TW201806204A - 用於行動電子設備的面內主動冷卻設備 - Google Patents

用於行動電子設備的面內主動冷卻設備 Download PDF

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Publication number
TW201806204A
TW201806204A TW106110691A TW106110691A TW201806204A TW 201806204 A TW201806204 A TW 201806204A TW 106110691 A TW106110691 A TW 106110691A TW 106110691 A TW106110691 A TW 106110691A TW 201806204 A TW201806204 A TW 201806204A
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TW
Taiwan
Prior art keywords
electrode
layer
lateral surface
junction
heat transfer
Prior art date
Application number
TW106110691A
Other languages
English (en)
Chinese (zh)
Inventor
王鵬
尤尼克理辛南恩 法達肯馬魯維度
維內 米特
Original Assignee
高通公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 高通公司 filed Critical 高通公司
Publication of TW201806204A publication Critical patent/TW201806204A/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW106110691A 2016-03-30 2017-03-30 用於行動電子設備的面內主動冷卻設備 TW201806204A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/086,039 US10267545B2 (en) 2016-03-30 2016-03-30 In-plane active cooling device for mobile electronics
US15/086,039 2016-03-30

Publications (1)

Publication Number Publication Date
TW201806204A true TW201806204A (zh) 2018-02-16

Family

ID=58548893

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106110691A TW201806204A (zh) 2016-03-30 2017-03-30 用於行動電子設備的面內主動冷卻設備

Country Status (8)

Country Link
US (1) US10267545B2 (https=)
EP (1) EP3436892B1 (https=)
JP (1) JP2019517128A (https=)
KR (1) KR20180130508A (https=)
CN (1) CN108780344B (https=)
CA (1) CA3015939A1 (https=)
TW (1) TW201806204A (https=)
WO (1) WO2017172752A1 (https=)

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KR102539153B1 (ko) * 2016-12-05 2023-06-01 삼성디스플레이 주식회사 표시 장치
WO2020160494A1 (en) * 2019-02-01 2020-08-06 Lon Bell Consulting Thermoelectric elements and devices with enhanced maximum temperature differences based on spatially varying distributed transport properties
US11421919B2 (en) 2019-02-01 2022-08-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
KR102846605B1 (ko) * 2020-02-04 2025-08-19 삼성디스플레이 주식회사 표시 모듈
US20210278887A1 (en) 2020-03-05 2021-09-09 Samsung Electronics Co., Ltd. Thermal control for electronic devices
WO2021257467A1 (en) 2020-06-15 2021-12-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
CN112254371A (zh) * 2020-09-28 2021-01-22 西南电子技术研究所（中国电子科技集团公司第十研究所） 多级梯度热电制冷片热控装置
US20230403935A1 (en) * 2022-05-20 2023-12-14 Apple Inc. Thermoelectric Cooling Modules
US12243469B2 (en) * 2022-12-13 2025-03-04 Lx Semicon Co., Ltd. Display driving apparatus for operating display device that displays image and control method therefor

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JPH02221821A (ja) * 1989-02-22 1990-09-04 Murata Mfg Co Ltd 薄膜熱電素子
JPH06318736A (ja) * 1993-05-06 1994-11-15 Canon Inc 薄膜ペルチェ熱電素子
US6282907B1 (en) 1999-12-09 2001-09-04 International Business Machines Corporation Thermoelectric cooling apparatus and method for maximizing energy transport
JP4218241B2 (ja) * 2001-12-27 2009-02-04 三菱電機株式会社 光モジュール、および光送信もしくは光受信装置
KR101094783B1 (ko) * 2003-10-27 2011-12-16 엘지디스플레이 주식회사 열전기 발생장치를 이용한 액정표시장치
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
JP3874365B2 (ja) * 2004-03-01 2007-01-31 松下電器産業株式会社 熱電変換デバイス、およびこれを用いた冷却方法および発電方法
US20060076046A1 (en) 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US7825324B2 (en) 2006-12-29 2010-11-02 Alcatel-Lucent Usa Inc. Spreading thermoelectric coolers
US20090071525A1 (en) 2007-09-17 2009-03-19 Lucent Technologies, Inc. Cooling Hot-Spots by Lateral Active Heat Transport
KR100997994B1 (ko) * 2009-04-13 2010-12-03 삼성전기주식회사 열전소자
US9443491B2 (en) * 2010-09-14 2016-09-13 Nec Display Solutions, Ltd. Information display device
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JP5857792B2 (ja) * 2012-02-27 2016-02-10 富士通株式会社 熱電デバイスおよびその製造方法
KR20160127740A (ko) * 2014-02-28 2016-11-04 고쿠리츠다이가쿠호징 나라 센탄카가쿠기쥬츠 다이가쿠인 다이가쿠 열전 변환 재료 및 열전 변환 소자
KR101574012B1 (ko) * 2014-04-17 2015-12-02 부산대학교 산학협력단 열전 장치 및 이를 포함하는 열전 시스템
CA2996898C (en) * 2015-09-04 2020-03-24 Hiroaki Nakaya Thermoelectric conversion element and thermoelectric conversion module

Also Published As

Publication number Publication date
KR20180130508A (ko) 2018-12-07
EP3436892B1 (en) 2020-09-23
EP3436892A1 (en) 2019-02-06
JP2019517128A (ja) 2019-06-20
US20170284708A1 (en) 2017-10-05
CA3015939A1 (en) 2017-10-05
US10267545B2 (en) 2019-04-23
BR112018069655A2 (pt) 2019-02-05
WO2017172752A1 (en) 2017-10-05
CN108780344B (zh) 2021-03-12
CN108780344A (zh) 2018-11-09

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