JPS6249728B2 - - Google Patents
Info
- Publication number
- JPS6249728B2 JPS6249728B2 JP20984381A JP20984381A JPS6249728B2 JP S6249728 B2 JPS6249728 B2 JP S6249728B2 JP 20984381 A JP20984381 A JP 20984381A JP 20984381 A JP20984381 A JP 20984381A JP S6249728 B2 JPS6249728 B2 JP S6249728B2
- Authority
- JP
- Japan
- Prior art keywords
- resist
- container
- wall
- resist coating
- peripheral wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011248 coating agent Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 31
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 235000012431 wafers Nutrition 0.000 description 30
- 229920002120 photoresistant polymer Polymers 0.000 description 21
- 239000007788 liquid Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】
この発明は、半導体装置の製造時などにシリコ
ンウエーハやガラスマスクなどのレジスト被覆体
にホトレジストなどの薬液を塗布する装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for applying a chemical solution such as photoresist to a resist-coated body such as a silicon wafer or a glass mask during the manufacture of semiconductor devices.
従来の回転式レジスト塗布装置を第１図によつ
て説明する。第１図において、１はレジスト被覆
体であるシリコンウエーハであつて、シリコンウ
エーハ１は回転チヤツク２に真空吸着される。３
は前記ウエーハ１およびチヤツク２の周囲を覆う
フード、４はフード３内から排気するための排気
ダクト、５はチヤツク２と連結したモータであ
る。また、R1，R2，R3，Ra，Rb，Rcはホトレジ
ストのようなレジストを示し、R1は滴下された
液状のレジスト、R2，R3はフード３、排気ダク
ト４の内面に付着した液状のレジスト、Ra，
Rb，Rcは浮遊するレジスト粒子や塗布時の末期
に発生する軽い綿状のレジストをそれぞれ示して
いる。ｆは排気ダクト４からの排気により、フー
ド３の外部および内部にできる空気の流れを示
す。 A conventional rotary resist coating apparatus will be explained with reference to FIG. In FIG. 1, reference numeral 1 denotes a silicon wafer which is a resist-coated body, and the silicon wafer 1 is vacuum-adsorbed onto a rotary chuck 2. As shown in FIG. 3
4 is an exhaust duct for exhausting air from inside the hood 3; 5 is a motor connected to the chuck 2; In addition, R 1 , R 2 , R 3 , Ra, Rb, and Rc represent resists such as photoresists, R 1 is a liquid resist that has been dropped, and R 2 and R 3 are applied to the inner surfaces of the hood 3 and exhaust duct 4. Adhering liquid resist, Ra,
Rb and Rc indicate floating resist particles and light flocculent resist generated at the final stage of coating, respectively. f indicates the flow of air generated outside and inside the hood 3 due to exhaust from the exhaust duct 4.
前述のような従来のレジスト塗布装置を作動さ
せると、まず、チヤツク２の上方に設けられた図
示しないノズルからウエーハ１の表面中心部にホ
トレジストR1が滴下される。滴下されたホトレ
ジストR1は、最初モータ５の低速回転（数百
rpm）により、ウエーハ１の全面に引延ばされ、
その後にモータ５を高速回転（数千rpm）させ
て、不要な液をウエーハ１の周囲に飛散させ、ウ
エーハ１に所望の厚さに塗布する。この時、飛散
したホトレジストR2，R3はフード３の内面に付
着し、排気ダクト４内に及ぶ。ホトレジストは、
一般に揮発性の溶剤を含む粘性の高い液体である
ため、長時間の使用後には円筒状のフード３、排
気ダクト４の内面に多量のホトレジストが付着、
凝固し、排気量などに影響を及ぼす。排気量はホ
トレジスト塗布時の溶剤の揮発速度を決めるもの
であり、ホトレジストの膜厚の大小に大きく影響
を及ぼす。前述したように、飛散した液状のホト
レジストはフード３の内面に付着するが、軽い粒
子状のホトレジストや塗布末期に発生する綿状の
ホトレジストRa，RbまたはRcは、フード３など
の内面に付着するものもあれば、排気流によつて
フード３外に排出されるものである。また、排気
による空気の流れｆは、ウエーハ１の表面側から
裏面側へ向うものであるため、薄い円盤状のウエ
ーハ１の周辺部裏側に空気の渦f1が生じ、これに
乗つた粒子状や軽い綿状のホトレジストRa，Rb
またはRcはウエーハ１の裏面に付着することが
ある。このようにしてウエーハ１の裏面へ塗着し
たホトレジストは、次工程の露光時にウエーハ１
を真空チヤツク平面などに吸着させる際に、これ
らの密着を妨げる原因となる。また、ウエーハ１
の表面に前述のような浮遊物が付着してはならな
いことは、よく知られているように、パターンの
断線などの問題を起すからである。 When the conventional resist coating apparatus as described above is operated, photoresist R 1 is first dropped onto the center of the surface of the wafer 1 from a nozzle (not shown) provided above the chuck 2 . The dropped photoresist R 1 is first rotated at a low speed of the motor 5 (several hundred
rpm) over the entire surface of the wafer 1,
Thereafter, the motor 5 is rotated at high speed (several thousand rpm) to scatter unnecessary liquid around the wafer 1 and coat the wafer 1 with a desired thickness. At this time, the scattered photoresists R 2 and R 3 adhere to the inner surface of the hood 3 and reach the inside of the exhaust duct 4. Photoresist is
Since it is generally a highly viscous liquid containing a volatile solvent, a large amount of photoresist will adhere to the inner surface of the cylindrical hood 3 and exhaust duct 4 after long periods of use.
It solidifies and affects exhaust volume, etc. The exhaust amount determines the volatilization rate of the solvent during photoresist coating, and has a large effect on the thickness of the photoresist film. As mentioned above, the scattered liquid photoresist adheres to the inner surface of the hood 3, but the light particulate photoresist and the cotton-like photoresist Ra, Rb, or Rc generated at the final stage of application adhere to the inner surface of the hood 3, etc. Some of them are discharged outside the hood 3 by the exhaust flow. In addition, since the air flow f due to exhaust air is from the front side to the back side of the wafer 1, an air vortex f1 is generated on the back side of the peripheral part of the thin disc-shaped wafer 1, and the particulate matter riding on it is generated. or light cotton-like photoresist Ra, Rb
Alternatively, Rc may adhere to the back surface of the wafer 1. The photoresist coated on the back side of the wafer 1 in this way is applied to the wafer 1 during exposure in the next process.
When adhering to the flat surface of a vacuum chuck, etc., this may prevent them from coming into close contact. Also, wafer 1
It is well known that the above-mentioned floating substances should not adhere to the surface of the substrate, as this may cause problems such as pattern disconnection.
この発明は、前述した従来の装置に、飛散した
レジスト液を排気ダクトに流さずに一時貯溜し、
レジストの粒子状のものや綿状のもののような浮
遊物のみをウエーハなどのレジスト被覆体の表面
からその周囲上方に飛散させる機能をもつた容器
を設けることにより、前述した問題を解決して、
排気量の変化によるレジスト膜厚の変動およびレ
ジストの浮遊物のレジスト被覆体裏面への付着を
防止できるレジスト塗布装置を提供することを目
的としている。 This invention temporarily stores the scattered resist liquid in the conventional device described above without discharging it into the exhaust duct.
The above-mentioned problem can be solved by providing a container that has the function of scattering only floating particles such as resist particles and flocs from the surface of a resist coating such as a wafer to the surrounding area.
It is an object of the present invention to provide a resist coating device that can prevent variations in resist film thickness due to changes in exhaust volume and prevent floating particles of resist from adhering to the back surface of a resist coating.
以下、この発明の実施例につき図面を参照して
説明する。 Embodiments of the invention will be described below with reference to the drawings.
第２図はこの発明の第１実施例によるレジスト
塗布装置を示す。第２図において、１１はレジス
ト被覆体である半導体ウエーハ、１２はこのウエ
ーハ１１を真空吸着するバキユームチヤツクであ
る。１３はこのチヤツク１２に吸着保持されたウ
エーハ１１を包囲するように設置したフード（包
囲体とも言う）であり、このフード１３は、上部
にウエーハ１１の径より大きな径をもつ広口開口
部１３ａが形成され、下部に図示しない排気ポン
プに連らなる開口部１３ｂが形成されている。１
５はフード１３内に支持された容器であり、容器
１５は、底壁１５ａの内、外周部上に内、外周壁
１５ｂ，１５ｃが一体に突出され、これらで囲ま
れた内部に余剰レジスト溜１５ｄが形成されてい
る。前記内周壁１５ｂは円筒状に形成されて、前
記チヤツク１２が内側に嵌まる内径をもち、この
チヤツク１２の上面より下方に頂面１５ｅが配置
され、頂面１５ｅの内側が開口されている。前記
外周壁１５ｃは上端１５ｆが前記チヤツク１２に
吸着されるウエーハ１１の水平延長面より上方に
位置し、この上端１５ｆの内側にフード１３の広
口開口部１３ａよりやや大径の開口部１５ｇが形
成され、また、外周壁１５ｃの上部には円錐台状
の傾斜部がその内面１５c1でレジスト溜１５ｄの
外周部上方を覆うように形成され、外周壁１５ｃ
の外面１５c2とフード１３の内周面との間には排
気ダクトを構成するダクト空間１４が形成されて
いる。１６はフード１３の底１３ｃ上に設けたド
ーナツ状の支持リングであり、このリング１６上
に前記容器１５が載置されている。１７は前記チ
ヤツク１２に連結されたモータである。また、
R1，R2，R3は液状のホトレジスト、Ra，Rb，Rc
は浮遊ホトレジスト、ｆは排気ポンプの作動によ
つて生ずる空気の流れを示す。 FIG. 2 shows a resist coating apparatus according to a first embodiment of the present invention. In FIG. 2, 11 is a semiconductor wafer coated with a resist, and 12 is a vacuum chuck for sucking the wafer 11 under vacuum. Reference numeral 13 denotes a hood (also referred to as an enclosure) installed to surround the wafer 11 held by the chuck 12, and the hood 13 has a wide opening 13a having a diameter larger than the diameter of the wafer 11 at the top. An opening 13b connected to an exhaust pump (not shown) is formed at the bottom. 1
Reference numeral 5 denotes a container supported within the hood 13, and the container 15 has inner and outer peripheral walls 15b and 15c integrally protruding from a bottom wall 15a and an outer peripheral portion, and an excess resist reservoir is contained in the interior surrounded by these walls. 15d is formed. The inner circumferential wall 15b is formed in a cylindrical shape and has an inner diameter into which the chuck 12 is fitted.A top surface 15e is disposed below the top surface of the chuck 12, and the inside of the top surface 15e is open. The upper end 15f of the outer peripheral wall 15c is located above the horizontally extending surface of the wafer 11 that is attracted to the chuck 12, and an opening 15g having a slightly larger diameter than the wide opening 13a of the hood 13 is formed inside the upper end 15f. Further, a truncated conical inclined part is formed at the upper part of the outer peripheral wall 15c so that its inner surface 15c1 covers the upper part of the outer peripheral part of the resist reservoir 15d, and the outer peripheral wall 15c
A duct space 14 constituting an exhaust duct is formed between the outer surface 15c 2 of the hood 13 and the inner peripheral surface of the hood 13. 16 is a donut-shaped support ring provided on the bottom 13c of the hood 13, and the container 15 is placed on this ring 16. 17 is a motor connected to the chuck 12. Also,
R 1 , R 2 , R 3 are liquid photoresists, Ra, Rb, Rc
is the floating photoresist and f is the air flow caused by the operation of the exhaust pump.
次に、前述のように構成された第１の実施例の
レジスト塗布装置の作用について説明する。ウエ
ーハ１１上に滴下されたレジストR1は、モータ
１７の高速回転時の遠心力によりウエーハ１１の
周囲に飛ばされる。この時、飛散したレジスト
R2は容器１５の外周壁１５ｃの内面１５c1上部に
形成した円錐台状の部分に付着して内面１５c1を
垂れ落ち、または内面１５c1に衝突して跳ね返
り、これらのレジストR3が余剰レジスト溜１５
ｄに溜まる。一方、重量の軽い粒子状レジストや
乾燥した綿状のレジストRa，Rb，Rcはウエーハ
１１の周辺部に浮遊するが排気による空気の流れ
ｆによつて運ばれ、ダクト空間１４を経てフード
１３の外部に排出される。したがつて、ホトレジ
ストの塗布時に、余剰ホトレジストはほとんどが
容器１５のレジスト溜１５ｄに溜まり、フード１
３やダクト空間１４に付着することがない。ま
た、ウエーハ１１の表面から粒子状のレジストや
綿状の乾燥したレジストRa，Rb，Rcが発生した
場合には、これらは排気による空気の流れｆで一
方向に向い、ウエーハ１１の周囲から斜め上方へ
導かれ、ダクト空間１４を経てフード１３の外部
に排出されるので、ウエーハ１１の表面および裏
面に付着したり、容器１５内に残つたりすること
がない。 Next, the operation of the resist coating apparatus of the first embodiment configured as described above will be explained. The resist R 1 dropped onto the wafer 11 is blown around the wafer 11 by centrifugal force when the motor 17 rotates at high speed. At this time, the scattered resist
R 2 adheres to the truncated cone-shaped part formed on the inner surface 15c 1 of the outer peripheral wall 15c of the container 15 and drips down the inner surface 15c 1 , or collides with the inner surface 15c 1 and rebounds, and these resists R 3 become surplus. Resist reservoir 15
It accumulates in d. On the other hand, light particulate resists and dry cotton-like resists Ra, Rb, and Rc float around the wafer 11, but are carried by the air flow f caused by the exhaust air and pass through the duct space 14 to the hood 13. It is discharged to the outside. Therefore, when applying photoresist, most of the excess photoresist accumulates in the resist reservoir 15d of the container 15, and the hood 1
3 or the duct space 14. In addition, if particulate resist or cotton-like dry resist Ra, Rb, and Rc are generated from the surface of the wafer 11, they are oriented in one direction by the air flow f caused by the exhaust and diagonally away from the periphery of the wafer 11. Since it is guided upward and discharged to the outside of the hood 13 through the duct space 14, it does not adhere to the front and back surfaces of the wafers 11 or remain in the container 15.
第３図はこの発明の第２の実施例によるレジス
ト塗布装置を示す。この塗布装置は、ウエーハ１
１および容器１５を囲む円筒状のフード１３を蓋
部（上部カバー）１３Ａと本体部（下部カバー）
１３Ｂとに上、下２分割し、容器１５のレジスト
溜１５ｄが余剰レジストR3で満たされた時に
は、蓋部１３Ａを本体部１３Ｂから取外して、容
器１５を取外し、別の空の容器と交換し、その後
再び蓋部１３Ａを本体部１３Ｂに取付けるように
したものである。 FIG. 3 shows a resist coating apparatus according to a second embodiment of the invention. This coating device uses wafer 1
1 and the cylindrical hood 13 that surrounds the container 15 is connected to a lid part (upper cover) 13A and a main body part (lower cover).
13B, and when the resist reservoir 15d of the container 15 is filled with surplus resist R3 , remove the lid part 13A from the main body part 13B, remove the container 15, and replace it with another empty container. After that, the lid part 13A is attached to the main body part 13B again.
第２の実施例において、容器１５の余剰レジス
ト溜１５ｄの外径Ｄ＝180mm、内径ｄ＝80mm、高
さｈ＝25mmとすれば、その内容積Ｖ＝510c.c.とな
る。また、塗布時のウエーハ１１ １枚当りのホ
トレジスト滴下量を１c.c.、塗布時間を１分間とす
れば、容器１５ １つで500枚のウエーハ１１へ
塗布が可能であり、容器１５の交換は約８時間で
１回となる。また、容器１５のレジスト溜１５ｄ
に溜つた余剰ホトレジストは、排気流に曝されな
いので凝固しにくく、溶剤によつて簡単に洗浄す
ることができる。そして、この第２の実施例で
は、容器１５を取外すことにより、レジスト溜１
５ｄに溜つた余剰ホトレジストを、装置上部から
簡単に取出せるので、レジスト塗布装置内部のメ
ンテナンスが不要となり、レジスト塗布装置数台
を並列に設置でき、これらを長期間にわたつて停
止させることなく、連続して嫁動させることがで
きる。 In the second embodiment, if the outer diameter D of the excess resist reservoir 15d of the container 15 is 180 mm, the inner diameter d is 80 mm, and the height h is 25 mm, the internal volume V is 510 c.c. Furthermore, if the amount of photoresist dropped per wafer 11 during coating is 1 c.c. and the coating time is 1 minute, it is possible to coat 500 wafers 11 with one container 15, and the container 15 can be replaced. This happens once every 8 hours. In addition, the resist reservoir 15d of the container 15
Excess photoresist that accumulates on the substrate is not exposed to the exhaust flow, so it is less likely to solidify and can be easily cleaned with a solvent. In this second embodiment, by removing the container 15, the resist reservoir 1
5d can be easily taken out from the top of the device, eliminating the need for maintenance inside the resist coating device and allowing several resist coating devices to be installed in parallel without having to stop them for a long period of time. Can be married continuously.
なお、第３図中の各部分に付けられた符号で説
明のない符号は、第２図で既に説明した部分と同
一であるから、説明を省略する。 Note that the reference numerals attached to each part in FIG. 3 that are not explained are the same as the parts already explained in FIG. 2, so the explanation will be omitted.
以上説明したように、この発明のレジスト塗布
装置は、排気流によつてウエーハのようなレジス
ト被覆体付近のレジスト浮遊物が前記レジスト被
覆体表面からその外周上方へ一方的に排出され、
前記浮遊物がレジスト被覆体の表面および裏面へ
付着することがなく、また、ホトレジスト滴下後
にレジスト被覆体の回転によつてその周囲に飛散
した液状レジストが容器内のレジスト溜に溜ま
り、排気系統に余剰レジストが流れ込むことがな
くなるので、長期間の使用後も安定した排気状態
を保つことができる。したがつて、この発明によ
れば、長期間にわたり、レジスト浮遊物がレジス
ト被覆体に付着せず、また安定した膜厚のレジス
トの塗布ができるという効果が得られる。又、包
囲体を上部カバーと下部カバーとの脱着可能な分
割構造にしたので、容器の包囲体からの出入が容
易となり、容器交換の際に装置の非稼動時間が長
くなることはない。 As explained above, the resist coating apparatus of the present invention unilaterally discharges resist floating substances near the resist coating such as a wafer from the surface of the resist coating upward to the outer circumference by the exhaust flow,
The floating matter does not adhere to the front and back surfaces of the resist coating, and the liquid resist scattered around the resist coating by rotation of the resist coating after dropping the photoresist collects in the resist reservoir in the container and does not flow into the exhaust system. Since excess resist does not flow in, stable exhaust conditions can be maintained even after long-term use. Therefore, according to the present invention, it is possible to obtain the effect that resist floating substances do not adhere to the resist coating over a long period of time, and that a resist having a stable film thickness can be applied. Furthermore, since the enclosure has a detachable split structure into an upper cover and a lower cover, it is easy to take the container in and out of the enclosure, and the non-operation time of the apparatus is not increased when the container is replaced.
第１図は従来のレジスト塗布装置を示す縦断面
図、第２図はこの発明の一実施例によるレジスト
塗布装置を示す縦断面図、第３図は同他の実施例
によるレジスト塗布装置を示す縦断面図である。
１１……ウエーハ（レジスト被覆体）、１２…
…チヤツク、１３……フード、１３Ａ……蓋部、
１３Ｂ……本体部、１３ａ……広口開口部、１３
ｂ……開口部、１３ｃ……底、１４……ダクト空
間、１５……容器、１５ａ……底壁、１５ｂ，１
５ｃ……内、外周壁、１５c1，１５c2……内面、
外面、１５ｄ……余剰レジスト溜、１５ｅ……頂
面、１５ｆ……上端、１５ｇ……開口部、１６…
…支持リング、１７……モータ。
FIG. 1 is a vertical sectional view showing a conventional resist coating device, FIG. 2 is a vertical sectional view showing a resist coating device according to an embodiment of the present invention, and FIG. 3 is a longitudinal sectional view showing a resist coating device according to another embodiment of the present invention. FIG. 11... wafer (resist coating), 12...
...chuck, 13...hood, 13A...lid,
13B...Main body, 13a...Wide opening, 13
b...opening, 13c...bottom, 14...duct space, 15...container, 15a...bottom wall, 15b, 1
5c...inner, outer peripheral wall, 15c 1 , 15c 2 ...inner surface,
Outer surface, 15d...Excess resist reservoir, 15e...Top surface, 15f...Top end, 15g...Opening, 16...
...Support ring, 17...Motor.
Claims (1)
保持するバキユームチヤツクと、 このバキユームチヤツクに吸着されるレジスト
被覆体を包囲するように配置されかつ、余剰レジ
ストを収容する容器を収容しうる大きさの内部空
間を有した包囲体と、 この包囲体内に収納された容器とを備え、 前記包囲体は、上部に前記被覆体を前記バキユ
ームチヤツクにロードまたはアンロードしうる大
きさの開口部を有した上部カバー及び下部に排気
ポンプに連なる開口部を有した下部カバーとから
なりかつ、上部カバー及び下部カバーは前記包囲
体内に収納された容器を交換しうるように両カバ
ー間で脱着可能に分割した構成とし、 前記容器は、外周壁、内周壁及び底壁を有し、
これらの内壁面で囲まれた部分に余剰レジスト溜
が形成され、前記内周壁の外壁面で囲まれた部分
に内側空間部が形成され、更に前記外周壁の上方
部分は前記レジスト溜側に折れ、その終端部は前
記上部カバーに設けられた開口部よりやや大きい
開口部を形成するべく終端した構成とし、 前記容器は、前記内側空間部に前記バキユーム
チヤツクが位置し、該容器の外周壁と前記包囲体
の内周壁との間に排気ダクトを構成するダクト空
間が形成され、かつ前記終端部が前記バキユーム
チヤツクに吸着されるレジスト被覆体の上表面の
水平延長線よりやや上方に位置するように前記包
囲体内に収納された事を特徴とするレジスト塗布
装置。[Scope of Claims] 1. A vacuum chuck connected to a motor and sucking and holding a resist coating, and a vacuum chuck disposed to surround the resist coating sucked by the vacuum chuck and accommodating excess resist. an enclosure having an internal space large enough to accommodate a container; and a container housed within the enclosure; It consists of an upper cover having an opening large enough to be loaded, and a lower cover having an opening connected to an exhaust pump at the lower part, and the upper cover and the lower cover are capable of replacing the container housed in the enclosure. The container has an outer peripheral wall, an inner peripheral wall, and a bottom wall, and the container has an outer peripheral wall, an inner peripheral wall, and a bottom wall,
A surplus resist reservoir is formed in a portion surrounded by these inner wall surfaces, an inner space is formed in a portion surrounded by the outer wall surface of the inner peripheral wall, and an upper portion of the outer peripheral wall is bent toward the resist reservoir side. , the terminal end thereof is configured to terminate to form an opening slightly larger than the opening provided in the upper cover, and the container has the vacuum chuck located in the inner space, and the outer periphery of the container A duct space constituting an exhaust duct is formed between the wall and the inner circumferential wall of the enclosure, and the terminal end is located slightly above the horizontal extension line of the upper surface of the resist coating adsorbed to the vacuum chuck. A resist coating device, characterized in that the resist coating device is housed in the enclosure so as to be located at .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20984381A JPS58114426A (en) | 1981-12-28 | 1981-12-28 | Resist coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20984381A JPS58114426A (en) | 1981-12-28 | 1981-12-28 | Resist coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58114426A JPS58114426A (en) | 1983-07-07 |
| JPS6249728B2 true JPS6249728B2 (en) | 1987-10-21 |
Family
ID=16579533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20984381A Granted JPS58114426A (en) | 1981-12-28 | 1981-12-28 | Resist coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58114426A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6042730U (en) * | 1983-08-31 | 1985-03-26 | 関西日本電気株式会社 | semiconductor manufacturing equipment |
| JPS6151732U (en) * | 1984-09-10 | 1986-04-07 | ||
| JPS61219136A (en) * | 1985-03-25 | 1986-09-29 | Iwatsu Electric Co Ltd | Apparatus for rotationally applying resist |
| JPH0444216Y2 (en) * | 1985-10-07 | 1992-10-19 |
-
1981
- 1981-12-28 JP JP20984381A patent/JPS58114426A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58114426A (en) | 1983-07-07 |
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