CA3015939A1 - In-plane active cooling device for mobile electronics - Google Patents

In-plane active cooling device for mobile electronics Download PDF

Info

Publication number
CA3015939A1
CA3015939A1 CA3015939A CA3015939A CA3015939A1 CA 3015939 A1 CA3015939 A1 CA 3015939A1 CA 3015939 A CA3015939 A CA 3015939A CA 3015939 A CA3015939 A CA 3015939A CA 3015939 A1 CA3015939 A1 CA 3015939A1
Authority
CA
Canada
Prior art keywords
electrode
layer
junction
transfer device
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA3015939A
Other languages
English (en)
French (fr)
Inventor
Peng Wang
Unnikrishnan Vadakkanmaruveedu
Vinay MITTER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CA3015939A1 publication Critical patent/CA3015939A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CA3015939A 2016-03-30 2017-03-28 In-plane active cooling device for mobile electronics Abandoned CA3015939A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/086,039 US10267545B2 (en) 2016-03-30 2016-03-30 In-plane active cooling device for mobile electronics
US15/086,039 2016-03-30
PCT/US2017/024517 WO2017172752A1 (en) 2016-03-30 2017-03-28 In-plane active cooling device for mobile electronics

Publications (1)

Publication Number Publication Date
CA3015939A1 true CA3015939A1 (en) 2017-10-05

Family

ID=58548893

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3015939A Abandoned CA3015939A1 (en) 2016-03-30 2017-03-28 In-plane active cooling device for mobile electronics

Country Status (8)

Country Link
US (1) US10267545B2 (https=)
EP (1) EP3436892B1 (https=)
JP (1) JP2019517128A (https=)
KR (1) KR20180130508A (https=)
CN (1) CN108780344B (https=)
CA (1) CA3015939A1 (https=)
TW (1) TW201806204A (https=)
WO (1) WO2017172752A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102539153B1 (ko) * 2016-12-05 2023-06-01 삼성디스플레이 주식회사 표시 장치
WO2020160494A1 (en) * 2019-02-01 2020-08-06 Lon Bell Consulting Thermoelectric elements and devices with enhanced maximum temperature differences based on spatially varying distributed transport properties
US11421919B2 (en) 2019-02-01 2022-08-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
KR102846605B1 (ko) * 2020-02-04 2025-08-19 삼성디스플레이 주식회사 표시 모듈
US20210278887A1 (en) 2020-03-05 2021-09-09 Samsung Electronics Co., Ltd. Thermal control for electronic devices
WO2021257467A1 (en) 2020-06-15 2021-12-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
CN112254371A (zh) * 2020-09-28 2021-01-22 西南电子技术研究所（中国电子科技集团公司第十研究所） 多级梯度热电制冷片热控装置
US20230403935A1 (en) * 2022-05-20 2023-12-14 Apple Inc. Thermoelectric Cooling Modules
US12243469B2 (en) * 2022-12-13 2025-03-04 Lx Semicon Co., Ltd. Display driving apparatus for operating display device that displays image and control method therefor

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02221821A (ja) * 1989-02-22 1990-09-04 Murata Mfg Co Ltd 薄膜熱電素子
JPH06318736A (ja) * 1993-05-06 1994-11-15 Canon Inc 薄膜ペルチェ熱電素子
US6282907B1 (en) 1999-12-09 2001-09-04 International Business Machines Corporation Thermoelectric cooling apparatus and method for maximizing energy transport
JP4218241B2 (ja) * 2001-12-27 2009-02-04 三菱電機株式会社 光モジュール、および光送信もしくは光受信装置
KR101094783B1 (ko) * 2003-10-27 2011-12-16 엘지디스플레이 주식회사 열전기 발생장치를 이용한 액정표시장치
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
JP3874365B2 (ja) * 2004-03-01 2007-01-31 松下電器産業株式会社 熱電変換デバイス、およびこれを用いた冷却方法および発電方法
US20060076046A1 (en) 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US7825324B2 (en) 2006-12-29 2010-11-02 Alcatel-Lucent Usa Inc. Spreading thermoelectric coolers
US20090071525A1 (en) 2007-09-17 2009-03-19 Lucent Technologies, Inc. Cooling Hot-Spots by Lateral Active Heat Transport
KR100997994B1 (ko) * 2009-04-13 2010-12-03 삼성전기주식회사 열전소자
US9443491B2 (en) * 2010-09-14 2016-09-13 Nec Display Solutions, Ltd. Information display device
DE102012105367A1 (de) 2012-02-24 2013-08-29 O-Flexx Technologies Gmbh Thermoelektrisches Modul und Herstellungsverfahren
JP5857792B2 (ja) * 2012-02-27 2016-02-10 富士通株式会社 熱電デバイスおよびその製造方法
KR20160127740A (ko) * 2014-02-28 2016-11-04 고쿠리츠다이가쿠호징 나라 센탄카가쿠기쥬츠 다이가쿠인 다이가쿠 열전 변환 재료 및 열전 변환 소자
KR101574012B1 (ko) * 2014-04-17 2015-12-02 부산대학교 산학협력단 열전 장치 및 이를 포함하는 열전 시스템
CA2996898C (en) * 2015-09-04 2020-03-24 Hiroaki Nakaya Thermoelectric conversion element and thermoelectric conversion module

Also Published As

Publication number Publication date
KR20180130508A (ko) 2018-12-07
EP3436892B1 (en) 2020-09-23
EP3436892A1 (en) 2019-02-06
JP2019517128A (ja) 2019-06-20
US20170284708A1 (en) 2017-10-05
US10267545B2 (en) 2019-04-23
TW201806204A (zh) 2018-02-16
BR112018069655A2 (pt) 2019-02-05
WO2017172752A1 (en) 2017-10-05
CN108780344B (zh) 2021-03-12
CN108780344A (zh) 2018-11-09

Similar Documents

Publication Publication Date Title
EP3436892B1 (en) In-plane active cooling device for mobile electronics
Saber et al. Performance optimization of cascaded and non-cascaded thermoelectric devices for cooling computer chips
KR100836305B1 (ko) 열전 모듈
CN103430442B (zh) 热电发电装置和便携式电子设备
US12591166B2 (en) Thermal-control system for a security camera
CN103975431B (zh) 微通道冷却器件、微通道冷却系统以及电子装置
US20080229759A1 (en) Method and apparatus for cooling integrated circuit chips using recycled power
JP2014204123A (ja) 印刷回路基板一体型熱電冷却器／加熱器
CN105091399A (zh) 一种制冷电路和终端及终端制冷方法
US20070091548A1 (en) Meter with reduced internal temperature rise and associated method
US20070297139A1 (en) Heat sink with themoelectric module
JP3977378B2 (ja) 半導体素子冷却用モジュール
CN104602484B (zh) 便携式设备及其散热装置
Solbrekken et al. Use of superlattice thermionic emission for" hot spot" reduction in a convectively-cooled chip
CN211698908U (zh) 压电模组及电子设备
BR112018069655B1 (pt) Dispositivo de resfriamento ativo em plano
JP2011082272A (ja) 熱電冷却装置
US11616185B2 (en) Energy harvesting device for electronic devices
JP5453296B2 (ja) 半導体装置
CN223810040U (zh) 散热器件及电子设备
JP2003309385A (ja) 放熱装置および電子機器
CN121604334A (zh) 电子设备
US20210329811A1 (en) Sub-ambient cooling system with condensation control for use with electronic devices and related methods
KR20120019517A (ko) 초소형 열전냉각모듈을 이용한 컴퓨터부품 냉각장치
Wang et al. On-Chip Hotspot Thermal Management with an Embedded Array of Silicon Thermoelectric Microcoolers

Legal Events

Date Code Title Description
FZDE Discontinued

Effective date: 20230627