JP3945569B2 - Development device - Google Patents
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- JP3945569B2 JP3945569B2 JP2001372171A JP2001372171A JP3945569B2 JP 3945569 B2 JP3945569 B2 JP 3945569B2 JP 2001372171 A JP2001372171 A JP 2001372171A JP 2001372171 A JP2001372171 A JP 2001372171A JP 3945569 B2 JP3945569 B2 JP 3945569B2
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3092—Recovery of material; Waste processing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Description
【0001】
【発明の属する技術分野】
本発明は半導体ウェーハやガラス基板等の基板の表面に形成されたホトレジスト被膜に対して現像を施す装置に関する。
【0002】
【従来の技術】
半導体ウェーハやガラス基板等の基板に微細な配線パターン等を形成するには、微細パターンのマスクを介してエッチングやイオンドーピングなどの各種処理を行う。
そして、上記の微細パターンのマスクを形成するには、基板表面にホトレジスト膜を形成し、このホトレジスト膜に対して選択的に露光を行い、露光後のホトレジスト膜に現像液を供給して、ネガ型のホトレジスト膜であれば非露光部分を溶出し、ポジ型のホトレジスト膜であれば露光部分を溶出して微細パターンを形成する。
【0003】
上記の現像処理を行う装置として、基板を回転せしめ、この基板上に現像液を供給し、遠心力で基板全体に現像液を行き渡らせる回転式の現像装置が従来から用いられている。この回転式の現像装置は基板上に供給された現像液のうち、実際に現像に寄与する現像液は僅かで、残りの現像液は基板の回転に伴って飛散してしまい、大量の現像液が未使用に近い状態で捨てられてしまうという問題があった。
【0004】
上記の問題を解消する現像装置として、特開平11−305450号公報および特開2000−164503号公報に開示される装置が知られている。
特開平11−305450号公報に開示される現像装置は、カップの内底部に現像液の回収ポケットを設け、特開2000−164503号公報に開示される現像装置は、外側整流リングに直接現像液を衝突させて回収口より回収するようにしている。
【0005】
【発明が解決しようとする課題】
上述した特開平11−305450号公報に開示される現像装置にあっては、基板の回転速度を上げると、現像液が飛び散って回収ポケットに回収できる現像液が少なくなり、回転速度を遅くすると回収に時間がかかる不利がある。また、特開2000−164503号公報に開示される現像装置にあっては、整流リングから回収口へ現像液が落下する際に空気を巻き込んでしまい、現在多用されている現像液はアルカリ性であることから、空気中の炭酸ガスによって現像液が劣化し、再利用に支障をきたすことになる。
【0006】
【課題を解決するための手段】
上記課題を解決すべく本発明に係る現像装置は、カップ内に基板を保持して回転せしめるチャックを配置し、前記カップ側壁の内側に例えばスカート状裾広がり形状の整流リングを取り付け、この前記整流リングの下端に沿って環状の現像液回収ポケットを設けた。
上記構成とすることで、基板の回転をある程度遅くしても現像液の回収効率は高くなり、且つ現像液中への空気の混入を抑制できる。
【0007】
なお、前記現像液回収ポケットについては、底面を回収箇所に向かって傾斜させることで回収効率を向上させることができる。回収箇所が複数ある場合には、それぞれの回収箇所に向かって傾斜せしめることが好ましい。
【0008】
空気との接触の割合を少なくし現像液の劣化を防ぐため、現像液回収ポケットの上面の開口幅はできるだけ狭くし、深さは深くすることが好ましく、現像液回収ポケット内に窒素ガスなどを供給してもよい。また、整流リング及び現像液回収ポケット内面にフッ素樹脂コーティングを施すことで、現像液の流れがスムーズになり回収を効率よく行うことができる。
【0009】
【発明の実施の形態】
以下に本発明の実施の形態を添付図面に基づいて説明する。ここで、図1は本発明に係る現像装置の縦断面図、図2は同現像装置の平面図、図3は同現像装置の要部拡大断面図、図4は現像液回収ポケットの斜視図である。
【0010】
現像装置1は、平面視で矩形状をなすケース2内にカップ3を配置している。ケース2内は排気兼排液通路4とされ、ケース2の上面の四隅には点検用の開口5が形成され、この点検用開口5の下方の排気兼排液通路4内には排気中の現像液を落下せしめる邪魔板6を配置している。
尚、排気兼排液通路4の底板は若干傾斜しており、最も低くなった箇所に排気兼排液口4aを形成している。
【0011】
また、前記カップ3は側壁7と底部8から構成され、側壁7は上方に向かって徐々にその径が小さくなり、上端開口には整流筒9が設けられている。この整流筒9はシリンダユニット10にて昇降可能とされ、現像装置1内に基板Wを投入する際には下降して基板Wの搬入の邪魔にならないようにし、現像処理中は上昇し、カップ3内に乱流が生じにくくしている。
【0012】
一方、前記カップ3の底部8の中央部には開口11が形成され、開口11にはスピンナー軸12が挿通し、このスピンナー軸12はベース13に取り付けたモータ14にて回転せしめられるとともにシリンダユニット15の作動で昇降動可能とされ、更にスピンナー軸12の上端には基板Wを吸着保持するチャック16が取り付けられている。
【0013】
また、前記底部8は中央の開口11から径方向外側に向かって下方に徐々に下がる傾斜部17とこの傾斜部17に連続する垂直部18とこの垂直部18に連続するとともに外端部が前記排気兼排液通路4に臨む水平部19を有している。これら傾斜部17、垂直部18及び水平部19の表面にはフッ素樹脂コーティングが施されており、表面に落下した現像液がスムーズに流れる
【0014】
そして、前記傾斜部17の下方に底板20が配置され、これら傾斜部17及び底板20は支持片21を介してベース13に取り付けられ、これら傾斜部17及び底板20間の空間をトラップ部とし、開口11を伝って内側まで入り込んだ現像液をこのトラップ部に取り込み、排出口22から取り出すようにしている。
【0015】
また、前記カップ3の側壁7内側には支持片23を介してスカート状裾広がり形状の整流リング25を取り付けている。即ち、整流リング25にも支持片24を設け、これら支持片23,24の何れか一方に長穴を形成し、ボルトにより上下位置調整可能に取り付けている。
【0016】
前記整流リング25の下端は現像液回収ポケット26内に臨んでいる。この現像液回収ポケット26は平面視が環状で断面が樋状をなすとともにその底面が一方向に向かって傾斜し、その最下点において、チューブ27が接続され、ポンプ28を駆動することで現像液回収ポケット26内の現像液を図示しないタンク等に回収する構造になっている。
【0017】
また前記現像液回収ポケット26は円周上4箇所において取付金具29によって側壁7に固着されている。
なお、図示例では回収ポケット26の回収箇所は1箇所としたが、複数箇所を回収箇所として回収効率を高めてもよい。この場合は各回収箇所に向かって底面が傾斜するようにする。
【0018】
以上において、ホトレジストに露光処理が終了した基板Wに現像処理を施すには、シリンダユニット15の作動でスピンナー軸12とともにチャック16を上昇せしめ、また同時にシリンダユニット10の作動で整流筒9を下降せしめた状態で、基板Wを側方から搬送してきてチャック16上に載置する。
【0019】
この後、それぞれのシリンダユニット10,15を逆方向に作動させて、整流筒9を上昇せしめるとともにチャック16を下降せしめ、更に図示しないノズルから基板W表面に現像液を供給し液盛りする。現像液の供給ノズルとしては、例えば、スリットノズルが好ましい。
【0020】
上記のように基板W表面に現像液を液盛りして所定時間経過したならば、モータ14を駆動して基板Wを回転せしめ、基板W上に盛られた現像液を除去する。このときの回転速度は10〜300rpmとする。また、回転時間は3〜15秒とする。
【0021】
以上の現像処理において、基板Wから飛散する現像液の多くは整流リング25内面に当たるが、整流リング25の形状がスカート状をしているため飛散することなくまた空気と混合されることなく整流リング25内面に沿って下方に流下し、回収ポケット26内に入る。
【0022】
そして、回収ポケット26内に入った現像液は回収ポケット26の底面の傾斜に沿って回収箇所まで流れ、ポンプ28の駆動でタンクに回収され、再利用に供される。
【0023】
【発明の効果】
以上に説明したように本発明によれば、基板から飛散する現像液をスムーズに回収することができる。特に飛散から回収までの時間を短縮することができるので、現像液と空気との接触の機会を減らすことができ、現像液の劣化を防止し、再生に有利である。
【図面の簡単な説明】
【図1】本発明に係る現像装置の縦断面図
【図2】同現像装置の平面図
【図3】同現像装置の要部拡大断面図
【図4】現像液回収ポケットの斜視図
【符号の説明】
1…現像装置、2…ケース、3…カップ、4…排気兼排液通路、4a…排気兼排液口、5…点検用の開口、6…邪魔板、7…カップ側壁、8…カップ底部、9…整流筒、12…スピンナー軸、13…ベース、14…モータ、16…チャック、17…底部の傾斜部、18…底部の垂直部、19…底部の水平部、20…底板、21,24…支持片、22…排出口、25…整流リング、26…現像液回収ポケット、27…チューブ、28…ポンプ。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for developing a photoresist film formed on the surface of a substrate such as a semiconductor wafer or a glass substrate.
[0002]
[Prior art]
In order to form a fine wiring pattern or the like on a substrate such as a semiconductor wafer or a glass substrate, various processes such as etching and ion doping are performed through a fine pattern mask.
In order to form the above-mentioned fine pattern mask, a photoresist film is formed on the substrate surface, the photoresist film is selectively exposed, a developer is supplied to the exposed photoresist film, and a negative In the case of a type photoresist film, a non-exposed portion is eluted, and in the case of a positive type photoresist film, an exposed portion is eluted to form a fine pattern.
[0003]
As a device for performing the above development processing, a rotary developing device that rotates a substrate, supplies a developing solution onto the substrate, and spreads the developing solution over the entire substrate by centrifugal force has been conventionally used. In this rotary developing device, only a small amount of the developer supplied to the substrate actually contributes to the development, and the remaining developer is scattered as the substrate rotates. There was a problem that was thrown away in a state close to unused.
[0004]
As developing devices that solve the above-mentioned problems, there are known devices disclosed in JP-A-11-305450 and JP-A-2000-164503.
The developing device disclosed in Japanese Patent Laid-Open No. 11-305450 is provided with a developer recovery pocket at the inner bottom of the cup, and the developing device disclosed in Japanese Patent Laid-Open No. 2000-164503 is directly applied to the outer rectifying ring. Are collected from the collection port.
[0005]
[Problems to be solved by the invention]
In the developing device disclosed in Japanese Patent Application Laid-Open No. 11-305450 described above, when the rotation speed of the substrate is increased, the developer is scattered and less developer can be collected in the collection pocket. There is a disadvantage that takes time. Further, in the developing device disclosed in Japanese Patent Application Laid-Open No. 2000-164503, air is entrained when the developer falls from the rectifying ring to the recovery port, and the currently widely used developer is alkaline. For this reason, the developer is deteriorated by the carbon dioxide gas in the air, which hinders reuse.
[0006]
[Means for Solving the Problems]
In order to solve the above-described problems, a developing device according to the present invention includes a chuck that holds and rotates a substrate in a cup, and a rectifying ring having, for example, a skirt-like flared shape is attached to the inside of the cup side wall. An annular developer recovery pocket was provided along the lower end of the ring.
With the above configuration, even when the rotation of the substrate is slowed to some extent, the recovery efficiency of the developer is increased, and mixing of air into the developer can be suppressed.
[0007]
Note that the recovery efficiency of the developer recovery pocket can be improved by inclining the bottom surface toward the recovery location. When there are a plurality of collection points, it is preferable to incline toward the respective collection points.
[0008]
In order to reduce the rate of contact with air and prevent deterioration of the developer, it is preferable to make the opening width of the upper surface of the developer recovery pocket as narrow and deep as possible. You may supply. Further, by applying a fluororesin coating on the inner surfaces of the rectifying ring and the developer recovery pocket, the flow of the developer can be made smooth and recovery can be performed efficiently.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is a longitudinal sectional view of the developing device according to the present invention, FIG. 2 is a plan view of the developing device, FIG. 3 is an enlarged cross-sectional view of the main part of the developing device, and FIG. It is.
[0010]
The developing device 1 has a cup 3 disposed in a
The bottom plate of the exhaust / drain passage 4 is slightly inclined, and an exhaust /
[0011]
The cup 3 includes a side wall 7 and a
[0012]
On the other hand, an
[0013]
Further, the
A
[0015]
Further, a rectifying
[0016]
The lower end of the rectifying
[0017]
The
In the illustrated example, the collection location of the
[0018]
In the above, in order to perform development processing on the substrate W after the exposure processing of the photoresist, the
[0019]
Thereafter, the
[0020]
As described above, when a predetermined time elapses after the developer is deposited on the surface of the substrate W, the
[0021]
In the above development processing, most of the developer splashed from the substrate W hits the inner surface of the rectifying
[0022]
Then, the developer that has entered the
[0023]
【The invention's effect】
As described above, according to the present invention, the developer scattered from the substrate can be collected smoothly. In particular, since the time from scattering to collection can be shortened, the chance of contact between the developer and air can be reduced, and the developer is prevented from deteriorating, which is advantageous for regeneration.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a developing device according to the present invention. FIG. 2 is a plan view of the developing device. FIG. 3 is an enlarged sectional view of a main part of the developing device. Explanation of]
DESCRIPTION OF SYMBOLS 1 ... Developing apparatus, 2 ... Case, 3 ... Cup, 4 ... Exhaust and drainage passage, 4a ... Exhaust and drainage port, 5 ... Inspection opening, 6 ... Baffle plate, 7 ... Cup side wall, 8 ... Cup bottom , 9 ... Rectifying cylinder, 12 ... Spinner shaft, 13 ... Base, 14 ... Motor, 16 ... Chuck, 17 ... Bottom inclined part, 18 ... Bottom vertical part, 19 ... Bottom horizontal part, 20 ... Bottom plate, 21 24 ... support piece, 22 ... discharge port, 25 ... rectifying ring, 26 ... developer recovery pocket, 27 ... tube, 28 ... pump.
Claims (2)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2001372171A JP3945569B2 (en) | 2001-12-06 | 2001-12-06 | Development device |
TW091132314A TW200300959A (en) | 2001-12-06 | 2002-10-31 | Developing device |
KR1020020070612A KR100902724B1 (en) | 2001-12-06 | 2002-11-14 | Development Apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2001372171A JP3945569B2 (en) | 2001-12-06 | 2001-12-06 | Development device |
Publications (2)
Publication Number | Publication Date |
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JP2003173957A JP2003173957A (en) | 2003-06-20 |
JP3945569B2 true JP3945569B2 (en) | 2007-07-18 |
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JP2001372171A Expired - Fee Related JP3945569B2 (en) | 2001-12-06 | 2001-12-06 | Development device |
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JP (1) | JP3945569B2 (en) |
KR (1) | KR100902724B1 (en) |
TW (1) | TW200300959A (en) |
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TWI361450B (en) * | 2003-10-31 | 2012-04-01 | Nikon Corp | Platen, stage device, exposure device and exposure method |
JP2005159322A (en) * | 2003-10-31 | 2005-06-16 | Nikon Corp | Surface plate, stage apparatus, exposure device and exposing method |
TWI612338B (en) | 2003-11-20 | 2018-01-21 | 尼康股份有限公司 | Optical illuminating apparatus, exposure device, exposure method, and device manufacturing method |
TWI360837B (en) | 2004-02-06 | 2012-03-21 | Nikon Corp | Polarization changing device, optical illumination |
US7898642B2 (en) * | 2004-04-14 | 2011-03-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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JP5267029B2 (en) | 2007-10-12 | 2013-08-21 | 株式会社ニコン | Illumination optical apparatus, exposure apparatus, and device manufacturing method |
US8379187B2 (en) | 2007-10-24 | 2013-02-19 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
US9116346B2 (en) | 2007-11-06 | 2015-08-25 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
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---|---|---|---|---|
JP3390313B2 (en) * | 1996-12-05 | 2003-03-24 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
KR20000021299U (en) * | 1999-05-25 | 2000-12-26 | 김영환 | Semiconductor wafer developing apparatus |
-
2001
- 2001-12-06 JP JP2001372171A patent/JP3945569B2/en not_active Expired - Fee Related
-
2002
- 2002-10-31 TW TW091132314A patent/TW200300959A/en unknown
- 2002-11-14 KR KR1020020070612A patent/KR100902724B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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TW200300959A (en) | 2003-06-16 |
KR20030047732A (en) | 2003-06-18 |
KR100902724B1 (en) | 2009-06-15 |
JP2003173957A (en) | 2003-06-20 |
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