CN108878314B - 基板清洗装置及基板处理装置 - Google Patents

基板清洗装置及基板处理装置 Download PDF

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Publication number
CN108878314B
CN108878314B CN201810450204.3A CN201810450204A CN108878314B CN 108878314 B CN108878314 B CN 108878314B CN 201810450204 A CN201810450204 A CN 201810450204A CN 108878314 B CN108878314 B CN 108878314B
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substrate
cleaning
roller
driven roller
shaft
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Chinese (zh)
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CN108878314A (zh
Inventor
中野央二郎
国泽淳次
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Ebara Corp
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Ebara Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201810450204.3A 2017-05-16 2018-05-11 基板清洗装置及基板处理装置 Active CN108878314B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017097621A JP6792512B2 (ja) 2017-05-16 2017-05-16 基板洗浄装置および基板処理装置
JP2017-097621 2017-05-16

Publications (2)

Publication Number Publication Date
CN108878314A CN108878314A (zh) 2018-11-23
CN108878314B true CN108878314B (zh) 2023-09-29

Family

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CN201810450204.3A Active CN108878314B (zh) 2017-05-16 2018-05-11 基板清洗装置及基板处理装置

Country Status (6)

Country Link
US (2) US10741423B2 (https=)
JP (1) JP6792512B2 (https=)
KR (1) KR102494451B1 (https=)
CN (1) CN108878314B (https=)
SG (1) SG10201804063YA (https=)
TW (1) TWI770175B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6792512B2 (ja) * 2017-05-16 2020-11-25 株式会社荏原製作所 基板洗浄装置および基板処理装置
JP7356811B2 (ja) 2019-04-02 2023-10-05 株式会社荏原製作所 基板支持装置及び基板支持装置の制御方法
CN110148573B (zh) * 2019-04-17 2020-12-04 湖州达立智能设备制造有限公司 一种半导体设备工艺腔的晶圆升降装置
KR102428927B1 (ko) * 2020-01-22 2022-08-04 주식회사 씨티에스 웨이퍼 세정 장치용 웨이퍼 회전 유닛 및 이를 포함하는 씨엠피 장치
KR102732711B1 (ko) * 2020-09-16 2024-11-20 삼성전자주식회사 웨이퍼 클리닝 장치 및 이를 이용한 웨이퍼 클리닝 방법
KR102590328B1 (ko) * 2020-12-24 2023-10-16 세메스 주식회사 기판 파지 장치 및 이를 포함하는 액 처리 장치, 및 기판 처리 설비
CN112820627B (zh) * 2020-12-30 2022-10-18 江苏亚电科技有限公司 一种高效晶圆片的清洗方法
JP7584361B2 (ja) * 2021-06-17 2024-11-15 株式会社荏原製作所 基板洗浄装置、基板処理装置
CN113607980B (zh) * 2021-10-08 2021-11-30 南通优睿半导体有限公司 一种半导体器材料研发的选择测试装置
CN113621786B (zh) * 2021-10-13 2021-12-14 南通锦发电缆有限公司 一种用于电线电缆制造的退火装置
JP7841895B2 (ja) * 2022-02-08 2026-04-07 株式会社ディスコ 洗浄装置
JP7805203B2 (ja) * 2022-03-08 2026-01-23 株式会社東京精密 ウエハの回転保持装置
KR20230140641A (ko) * 2022-03-29 2023-10-10 삼성디스플레이 주식회사 임프린트 장치
KR20240066876A (ko) * 2022-11-08 2024-05-16 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
JP2024106241A (ja) * 2023-01-26 2024-08-07 芝浦メカトロニクス株式会社 洗浄装置及び洗浄方法
CN119342707B (zh) * 2024-12-19 2025-03-14 广汉川亿石油科技有限公司 一种电路板生产的等离子处理装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175315A (ja) * 1991-12-19 1993-07-13 Dainippon Screen Mfg Co Ltd 回転式基板処理装置における基板の有無検出装置
JPH11135468A (ja) * 1997-10-31 1999-05-21 Shibaura Mechatronics Corp 洗浄装置とその方法および洗浄用ディスクブラシ
JPH11176790A (ja) * 1997-12-12 1999-07-02 Tokyo Electron Ltd 洗浄装置
EP1072359A2 (en) * 1999-07-26 2001-01-31 Ebara Corporation Semiconductor wafer polishing apparatus
JP2007294920A (ja) * 2006-03-31 2007-11-08 Ebara Corp 基板保持回転機構、基板処理装置
JP2010169606A (ja) * 2009-01-26 2010-08-05 Mitsuboshi Belting Ltd 動力伝達機構の耐久試験機
CN105097615A (zh) * 2014-05-20 2015-11-25 株式会社荏原制作所 基板清洗装置及以基板清洗装置来执行的方法
WO2016067562A1 (ja) * 2014-10-31 2016-05-06 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2016152382A (ja) * 2015-02-19 2016-08-22 株式会社荏原製作所 基板洗浄装置および方法
JP2016167514A (ja) * 2015-03-09 2016-09-15 株式会社荏原製作所 基板洗浄装置、基板洗浄方法、および基板処理装置

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* Cited by examiner, † Cited by third party
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JPH10289889A (ja) 1997-04-16 1998-10-27 Dainippon Screen Mfg Co Ltd 基板処理装置
US7685667B2 (en) * 2005-06-14 2010-03-30 Taiwan Semiconductor Manufacturing Co., Ltd. Post-CMP cleaning system
US7938130B2 (en) 2006-03-31 2011-05-10 Ebara Corporation Substrate holding rotating mechanism, and substrate processing apparatus
WO2007145904A2 (en) * 2006-06-05 2007-12-21 Applied Materials, Inc. Methods and apparatus for supporting a substrate in a horizontal orientation during cleaning
KR100786627B1 (ko) 2006-07-24 2007-12-21 두산메카텍 주식회사 웨이퍼의 회전 감지장치
US7823241B2 (en) 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
SG10201601095UA (en) 2015-02-18 2016-09-29 Ebara Corp Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatus
JP6328577B2 (ja) * 2015-02-24 2018-05-23 株式会社荏原製作所 荷重測定装置および荷重測定方法
JP6792512B2 (ja) * 2017-05-16 2020-11-25 株式会社荏原製作所 基板洗浄装置および基板処理装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175315A (ja) * 1991-12-19 1993-07-13 Dainippon Screen Mfg Co Ltd 回転式基板処理装置における基板の有無検出装置
JPH11135468A (ja) * 1997-10-31 1999-05-21 Shibaura Mechatronics Corp 洗浄装置とその方法および洗浄用ディスクブラシ
JPH11176790A (ja) * 1997-12-12 1999-07-02 Tokyo Electron Ltd 洗浄装置
EP1072359A2 (en) * 1999-07-26 2001-01-31 Ebara Corporation Semiconductor wafer polishing apparatus
JP2007294920A (ja) * 2006-03-31 2007-11-08 Ebara Corp 基板保持回転機構、基板処理装置
JP2010169606A (ja) * 2009-01-26 2010-08-05 Mitsuboshi Belting Ltd 動力伝達機構の耐久試験機
CN105097615A (zh) * 2014-05-20 2015-11-25 株式会社荏原制作所 基板清洗装置及以基板清洗装置来执行的方法
WO2016067562A1 (ja) * 2014-10-31 2016-05-06 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2016152382A (ja) * 2015-02-19 2016-08-22 株式会社荏原製作所 基板洗浄装置および方法
JP2016167514A (ja) * 2015-03-09 2016-09-15 株式会社荏原製作所 基板洗浄装置、基板洗浄方法、および基板処理装置

Also Published As

Publication number Publication date
JP2018195680A (ja) 2018-12-06
CN108878314A (zh) 2018-11-23
JP6792512B2 (ja) 2020-11-25
TW201902585A (zh) 2019-01-16
KR20180125887A (ko) 2018-11-26
KR102494451B1 (ko) 2023-02-01
US20200335363A1 (en) 2020-10-22
US11532491B2 (en) 2022-12-20
US20180337072A1 (en) 2018-11-22
SG10201804063YA (en) 2018-12-28
US10741423B2 (en) 2020-08-11
TWI770175B (zh) 2022-07-11

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