SG10201804063YA - Substrate cleaning apparatus, substrate processing apparatus, and method of cleaning substrate - Google Patents
Substrate cleaning apparatus, substrate processing apparatus, and method of cleaning substrateInfo
- Publication number
- SG10201804063YA SG10201804063YA SG10201804063YA SG10201804063YA SG10201804063YA SG 10201804063Y A SG10201804063Y A SG 10201804063YA SG 10201804063Y A SG10201804063Y A SG 10201804063YA SG 10201804063Y A SG10201804063Y A SG 10201804063YA SG 10201804063Y A SG10201804063Y A SG 10201804063YA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- cleaning
- driving
- spindle
- processing apparatus
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
OF THE DISCLOSURE SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF CLEANING SUBSTRATE A substrate cleaning apparatus and related apparatuses/methods are disclosed. In one embodiment, a substrate cleaning apparatus includes: a first spindle group including a first driving spindle having a first driving roller configured to rotate a substrate and an idler spindle having a driven roller rotated by the substrate; a second spindle group including a plurality of second driving spindles each having a second driving roller configured to rotate the substrate; a cleaning mechanism configured to clean the substrate rotated by the first driving roller and the plurality of second driving rollers; and a rotation detector configured to detect the rotational speed of the driven roller. The driven roller is positioned on the opposite side to a direction in which the substrate receives a force from the cleaning mechanism. Figure 7
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017097621A JP6792512B2 (en) | 2017-05-16 | 2017-05-16 | Substrate cleaning equipment and substrate processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201804063YA true SG10201804063YA (en) | 2018-12-28 |
Family
ID=64272527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201804063YA SG10201804063YA (en) | 2017-05-16 | 2018-05-14 | Substrate cleaning apparatus, substrate processing apparatus, and method of cleaning substrate |
Country Status (6)
Country | Link |
---|---|
US (2) | US10741423B2 (en) |
JP (1) | JP6792512B2 (en) |
KR (1) | KR102494451B1 (en) |
CN (1) | CN108878314B (en) |
SG (1) | SG10201804063YA (en) |
TW (1) | TWI770175B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6792512B2 (en) * | 2017-05-16 | 2020-11-25 | 株式会社荏原製作所 | Substrate cleaning equipment and substrate processing equipment |
JP7356811B2 (en) * | 2019-04-02 | 2023-10-05 | 株式会社荏原製作所 | Substrate support device and method for controlling the substrate support device |
CN110148573B (en) * | 2019-04-17 | 2020-12-04 | 湖州达立智能设备制造有限公司 | Wafer lifting device of semiconductor equipment process chamber |
KR102428927B1 (en) * | 2020-01-22 | 2022-08-04 | 주식회사 씨티에스 | Wafer rotation unit and CMP apparatus having for the same |
KR20220036517A (en) * | 2020-09-16 | 2022-03-23 | 삼성전자주식회사 | Wafer cleaning apparatus and wafer cleaning method using the same |
KR102590328B1 (en) * | 2020-12-24 | 2023-10-16 | 세메스 주식회사 | Substrate gripping apparatus and liquid processing apparatus, and substrate processing equipment including the same |
CN112820627B (en) * | 2020-12-30 | 2022-10-18 | 江苏亚电科技有限公司 | Efficient wafer cleaning method |
CN113607980B (en) * | 2021-10-08 | 2021-11-30 | 南通优睿半导体有限公司 | Selection testing arrangement of semiconductor device material research and development |
CN113621786B (en) * | 2021-10-13 | 2021-12-14 | 南通锦发电缆有限公司 | Annealing device for manufacturing wires and cables |
KR20230140641A (en) * | 2022-03-29 | 2023-10-10 | 삼성디스플레이 주식회사 | Imprint apparatus |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2582976B2 (en) * | 1991-12-19 | 1997-02-19 | 大日本スクリーン製造株式会社 | Substrate presence / absence detection device in rotary substrate processing equipment |
JPH10289889A (en) | 1997-04-16 | 1998-10-27 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
JP3964517B2 (en) * | 1997-10-31 | 2007-08-22 | 芝浦メカトロニクス株式会社 | Cleaning device and method |
JP3343503B2 (en) * | 1997-12-12 | 2002-11-11 | 東京エレクトロン株式会社 | Cleaning equipment |
JP2001038614A (en) * | 1999-07-26 | 2001-02-13 | Ebara Corp | Grinding device |
US7685667B2 (en) * | 2005-06-14 | 2010-03-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Post-CMP cleaning system |
JP4937807B2 (en) * | 2006-03-31 | 2012-05-23 | 株式会社荏原製作所 | Substrate holding and rotating mechanism, substrate processing apparatus |
US7938130B2 (en) * | 2006-03-31 | 2011-05-10 | Ebara Corporation | Substrate holding rotating mechanism, and substrate processing apparatus |
US20080011325A1 (en) * | 2006-06-05 | 2008-01-17 | Olgado Donald J | Methods and apparatus for supporting a substrate in a horizontal orientation during cleaning |
KR100786627B1 (en) | 2006-07-24 | 2007-12-21 | 두산메카텍 주식회사 | Apparatus for sensing rotation of wafer |
US7823241B2 (en) | 2007-03-22 | 2010-11-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | System for cleaning a wafer |
JP2010169606A (en) * | 2009-01-26 | 2010-08-05 | Mitsuboshi Belting Ltd | Endurance testing machine for power transmission mechanism |
JP2015220402A (en) * | 2014-05-20 | 2015-12-07 | 株式会社荏原製作所 | Substrate cleaning device and method performed by substrate cleaning device |
KR20170043664A (en) * | 2014-10-31 | 2017-04-21 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate cleaning device and substrate cleaning method |
SG10201601095UA (en) | 2015-02-18 | 2016-09-29 | Ebara Corp | Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatus |
JP6491908B2 (en) * | 2015-03-09 | 2019-03-27 | 株式会社荏原製作所 | Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatus |
JP6491903B2 (en) * | 2015-02-19 | 2019-03-27 | 株式会社荏原製作所 | Substrate cleaning apparatus and method |
JP6328577B2 (en) * | 2015-02-24 | 2018-05-23 | 株式会社荏原製作所 | Load measuring device and load measuring method |
JP6792512B2 (en) * | 2017-05-16 | 2020-11-25 | 株式会社荏原製作所 | Substrate cleaning equipment and substrate processing equipment |
-
2017
- 2017-05-16 JP JP2017097621A patent/JP6792512B2/en active Active
-
2018
- 2018-05-08 KR KR1020180052454A patent/KR102494451B1/en active IP Right Grant
- 2018-05-11 CN CN201810450204.3A patent/CN108878314B/en active Active
- 2018-05-14 US US15/978,320 patent/US10741423B2/en active Active
- 2018-05-14 TW TW107116219A patent/TWI770175B/en active
- 2018-05-14 SG SG10201804063YA patent/SG10201804063YA/en unknown
-
2020
- 2020-07-02 US US16/919,788 patent/US11532491B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20180125887A (en) | 2018-11-26 |
US20180337072A1 (en) | 2018-11-22 |
US10741423B2 (en) | 2020-08-11 |
TWI770175B (en) | 2022-07-11 |
CN108878314A (en) | 2018-11-23 |
JP6792512B2 (en) | 2020-11-25 |
TW201902585A (en) | 2019-01-16 |
KR102494451B1 (en) | 2023-02-01 |
JP2018195680A (en) | 2018-12-06 |
US11532491B2 (en) | 2022-12-20 |
CN108878314B (en) | 2023-09-29 |
US20200335363A1 (en) | 2020-10-22 |
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