CN108885068A - 蒸汽腔用铜或铜合金条 - Google Patents

蒸汽腔用铜或铜合金条 Download PDF

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Publication number
CN108885068A
CN108885068A CN201780020234.4A CN201780020234A CN108885068A CN 108885068 A CN108885068 A CN 108885068A CN 201780020234 A CN201780020234 A CN 201780020234A CN 108885068 A CN108885068 A CN 108885068A
Authority
CN
China
Prior art keywords
copper
warpage
alloy bar
copper alloy
vapor chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780020234.4A
Other languages
English (en)
Chinese (zh)
Inventor
桥本大辅
西村昌泰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to CN202011051874.1A priority Critical patent/CN112159910A/zh
Publication of CN108885068A publication Critical patent/CN108885068A/zh
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/19Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081Heat exchange elements made from metals or metal alloys
    • F28F21/085Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201780020234.4A 2016-03-30 2017-03-23 蒸汽腔用铜或铜合金条 Pending CN108885068A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011051874.1A CN112159910A (zh) 2016-03-30 2017-03-23 蒸汽腔用铜或铜合金条

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-069416 2016-03-30
JP2016069416A JP6166414B1 (ja) 2016-03-30 2016-03-30 ベーパチャンバー用銅又は銅合金条
PCT/JP2017/011686 WO2017170113A1 (ja) 2016-03-30 2017-03-23 ベーパチャンバー用銅又は銅合金条

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202011051874.1A Division CN112159910A (zh) 2016-03-30 2017-03-23 蒸汽腔用铜或铜合金条

Publications (1)

Publication Number Publication Date
CN108885068A true CN108885068A (zh) 2018-11-23

Family

ID=59351420

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201780020234.4A Pending CN108885068A (zh) 2016-03-30 2017-03-23 蒸汽腔用铜或铜合金条
CN202011051874.1A Pending CN112159910A (zh) 2016-03-30 2017-03-23 蒸汽腔用铜或铜合金条

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202011051874.1A Pending CN112159910A (zh) 2016-03-30 2017-03-23 蒸汽腔用铜或铜合金条

Country Status (5)

Country Link
JP (1) JP6166414B1 (ja)
KR (1) KR102277625B1 (ja)
CN (2) CN108885068A (ja)
TW (1) TWI624641B (ja)
WO (1) WO2017170113A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7000839B2 (ja) * 2017-12-18 2022-02-04 凸版印刷株式会社 金属板および放熱部材用金属板の製造方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH093571A (ja) * 1995-06-14 1997-01-07 Mitsubishi Shindoh Co Ltd ヒートシンク
JP2001074381A (ja) * 1999-09-07 2001-03-23 Furukawa Electric Co Ltd:The 薄型平面型ヒートパイプおよびコンテナ
JP2002221398A (ja) * 2001-01-25 2002-08-09 Toyo Kohan Co Ltd プレート積層体、プレート積層体を用いた中空積層体および中空積層体を用いたプレート型ヒートパイプ
JP2003027248A (ja) * 2001-07-18 2003-01-29 Kobe Steel Ltd セラミックス被覆銅又は銅合金材、その製造方法及びセラミックス被覆銅又は銅合金管
JP2003294386A (ja) * 2002-04-02 2003-10-15 Kobe Steel Ltd 内面溝付伝熱管及びその製造装置
JP2010007174A (ja) * 2008-05-29 2010-01-14 Nippon Mining & Metals Co Ltd 電子材料用Cu−Ni−Si系合金板又は条
JP2011025284A (ja) * 2009-07-27 2011-02-10 Hitachi Cable Ltd 銅または銅合金材およびその製造方法、並びに半導体パッケージ
JP2014019892A (ja) * 2012-07-17 2014-02-03 Sh Copper Products Corp 圧延銅箔
JP2014198889A (ja) * 2013-03-29 2014-10-23 Jx日鉱日石金属株式会社 銅条または銅合金条および、それを備える放熱部品
JP2015113487A (ja) * 2013-12-11 2015-06-22 三菱伸銅株式会社 ろう付け性及びプレス加工性に優れたリン脱酸銅板及びその製造方法
WO2015146987A1 (ja) * 2014-03-27 2015-10-01 日産化学工業株式会社 液晶表示素子、液晶配向膜及び液晶配向処理剤
JP2015203127A (ja) * 2014-04-11 2015-11-16 三菱伸銅株式会社 ハーフエッチング特性に優れたCu−Fe−P系銅合金板及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3520034B2 (ja) * 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
JP2004238672A (ja) 2003-02-05 2004-08-26 Fujikura Ltd 平板型ヒートパイプの製造方法
JP4112602B2 (ja) 2005-09-01 2008-07-02 株式会社渕上ミクロ ヒートパイプ
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
KR101419149B1 (ko) * 2009-12-02 2014-07-11 후루카와 덴키 고교 가부시키가이샤 구리합금판재
JP2014019907A (ja) * 2012-07-18 2014-02-03 Sh Copper Products Corp 電気・電子部品用銅合金
JP6176433B2 (ja) 2013-01-10 2017-08-09 株式会社Welcon ベーパチャンバ
JP6696720B2 (ja) * 2013-07-11 2020-05-20 古河電気工業株式会社 銅合金板材およびその製造方法
JP6121893B2 (ja) 2013-12-24 2017-04-26 東芝ホームテクノ株式会社 シート型ヒートパイプ
KR102370860B1 (ko) * 2014-03-25 2022-03-07 후루카와 덴키 고교 가부시키가이샤 구리합금 판재, 커넥터, 및 구리합금 판재의 제조방법

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH093571A (ja) * 1995-06-14 1997-01-07 Mitsubishi Shindoh Co Ltd ヒートシンク
JP2001074381A (ja) * 1999-09-07 2001-03-23 Furukawa Electric Co Ltd:The 薄型平面型ヒートパイプおよびコンテナ
JP2002221398A (ja) * 2001-01-25 2002-08-09 Toyo Kohan Co Ltd プレート積層体、プレート積層体を用いた中空積層体および中空積層体を用いたプレート型ヒートパイプ
JP2003027248A (ja) * 2001-07-18 2003-01-29 Kobe Steel Ltd セラミックス被覆銅又は銅合金材、その製造方法及びセラミックス被覆銅又は銅合金管
JP2003294386A (ja) * 2002-04-02 2003-10-15 Kobe Steel Ltd 内面溝付伝熱管及びその製造装置
JP2010007174A (ja) * 2008-05-29 2010-01-14 Nippon Mining & Metals Co Ltd 電子材料用Cu−Ni−Si系合金板又は条
JP2011025284A (ja) * 2009-07-27 2011-02-10 Hitachi Cable Ltd 銅または銅合金材およびその製造方法、並びに半導体パッケージ
JP2014019892A (ja) * 2012-07-17 2014-02-03 Sh Copper Products Corp 圧延銅箔
JP2014198889A (ja) * 2013-03-29 2014-10-23 Jx日鉱日石金属株式会社 銅条または銅合金条および、それを備える放熱部品
JP2015113487A (ja) * 2013-12-11 2015-06-22 三菱伸銅株式会社 ろう付け性及びプレス加工性に優れたリン脱酸銅板及びその製造方法
WO2015146987A1 (ja) * 2014-03-27 2015-10-01 日産化学工業株式会社 液晶表示素子、液晶配向膜及び液晶配向処理剤
JP2015203127A (ja) * 2014-04-11 2015-11-16 三菱伸銅株式会社 ハーフエッチング特性に優れたCu−Fe−P系銅合金板及びその製造方法

Also Published As

Publication number Publication date
KR20180127440A (ko) 2018-11-28
TW201804128A (zh) 2018-02-01
TWI624641B (zh) 2018-05-21
JP6166414B1 (ja) 2017-07-19
WO2017170113A1 (ja) 2017-10-05
KR102277625B1 (ko) 2021-07-14
CN112159910A (zh) 2021-01-01
JP2017180967A (ja) 2017-10-05

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20181123

RJ01 Rejection of invention patent application after publication