CN108885068A - 蒸汽腔用铜或铜合金条 - Google Patents
蒸汽腔用铜或铜合金条 Download PDFInfo
- Publication number
- CN108885068A CN108885068A CN201780020234.4A CN201780020234A CN108885068A CN 108885068 A CN108885068 A CN 108885068A CN 201780020234 A CN201780020234 A CN 201780020234A CN 108885068 A CN108885068 A CN 108885068A
- Authority
- CN
- China
- Prior art keywords
- copper
- warpage
- alloy bar
- copper alloy
- vapor chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010949 copper Substances 0.000 title claims abstract description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 67
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 54
- 238000005096 rolling process Methods 0.000 claims description 15
- 238000012360 testing method Methods 0.000 description 72
- 239000000463 material Substances 0.000 description 59
- 238000000034 method Methods 0.000 description 43
- 230000035882 stress Effects 0.000 description 36
- 238000005530 etching Methods 0.000 description 30
- 230000008569 process Effects 0.000 description 24
- 238000005520 cutting process Methods 0.000 description 21
- 238000009792 diffusion process Methods 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 18
- 230000003746 surface roughness Effects 0.000 description 16
- 238000000137 annealing Methods 0.000 description 14
- 238000005259 measurement Methods 0.000 description 13
- 238000012545 processing Methods 0.000 description 12
- 238000005097 cold rolling Methods 0.000 description 11
- 235000019592 roughness Nutrition 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000001816 cooling Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 238000009736 wetting Methods 0.000 description 7
- 238000005098 hot rolling Methods 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 238000004881 precipitation hardening Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- OUCSEDFVYPBLLF-KAYWLYCHSA-N 5-(4-fluorophenyl)-1-[2-[(2r,4r)-4-hydroxy-6-oxooxan-2-yl]ethyl]-n,4-diphenyl-2-propan-2-ylpyrrole-3-carboxamide Chemical compound C=1C=CC=CC=1C1=C(C=2C=CC(F)=CC=2)N(CC[C@H]2OC(=O)C[C@H](O)C2)C(C(C)C)=C1C(=O)NC1=CC=CC=C1 OUCSEDFVYPBLLF-KAYWLYCHSA-N 0.000 description 1
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 1
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 1
- 229910017824 Cu—Fe—P Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 235000019587 texture Nutrition 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011051874.1A CN112159910A (zh) | 2016-03-30 | 2017-03-23 | 蒸汽腔用铜或铜合金条 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-069416 | 2016-03-30 | ||
| JP2016069416A JP6166414B1 (ja) | 2016-03-30 | 2016-03-30 | ベーパチャンバー用銅又は銅合金条 |
| PCT/JP2017/011686 WO2017170113A1 (ja) | 2016-03-30 | 2017-03-23 | ベーパチャンバー用銅又は銅合金条 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011051874.1A Division CN112159910A (zh) | 2016-03-30 | 2017-03-23 | 蒸汽腔用铜或铜合金条 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108885068A true CN108885068A (zh) | 2018-11-23 |
Family
ID=59351420
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780020234.4A Pending CN108885068A (zh) | 2016-03-30 | 2017-03-23 | 蒸汽腔用铜或铜合金条 |
| CN202011051874.1A Pending CN112159910A (zh) | 2016-03-30 | 2017-03-23 | 蒸汽腔用铜或铜合金条 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011051874.1A Pending CN112159910A (zh) | 2016-03-30 | 2017-03-23 | 蒸汽腔用铜或铜合金条 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6166414B1 (ja) |
| KR (1) | KR102277625B1 (ja) |
| CN (2) | CN108885068A (ja) |
| TW (1) | TWI624641B (ja) |
| WO (1) | WO2017170113A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7000839B2 (ja) * | 2017-12-18 | 2022-02-04 | 凸版印刷株式会社 | 金属板および放熱部材用金属板の製造方法 |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH093571A (ja) * | 1995-06-14 | 1997-01-07 | Mitsubishi Shindoh Co Ltd | ヒートシンク |
| JP2001074381A (ja) * | 1999-09-07 | 2001-03-23 | Furukawa Electric Co Ltd:The | 薄型平面型ヒートパイプおよびコンテナ |
| JP2002221398A (ja) * | 2001-01-25 | 2002-08-09 | Toyo Kohan Co Ltd | プレート積層体、プレート積層体を用いた中空積層体および中空積層体を用いたプレート型ヒートパイプ |
| JP2003027248A (ja) * | 2001-07-18 | 2003-01-29 | Kobe Steel Ltd | セラミックス被覆銅又は銅合金材、その製造方法及びセラミックス被覆銅又は銅合金管 |
| JP2003294386A (ja) * | 2002-04-02 | 2003-10-15 | Kobe Steel Ltd | 内面溝付伝熱管及びその製造装置 |
| JP2010007174A (ja) * | 2008-05-29 | 2010-01-14 | Nippon Mining & Metals Co Ltd | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金板又は条 |
| JP2011025284A (ja) * | 2009-07-27 | 2011-02-10 | Hitachi Cable Ltd | 銅または銅合金材およびその製造方法、並びに半導体パッケージ |
| JP2014019892A (ja) * | 2012-07-17 | 2014-02-03 | Sh Copper Products Corp | 圧延銅箔 |
| JP2014198889A (ja) * | 2013-03-29 | 2014-10-23 | Jx日鉱日石金属株式会社 | 銅条または銅合金条および、それを備える放熱部品 |
| JP2015113487A (ja) * | 2013-12-11 | 2015-06-22 | 三菱伸銅株式会社 | ろう付け性及びプレス加工性に優れたリン脱酸銅板及びその製造方法 |
| WO2015146987A1 (ja) * | 2014-03-27 | 2015-10-01 | 日産化学工業株式会社 | 液晶表示素子、液晶配向膜及び液晶配向処理剤 |
| JP2015203127A (ja) * | 2014-04-11 | 2015-11-16 | 三菱伸銅株式会社 | ハーフエッチング特性に優れたＣｕ−Ｆｅ−Ｐ系銅合金板及びその製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3520034B2 (ja) * | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | 電子電気機器部品用銅合金材 |
| JP2004238672A (ja) | 2003-02-05 | 2004-08-26 | Fujikura Ltd | 平板型ヒートパイプの製造方法 |
| JP4112602B2 (ja) | 2005-09-01 | 2008-07-02 | 株式会社渕上ミクロ | ヒートパイプ |
| US20080190523A1 (en) * | 2007-02-13 | 2008-08-14 | Weilin Gao | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
| KR101419149B1 (ko) * | 2009-12-02 | 2014-07-11 | 후루카와 덴키 고교 가부시키가이샤 | 구리합금판재 |
| JP2014019907A (ja) * | 2012-07-18 | 2014-02-03 | Sh Copper Products Corp | 電気・電子部品用銅合金 |
| JP6176433B2 (ja) | 2013-01-10 | 2017-08-09 | 株式会社Ｗｅｌｃｏｎ | ベーパチャンバ |
| JP6696720B2 (ja) * | 2013-07-11 | 2020-05-20 | 古河電気工業株式会社 | 銅合金板材およびその製造方法 |
| JP6121893B2 (ja) | 2013-12-24 | 2017-04-26 | 東芝ホームテクノ株式会社 | シート型ヒートパイプ |
| KR102370860B1 (ko) * | 2014-03-25 | 2022-03-07 | 후루카와 덴키 고교 가부시키가이샤 | 구리합금 판재, 커넥터, 및 구리합금 판재의 제조방법 |
-
2016
- 2016-03-30 JP JP2016069416A patent/JP6166414B1/ja not_active Expired - Fee Related
-
2017
- 2017-03-23 CN CN201780020234.4A patent/CN108885068A/zh active Pending
- 2017-03-23 KR KR1020187030601A patent/KR102277625B1/ko active IP Right Review Request
- 2017-03-23 WO PCT/JP2017/011686 patent/WO2017170113A1/ja active Application Filing
- 2017-03-23 CN CN202011051874.1A patent/CN112159910A/zh active Pending
- 2017-03-29 TW TW106110572A patent/TWI624641B/zh not_active IP Right Cessation
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH093571A (ja) * | 1995-06-14 | 1997-01-07 | Mitsubishi Shindoh Co Ltd | ヒートシンク |
| JP2001074381A (ja) * | 1999-09-07 | 2001-03-23 | Furukawa Electric Co Ltd:The | 薄型平面型ヒートパイプおよびコンテナ |
| JP2002221398A (ja) * | 2001-01-25 | 2002-08-09 | Toyo Kohan Co Ltd | プレート積層体、プレート積層体を用いた中空積層体および中空積層体を用いたプレート型ヒートパイプ |
| JP2003027248A (ja) * | 2001-07-18 | 2003-01-29 | Kobe Steel Ltd | セラミックス被覆銅又は銅合金材、その製造方法及びセラミックス被覆銅又は銅合金管 |
| JP2003294386A (ja) * | 2002-04-02 | 2003-10-15 | Kobe Steel Ltd | 内面溝付伝熱管及びその製造装置 |
| JP2010007174A (ja) * | 2008-05-29 | 2010-01-14 | Nippon Mining & Metals Co Ltd | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金板又は条 |
| JP2011025284A (ja) * | 2009-07-27 | 2011-02-10 | Hitachi Cable Ltd | 銅または銅合金材およびその製造方法、並びに半導体パッケージ |
| JP2014019892A (ja) * | 2012-07-17 | 2014-02-03 | Sh Copper Products Corp | 圧延銅箔 |
| JP2014198889A (ja) * | 2013-03-29 | 2014-10-23 | Jx日鉱日石金属株式会社 | 銅条または銅合金条および、それを備える放熱部品 |
| JP2015113487A (ja) * | 2013-12-11 | 2015-06-22 | 三菱伸銅株式会社 | ろう付け性及びプレス加工性に優れたリン脱酸銅板及びその製造方法 |
| WO2015146987A1 (ja) * | 2014-03-27 | 2015-10-01 | 日産化学工業株式会社 | 液晶表示素子、液晶配向膜及び液晶配向処理剤 |
| JP2015203127A (ja) * | 2014-04-11 | 2015-11-16 | 三菱伸銅株式会社 | ハーフエッチング特性に優れたＣｕ−Ｆｅ−Ｐ系銅合金板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180127440A (ko) | 2018-11-28 |
| TW201804128A (zh) | 2018-02-01 |
| TWI624641B (zh) | 2018-05-21 |
| JP6166414B1 (ja) | 2017-07-19 |
| WO2017170113A1 (ja) | 2017-10-05 |
| KR102277625B1 (ko) | 2021-07-14 |
| CN112159910A (zh) | 2021-01-01 |
| JP2017180967A (ja) | 2017-10-05 |
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