CN108695212A - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
- Publication number
- CN108695212A CN108695212A CN201810319692.4A CN201810319692A CN108695212A CN 108695212 A CN108695212 A CN 108695212A CN 201810319692 A CN201810319692 A CN 201810319692A CN 108695212 A CN108695212 A CN 108695212A
- Authority
- CN
- China
- Prior art keywords
- substrate
- wafer
- processing device
- thread
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Abstract
The present invention provides a kind of substrate processing device.The liquid processing unit (U1) of the substrate processing device includes:Keep the rotary chuck (61) of chip (W);The rotary driving part (64) for making rotary chuck (61) rotate;The coating liquid supply nozzle (62) for chip (W) the supply coating liquid that the rotary chuck (61) rotated to the driving by rotary driving part (64) is kept;Recycle the cup body pedestal (65) from the coating liquid of chip (W) fallen with the face i.e. back side (W2) of face (surface (the W1)) opposite side for being supplied to coating liquid;And configure overleaf between (W2) and cup body pedestal (65), for collecting the collecting board (30) due to the thread that the wafer W to rotation supplies coating liquid and generates.Thereby, it is possible to inhibit the thread generated when the substrate to rotation supplies treatment fluid to be deposited in recoverer.
Description
Technical field
The present invention relates to substrate processing devices.
Background technology
Patent document 1, which is disclosed, will produce making the substrate coated with coating liquid (treatment fluid) rotate when extending coating liquid
Coating liquid is cured as linear thread, which is possible to be blocked in exhaust flow path, and in the upper of exhaust flow path
The collection portion of the thread is collected in side's setting.
Existing technical literature
Patent document
Patent document 1:No. 3175893 bulletin of utility model registration
Invention content
Technical problems to be solved by the inivention
By the device disclosed in above patent document 1, suitably thread can be inhibited to be blocked in exhaust flow path.
, there is a part for the thread generated by the rotation of substrate around the back side of substrate, be configured at holding substrate in this
The accumulations such as the cup body pedestal (recoverers of recycle process fluids) of lower section of maintaining part the case where.In guarantors such as the peripheries of cup body pedestal
More piping is arranged in the lower section for holding portion, and therefore, recycling the operation of the thread of accumulation becomes complicated.
The present invention has been made in view of the above-described circumstances, and its object is to inhibit when the substrate to rotation supplies treatment fluid
The thread of generation is deposited in the lower section for the maintaining part for keeping substrate.
Technical solution for solving technical problem
The substrate processing device of one embodiment of the present invention, including:Keep the maintaining part of substrate;Above-mentioned maintaining part is set to rotate
Rotary driving part;Treatment fluid supply unit, the above-mentioned maintaining part rotated to the driving by above-mentioned rotary driving part are kept
Substrate supply treatment fluid;With the first collection portion, configuration is in the lower section of above-mentioned maintaining part, for collecting due to rotation
It states substrate and supplies above-mentioned treatment fluid and the thread that generates.
The substrate processing device of the present invention is collected using first collection portion of the configuration in the lower section of maintaining part due to rotation
The substrate supply treatment fluid that turns and the thread that generates.Due to the lower section configuration the of the substrate in the generating unit as thread
One collection portion, therefore can effectively collect thread.Substrate processing device according to the present invention as a result, can inhibit right
The thread generated when the substrate supply treatment fluid of rotation is deposited in the lower section of maintaining part.
Above-mentioned substrate processing device further include receive escape to substrate back side treatment fluid recoverer, above-mentioned first
Collection portion configures between maintaining part and recoverer.First collection portion is configured in the top of recoverer, and thus, it is possible to inhibit online
The recoverer that shape object is easy accumulation accumulates thread.
Above-mentioned substrate processing device can also include the back flushing liquor supply that back flushing liquor is supplied to the back side of substrate
Portion.Back flushing liquor is supplied by the back side to substrate, the treatment fluid for being fed into the surface of substrate can be inhibited around substrate
The back side.In addition, the back flushing liquor for being fed into the back side of substrate is reflected back by the back side, and configuration is fed into than substrate
The back side the first collection portion on the lower.Thereby, it is possible to rinse thread collected by the first collection portion with back flushing liquor.Cause
Become liquid for the gleanings that are rinsed, thus will not as threadiness when be deposited in recoverer.
There is first collection portion the first opening, back flushing liquor supply unit can have upward in the lower section of the first opening
The outlet of opening.The back flushing liquor supplied as a result, from back flushing liquor supply unit can suitably be reached through the first opening
The back side of substrate functions well as the effect of above-mentioned back flushing liquor.That is, in the outlet from back flushing liquor supply unit
When back flushing liquor is gone upward, back flushing liquor can be made to pass through the back side that the first opening reaches substrate, it can be suitably clear
Wash the back side.Due to rearwardly can sufficiently supply back flushing liquor, the back fallen from the back side to the first collection portion rushes
The amount of washing lotion also can be sufficient.
First collection portion can be constituted and be fixed seperatedly with maintaining part.Since the first collection portion is seperated with maintaining part
The component without rotation (position is fixed), therefore with rotation the case where compared with can more effectively collect thread.
First collection portion can be integrally provided with maintaining part, be rotated together with maintaining part.Since the first collection portion carries out
Rotation, therefore back flushing liquor can be rinsed to multiple faces of the first collection portion.Thereby, it is possible to more effectively use back flushing liquor
To rinse the thread of the first collection portion collection.
First collection portion can be formed as plate.Even if can if in the limited space as a result, in substrate processing device
It is enough to carry out exhausting line shape object in simple structure.
First collection portion can be tilted relative to the face parallel with the back side of substrate.Thereby, it is possible to form back flushing liquor
Hold runny structure (can make thread suitably becomes the structure of liquid).
Above-mentioned substrate processing device can also include:What is extended in above-below direction from the position that outside surrounds maintaining part
Exhaust flow path;It is collected on the top of exhaust flow path for collecting the second of thread with being configured in a manner of covering exhaust flow path
Portion, the second collection portion have the second opening for making the discharge gas flowed in exhaust flow path pass through.Thread due to treatment fluid from
The end of the substrate of rotation is thrown out of and generates.Therefore, thread easy tos produce in the end side i.e. outside of maintaining part of substrate.
That is, being easy to be blocked by thread in the exhaust flow path that the position for surrounding maintaining part from outside extends in above-below direction.In this regard, with
The second collection portion is arranged in the mode of covering exhaust flow path, and thread can be inhibited to block exhaust flow path.In addition, the second collection portion shape
At there is the opening portion for making discharge gas pass through.Thereby, it is possible to be suitably exhausted in flow path while collecting thread
Exhaust.
The effect of invention
In accordance with the invention it is possible to which the thread generated when the substrate to rotation supplies treatment fluid is inhibited to be deposited in holding base
The lower section of the maintaining part of piece.
Description of the drawings
Fig. 1 is the stereogram of the outline structure for the substrate handling system for indicating first embodiment.
Fig. 2 is the sectional view of the II-II lines in Fig. 1.
Fig. 3 is the sectional view of the III-III lines in Fig. 2.
Fig. 4 is the schematic diagram of the liquid processing unit of first embodiment.
Fig. 5 is the schematic diagram of the collecting part of first embodiment.
Fig. 6 is the schematic diagram of the liquid processing unit of second embodiment.
Fig. 7 is the schematic diagram of the collecting part of second embodiment.
Fig. 8 is the schematic diagram of the liquid processing unit of third embodiment.
Fig. 9 is the schematic diagram of the liquid processing unit of the 4th embodiment.
Figure 10 is the schematic diagram of the 4th embodiment collecting part.
Reference sign
2 ... coatings and developing apparatus (substrate processing device)
30,40,50 ... collecting boards (the first collection portion)
30b, 40b ... pass through mouth
61 ... rotary chucks (maintaining part)
62 ... coating liquid supply nozzles (treatment fluid supply unit),
64 ... rotary driving parts
65 ... cup body pedestals (recoverer)
70 ... discharge units
77 ... back flushing liquor supply nozzles (back flushing liquor supply unit)
80 ... exhaust flow paths
90 ... collecting parts (the second collection portion)
The opening portions 90d ...
W ... chips (substrate)
The back sides W2 ....
Specific implementation mode
[Yi Shishifangshi ]
Hereinafter, first embodiment is described in detail with reference to accompanying drawings.In explanation, to identical element or there is identical work(
The element of energy marks identical reference numeral, and the repetitive description thereof will be omitted.
(substrate handling system)
Substrate handling system 1 is to carry out the formation of photonasty overlay film, the exposure of the photonasty overlay film to substrate and this is photosensitive
The system of the development of property overlay film.The substrate of process object is, for example, the wafer W of semiconductor.Photonasty overlay film is, for example, resist
Film.
Substrate handling system 1 includes coating and developing apparatus 2 and exposure device 3.Exposure device 3 carries out being formed in wafer W
On resist film exposure-processed.Specifically, by the method for immersion exposure etc., to the exposure object part of resist film
Irradiation energy line.Before the exposure-processed that exposure device 3 carries out, progress is formed on the surface of wafer W for coating and developing apparatus 2
The processing of resist film carries out the development treatment of resist film after exposure-processed.
(coating and developing apparatus)
Hereinafter, an example as substrate processing device, illustrates the structure of coating and developing apparatus 2.Such as Fig. 1~Fig. 3
Shown, coating and developing apparatus 2 include conveying unit 4, processing unit 5, interface portion 6 and controller 100.
The feeding and the crystalline substance out of coating and developing apparatus 2 that conveying unit 4 carries out the wafer W into coating and developing apparatus 2
The submitting of piece W.Such as conveying unit 4 can support multiple supporting parts 11 of wafer W, built-in handing-over arm A1.Supporting part 11 is for example
Store circular multiple wafer Ws.Handing-over arm A1 takes out wafer W from supporting part 11 and is handed off to processing unit 5, and crystalline substance is received from processing unit 5
Piece W is simultaneously backed into supporting part 11.
Processing unit 5 has multiple processing components 14,15,16,17.As shown in Figures 2 and 3, processing component 14,15,16,17
It is built-in with multiple liquid processing unit U1, multiple thermal treatment unit U2 and transports the carrying arm A3 of wafer W to these units.Processing group
Part 17 is also built-in with the direct carrying arm A6 that wafer W is transported not via liquid processing unit U1 and thermal treatment unit U2.Liquid processing
Treatment fluid is coated in the surface of wafer W by unit U1.Thermal treatment unit U2 is built-in with such as heating plate and coldplate, uses heating plate
Wafer W is heated, is cooled down the wafer W after heating with coldplate, to being heat-treated.
Processing component 14 forms base film layer by liquid processing unit U1 and thermal treatment unit U2 on the surface of wafer W.Place
The liquid processing unit U1 for managing component 14 applies the treatment fluid of base film layer formation on the wafer W.The heat treatment of processing component 14
Unit U2 carries out the various heat treatments associated with the formation of base film layer.
Processing component 15 forms resist film by liquid processing unit U1 and thermal treatment unit U2 on base film layer.Processing group
The liquid processing unit U1 of part 15 is by the treatment fluid (coating liquid) of resist film formation coated on base film layer.Processing component 15
Thermal treatment unit U2 carry out the various heat treatments associated with the formation of resist film.The liquid processing unit U1's of processing component 15
It states later in detail.
Processing component 16 forms upper layer film by liquid processing unit U1 and thermal treatment unit U2 on resist film.Processing group
The liquid processing unit U1 of part 16 is by the treatment fluid of upper layer film formation coated on resist film.The heat treatment of processing component 16
Unit U2 carries out the various heat treatments associated with the formation of upper layer film.
Processing component 17 be exposed by liquid processing unit U1 and thermal treatment unit U2 after resist film development at
Reason.Treatment fluid (the development of development is applied on the surface of wafer Ws of the liquid processing unit U1 of processing component 17 after end exposure
Liquid) after, it is rinsed using clean treatment fluid (flushing liquor), thus carries out the development treatment of resist film.Processing
The thermal treatment unit U2 of component 17 is carried out and the associated various heat treatments of development treatment.As the concrete example of heat treatment, Neng Goulie
Lift the heat treatment (PEB before development treatment:Post Exposure Bake), the heat treatment (PB after development treatment:Post
Bake) etc..
4 side of conveying unit in processing unit 5 is provided with shelving unit U10.Shelving unit U10 is divided into above-below direction
Multiple units of arrangement.Lifting arm A7 is provided near shelving unit U10.Lifting arm A7 makes wafer W in shelving unit U10
Unit each other lift.6 side of interface portion in processing unit 5 is provided with shelving unit U11.Shelving unit U11 is divided
For the multiple units arranged in above-below direction.
Interface portion 6 carries out the handing-over of wafer W between exposure device 3.Such as the built-in handing-over arm A8 of interface portion 6, with exposure
Electro-optical device 3 connects.Wafer Ws of the handing-over arm A8 by configuration in shelving unit U11 is handed off to exposure device 3, is received from exposure device 3
Wafer W simultaneously backs into shelving unit U11.
Controller 100 for example controls coating and developing apparatus 2 executes coating, development treatment in the following order.
First, the control of controller 100 handing-over arm A1 by the wafer W in supporting part 11 to be transported to shelving unit U10, control
The wafer W to be configured the unit in processing component 14 by lifting arm A7.
Then, controller 100 controls carrying arm A3 so that the wafer W of shelving unit U10 to be transported in processing component 14
Liquid processing unit U1 and thermal treatment unit U2, liquid processing unit U1 and thermal treatment unit U2 is on the surface of the wafer W for control
Form base film layer.Later, controller 100 control carrying arm A3 to send the wafer W for being formed with base film layer back to shelving unit U10,
Lifting arm A7 is controlled so that the wafer W to be configured to the unit in processing component 15.
Then, controller 100 controls carrying arm A3 so that the wafer W of shelving unit U10 to be transported in processing component 15
Liquid processing unit U1 and thermal treatment unit U2, liquid processing unit U1 and thermal treatment unit U2 is in the base film layer of the wafer W for control
Upper formation resist film.Later, controller 100 controls carrying arm A3 so that wafer W is sent back to shelving unit U10, control lifting
The wafer W to be configured the unit in processing component 16 by arm A7.
Then, controller 100 controls carrying arm A3 so that the wafer W of shelving unit U10 to be transported in processing component 16
Each unit, liquid processing unit U1 and thermal treatment unit U2 on the resist film of the wafer W to form upper layer film for control.Later,
Controller 100 controls carrying arm A3 so that wafer W is sent back to shelving unit U10, and control lifting arm A7 is to exist wafer W configuration
The unit of processing component 17.
Then, controller 100 controls direct carrying arm A6 so that the wafer W of shelving unit U10 is transported to shelving unit
U11, arm A8 by the wafer W to pass out to exposure device 3 for control handing-over.Later, the control of controller 100 handing-over arm A8 is with from exposure
Device 3 receives the wafer W for being carried out exposure-processed and backs into shelving unit U11.
Then, controller 100 controls carrying arm A3 so that the wafer W of shelving unit U11 to be transported in processing component 17
Each unit, control liquid processing unit U1 and thermal treatment unit U2 to the resist film of the wafer W to implement development treatment.Later,
Controller 100 controls carrying arm A3 so that wafer W is sent back to shelving unit U10, and control lifting arm A7 and handing-over arm A1 were with should
Wafer W sends back in supporting part 11.More than, coating, development treatment terminate.
In addition, the specific structure of substrate processing device is not limited to the coating of the above illustration and the structure of developing apparatus 2.Base
As long as piece treating apparatus have overlay film formation liquid processing unit U1 (the liquid processing unit U1 of processing component 14,15,16) and
The controller 100 of above-mentioned component can be controlled, then can be arbitrary structure.
(liquid processing unit)
Then, the liquid processing unit U1 of processing component 15 is described in detail.As shown in figure 4, the liquid of processing component 15
Processing unit U1 includes rotary chuck 61 (maintaining part), coating liquid supply nozzle 62 (treatment fluid supply unit), solvent supply nozzle
63, rotary driving part 64, cup body pedestal 65 (recoverer), back flushing liquor supply nozzle 77 (back flushing liquor supply unit), row
Go out portion 70 and collecting board 30 (the first collection portion).
(rotary chuck)
Rotary chuck 61 is horizontal to keep wafer W (substrate).Rotary chuck 61 extends via (vertical direction) in above-below direction
Axis 66 and rotary driving part 64 link.Rotary chuck 61 makes the rotation of axis 66 correspondingly be revolved around vertical axis with rotary driving part 64
Turn.Rotary chuck 61 is rotated around vertical axis, and the wafer W for being thus held in rotary chuck 61 is rotated around vertical axis.In addition, revotating card
Disk 61 makes the lifting of axis 66 correspondingly lift in above-below direction with rotary driving part 64.
(rotary driving part)
Rotary driving part 64 makes rotary chuck 61 be rotated around vertical axis.Rotary driving part 64 make axis 66 rotate, thus make with
The rotary chuck 61 of the upper end connection of the axis 66 rotates.In addition, rotary driving part 64 makes axis 66 lift, thus make and the axis 66
The rotary chuck 61 of upper end connection lifts in above-below direction.
Rotary driving part 64 makes rotary chuck 61 with appropriate in each process of the liquid processing unit U1 of processing component 15
Speed rotation.The process packet, which includes at least, pre-wets process, coating liquid supply step and coating liquid extension process.Pre-wet work
Sequence is the liquid film for forming organic solvent on the wafer W before by coating liquid coated on wafer W, to make coating liquid be easy
It extends on the wafer W, and is difficult between wafer W and coating liquid the process for being mixed into bubble.Coating liquid supply step is will be high
The process that the coating liquid of viscosity resist etc. is supplied to wafer W.It is to make the coating liquid of coating on the wafer W that coating liquid, which extends process,
The process for extending to the peripheral part of wafer W.Coated film extend process in, by making wafer W rotate, a part of coated film from
The end of wafer W is thrown out of, and the coated film of high viscosity (such as 1000cp or more) is cured as linear and becomes thread.Rotation is driven
Dynamic portion 64 for example makes wafer W be rotated with 500~1500rpm in pre-wetting process.Rotary driving part 64 supplies work in coating liquid
Wafer W is for example set to be rotated with 800~1500rpm in sequence.Rotary driving part 64 coating liquid extend process in for example make wafer W with
500~1200rpm rotates.
(coating liquid supply nozzle)
Coating liquid supply nozzle 62 is in coating liquid supply step to being rotated by the driving of rotary driving part 64
The coating liquid (treatment fluid) of wafer W supply resist etc. that is kept of rotary chuck 61.Coating liquid supply nozzle 62 supplies example
If organic solvent concentration is in the coating liquid of 70% high viscosity (such as 2000cp or more) below.Coating liquid supply nozzle 62 is from crystalline substance
Coating liquid is supplied to the surface W1 of wafer W above the approximate centre position of piece W.In addition, coating liquid supply nozzle 62 can be from crystalline substance
Coating liquid is supplied above position between the center and peripheral part of piece W, it can also be in the center and peripheral part of wafer W
Between supply coating liquid while scanning.
(solvent supply nozzle)
Solvent supply nozzle 63 is in the rotation to being rotated by the driving of rotary driving part 64 in pre-wetting process
The organic solvent of the wafer W supply diluent that chuck 61 is kept etc..Solvent supply nozzle 63 is in the center of wafer W and week
Organic solvent is for example supplied while scanning with the speed of 10~200mm/sec between edge.In addition, solvent supply nozzle 63
Organic solvent is supplied in the state of can stopping above the approximate centre position of wafer W.
(cup body pedestal)
Cup body pedestal 65 is configured in the lower section of rotary chuck 61 in a manner of surrounding axle 66.The reception of cup body pedestal 65 escapes to
Wafer W back side W2 (face with the surface W1 opposite side for being supplied to coated film of wafer W) sides and the coating liquid that falls, is carried out
Recycling.
(back flushing liquor supply nozzle)
The back that back flushing liquor supply nozzle 77 supplies the organic solvent as diluent etc. to the back side W2 of wafer W rushes
Washing lotion.Back flushing liquor supply nozzle 77 is arranged at such as the two of cup body pedestal 65, passes through mouth in aftermentioned collecting board 30
The lower section of 30b has the outlet being open upward.In coating liquid extends process, by the way that back flushing liquor is supplied to chip
The back side W2 of W can inhibit the coated film for being supplied to surface W1 around the back side sides W2.In addition, in coated film extends process, companion
With the rotation of wafer W, when in the end of wafer W, generation coated film is cured as thread obtained by threadiness, due to back flushing liquor
It is fed into the back side W2 of wafer W, therefore the thread just generated can be dissolved.Also, it is fed into the back side W2 of wafer W
Back flushing liquor is reflected back because of back side W2, is also fed with the collecting board 30 (aftermentioned) for configuring the overleaf lower section of W2.
(discharge unit)
The configuration of discharge unit 70 is to be related to exhaust and the discharge of coating liquid (to give up in the position for surrounding rotary chuck 61 from outside
Liquid) structure.Discharge unit 70 as the processing cup body for surrounding rotary chuck 61 there is inside cup body 71 and configuration to be wrapped from outside
Enclose the outside cup body 72 of the position of the inside cup body 71.It is formed with exhaust flow path between inside cup body 71 and outside cup body 72
80。
Inside cup body 71 includes:From the back side sides the W2 peripheral part close proximity with wafer W outward 72 direction of cup body and
Lower section (outer side-lower) tilts the cricoid inclined wall 79 extended;Continuously extend below vertical with the lower end with inclined wall 79
Cricoid vertical wall 75.The inclined wall 79 and vertical wall 75 be for the coating liquid thrown away from the end of wafer W flow down into
The structure of row guiding.The bottom of outside cup body 72 is formed on recess portion, is configured to cricoid liquid receiving part.Outside cup body 72 is under
Portion is formed with waste liquid port 73 and is being formed with exhaust outlet 78 by the position of rotary chuck 61 (inside) than waste liquid port 73.In waste liquid
It is formed with the dividing wall 76 extended upward from below between mouth 73 and exhaust outlet 78.Dividing wall 76 is in the inner part than vertical wall 75
Position extend to the position more upper than the lower end of vertical wall 75.Labyrinth is formed with by dividing wall 76 and vertical wall 75 as a result,
Construction, gas and liquid are suitably detached, are suitably discharged from exhaust outlet 78 by gas, from waste liquid port 73 by liquid suitably
Discharge.
(collecting board)
Collecting board 30 is configured in the lower section of rotary chuck 61, in more detail between rotary chuck 61 and cup body pedestal 65,
It is the component for collecting the thread generated due to the wafer W to rotation supplies coating liquid.In more detail, collecting board 30 with
The mode of surrounding axle 66 is configured in the upper surface of cup body pedestal 65.Constitute to the component different from rotary chuck 61 of collecting board 30
Fixed plate-shaped member.Collecting board 30 is fixed on cup body pedestal 65.
As shown in figure 5, collecting board 30 is formed as discoid.Collecting board 30 includes:Make axis 66 by axis hole 30a;Make from
The back flushing liquor that back flushing liquor supply nozzle 77 is supplied to the back side W2 of wafer W by pass through mouth 30b (first opening);
It is inserted into the pin hole 30x for the positioning pin fixed to cup body pedestal 65.Axis hole 30a is formed in the substantially central portion of collecting board 30
Point.By mouth 30b in the state that collecting board 30 is fixed on cup body pedestal 65, being formed in can make to come from back flushing liquor
The back flushing liquor of supply nozzle 77 by position.In present embodiment, back flushing liquor supply nozzle 77 is arranged in cup body
Two positions of pedestal 65, what is be correspondingly formed is also formed in two positions of collecting board 30 by mouth 30b.Pin hole 30x such as shapes
At at 2 positions symmetrical across center portion of collecting board 30.
Collecting board 30 can be the component for being carried out the various processing for preferably collecting thread.For example, collecting
Plate 30 can have jog on surface.In addition, collecting board 30 can also be that its surface is carried out the component of blasting treatment.Separately
Outside, collecting board 30 can also have air nozzle, temperature and humidity and/or air-flow be controlled by air nozzle, so that thread
State change.
Collecting board 30 is such as by metal, PTFE (Poly Tetra Fluoro Ethylene, the polytetrafluoroethyl-ne stainless steel
Alkene), PTEFE (Poly Chloro Tri Furuoro Ethylene, polychlorotrifluoroethylene) or polytrifluorochloroethylene etc.
There is the material of resistance to feeding habits to constitute coating liquid.
(function and effect of first embodiment)
The liquid processing unit U1 of first embodiment includes:Keep the rotary chuck 61 of wafer W;Rotary chuck 61 is set to rotate
Rotary driving part 64;The wafer W kept to the rotary chuck 61 rotated by the driving of rotary driving part 64 supplies
To the coating liquid supply nozzle 62 of coating liquid;It recycles from wafer W and face (surface W1) opposite side for being supplied to coating liquid
The cup body pedestal 65 for the coating liquid that face, that is, back side W2 is fallen;Configuration is overleaf between W2 and cup body pedestal 65, for collect because to
The wafer W supply coating liquid of rotation and the collecting board 30 of thread generated.
In liquid processing unit U1, the thread generated because supplying coating liquid to the wafer W of rotation is by configuring overleaf
Collecting board 30 between W2 and cup body pedestal 65 is collected.It is configured by the lower section of the wafer W in the generating unit for being used as thread
Collecting board 30 can effectively collect thread.In addition, by configuring collecting board 30 in the top of cup body pedestal 65, can press down
System accumulates thread in cup body pedestal 65.As a result, according to liquid processing unit U1, can inhibit to supply painting in the wafer W to rotation
Apply the space (such as cup body pedestal 65) that the thread generated when liquid is deposited in the lower section of rotary chuck 61.
Liquid processing unit U1 further includes the back flushing liquor supply nozzle that back flushing liquor is supplied to the back side W2 of wafer W
77.By the way that back flushing liquor to be supplied to the back side W2 of wafer W, the coating liquid for the surface W1 for being fed into wafer W can be inhibited
Around the back side W2 of wafer W.In addition, the back flushing liquor for being fed into back side W2 is reflected back because of back side W2, it is also fed with
Configure the collecting board 30 of the overleaf lower section of W2.Thereby, it is possible to rinse thread collected by collecting board 30 with back flushing liquor.
Because the gleanings being flushed become liquid, cup body pedestal 65 will not be deposited in as when threadiness.
Collecting board 30 has through mouth 30b, and back flushing liquor supply nozzle 77 has upward by the lower section of mouth 30b
The outlet of opening.The back flushing liquor supplied as a result, from back flushing liquor supply nozzle 77 is passed through suitably to be reached by mouth 30b
The back side W2 of wafer W, thereby, it is possible to function well as the effect of above-mentioned back flushing liquor.That is, being supplied from back flushing liquor
When the back flushing liquor of the outlet of nozzle 77 is gone upward, back flushing liquor can be made to pass through, wafer W is reached by mouth 30b
Back side W2 can suitably clean back side W2.Since rearwardly back flushing liquor fully can be supplied by W2, from back side W2
The amount for dropping to the back flushing liquor of collecting board 30 also can be sufficient.
In addition, in the present embodiment, illustrate to rinse the thread collected by collecting board 30 using back flushing liquor, but
Even if the thread collected by collecting board 30 is not rinsed well by back flushing liquor, cup is deposited in previous such ground thread
The structure of body pedestal is compared, and the utilization of liquid processing unit also becomes easy.That is, previous accumulate wired shape in cup body pedestal like that
In the case of object, need directly to clean and be provided with the cup body pedestal of more piping, liquid processing unit with becoming complicated.It is right
This, even if thread is not rinsed well by back flushing liquor, passes through taking-up in the structure for collecting thread with collecting board 30
Collecting board 30 is cleaned, and thread can be also easily removed.It is compared with the past as a result, that using for liquid processing unit can be made to become
It must be easy.
Collecting board 30 is seperated with rotary chuck 61, is fixed on cup body pedestal 65.By making collecting board 30 and rotary chuck
61 is seperated, makes it without rotation (position is fixed), thread can be effectively collected compared with the case where being rotated.
Collecting board 30 is formed as plate.Even if can be with letter if as a result, in the limited space in liquid processing unit U1
Single structure recycles thread.
[Er Shishifangshi ]
Then, illustrate the liquid processing unit U1A of second embodiment referring to figure 6 and figure 7.In addition, in present embodiment
In explanation, the difference of main explanation and above-mentioned first embodiment.
As shown in fig. 6, in the liquid processing unit U1A of second embodiment, the receipts illustrated in the first embodiment are substituted
Collect plate 30, and has collecting board 40.Collecting board 40 is integrally provided with rotary chuck 61, is rotated together with rotary chuck 61.More
Particularly, the configuration of collecting board 40 is rotated in the lower surface of rotary chuck 61 with rotary chuck 61 together.
As shown in fig. 7, discoid collecting board 40 be circumferentially formed with it is multiple for making what back flushing liquor passed through to pass through
Mouth 40b.In example shown in Fig. 7, it is formed at 8 in collecting board 40 by mouth 40b.In collecting board 40, it is being supplied to back
The position (position radially) of flushing liquor at least (does not make back than being not provided with by the region of mouth 40b by mouth 40b
Flushing liquor passes through) region is wide.Even if can make back flushing liquor from passing through mouth if as a result, in the structure that collecting board 40 rotates
40b suitably by.
As noted above, in the liquid processing unit U1A of second embodiment, collecting board 40 and rotary chuck 61 are integrally
Setting, rotates together with rotary chuck 61.Collecting board 40 is rotated, so as to move back in multiple surface currents of collecting board 40
Flushing liquor.Thereby, it is possible to more effectively back flushing liquor be used to rinse thread collected by collecting board 40.
In addition, the configuration of collecting board 40 is in the lower surface of rotary chuck 61, thereby, it is possible to simply form above-mentioned collecting board 40
The structure of rotation, that is, the structure by back flushing liquor flushing thread.
[Third Shi Shifangshi ]
Then, the liquid processing unit U1B of third embodiment is illustrated with reference to Fig. 8.In addition, in description of the present embodiment,
The difference of main explanation and above-mentioned first and second embodiment.
As shown in figure 8, in the liquid processing unit U1B of third embodiment, the receipts illustrated in the first embodiment are substituted
Collection plate 30 and the collecting board 40 illustrated in second embodiment, and have collecting board 50.Collecting board 50 is relative to the back of the body with wafer W
Face parallel face W2 tilts.In more detail, collecting board 50 by paraxial 66 side (inside) be heavy wall, and with by
The side (outside) of nearly discharge unit 70 is close and becomes thin-walled, is tilted relative to the face parallel with the back side W2 of wafer W.
In such inclined collecting board 50, rinsed at the back that the back side W2 of wafer W is reflected back and reached collecting board 50
Liquid BR readily flows to 70 side of discharge unit on collecting board 50 (with reference to Fig. 8).That is, can form back flushing liquor BR is easy flowing
Structure.Thereby, it is possible to effectively rinse the thread SI collected in collecting board 50, thread SI can be made suitably to become liquid
Shape.
[4th Shi Shifangshi ]
Then, the liquid processing unit U1C of the 4th embodiment is illustrated with reference to Fig. 9 and Figure 10.In addition, present embodiment is said
In bright, the difference of main explanation and above-mentioned first~third embodiment.
As shown in figure 9, the liquid processing unit U1C of the 4th embodiment, in addition to the structure illustrated in the first embodiment
Except, further include collect thread collecting part 90 (the second collection portion), from outside surround rotary chuck 61 position,
The top of the exhaust flow path 80 extended in above-below direction is configured in a manner of covering exhaust flow path 80.Collecting part 90 is with the row of blocking
The mode on air-flow road 80 is arranged.Collecting part 90 have make the opening portion that the discharge gas flowed in exhaust flow path 80 passes through
90d (the second opening) (referring to Fig.1 0), collects while being thus configured to be exhausted from opening portion 90d and reaches exhaust stream
The thread of 80 side of road.
As shown in Figure 10, collecting part 90 has metal interior side ring 90a such as stainless steel, diameter than interior side ring
Big 90a outer side ring 90b, by the connecting member 90c of the multiple such as triangular shapes connected between interior side ring 90a and outer side ring 90b.
In collecting part 90, the area of the connecting member 90c for being provided with triangular shape in the region between interior side ring 90a and outer side ring 90b
It is opening portion 90d other than domain.It can be connected to, can will locate via opening portion 90d above and below collecting part 90 as a result,
The atmosphere of reason chamber interior is discharged to exhaust flow path 80.Collecting part 90 is made using opening portion 90d in discharge gas and discharge gas
Liquid collect thread by the lower section of collecting part 90, and using connecting member 90c.
In the manner described above, thread generates due to coating liquid is thrown out of from the peripheral part of the wafer W of rotation.Therefore, linear
Object easy tos produce in the peripheral part side of the wafer W i.e. outside of rotary chuck 61.That is, in the position for surrounding rotary chuck 61 from outside
It sets, thread is easy to block the exhaust flow path 80 extended in above-below direction.In this regard, being set in a manner of covering exhaust flow path 80
Collecting part 90 is set, thread can be inhibited to block exhaust flow path 80.In addition, being formed in collecting part 90 keeps discharge gas logical
The opening portion 90d crossed.The exhaust that thereby, it is possible to be suitably exhausted while collecting thread in flow path 80.
The first~the 4th embodiment of the present invention is this concludes the description of, but the present invention is not limited to the above embodiments, it can
By carried out in the range of not changing the purport recorded in each claim deform or suitable for others in a manner of.
For example, illustrate the example by the structure of the present invention for the liquid processing unit U1 of processing component 15, but it is unlimited
In this, structure of the invention also can be used in generating each of thread by supplying highly viscous treatment fluid to the substrate of rotation
Kind device.
Claims (9)
1. a kind of substrate processing device, which is characterized in that including:
Keep the maintaining part of substrate;
Make the rotary driving part of the maintaining part rotation;
Treatment fluid supply unit, the substrate supply that the maintaining part rotated to the driving by the rotary driving part is kept
Treatment fluid;With
First collection portion, configuration is in the lower section of the maintaining part, for collecting due to described in the substrate supply to rotation
Treatment fluid and the thread generated.
2. substrate processing device as described in claim 1, it is characterised in that:
Further include the recoverer for the treatment fluid for receiving the back side for escaping to the substrate,
The first collection portion configuration is between the maintaining part and the recoverer.
3. substrate processing device as claimed in claim 1 or 2, it is characterised in that:
It further include the back flushing liquor supply unit that back flushing liquor is supplied to the back side of the substrate.
4. substrate processing device as claimed in claim 3, it is characterised in that:
First collection portion has the first opening,
The back flushing liquor supply unit has the outlet being open upward in the lower section of first opening.
5. substrate processing device as described in any one of claims 1 to 4, it is characterised in that:
First collection portion is constituted and is fixed seperatedly with the maintaining part.
6. substrate processing device as described in any one of claims 1 to 4, it is characterised in that:
First collection portion is integrally provided with the maintaining part, and is rotated together with the maintaining part.
7. such as substrate processing device according to any one of claims 1 to 6, it is characterised in that:
First collection portion is formed as plate.
8. substrate processing device as claimed in claim 7, it is characterised in that:
First collection portion is tilted relative to the face parallel with the back side of the substrate.
9. such as substrate processing device according to any one of claims 1 to 8, which is characterized in that further include:
In the exhaust flow path that the position for surrounding the maintaining part from outside extends in above-below direction;With
The on the top of the exhaust flow path for collecting the thread is configured in a manner of covering the exhaust flow path
Two collection portions,
Second collection portion has the second opening for making the discharge gas flowed in the exhaust flow path pass through.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-078260 | 2017-04-11 | ||
| JP2017078260A JP6883462B2 (en) | 2017-04-11 | 2017-04-11 | Board processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108695212A true CN108695212A (en) | 2018-10-23 |
| CN108695212B CN108695212B (en) | 2023-03-28 |
Family
ID=63844973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810319692.4A Active CN108695212B (en) | 2017-04-11 | 2018-04-11 | Substrate processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6883462B2 (en) |
| KR (1) | KR102448807B1 (en) |
| CN (1) | CN108695212B (en) |
| TW (1) | TWI754031B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113661014A (en) * | 2019-04-16 | 2021-11-16 | 大金工业株式会社 | Wafer cup |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110420803B (en) * | 2019-06-25 | 2020-12-11 | 德清县诚达金属材料有限公司 | Movable type drying accelerating type sensor sealing equipment |
| KR102386209B1 (en) * | 2020-03-06 | 2022-04-13 | 세메스 주식회사 | Apparatus for treating substrate and method for treating substrate |
| TWI800064B (en) * | 2021-10-29 | 2023-04-21 | 弘塑科技股份有限公司 | Single wafer wet processing equipment |
| KR102584570B1 (en) * | 2021-12-31 | 2023-10-05 | 세메스 주식회사 | Apparatus for treating a substrate and method for reducing scattering |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW475212B (en) * | 1999-12-17 | 2002-02-01 | Tokyo Electron Ltd | Coating film forming apparatus |
| TW514959B (en) * | 1999-12-16 | 2002-12-21 | Tokyo Electron Ltd | Film forming unit |
| TW200515498A (en) * | 2003-10-02 | 2005-05-01 | Tokyo Electron Ltd | Coating film forming apparatus and coating film forming method |
| CN1749859A (en) * | 2004-09-14 | 2006-03-22 | 东京応化工业株式会社 | Coating device |
| CN102416761A (en) * | 2010-09-28 | 2012-04-18 | 大日本网屏制造株式会社 | Pattern forming method and pattern forming apparatus |
| JP3175893U (en) * | 2012-03-15 | 2012-06-07 | 東京エレクトロン株式会社 | Liquid processing equipment |
| JP2013243317A (en) * | 2012-05-22 | 2013-12-05 | Tokyo Ohka Kogyo Co Ltd | Coating applicator, substrate processing system, and substrate processing method |
| JP2016184644A (en) * | 2015-03-26 | 2016-10-20 | 株式会社テックインテック | Rotary coating apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5325267U (en) * | 1976-08-10 | 1978-03-03 | ||
| JPS54103164U (en) * | 1977-12-27 | 1979-07-20 | ||
| JPH01140628A (en) * | 1987-11-26 | 1989-06-01 | Nec Corp | Resist coating equipment |
| JP3175893B2 (en) | 1994-03-25 | 2001-06-11 | 日石三菱株式会社 | Hydraulic oil composition for shock absorber |
| US7670643B2 (en) * | 2004-07-01 | 2010-03-02 | Tokyo Electron Limited | Method and system for dispensing resist solution |
| JP6314779B2 (en) * | 2014-10-01 | 2018-04-25 | 東京エレクトロン株式会社 | Liquid processing method, storage medium, and liquid processing apparatus |
-
2017
- 2017-04-11 JP JP2017078260A patent/JP6883462B2/en active Active
-
2018
- 2018-03-27 TW TW107110402A patent/TWI754031B/en active
- 2018-04-05 KR KR1020180039586A patent/KR102448807B1/en active IP Right Grant
- 2018-04-11 CN CN201810319692.4A patent/CN108695212B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW514959B (en) * | 1999-12-16 | 2002-12-21 | Tokyo Electron Ltd | Film forming unit |
| TW475212B (en) * | 1999-12-17 | 2002-02-01 | Tokyo Electron Ltd | Coating film forming apparatus |
| TW200515498A (en) * | 2003-10-02 | 2005-05-01 | Tokyo Electron Ltd | Coating film forming apparatus and coating film forming method |
| CN1749859A (en) * | 2004-09-14 | 2006-03-22 | 东京応化工业株式会社 | Coating device |
| JP2006086204A (en) * | 2004-09-14 | 2006-03-30 | Tokyo Ohka Kogyo Co Ltd | Coating device |
| CN102416761A (en) * | 2010-09-28 | 2012-04-18 | 大日本网屏制造株式会社 | Pattern forming method and pattern forming apparatus |
| JP3175893U (en) * | 2012-03-15 | 2012-06-07 | 東京エレクトロン株式会社 | Liquid processing equipment |
| JP2013243317A (en) * | 2012-05-22 | 2013-12-05 | Tokyo Ohka Kogyo Co Ltd | Coating applicator, substrate processing system, and substrate processing method |
| JP2016184644A (en) * | 2015-03-26 | 2016-10-20 | 株式会社テックインテック | Rotary coating apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113661014A (en) * | 2019-04-16 | 2021-11-16 | 大金工业株式会社 | Wafer cup |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102448807B1 (en) | 2022-09-29 |
| KR20180114841A (en) | 2018-10-19 |
| TWI754031B (en) | 2022-02-01 |
| CN108695212B (en) | 2023-03-28 |
| TW201903860A (en) | 2019-01-16 |
| JP6883462B2 (en) | 2021-06-09 |
| JP2018182023A (en) | 2018-11-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108695212A (en) | Substrate processing device | |
| CN105702604B (en) | Coating method and application processing apparatus | |
| KR0167572B1 (en) | Apparatus of coating wafer | |
| CN102479736B (en) | Base plate processing system and substrate processing method using same | |
| KR101530959B1 (en) | Liquid processing apparatus, liquid processing method, and storage medium | |
| CN204668283U (en) | Chip processing device | |
| JP5139844B2 (en) | Substrate processing method and substrate processing apparatus | |
| CN108074858A (en) | Base plate wet processing unit | |
| CN110034055A (en) | A kind of system for rinsing with dry wafer | |
| CN110164793A (en) | Liquid handling device | |
| KR19990013571A (en) | Coating device | |
| CN105404102B (en) | Developing method and developing apparatus | |
| CN109801857A (en) | Spin coater and substrate processing apparatus and system with the spin coater | |
| TWI618991B (en) | Developing apparatus | |
| KR20120016011A (en) | Liquid processing apparatus, liquid processing method and storage medium | |
| JP2008034428A (en) | Equipment and method for processing substrate | |
| TW202040737A (en) | Wafer processing tools and methods thereof | |
| JP5920736B2 (en) | Spin development method and apparatus | |
| JP2893146B2 (en) | Coating device | |
| JP5293790B2 (en) | Liquid processing apparatus, liquid processing method, and storage medium | |
| JP3840388B2 (en) | Substrate processing equipment | |
| KR101100275B1 (en) | Method for treating substrate | |
| JP2022104903A (en) | Nozzle standby port, apparatus for treating substrate including the same and method for cleaning nozzle using the same | |
| JP7056107B2 (en) | Coating film forming method and coating film forming device | |
| KR100834117B1 (en) | Substrate support unit, and apparatus and method for treating substrate with the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |