KR20030047732A - Development apparatus - Google Patents
Development apparatus Download PDFInfo
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- KR20030047732A KR20030047732A KR1020020070612A KR20020070612A KR20030047732A KR 20030047732 A KR20030047732 A KR 20030047732A KR 1020020070612 A KR1020020070612 A KR 1020020070612A KR 20020070612 A KR20020070612 A KR 20020070612A KR 20030047732 A KR20030047732 A KR 20030047732A
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- developer
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- developing solution
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3092—Recovery of material; Waste processing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
본 발명은 반도체 웨이퍼나 유리기판 등의 기판의 표면에 형성된 포토레지스트피막에 대해 현상을 행하는 장치에 관한 것이다.The present invention relates to an apparatus for developing a photoresist film formed on the surface of a substrate such as a semiconductor wafer or a glass substrate.
반도체 웨이퍼나 유리기판 등의 기판에 미세한 배선 패턴 등을 형성하기 위해서는, 미세 패턴의 마스크를 사이에 두고 에칭이나 이온도핑 등의 각종 처리를 행한다.In order to form a fine wiring pattern on a substrate such as a semiconductor wafer or a glass substrate, various processes such as etching and ion doping are performed with a mask of the fine pattern interposed therebetween.
그리고, 상기 미세 패턴의 마스크를 형성하기 위해서는, 기판 표면에 포토레지스트막을 형성하여, 이 포토레지스트막에 대해 선택적으로 노광을 행하고, 노광 후의 포토레지스트막에 현상액을 공급하여, 네거형 포토레지스트막이라면 비노광부분을 용출하고, 포지형 포토레지스트막이라면 노광부분을 용출하여 미세 패턴을 형성한다.In order to form the mask of the fine pattern, a photoresist film is formed on the surface of the substrate, the photoresist film is selectively exposed to light, a developer is supplied to the photoresist film after exposure, and a negative photoresist film is used. The non-exposed portion is eluted, and in the case of a positive photoresist film, the exposed portion is eluted to form a fine pattern.
상기 현상처리를 행하는 장치로서, 기판을 회전시켜, 이 기판상에 현상액을 공급하여, 원심력으로 기판 전체에 현상액을 골고루 가게 하는 회전식 현상장치가 종래부터 사용되고 있다. 이 회전식 현상장치는 기판상에 공급된 현상액 중, 실제로 현상에 기여하는 현상액은 얼마 되지 않고, 나머지 현상액은 기판의 회전에 동반하여 비산되어 버려, 대량의 현상액이 미사용에 가까운 상태로 버려져 버린다고 하는 문제가 있었다.BACKGROUND ART As a device for performing the above developing process, a rotating developing apparatus which rotates a substrate, supplies a developing solution onto the substrate, and evenly distributes the developing solution to the entire substrate by centrifugal force has been conventionally used. In the rotary developer, a few developers are actually contributing to the development of the developer supplied on the substrate, and the remaining developer is scattered with the rotation of the substrate, and a large amount of the developer is left unused. There was.
상기 문제를 해소하는 현상장치로서, 일본국 특개평 11-305450호 공보 및 일본국 특개 2000-164503호 공보에 개시되는 장치가 알려져 있다.As a developing device which solves the above problem, a device disclosed in Japanese Patent Laid-Open No. 11-305450 and Japanese Patent Laid-Open No. 2000-164503 is known.
일본국 특개평 11-305450호 공보에 개시되는 현상장치는, 컵 안의 바닥부에 현상액의 회수포켓을 설치하고, 일본국 특개 2000-164503호 공보에 개시되는 현상장치는, 바깥쪽 정류링에 직접 현상액을 충돌시켜 회수구로부터 회수하도록 하고 있다.The developing device disclosed in Japanese Patent Laid-Open No. 11-305450 provides a collecting pocket for the developer at the bottom of the cup, and the developing device disclosed in Japanese Patent Laid-Open No. 2000-164503 directly connects to the outer rectifying ring. The developer is collided to recover from the recovery port.
상술한 일본국 특개평 11-305450호 공보에 개시되는 현상장치에 있어서는, 기판의 회전속도를 올리면, 현상액이 비산하여 회수포켓으로 회수할 수 있는 현상액이 적어지고, 회전속도를 늦추면 회수에 시간이 걸리는 불리함이 있다. 또한, 일본국 특개 2000-164503호 공보에 개시되는 현상장치에 있어서는, 정류링으로부터 회수구로 현상액이 낙하할 때에 공기를 끌어들여 버려, 현재 많이 사용되고 있는 현상액은 알칼리성이기 때문에, 공기 중의 탄산가스에 의해 현상액이 열화되어, 재이용에 지장을 초래하게 된다.In the developing apparatus disclosed in Japanese Unexamined Patent Publication No. 11-305450, when the rotational speed of the substrate is increased, the developer is scattered and the developer which can be recovered by the recovery pocket is reduced. There is a disadvantage. In the developing apparatus disclosed in Japanese Patent Laid-Open No. 2000-164503, air is drawn in when the developing solution falls from the rectifying ring to the recovery port. The developer deteriorates, which causes a problem in reuse.
도 1은, 본 발명의 현상장치의 종단면도이다.1 is a longitudinal sectional view of the developing apparatus of the present invention.
도 2는, 동 현상장치의 평면도이다.2 is a plan view of the developing device.
도 3은, 동 현상장치의 요부 확대 단면도이다.3 is an enlarged sectional view of a main portion of the developing device.
도 4는, 현상액 회수포켓의 사시도이다.4 is a perspective view of the developer recovery pocket.
부호의 설명Explanation of the sign
1 …현상장치, 2 …케이스, 3 …컵, 4 …배기겸 배액통로, 4a …배기겸 배액구, 5 …점검용 개구, 6 …방해판, 7 …컵 측벽, 8 …컵 바닥부, 9 …정류통, 12 …스피너축, 13 …베이스, 14 …모터, 16 …척, 17 …바닥부의 경사부, 18 … 바닥부의 수직부, 19 …바닥부의 수평부, 20 …바닥판, 21, 24 …지지편, 22 …배출구, 25 …정류링, 26 …현상액 회수포켓, 27 …튜브, 28 …펌프.One … Developing device; Case, 3... Cup, 4... Exhaust and drain passage, 4a... 5 exhaust and drain ports; Inspection opening 6. Baffle, 7... Cup sidewall, 8... Cup bottom 9. Rectifier, 12... Spinner shaft 13... Base, 14... Motor, 16... Chuck, 17. 18 inclined portion at the bottom; 19 vertical portion of the bottom; 20 horizontal part of bottom part; Bottom plate, 21, 24... Support piece; Outlet 25. Commutation ring, 26... Developer recovery pocket 27. Tube, 28... Pump.
상기 과제를 해결하기 위해 본 발명의 현상장치는, 컵 내에 기판을 보유하여 회전시키는 척을 배치하고, 상기 컵 측벽의 안쪽에 예를 들면 스커트상 옷자락이 퍼지는 형상의 정류링을 부착하여, 상기 정류링의 하단을 따라 고리상의 현상액 회수포켓을 설치했다.In order to solve the above problems, the developing apparatus of the present invention includes a chuck for holding and rotating a substrate in a cup, and attaching a rectifying ring having a shape such that a skirt-like hem spreads inside the cup sidewall, for example, the rectification. A ring-shaped developer recovery pocket was installed along the bottom of the ring.
상기 구성으로 함으로써, 기판의 회전을 어느 정도 늦추더라도 현상액의 회수효율은 높아지고, 또한 현상액 속으로의 공기의 혼입을 억제할 수 있다.By the above configuration, even if the rotation of the substrate is delayed to some extent, the recovery efficiency of the developing solution is increased, and the mixing of air into the developing solution can be suppressed.
또한, 상기 현상액 회수포켓에 대해서는, 바닥면을 회수개소를 향해 경사지게 함으로써 회수효율을 향상시킬 수 있다. 회수개소가 복수 있는 경우에는, 각각의 회수개소를 향해 경사지게 하는 것이 바람직하다.In addition, with respect to the developer recovery pocket, the recovery efficiency can be improved by inclining the bottom surface toward the recovery point. When there are a plurality of recovery points, it is preferable to incline toward each recovery point.
공기와의 접촉 비율을 적게 하여 현상액의 열화를 방지하기 위해, 현상액 회수포켓의 윗쪽면 개구폭은 가능한 한 좁게 하고, 깊이는 깊게 하는 것이 바람직하며, 현상액 회수포켓 내에 질소가스 등을 공급하더라도 좋다. 또한, 정류링 및 현상액 회수포켓 내면에 불소 수지 코팅을 행함으로써, 현상액의 흐름이 부드러워져 회수를 효율 좋게 행할 수 있다.In order to prevent the deterioration of the developer by reducing the contact ratio with air, the opening width of the upper surface of the developer recovery pocket is preferably as narrow as possible, and the depth is as deep as possible, and nitrogen gas or the like may be supplied into the developer recovery pocket. In addition, by applying a fluororesin coating on the inner surface of the rectifying ring and the developer recovery pocket, the flow of the developer is smoothed, and the recovery can be efficiently performed.
아래에 본 발명의 실시형태를 첨부하는 도면을 토대로 설명한다. 여기에서, 도 1은 본 발명의 현상장치의 종단면도, 도 2는 동 현상장치의 평면도, 도 3은 동 현상장치의 요부 확대 단면도, 도 4는 현상액 회수포켓의 사시도이다.EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described based on drawing attached. 1 is a longitudinal sectional view of the developing device of the present invention, FIG. 2 is a plan view of the developing device, FIG. 3 is an enlarged cross-sectional view of the main portion of the developing device, and FIG. 4 is a perspective view of the developer recovery pocket.
현상장치(1)은, 평면에서 봤을 때 직사각형 형상을 이루는 케이스(2)내에 컵(3)을 배치하고 있다. 케이스(2)내는 배기겸 배액통로(4)가 되고, 케이스(2)의 윗쪽면의 네모서리에는 점검용 개구(5)가 형성되며, 이 점검용 개구(5) 아랫쪽의 배기겸 배액통로(4)내에는 배기 중의 현상액을 낙하시키는 방해판(6)을 배치하고 있다.The developing apparatus 1 arrange | positions the cup 3 in the case 2 which has a rectangular shape by planar view. In the case 2, an exhaust and drain passage 4 is formed, and an inspection opening 5 is formed in a corner of the upper surface of the case 2, and an exhaust and drain passage below the inspection opening 5 is formed. 4), an obstruction plate 6 for dropping the developer in exhaust is disposed.
또한, 배기겸 배액통로(4)의 바닥판은 약간 경사져 있어, 가장 낮아진 개소에 배기겸 배액구(4a)를 형성하고 있다.In addition, the bottom plate of the exhaust / drainage passage 4 is slightly inclined, and the exhaust / drainage port 4a is formed at the lowest point.
또한, 상기 컵(3)은 측벽(7)과 바닥부(8)로 구성되고, 측벽(7)은 윗쪽을 향해 서서히 그 지름이 작아지고, 상단 개구에는 정류통(9)가 설치되어 있다. 이 정류통(9)는 실린더유닛(10)으로 상승 가능해지고, 현상장치(1)내에 기판(W)를 투입할 때에는 하강하여 기판(W) 반입의 방해가 되지 않도록 하며, 현상처리 중은 상승하여, 컵(3)내에 난류가 생기기 어렵게 하고 있다.Moreover, the said cup 3 is comprised from the side wall 7 and the bottom part 8, The side wall 7 gradually becomes small diameter toward upper direction, and the rectifier cylinder 9 is provided in the upper opening. The rectifier 9 can be lifted up to the cylinder unit 10, and when lowering the substrate W into the developing apparatus 1, the rectifying cylinder 9 is lowered so as not to disturb the loading of the substrate W. Thus, turbulence is less likely to occur in the cup 3.
한편, 상기 컵(3)의 바닥부(8)의 중앙부에는 개구(11)이 형성되고, 개구(11)에는 스피너축(12)가 삽통(揷通)하고, 이 스피너축(12)는 베이스(13)에 부착한 모터(14)로 회전시키는 동시에 실린더유닛(15)의 작동으로 승강동(昇降動) 가능해지고, 더욱이 스피너축(12)의 상단에는 기판(W)를 흡착 보유하는 척(16)이 부착되어 있다.On the other hand, the opening 11 is formed in the center part of the bottom part 8 of the said cup 3, The spinner shaft 12 is inserted in the opening 11, This spinner shaft 12 is a base It is possible to move up and down by operating the cylinder unit 15 while rotating with the motor 14 attached to the (13), and furthermore, a chuck that sucks and holds the substrate W on the upper end of the spinner shaft 12 ( 16) is attached.
또한, 상기 바닥부(8)은 중앙의 개구(11)로부터 지름방향 바깥쪽을 향해 아랫쪽으로 서서히 내려가는 경사부(17)과, 이 경사부(17)에 연속하는 수직부(18), 이 수직부(18)에 연속하는 동시에 외단부가 상기 배기겸 배액통로(4)에 면하는 수평부(19)를 가지고 있다. 이들 경사부(17), 수직부(18) 및 수평부(19)의 표면에는 불소 수지 코팅이 행해져 있어, 표면에 낙하한 현상액이 부드럽게 흐른다.In addition, the bottom portion 8 includes an inclined portion 17 gradually descending downward from the central opening 11 toward the radially outward side, a vertical portion 18 continuous to the inclined portion 17, and the vertical portion thereof. It has a horizontal section 19 that is continuous to the section 18 and whose outer end faces the exhaust and drain passage 4. Fluorine resin coating is performed on the surfaces of the inclined portions 17, the vertical portions 18, and the horizontal portions 19, and the developer that has dropped on the surfaces flows smoothly.
그리고, 상기 경사부(17)의 아랫쪽에 바닥판(20)이 배치되고, 이들 경사부(17) 및 바닥판(20)은 지지편(21)을 사이에 두고 베이스(13)에 부착되고, 이들 경사부(17) 및 바닥판(20) 사이의 공간을 트랩부로 하여, 개구(11)을 따라 안쪽까지 들어 온 현상액을 이 트랩부에 넣고, 배출구(22)로부터 꺼내도록 하고 있다.The bottom plate 20 is disposed below the inclined portion 17, and the inclined portion 17 and the bottom plate 20 are attached to the base 13 with the support piece 21 interposed therebetween. Using the space between these inclined portions 17 and the bottom plate 20 as a trap portion, the developer, which has been introduced to the inside along the opening 11, is put in the trap portion and is taken out from the discharge port 22.
또한, 상기 컵(3)의 측벽(7) 안쪽에는 지지편(23)을 사이에 두고 스커트상 옷자락이 퍼지는 형상의 정류링(25)를 부착하고 있다. 즉, 정류링(25)에도 지지편(24)를 설치하고, 이들 지지편(23, 24)의 어느 한쪽에 긴 구멍을 형성하여, 볼트로 상하 위치조정 가능하게 부착하고 있다.Moreover, inside the side wall 7 of the said cup 3, the rectifying ring 25 of the shape which spreads a skirt-like hem spreads through the support piece 23 is attached. That is, the support piece 24 is also provided in the rectifying ring 25, and a long hole is formed in either of these support pieces 23 and 24, and it attaches so that up-and-down position can be adjusted with a bolt.
상기 정류링(25)의 하단은 현상액 회수포켓(26)내에 면하고 있다. 이 현상액 회수포켓(26)은 평면에서 봤을 때가 고리상이고, 단면이 통상을 이루는 동시에, 그 바닥면이 한쪽 방향을 향해 경사지고, 그 최하점에 있어서, 튜브(27)이 접속되고, 펌프(28)을 구동함으로써 현상액 회수포켓(26)내의 현상액을 도시하지 않는 탱크 등으로 회수하는 구조로 되어 있다.The lower end of the rectifying ring 25 faces the developer recovery pocket 26. The developer recovery pocket 26 has a ring shape when viewed in plan, the cross section is normal, the bottom surface thereof is inclined toward one direction, and at the lowest point, the tube 27 is connected, and the pump 28 Is driven to recover the developer in the developer recovery pocket 26 into a tank (not shown).
또한, 상기 현상액 회수포켓(26)은 원주상 4개소에 있어서 부착금구(金具) (29)에 의해 측벽(7)에 고착되어 있다.In addition, the developer recovery pocket 26 is fixed to the side wall 7 by the mounting bracket 29 at four circumferential positions.
또한, 도시예에서는 회수포켓(26)의 회수개소는 1개소로 했지만, 복수개소를 회수개소로 하여 회수효율을 높이더라도 좋다. 이 경우는 각 회수개소를 향해 바닥면이 경사지도록 한다.In addition, although the collection | recovery location of the collection | recovery pocket 26 was made into one place in the example of illustration, you may improve collection efficiency by making multiple places into a collection place. In this case, the bottom surface is inclined toward each recovery point.
이상에 있어서, 포토레지스트에 노광처리가 종료된 기판(W)에 현상처리를 행하기 위해서는, 실린더유닛(15)의 작동으로 스피너축(12)와 함께 척(16)을 상승시키고, 또 동시에 실린더유닛(10)의 작동으로 정류통(9)를 하강시킨 상태로, 기판(W)를 측쪽에서 반송해 와서 척(16)상에 올려둔다.In the above, in order to develop the substrate W on which the photoresist has been subjected to the exposure treatment, the chuck 16 is raised together with the spinner shaft 12 by the operation of the cylinder unit 15, and at the same time the cylinder The board | substrate W is conveyed from the side, and is mounted on the chuck 16 in the state which lowered the rectifier 9 by operation of the unit 10. As shown in FIG.
이 후, 각각의 실린더유닛(10,15)를 역방향으로 작동시켜, 정류통(9)를 상승시키는 동시에 척(16)을 하강시키고, 더욱이 도시하지 않는 노즐로부터 기판(W) 표면에 현상액을 공급하여 액쌓기한다. 현상액의 공급 노즐로서는, 예를 들면, 슬릿 노즐이 바람직하다.Thereafter, the cylinder units 10 and 15 are operated in the reverse direction to raise the rectifier 9 and lower the chuck 16 and further supply the developer to the surface of the substrate W from a nozzle (not shown). Stack the liquid. As a supply nozzle of a developing solution, a slit nozzle is preferable, for example.
상기와 같이 기판(W) 표면에 현상액을 액쌓기하여 소정 시간 경과했다면, 모터(14)를 구동하여 기판(W)를 회전시켜, 기판(W)상에 쌓인 현상액을 제거한다. 이 때의 회전속도는 10~300 rpm으로 한다. 또한, 회전시간은 3~15초로 한다.When a predetermined time has elapsed by stacking the developer on the surface of the substrate W as described above, the motor 14 is driven to rotate the substrate W to remove the developer accumulated on the substrate W. The rotational speed at this time is 10 to 300 rpm. The rotation time is set to 3 to 15 seconds.
이상의 현상처리에 있어서, 기판(W)로부터 비산하는 현상액의 대부분은 정류링(25)내면에 닿지만, 정류링(25)의 형상이 스커트상을 하고 있기 때문에 비산하지 않고 또한 공기와 혼합되지 않고 정류링(25)내면을 따라 아랫쪽으로 유하(流下)하여, 회수포켓(26)내에 들어간다.In the above developing process, most of the developing solution scattered from the substrate W touches the inner surface of the rectifying ring 25, but since the shape of the rectifying ring 25 is in the form of a skirt, it is not scattered and mixed with air. It flows downward along the inner surface of the rectifying ring 25 and enters the recovery pocket 26.
그리고, 회수포켓(26)내에 들어간 현상액은 회수포켓(26) 바닥면의 경사를 따라 회수개소까지 흘러, 펌프(28)의 구동으로 탱크에 회수되어, 재이용에 제공된다.And the developing solution which entered into the collection | recovery pocket 26 flows to the collection | recovery location along the inclination of the bottom surface of the collection | recovery pocket 26, it is collect | recovered by a tank by the pump 28, and is provided for reuse.
이상에 설명한 바와 같이 본 발명에 의하면, 기판으로부터 비산하는 현상액을 부드럽게 회수할 수 있다. 특히 비산에서 회수까지의 시간을 단축할 수 있기 때문에, 현상액과 공기와의 접촉 기회를 줄일 수 있어, 현상액의 열화를 방지하여, 재생에 유리하다.As mentioned above, according to this invention, the developing solution scattered from a board | substrate can be collect | recovered gently. In particular, since the time from scattering to recovery can be shortened, the opportunity for contact between the developer and the air can be reduced, and the deterioration of the developer is prevented, which is advantageous for regeneration.
Claims (2)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001372171A JP3945569B2 (en) | 2001-12-06 | 2001-12-06 | Development device |
| JPJP-P-2001-00372171 | 2001-12-06 |
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| KR20030047732A true KR20030047732A (en) | 2003-06-18 |
| KR100902724B1 KR100902724B1 (en) | 2009-06-15 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP3226073A3 (en) | 2003-04-09 | 2017-10-11 | Nikon Corporation | Exposure method and apparatus, and method for fabricating device |
| TWI609409B (en) | 2003-10-28 | 2017-12-21 | 尼康股份有限公司 | Optical illumination device, exposure device, exposure method and device manufacturing method |
| JP2005159322A (en) * | 2003-10-31 | 2005-06-16 | Nikon Corp | Surface plate, stage apparatus, exposure device and exposing method |
| TWI361450B (en) * | 2003-10-31 | 2012-04-01 | Nikon Corp | Platen, stage device, exposure device and exposure method |
| TWI512335B (en) | 2003-11-20 | 2015-12-11 | 尼康股份有限公司 | Light beam converter, optical illuminating apparatus, exposure device, and exposure method |
| TWI614795B (en) | 2004-02-06 | 2018-02-11 | Nikon Corporation | Optical illumination apparatus, light-exposure apparatus, light-exposure method and device manufacturing method |
| US7898642B2 (en) * | 2004-04-14 | 2011-03-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP3232270A3 (en) | 2005-05-12 | 2017-12-13 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
| JP5267029B2 (en) | 2007-10-12 | 2013-08-21 | 株式会社ニコン | Illumination optical apparatus, exposure apparatus, and device manufacturing method |
| US8379187B2 (en) | 2007-10-24 | 2013-02-19 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
| US9116346B2 (en) | 2007-11-06 | 2015-08-25 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
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| KR20000021299U (en) * | 1999-05-25 | 2000-12-26 | 김영환 | Semiconductor wafer developing apparatus |
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| JP3945569B2 (en) | 2007-07-18 |
| JP2003173957A (en) | 2003-06-20 |
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