CN108780344B - 用于移动电子设备的面内主动冷却设备 - Google Patents

用于移动电子设备的面内主动冷却设备 Download PDF

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Publication number
CN108780344B
CN108780344B CN201780018440.1A CN201780018440A CN108780344B CN 108780344 B CN108780344 B CN 108780344B CN 201780018440 A CN201780018440 A CN 201780018440A CN 108780344 B CN108780344 B CN 108780344B
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electrode
layer
junction
lateral surface
heat
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CN201780018440.1A
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Chinese (zh)
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CN108780344A (zh
Inventor
P·王
U·瓦达坎玛卢维多
V·米特
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Qualcomm Inc
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Qualcomm Inc
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201780018440.1A 2016-03-30 2017-03-28 用于移动电子设备的面内主动冷却设备 Active CN108780344B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/086,039 US10267545B2 (en) 2016-03-30 2016-03-30 In-plane active cooling device for mobile electronics
US15/086,039 2016-03-30
PCT/US2017/024517 WO2017172752A1 (en) 2016-03-30 2017-03-28 In-plane active cooling device for mobile electronics

Publications (2)

Publication Number Publication Date
CN108780344A CN108780344A (zh) 2018-11-09
CN108780344B true CN108780344B (zh) 2021-03-12

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CN201780018440.1A Active CN108780344B (zh) 2016-03-30 2017-03-28 用于移动电子设备的面内主动冷却设备

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US (1) US10267545B2 (https=)
EP (1) EP3436892B1 (https=)
JP (1) JP2019517128A (https=)
KR (1) KR20180130508A (https=)
CN (1) CN108780344B (https=)
CA (1) CA3015939A1 (https=)
TW (1) TW201806204A (https=)
WO (1) WO2017172752A1 (https=)

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KR102539153B1 (ko) * 2016-12-05 2023-06-01 삼성디스플레이 주식회사 표시 장치
WO2020160494A1 (en) * 2019-02-01 2020-08-06 Lon Bell Consulting Thermoelectric elements and devices with enhanced maximum temperature differences based on spatially varying distributed transport properties
US11421919B2 (en) 2019-02-01 2022-08-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
KR102846605B1 (ko) * 2020-02-04 2025-08-19 삼성디스플레이 주식회사 표시 모듈
US20210278887A1 (en) 2020-03-05 2021-09-09 Samsung Electronics Co., Ltd. Thermal control for electronic devices
WO2021257467A1 (en) 2020-06-15 2021-12-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
CN112254371A (zh) * 2020-09-28 2021-01-22 西南电子技术研究所（中国电子科技集团公司第十研究所） 多级梯度热电制冷片热控装置
US20230403935A1 (en) * 2022-05-20 2023-12-14 Apple Inc. Thermoelectric Cooling Modules
US12243469B2 (en) * 2022-12-13 2025-03-04 Lx Semicon Co., Ltd. Display driving apparatus for operating display device that displays image and control method therefor

Citations (2)

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CN1926695A (zh) * 2004-01-13 2007-03-07 纳诺库勒斯公司 包含互补的热电材料的单片式薄膜热电装置
CN101859867A (zh) * 2009-04-13 2010-10-13 三星电机株式会社 热电元件

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JPH02221821A (ja) * 1989-02-22 1990-09-04 Murata Mfg Co Ltd 薄膜熱電素子
JPH06318736A (ja) * 1993-05-06 1994-11-15 Canon Inc 薄膜ペルチェ熱電素子
US6282907B1 (en) 1999-12-09 2001-09-04 International Business Machines Corporation Thermoelectric cooling apparatus and method for maximizing energy transport
JP4218241B2 (ja) * 2001-12-27 2009-02-04 三菱電機株式会社 光モジュール、および光送信もしくは光受信装置
KR101094783B1 (ko) * 2003-10-27 2011-12-16 엘지디스플레이 주식회사 열전기 발생장치를 이용한 액정표시장치
JP3874365B2 (ja) * 2004-03-01 2007-01-31 松下電器産業株式会社 熱電変換デバイス、およびこれを用いた冷却方法および発電方法
US20060076046A1 (en) 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US7825324B2 (en) 2006-12-29 2010-11-02 Alcatel-Lucent Usa Inc. Spreading thermoelectric coolers
US20090071525A1 (en) 2007-09-17 2009-03-19 Lucent Technologies, Inc. Cooling Hot-Spots by Lateral Active Heat Transport
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DE102012105367A1 (de) 2012-02-24 2013-08-29 O-Flexx Technologies Gmbh Thermoelektrisches Modul und Herstellungsverfahren
JP5857792B2 (ja) * 2012-02-27 2016-02-10 富士通株式会社 熱電デバイスおよびその製造方法
KR20160127740A (ko) * 2014-02-28 2016-11-04 고쿠리츠다이가쿠호징 나라 센탄카가쿠기쥬츠 다이가쿠인 다이가쿠 열전 변환 재료 및 열전 변환 소자
KR101574012B1 (ko) * 2014-04-17 2015-12-02 부산대학교 산학협력단 열전 장치 및 이를 포함하는 열전 시스템
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CN101859867A (zh) * 2009-04-13 2010-10-13 三星电机株式会社 热电元件

Also Published As

Publication number Publication date
KR20180130508A (ko) 2018-12-07
EP3436892B1 (en) 2020-09-23
EP3436892A1 (en) 2019-02-06
JP2019517128A (ja) 2019-06-20
US20170284708A1 (en) 2017-10-05
CA3015939A1 (en) 2017-10-05
US10267545B2 (en) 2019-04-23
TW201806204A (zh) 2018-02-16
BR112018069655A2 (pt) 2019-02-05
WO2017172752A1 (en) 2017-10-05
CN108780344A (zh) 2018-11-09

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