起翘部1221的第二端和第一端均位于弯曲顶部的同侧，起翘部1221由其第二端至靠近其弯曲顶部之间的部位形成贴合段1221a，起翘部1221可以依靠其自身形成的贴合段1221a与对应器件300的接地部贴合，而无须额外增设导电件(例如导电垫片420)来与器件300连接。起翘部1221的位于其弯曲顶部两侧的部位形成相对设置的弹性臂，依靠弹性臂的弹性力，可保证起翘部1221与器件300的接地部贴合紧密。
其中，贴合段1221a与器件300的接地部之间可以通过焊接或导电胶粘接的方式连接，或者，与前述导电垫片420的连接方式类似的，贴合段1221a可以通过螺钉、螺栓或铆钉等连接件锁固在器件300上，此处不再赘述。
与图8a及图8b中示出的起翘部1221的位置设置方式类似的，对于弯曲弧度大于90°且小于180°的起翘部1221，起翘部1221可以设置在平板部122的中间区域，或者，起翘部1221也可以设置在平板部122的边缘区域，此处不再赘述。
在其他示例中，起翘部1221与对应器件300的接地部之间还可以通过其他连接结构连接，例如，起翘部1221与对应器件300的接地部可以卡接在一起，可以在起翘部1221上一体成型卡扣部或连接单独的卡扣部，在对应器件300的接地部上开设卡槽，卡扣部卡入卡槽内，实现起翘部1221与对应器件300的接地部之间的电连接。
请一并参照图8和图10，无论是起翘部1221的弯曲弧度小于90°，还是起翘部1221的弯曲弧度大于90°且小于180°，起翘部1221上均可以分布有多个开口a，类似于支撑片120的镂空部121，如此，便于起翘部1221的折弯，有利于形成朝向器件300的接地部翘起的起翘部1221。并且，该多个开口a相当于在起翘部1221形成多个空气介质层，可以有效减弱起翘部1221的热传导作用，对于起翘部1221通过焊接方式与导电垫片420或器件300的接地部连接的情况，防止焊接过程对屏体110造成损伤。其中，对于弯曲弧度大于90°且小于180°的起翘部1221，起翘部1221的贴合段1221a可以不设置开口a，以保证贴合段1221a与对应器件300的接地部之间的接触面积，确保贴合段1221a与器件300的接地部连接稳定。
在其他实施方式中，导电结构400例如还可以为设置在支撑片120与对应器件300的接地部之间的导电弹片，导电弹片的一侧与支撑片120贴合，导电弹片的另一侧与对应器件300的接地部贴合，以通过导电弹片实现支撑片120与对应器件300的接地部之间的电连接。位于支撑片120与器件300的接地部之间的导电弹片处于被压缩的状态，导电弹片产生的弹 性力，可以使其两侧分别紧贴支撑片120及对应器件300的接地部，保证支撑片120与对应器件300的接地部稳定电导通。
示例性的，导电弹片可以设置为与图10中的起翘部1221类似的“U”型结构，或者，导电弹片也可以设置为类似“S”型结构、框型结构等不同形式，本实施例对此不作限制。
另外，还可以通过对支撑片120自身进行改进，以减小其阻抗。图11为本申请实施例提供的应用另一种支撑片的公共接地结构的结构示意图。参照图11所示，本实施例将支撑片120的镂空部121中，位于两侧的导电结构400之间围成的区域定义为第一区域1211，镂空部121中位于第一区域1211以外的区域为第二区域1212。其中，两侧的导电结构400之间围成的区域，即为两侧的导电结构400的相对侧的边缘之间的连线围成的区域，以两侧的导电结构400相对设置为例，两侧的导电结构400围成的区域即为两侧的导电结构400的相对端之间的连线与各自的侧边之间共同围成的矩形区域。
其中，可以对镂空部121的第一区域1211内的开口a(例如条形孔)的尺寸进行设计，减小开口a的尺寸，减小第一区域1211内的开口a的覆盖面积，换言之，减小第一区域1211的镂空面积，使第一区域1211的镂空面积小于第二区域1212的镂空面积。由于电流主要在支撑片120中对应两侧的导电结构400围成的区域内流动，因此，通过减小第一区域1211内的镂空面积，增大了第一区域1211内的过流面积，增大了电流流过第一区域1211的密度，降低了支撑片120的阻抗，有利于提升公共接地结构的接地效果。
同时，第二区域1212内的开口a仍然保持较大尺寸，使第二区域1212维持较大镂空面积，以保证支撑片120的可弯折性能，确保支撑片120在起到提升折叠屏100在可折叠部分103的强度的基础上，支撑片120不会影响可折叠部分103的弯折与展平。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。

Claims (20)

  1. 一种可折叠电子设备，其特征在于，包括：第一壳体、第二壳体、转轴和折叠屏，所述转轴连接在所述第一壳体和所述第二壳体之间，所述折叠屏支撑并连接在第一壳体和第二壳体的一侧表面；其中，所述折叠屏包括屏体和导电的支撑片，所述支撑片贴设在所述屏体朝向所述转轴的一侧并对应所述转轴设置，所述支撑片随所述屏体弯折或展开；
    所述可折叠电子设备还包括：器件和导电结构，所述器件包括设于所述第一壳体内的第一器件和设于所述第二壳体内的第二器件，所述第一器件的接地部和所述支撑片之间及所述第二器件的接地部和所述支撑片之间均连接有所述导电结构。
  2. 根据权利要求1所述的可折叠电子设备，其特征在于，所述支撑片宽度方向的两侧伸出至所述转轴的两侧之外；
    所述支撑片在所述第一壳体上的正投影与所述第一器件的接地部具有重叠区域，所述支撑片在所述第二壳体上的正投影与所述第二器件的接地部也具有重叠区域，所述导电结构位于所述支撑片与对应所述器件的接地部之间的重叠区域内。
  3. 根据权利要求2所述的可折叠电子设备，其特征在于，所述导电结构为贴合在所述支撑片与对应所述器件的接地部之间的导电层。
  4. 根据权利要求3所述的可折叠电子设备，其特征在于，所述导电层为长条状结构。
  5. 根据权利要求4所述的可折叠电子设备，其特征在于，所述导电层沿所述支撑片的长度方向延长。
  6. 根据权利要求5所述的可折叠电子设备，其特征在于，对应所述第一器件的所述导电层与对应所述第二器件的所述导电层相对设置在所述转轴的两侧。
  7. 根据权利要求5所述的可折叠电子设备，其特征在于，所述导电层由所述支撑片的边缘向所述支撑片的中心延伸。
  8. 根据权利要求3-7任一项所述的可折叠电子设备，其特征在于，所述导电层包括导电泡棉。
  9. 根据权利要求8所述的可折叠电子设备，其特征在于，所述导电层还包括导电介质层；
    所述导电介质层至少覆盖所述导电泡棉朝向所述支撑片的一侧表面及所述导电泡棉朝向对应所述器件的接地部的一侧表面。
  10. 根据权利要求9所述的可折叠电子设备，其特征在于，所述导电介质层包括金层或铜层。
  11. 根据权利要求3-7任一项所述的可折叠电子设备，其特征在于，所述导电层为导电胶层。
  12. 根据权利要求2所述的可折叠电子设备，其特征在于，所述支撑片包括平板部和起翘部，所述起翘部的第一端一体连接于所述平板部，所述起翘部的第二端朝向对应所述器件的接地部翘起；
    所述起翘部构成至少部分所述导电结构，所述起翘部与对应所述器件的接地部电连接。
  13. 根据权利要求12所述的可折叠电子设备，其特征在于，所述起翘部分布有多个开口。
  14. 根据权利要求13所述的可折叠电子设备，其特征在于，所述起翘部的弯曲弧度小于90°，所述导电结构还包括导电垫片，所述导电垫片连接于所述起翘部的第二端，且所述导电垫片伸向所述起翘部所在的一侧，所述导电垫片与对应所述器件的接地部贴合并连接。
  15. 根据权利要求14所述的可折叠电子设备，其特征在于，所述导电垫片包括依次连接的固定段、弯折段及连接段，所述固定段贴合在所述起翘部的表面并朝向所述接地部伸出，所述弯折段朝向所述起翘部的第一端所在的一侧弯折，所述连接段与所述接地部贴合。
  16. 根据权利要求15所述的可折叠电子设备，其特征在于，所述连接段具有安装孔，所述安装孔内穿设有锁紧件，所述导电垫片通过所述锁紧件与所述接地部连接。
  17. 根据权利要求13所述的可折叠电子设备，其特征在于，所述起翘部的弯曲弧度大于90°且小于180°，所述起翘部具有贴合段，所述贴合段由所述起翘部的第二端覆盖至靠近所述起翘部的弯曲顶部，所述贴合段与对应所述器件的接地部贴合。
  18. 根据权利要求2所述的可折叠电子设备，其特征在于，所述导电结构为导电弹片，所述导电弹片连接在所述支撑片与对应所述器件的接地部之间，且所述导电弹片处于被压缩的状态。
  19. 根据权利要求2-18任一项所述的可折叠电子设备，其特征在于，所述支撑片的宽度方向的中间区域为镂空部，对应所述第一器件的接地部的所述导电结构及对应所述第二器件的接地部的所述导电结构分别位于所述镂空部的两侧。
  20. 根据权利要求19所述的可折叠电子设备，其特征在于，两侧的所述导电结构之间围成的区域中，位于所述镂空部内的区域为第一区域，所述镂空部中位于所述第一区域以外的区域为第二区域；
    其中，所述第一区域的镂空面积小于所述第二区域的镂空面积。
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CN114401328A (zh) * 2022-01-20 2022-04-26 Oppo广东移动通信有限公司 内折叠柔性屏支撑装置以及可折叠电子设备
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CN114401328A (zh) * 2022-01-20 2022-04-26 Oppo广东移动通信有限公司 内折叠柔性屏支撑装置以及可折叠电子设备
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