CN1749859A - Coating device - Google Patents
Coating device Download PDFInfo
- Publication number
- CN1749859A CN1749859A CNA2005101040558A CN200510104055A CN1749859A CN 1749859 A CN1749859 A CN 1749859A CN A2005101040558 A CNA2005101040558 A CN A2005101040558A CN 200510104055 A CN200510104055 A CN 200510104055A CN 1749859 A CN1749859 A CN 1749859A
- Authority
- CN
- China
- Prior art keywords
- substrate
- aforementioned
- coating liquid
- mist
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
Subject of the invention is to provide a coating device which can prevent the attachment of a coating liquid to the rear surface of a substrate by containing little mist of the coating liquid in an air flow passing along the rear surface side of the substrate. When the substrate W turns and a space S becomes a decompressed state, only the pure air passes through a punching plate 8 from the peripheral edge of the substrate W and then passes in a space between a mist guard 10 and a horizontal portion 7 and then flows outward in the radial direction in a space between the top face of the horizontal portion 7 and the bottom face of the substrate W from an opening 9 for breathing. Meanwhile, excessive filamentous coating liquid scattering from the peripheral edge of the substrate W is trapped by the punching plate 8 when it passes through it, and the mist passes through the punching plate 8 but is trapped by the mist guard 10. Consequently, there is no coating liquid nor the mist contained in the air flow going toward the space between the top face of the horizontal portion 7 and the bottom face of the substrate W from the opening 9 for breathing, and therefore the coating liquid never attaches to the bottom face of the substrate W.
Description
Technical field
The present invention relates to a kind of on the substrate surface of semiconductor wafer or glass substrate etc. the even applying device of coating liquid such as coating resist liquid.
Background technology
Following applying device is by known, it disposes spinner in cup, semiconductor wafer is adsorbed under the state on the substrates such as glass substrate, make the spinner high speed rotating, the coating liquid such as resist that utilize centrifugal force to make to drop onto on the substrate surface evenly are diffused on the substrate surface.For this existing apparatus, adhering on substrate back sometimes becomes vaporific resist, then can not keep level of base plate or height when exposure after it solidifies, thereby can cause focal shift.
Therefore, in patent documentation 1～3, proposed can on substrate back, not adhere to the scheme of vaporific coating liquid in the past.
In patent documentation 1, cup is divided into outer cup and interior cup, in this in cup, in the back side of substrate periphery and complete all scopes so that the collector ring of adjacency uniformly-spaced to be set, in internal cup, carry out in the exhaust, the atmosphere that makes the substrate back side along substrate back from by substrate center towards periphery, thereby make that the resist mist can be around arriving substrate back.
In patent documentation 2, in cup, be provided with the rectification part of frusto-conical, being formed with many endless grooves, prevent that the spittle that applies liquid is attached on the back side of substrate (wafer) via the gap with on the upper surface of the opposed rectification part in the back side of substrate.
In patent documentation 3, with the little gap configuration of trying one's best cowling panel is arranged at the back side of substrate (wafer).In this patent documentation 3, the post-flush nozzle at the cleaning base plate back side is disclosed particularly.
Patent documentation 1: the spy opens flat 5-109612 communique
Patent documentation 2: the spy opens flat 5-206019 communique
Patent documentation 3: the spy opens flat 6-20935 communique
According to disclosed means in the above-mentioned patent documentation, can not prevent fully that vaporific coating liquid is attached on the substrate back.Particularly contain under the situation of resist liquid of acrylic resin in coating, can be inhaled into and be attached to white line shape like the cotton candy (cigarette shape) becomes the substrate back of negative pressure side.
For example, (chemical industry system is answered in Tokyo to resist PMER-LA900: in the time of viscosity 900cp) when dripping on by the semiconductor wafer of existing applying device with the 1000rpm rotation that does not possess rectification part, can produce a large amount of fishing lines in housing, this line can be attached on the chip back surface.
Summary of the invention
In order to solve above-mentioned problem, applying device of the present invention, on the bottom surface of the housing that disposes spindle chuck, be provided with aforementioned spindle chuck so that the cylindrical wall portion that the state that its upper surface exposes is taken in, the outside in this cylindrical wall portion disposes rectification part, this rectification part comprises the wall that erects that is fixedly installed on the aforementioned housing, the horizontal part that extends to aforementioned cylindrical wall portion with the upper end that erects wall from this, and then, aforementionedly erect the whole or local for negotiable porous body of air or punched-plate of wall, in aforementioned levels portion, be formed with the opening of ventilation usefulness, below the opening of this ventilation usefulness, dispose and keep off the mist device.By making this structure, can prevent from reliably to apply liquid around to and attached to substrate back on.
In addition, a plurality of cleaning solution supplying mouths are set, can supply with cleaning fluid to erecting wall surface all the time or where necessary, thereby can will wash by erecting the coating liquid that wall surface captures by the wall upper end of erecting at aforementioned rectification part.
According to the present invention, flow through between the horizontal part of substrate back and rectification part air-flow outwardly, and in air-flow, comprise vaporific coating liquid hardly, so coating liquid can not be attached on the substrate back.As a result, for example in exposure process, can not keep the problem that level of base plate causes focal shift etc. thereby can not produce.
Description of drawings
Fig. 1 is the sectional view of applying device of the present invention.
Fig. 2 is the vertical view of this applying device.
Fig. 3 is the enlarged side view of the effect of this applying device of explanation.
Embodiment
Below, based on accompanying drawing embodiments of the invention are described.Fig. 1 is the sectional view face of applying device of the present invention, Fig. 2 is the vertical view of this applying device, applying device is formed with exhausr port 1a on the side of the housing 1 of opening in the above, and then main shaft 2 runs through the bottom surface of housing 1 and extend in the housing 1, and chuck 3 is installed on the upper end of this main shaft 2.This chuck 3 is by attracting or fixing substrate such as semiconductor wafer or the glass substrate W of electrostatic force.
In addition, main shaft 2 is set as and can moves up at upper and lower, and the central authorities in the bottom surface of aforementioned housing 1 are formed with cylindrical wall portion 4, have taken in spindle chuck (main shaft 2 and chuck 3) in this cylindrical wall portion 4.In addition, the height setting of cylindrical wall portion 4 is, drops on the minimum position at main shaft 2, and the upper surface of chuck 3 is higher slightly than the upper end of cylindrical wall portion 4.
In addition, dispose rectification part 5 in the outside of cylindrical wall portion 4.This rectification part 5 comprises: be fixedly installed on the horizontal part 7 that erects wall 6, extends towards aforementioned cylindrical wall portion 4 from this upper end that erects wall 6 on aforementioned housing 1 bottom surface, and then the aforementioned Lower Half that erects wall 6 is made of punched-plate 8.At this, the position that erects wall 6 is set is made as radially to be the outer circumference end position more in the outer part of benchmark than the substrate W that keeps by spindle chuck.
In addition, can replace punched-plate 8, and use porous bodies etc. can not hinder the circulation of air but can catch the parts that wire applies liquid yet.And, also can make to erect wall 6 integral body and all constitute by punched-plate or porous body.
In addition, between the medial extremity of the aforementioned horizontal part 7 that erects wall 6 and cylindrical wall portion 4, be formed with the gap, and then, on the centre position, be formed with the opening 9 of a plurality of ventilation usefulness, below the opening 9 of this ventilation usefulness, dispose retaining mist device 10.Set narrowlyer by the space between the lower surface that will keep off mist device 10 and horizontal part 7, make that vaporific coating liquid can be around arriving substrate W rear side thereby bring into play the labyrinth function.
In addition, the dip plane is made in the above-mentioned upper end that erects wall 6, is formed with the cleaning solution supplying mouth 11 of a plurality of supply cleaning fluids on this dip plane, will wash off attached to the residue coating liquid that erects the wire on wall 6 and the punched-plate 8 as required.
More than, via exhausr port 1a attract on one side make spindle chuck (main shaft 2 and chuck 3) rotation on one side, utilize centrifugal force to make and drip to the lip-deep coating liquid diffusion of substrate W.Be accompanied by this rotation, form the air-flow towards radial outside on substrate W surface, space S of being surrounded by cylindrical wall portion 4 and rectification part 5 and the gap between the substrate W back side and the rectification part become decompression state.
Like this, after becoming decompression state in substrate W rotation and the space S, as shown in Figure 3, only have pure air to see through punched-plate 8 and pass gap between retaining mist device 10 and the horizontal part 7 from the outer peripheral edges of substrate W, the gap of passing from the opening 9 of ventilation usefulness between the lower surface of the upper surface of horizontal part 7 and substrate W is mobile to radial outside.
On the one hand, except the air-flow that pure air is only arranged, also have from the outer peripheral edges wire of substrate W the remaining coating liquid and the resist that fly out.Thereby the residue of wire coating liquid captures passing to be trapped by punched-plate in the punched-plate 8.On the other hand, though can passing punched-plate 8, mist is caught at retaining mist device 10 places, the result, from the air-flow in the gap of opening 9 between the lower surface of the upper surface of horizontal part 7 and substrate W of ventilation usefulness, do not comprise coating liquid and mist, thereby coating liquid can not be attached on the lower surface of substrate W.In addition, suitably supply with cleaning fluid, will wash off at any time attached to the residue coating liquid that erects on wall 6 and the punched-plate 8 from cleaning solution supplying mouth 11.
Dripping on the semiconductor wafer of the applying device more than using with the 1000rpm rotation, (chemical industry system is answered in Tokyo to resist PMER-LA900: viscosity 900cp), can in housing, produce fishing line, but this line can be around to chip back surface, but the punched-plate that is erected wall captures.
Claims (2)
1. applying device, mounting substrate on its spindle chuck in being disposed at housing, utilize aforementioned spindle chuck to make the substrate rotation, the coating liquid that drops onto on the substrate surface is evenly spread, it is characterized in that, on the bottom surface of aforementioned housing, be provided with aforementioned spindle chuck so that the cylindrical wall portion that the state that its upper surface exposes is taken in, the outside in this cylindrical wall portion disposes rectification part, this rectification part comprises the wall that erects that is fixedly installed on the aforementioned housing, the horizontal part that extends to aforementioned cylindrical wall portion with the upper end that erects wall from this, and then, aforementionedly erect the whole or local for negotiable porous body of air or punched-plate of wall, in aforementioned levels portion, be formed with the opening of ventilation usefulness, below the opening of this ventilation usefulness, dispose and keep off the mist device.
2. applying device as claimed in claim 1 is characterized in that, aforementioned rectification part erect wall upper end, be formed with and a plurality ofly supply with the cleaning solution supplying mouth of cleaning fluid to erecting wall surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP267121/04 | 2004-09-14 | ||
| JP2004267121A JP2006086204A (en) | 2004-09-14 | 2004-09-14 | Coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1749859A true CN1749859A (en) | 2006-03-22 |
Family
ID=36164478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005101040558A Pending CN1749859A (en) | 2004-09-14 | 2005-09-14 | Coating device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006086204A (en) |
| KR (1) | KR20060050905A (en) |
| CN (1) | CN1749859A (en) |
| TW (1) | TW200611315A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102059197A (en) * | 2009-11-13 | 2011-05-18 | 采钰科技股份有限公司 | Spray coating system and method |
| CN108695212A (en) * | 2017-04-11 | 2018-10-23 | 东京毅力科创株式会社 | Substrate processing device |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011222685A (en) * | 2010-04-08 | 2011-11-04 | Tokyo Electron Ltd | Substrate processing apparatus and coating development system equipped with the same |
| JP5982176B2 (en) * | 2012-05-22 | 2016-08-31 | 東京応化工業株式会社 | Substrate processing system and substrate processing method |
| JP5956946B2 (en) * | 2013-03-13 | 2016-07-27 | 東京エレクトロン株式会社 | Liquid processing apparatus and liquid processing method |
| JP6482348B2 (en) * | 2015-03-26 | 2019-03-13 | 株式会社テックインテック | Rotary coater |
| JP6841188B2 (en) * | 2017-08-29 | 2021-03-10 | 東京エレクトロン株式会社 | Coating processing device and coating liquid collecting member |
| JP7154995B2 (en) * | 2018-12-17 | 2022-10-18 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| JP2023167687A (en) | 2022-05-12 | 2023-11-24 | Ａｉメカテック株式会社 | Substrate cleaning device |
-
2004
- 2004-09-14 JP JP2004267121A patent/JP2006086204A/en not_active Withdrawn
-
2005
- 2005-09-01 KR KR1020050081111A patent/KR20060050905A/en not_active Application Discontinuation
- 2005-09-05 TW TW094130392A patent/TW200611315A/en unknown
- 2005-09-14 CN CNA2005101040558A patent/CN1749859A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102059197A (en) * | 2009-11-13 | 2011-05-18 | 采钰科技股份有限公司 | Spray coating system and method |
| CN102059197B (en) * | 2009-11-13 | 2014-03-26 | 采钰科技股份有限公司 | Spray coating system and method |
| CN108695212A (en) * | 2017-04-11 | 2018-10-23 | 东京毅力科创株式会社 | Substrate processing device |
| CN108695212B (en) * | 2017-04-11 | 2023-03-28 | 东京毅力科创株式会社 | Substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200611315A (en) | 2006-04-01 |
| JP2006086204A (en) | 2006-03-30 |
| KR20060050905A (en) | 2006-05-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |