JP2007335758A - Liquid processing device and liquid processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid processing device which can discharge promptly a process liquid collected in a waste liquid cup, and at the same time, can collect securely also the process liquid leaked out to the back side of a substrate retainer. <P>SOLUTION: A liquid processing device 100 includes a rotary plate 11 which holds a wafer W horizontally, and is capable of rotating together with the wafer W; a rotary cup 4 which has annular shape so as to surround the wafer W held by the rotary plate 11, and catches the process liquid shaken off from the rotating wafer W; a rotating motor 3 to rotate the rotary plate 11; a surface process liquid supply 5 to supply the process liquid to the wafer W; a main liquid receptacle 56 which has annular shape corresponding to the rotary cup 4, and catches the process liquid discharged from the rotary cup 4; and the waste liquid cup which has a sub-liquid receptacle provided inside the main liquid receptacle 56, and catches the process liquid leaked out to the backside of the rotary plate 11. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid processing apparatus and a liquid processing method for performing predetermined liquid processing on a substrate such as a semiconductor wafer.

  In a semiconductor device manufacturing process and a flat panel display (FPD) manufacturing process, a process of supplying a processing liquid to a semiconductor wafer or a glass substrate, which is a substrate to be processed, and performing liquid processing is frequently used. As such a process, for example, a cleaning process for removing particles or contamination attached to the substrate, a coating process of a photoresist solution or a developing solution in a photolithography process, and the like can be given.

  As such a liquid processing apparatus, a substrate such as a semiconductor wafer is held on a spin chuck, a processing liquid is supplied to the front surface or front and back surfaces of the wafer while the substrate is rotated, and a liquid film is applied to the front or back surface of the wafer. A single-wafer type is known in which processing is performed by forming a film.

  In this type of apparatus, the processing liquid is usually supplied to the center of the substrate, and by rotating the substrate, the processing liquid is spread outward to form a liquid film, and the processing liquid is generally released. ing. Then, a member such as a liquid receiving cup surrounding the outside of the substrate is provided so as to guide the processing liquid shaken out of the substrate downward, and the processing liquid shaken off from the substrate is discharged from the liquid receiving cup below. It is led to the liquid cup and discharged quickly.

Further, in the liquid processing apparatus that rotates while the substrate is horizontally supported as described above, if the substrate is displaced during rotation, it may cause damage to the substrate. Therefore, in order to securely fix the substrate to the substrate holding body that rotatably holds the substrate and rotate the substrate integrally, a holding member (chuck) that regulates and holds the outer edge of the substrate is provided. (For example, Patent Document 1).
JP 2002-368066 A (FIG. 7 etc.)

In the liquid processing apparatus described in Patent Document 1, the holding member is mounted at several locations so as to protrude to the back side of the substrate holder, and is configured to support the periphery of the substrate on the front side. When the substrate holder having such a holding member is rotated, an air flow is generated in the lower space of the substrate holder by the holding member protruding below the substrate holder. When such an air flow is generated, the flow of the processing liquid collected in the drain cup is disturbed by the air flow, preventing smooth discharge of the processing liquid and causing mist and particles to contaminate the substrate. It also becomes.
Further, the processing liquid may go around to the back side of the substrate holder through the mounting portion of the holding member. Since the processing liquid leaked to the back side of the substrate holder in this manner also causes mist and particles, it is necessary to be surely received and drained by the drain cup.

  The present invention has been made in view of such circumstances, and is capable of quickly discharging the processing liquid collected in the drainage cup and also capable of reliably collecting the processing liquid leaked to the back side of the substrate holder. An object is to provide a processing apparatus.

  In order to solve the above problems, a first aspect of the present invention is to form a ring so as to surround a substrate holding body that can hold the substrate horizontally and rotate together with the substrate, and the substrate held by the substrate holding body. A liquid receiving cup for receiving the processing liquid shaken off from the rotating substrate; a rotating mechanism for rotating the substrate holder; a liquid supply mechanism for supplying the processing liquid to the substrate; and an annular shape corresponding to the liquid receiving cup. A first processing liquid receiving portion that receives the processing liquid discharged from the liquid receiving cup and a first processing liquid receiving portion that is provided inside the first processing liquid receiving portion and that receives the processing liquid leaked to the back surface of the substrate holder. And a draining cup having two processing liquid receiving portions. A liquid processing apparatus is provided.

  In the first aspect, it is preferable to have a communication port for discharging the processing liquid from the second processing liquid receiving part to the first processing liquid receiving part. Moreover, it is preferable that the bottom part of the first processing liquid receiving part and the bottom part of the second processing liquid receiving part are inclined so as to rise from the outside toward the inside. The substrate holder has a holding member that is disposed on the lower surface side thereof and holds the substrate by a holding portion that protrudes to the upper surface side of the substrate holder through the opening. The processing liquid receiving part may receive the processing liquid leaked to the back surface of the substrate holder through the opening. In this case, a partition wall is provided between the first processing liquid receiving portion and the second processing liquid receiving portion, and the partition wall is more than the holding member when viewed from the rotation center of the substrate holder. It is preferable to be located radially outside.

  In the first aspect, the first processing liquid receiving portion is formed as a first annular recess, and the second processing liquid receiving portion is provided on the inner side of the first annular recess. Alternatively, it may be formed as a second annular recess. In this case, it is preferable to have a communication port for discharging the processing liquid from the second annular recess to the first annular recess. In addition, it is preferable that the second annular recess is formed to be shallower than the first annular recess. The bottom of the first annular recess and the bottom of the second annular recess are preferably inclined so as to rise from the outside toward the inside. The substrate holder has a holding member that is disposed on the lower surface side thereof and holds the substrate by a holding portion that protrudes to the upper surface side of the substrate holder through the opening. The processing liquid receiving part may receive the processing liquid leaked to the back surface of the substrate holder through the opening. In this case, a partition wall is provided between the first annular recess and the second annular recess, and the partition wall is more radially outward than the holding member when viewed from the center of rotation of the substrate holder. Preferably it is located.

  Further, in the first aspect, an exhaust cup that is provided outside the drain cup so as to surround the drain cup, and that exhausts mainly by taking in gas components from the liquid receiver cup and its surroundings. It is preferable to comprise.

  According to a second aspect of the present invention, the substrate is held horizontally and rotated together with the substrate, and a ring is formed so as to surround the substrate held by the substrate holder. A liquid receiving cup for receiving the processed liquid, a rotating mechanism for rotating the substrate holder, a liquid supply mechanism for supplying the processing liquid to the substrate, and an annular shape corresponding to the liquid receiving cup, for discharging the processing liquid. A liquid processing method using a liquid processing apparatus having a drain cup having a liquid port and a drain cup for receiving the processing liquid discharged from the liquid receiving cup, the first being provided in the drain cup The processing liquid discharged from the liquid receiving cup is received by one processing liquid receiving part, and the substrate is provided by a second processing liquid receiving part provided inside the first processing liquid receiving part in the draining cup. Holding body Receiving a processing liquid that has leaked into the surface, characterized in that directing the processing liquid to said drain port to provide a liquid processing method.

  According to the present invention, in the liquid processing apparatus of the type that holds and rotates the substrate horizontally, the first processing liquid receiving portion that receives the processing liquid discharged from the liquid receiving cup in the draining cup, and the first And a second processing liquid receiving portion that receives the processing liquid leaked on the back surface of the substrate holder, and is provided from the liquid receiving cup to the first processing liquid receiving portion. The processing liquid leaked to the back surface of the substrate holder can be reliably received in the second processing liquid receiving portion while suppressing the guided processing liquid from being disturbed by the airflow. Therefore, the processing liquid can be quickly discharged from the drain cup.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, a case where the present invention is applied to a liquid processing apparatus that performs front and back surface cleaning of a semiconductor wafer (hereinafter simply referred to as a wafer) will be described.

<First Embodiment>
FIG. 1 is a sectional view showing a schematic configuration of a liquid processing apparatus according to a first embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is an enlarged sectional view showing an exhaust / drainage part. The liquid processing apparatus 100 is held by a base plate 1, a wafer holder 2 that rotatably holds a wafer W that is a substrate to be processed, a rotation motor 3 that rotates the wafer holder 2, and the wafer holder 2. A rotating cup 4 that is provided so as to surround the wafer W and rotates together with the wafer holding unit 2, a surface treatment liquid supply nozzle 5 that supplies a treatment liquid to the surface of the wafer W, and a treatment liquid to the back surface of the wafer W The back surface treatment liquid supply nozzle 6 and the exhaust / drainage part 7 provided at the peripheral edge of the rotary cup 4 are provided. A casing 8 is provided so as to cover the periphery of the exhaust / drainage unit 7 and the upper portion of the wafer W. A fan filter unit (FFU) 9 is provided on the upper portion of the casing 8 so that a downflow of clean air is supplied to the wafer W held by the wafer holder 2.

  The wafer holding unit 2 includes a horizontally-rotating rotating plate 11 having a disk shape and a cylindrical rotating shaft 12 connected to the center of the back surface and extending vertically downward. A circular hole 11 a that communicates with the hole 12 a in the rotating shaft 12 is formed at the center of the rotating plate 11. And the raising / lowering member 13 provided with the back surface process liquid supply nozzle 6 is provided so that raising / lowering is possible in the hole 12a and the hole 11a. The rotating plate 11 is provided with holding members 14 for holding the outer edge of the wafer W, and as shown in FIG. 2, three of them are arranged at equal intervals. The holding member 14 is configured to hold the wafer W horizontally with the wafer W slightly floating from the rotating plate 11. The holding member 14 includes a holding portion 14a capable of holding the end surface of the wafer W, an attaching / detaching portion 14b extending from the holding portion 14a toward the center of the back surface of the rotating plate, and a rotating shaft for rotating the holding portion 14a in a vertical plane. 14c and a fulcrum part 14d including the rotating shaft 14c, and the holding part 14a is rotated outward by pushing up the tip of the attaching / detaching part 14b by a cylinder mechanism (not shown) to release the holding of the wafer W. Is done. The holding member 14 is urged in a direction in which the holding portion 14a holds the wafer W by a spring member (not shown), and the wafer W is held by the holding member 14 when the cylinder mechanism is not operated.

  The rotating shaft 12 is rotatably supported by the base plate 1 via a bearing member 15 having two bearings 15a. A pulley 16 is fitted into the lower end of the rotating shaft 12, and a belt 17 is wound around the pulley 16. The belt 17 is also wound around a pulley 18 attached to the shaft of the motor 3. The rotating shaft 12 is rotated via the pulley 18, the belt 17 and the pulley 16 by rotating the motor 3.

A purge gas supply port 19 having an annular shape along the outer periphery of the rotary shaft 12 is provided immediately above the bearing member 15. The purge gas supply port 19 is connected to a purge gas flow path 20 provided along the vertical direction in the outer wall of the bearing member 15, and the purge gas flow path 20 is located at a position below the base plate 1 of the bearing member 15. A purge gas pipe 21 is connected to the corresponding part. Then, for example, N ₂ gas is supplied as a purge gas from a purge gas supply source (not shown) to the purge gas supply port 19 through the purge gas pipe 21 and the purge gas flow path 20. This purge gas flows from the purge gas supply port 19 to the upper side and the lower side of the rotating shaft 12.

The purge gas introduced upward from the purge gas supply port 19 is discharged into the space S1 around the rotation shaft 12 defined by the partition wall 65, and this space S1 is set to a positive pressure. Thereby, it is avoided that the mist and the processing liquid splashed from the space S2 outside the partition wall 65 which is a chemical atmosphere due to various processing liquid components adhere to the upper part of the rotating shaft 12 made of a metal material which is easily corroded, Corrosion of the rotating shaft 12 is prevented.
On the other hand, the purge gas introduced downward from the purge gas supply port 19 passes around the upper and lower bearings 15a and 15b in the bearing member 15 and is discharged to the outside of the apparatus. Thereby, particles generated by the wear of the bearings 15a and 15b can be carried out of the apparatus. Therefore, it is possible to suppress particles from the bearings 15a and 15b from reaching the wafer W.

  The surface treatment liquid supply nozzle 5 is held by a nozzle arm 22 so that the treatment liquid is supplied from a liquid supply tube (not shown) and discharges the treatment liquid through a nozzle hole 5a provided therein. Yes. Examples of the processing liquid to be discharged include cleaning chemicals, rinsing liquids such as pure water, and dry solvents such as IPA. One type or two or more types of processing liquids can be discharged. As shown in FIG. 2, the nozzle arm 22 is provided so as to be rotatable about a shaft 23, and a discharge position on the center and outer periphery of the wafer W and a retreat position outside the wafer W by a driving mechanism (not shown). It is possible to move between. The nozzle arm 22 is provided so as to be movable up and down. When the nozzle arm 22 rotates between the retreat position and the discharge position, the nozzle arm 22 is in a raised state, and when the treatment liquid is discharged from the surface treatment liquid supply nozzle 5, the nozzle arm 22 is in a lowered state. Become.

  The back surface treatment liquid supply nozzle 6 is provided at the center of the elevating member 13, and a nozzle hole 6a extending along the longitudinal direction is formed therein. A predetermined processing liquid is supplied from the lower end of the nozzle hole 6a through a processing liquid tube (not shown), and the processing liquid is discharged to the back surface of the wafer W through the nozzle hole 6a. Examples of the processing liquid to be discharged include cleaning chemicals, rinsing liquids such as pure water, dry solvents such as IPA, and the like, as with the surface processing liquid supply nozzle 5. The liquid can be discharged. A wafer support 24 for supporting the wafer W is provided at the upper end of the elevating member 13. On the upper surface of the wafer support 24, there are three wafer support pins 25 (only two are shown) for supporting the wafer W. A cylinder mechanism 27 is connected to the lower end of the back surface treatment liquid supply nozzle 6 via a connection member 26. The wafer mechanism W is moved up and down by the cylinder mechanism 27 so that the wafer W is loaded. And unloading is performed.

  As shown in FIG. 3, the rotating cup 4 includes an annular flange 31 that extends obliquely upward and inward from the upper end of the rotating plate 11, and a cylindrical outer wall that extends vertically downward from the outer end of the flange 31. A portion 32 is provided. An annular gap 33 is formed between the outer wall portion 32 and the rotating plate 11, and the processing liquid (mist) in which the wafer W is rotated together with the rotating plate 11 and the rotating cup 4 and scattered from the gap 33. Guided downward.

  A plate-shaped guide member 35 is interposed between the flange portion 31 and the rotating plate 11 at a position substantially the same height as the wafer W. As shown in FIG. 4, a plurality of openings 36 and 37 for allowing the processing liquid to pass therethrough are formed between the collar portion 31 and the guide member 35 and between the guide member 35 and the rotating plate 11, respectively. Spacer members 38 and 39 are arranged along the circumferential direction. The flange 31, the guide member 35, the rotating plate 11, and the spacer members 38 and 39 between them are screwed with screws 40.

  The guide member 35 is provided such that the front and back surfaces thereof are substantially continuous with the front and back surfaces of the wafer W. Then, when the processing liquid is supplied from the surface processing liquid supply nozzle 5 to the center of the surface of the wafer W by rotating the wafer holding member 2 and the rotating cup 4 together with the wafer W by the motor 3, the processing liquid is centrifuged by the centrifugal force. Is spread out from the periphery of the wafer W. The processing liquid shaken off from the surface of the wafer W is guided to the surface of the guide member 35 provided substantially continuously, discharged outward from the opening 36, and guided downward by the flange portion 31 and the outer wall portion 32. . Similarly, when the processing liquid is supplied to the center of the back surface of the wafer W from the back surface processing liquid supply nozzle 6 by rotating the wafer holding member 2 and the rotating cup 4 together with the wafer W, the processing liquid is centrifugally applied to the wafer W. Is spread from the periphery of the wafer W. The processing liquid shaken off from the back surface of the wafer W is guided to the back surface of the guide member 35 provided substantially continuously with the back surface of the wafer W and discharged outward from the opening 37, and the flange portion 31 and the outer wall portion 32. Is led downwards. At this time, since the centrifugal force acts on the processing liquid that has reached the spacer members 38 and 39 and the outer wall portion 32, they are prevented from returning to the inside as mist.

  Further, since the guide member 35 guides the processing liquid shaken off from the front surface and the back surface of the wafer W in this way, the processing liquid detached from the peripheral edge of the wafer W is not easily turbulent and rotates without causing the processing liquid to be misted. It can be led out of the cup 4. As shown in FIG. 2, the guide member 35 is provided with a notch 41 at a position corresponding to the holding member 14 so as to avoid the holding member 14.

  The exhaust / drainage part 7 is mainly for recovering gas and liquid discharged from the space surrounded by the rotary plate 11 and the rotary cup 4, and as shown in the enlarged view of FIG. An annular drain cup 51 that receives the processing liquid discharged from the cup 4 and an annular exhaust cup 52 that is provided outside the drain cup 51 so as to surround the drain cup 51 are provided. .

As shown in FIG. 1 and FIG. 3, the drainage cup 51 has a vertical wall 53 that is vertically provided near the outer wall portion 32 on the outer side of the rotating cup 4, and the inner side from the lower end of the vertical wall 53. And a bottom 54 extending in the direction. The upper end of the vertical wall 53 extends to above the outer wall portion 32 of the rotating cup 4 and is curved along the flange portion 31. This prevents the mist in the drain cup 51 from flowing back to the wafer W side.
The bottom portion 54 of the drainage cup 51 having an annular shape is inclined so as to rise from the outer side toward the inner side (that is, the rotation center side of the wafer W), and the inner end thereof is inside the holding portion 14a of the holding member 14 ( It reaches the position corresponding to the rotation center side).

  Further, a shielding wall 55 provided in an annular shape (cylindrical shape) along the circumferential direction extends from the bottom 54 to the vicinity of the lower surface of the rotating plate 11 at a position outside the holding member 14 inside the drainage cup 51. is doing. The shielding wall 55 has an effect of preventing the airflow generated in the space S2 below the rotating plate 11 from traveling toward the outside of the drain cup 51 (the direction opposite to the rotating shaft 12). Then, the drainage cup 51 is separated from the main liquid receiving part 56 which is the first processing liquid receiving part for receiving the processing liquid discharged from the gap 33 by the shielding wall 55 and from the vicinity of the holding part 14 a of the holding member 14. It is divided into a secondary liquid receiving part 57 which is a second processing liquid receiving part for receiving the dropped processing liquid. That is, the shielding wall 55 also has a function as a partition wall (partition wall) that divides the processing liquid receiving portion that receives the processing liquid into two.

Since the holding portion 14a of the holding member 14 is configured to hold or release the wafer W by rotating about the rotation shaft 14c, the holding portion 14a is inserted into the rotating plate 11. An opening 11b is provided for this purpose. When the processing liquid reaches the back side (lower surface) of the rotating plate 11 through the opening 11 b of the rotating plate 11 and drops downward, it can be received by the sub liquid receiving portion 57.
The shielding wall 55 is formed with a hole 58 that is a communication port for guiding the processing liquid from the secondary liquid receiving part 57 to the main liquid receiving part 56.

  One drainage port 60 is provided in the outermost part of the bottom 54 of the drainage cup 51, and a drainage pipe 61 is connected to the drainage port 60. The drainage pipe 61 is provided with a drainage switching unit and a suction mechanism (both not shown), and are collected or discarded separately according to the type of processing liquid. In addition, the drain port 60 may be provided in multiple places according to the kind of process liquid, for example.

  The exhaust cup 52 is provided so that the outer wall 64 provided perpendicular to the outer portion of the vertical wall 53 of the drain cup 51 and the inner portion of the holding member 14 are perpendicular to the upper end of the holding member 14. The partition wall 65, the bottom wall 66 provided on the base plate 1, and the upper side wall 67 that curves upward from the outer wall 64 and covers the upper side of the rotating cup 4. As described above, the partition wall 65 is a wall that separates the atmosphere of the space S1 around the inner rotary shaft 12 and the outer space S2. The exhaust cup 52 takes in and exhausts mainly gas components in and around the rotary cup 4 from an annular inlet 68 formed between the upper side wall 67 and the flange 31 of the rotary cup 4. ing. As shown in FIG. 1, an exhaust port 70 is provided below the exhaust cup 52, and an exhaust pipe 71 is connected to the exhaust port 70. A suction mechanism (not shown) is provided on the downstream side of the exhaust pipe 71 so that the periphery of the rotary cup 4 can be exhausted. A plurality of exhaust ports 70 are provided, and can be switched and used in accordance with the type of treatment liquid.

  Thus, the processing liquid is guided to the drainage cup 51 through the rotating cup 4, the gas component is guided from the introduction port 68 to the exhaust cup 52, and the drainage liquid from the drainage cup 51 and the exhaust cup 52 Since the exhaust is performed independently, it is possible to guide the drainage and the exhaust in a separated state. Further, even if mist leaks from the drain cup 51, the exhaust cup 52 surrounds the periphery thereof, so that it is quickly discharged through the exhaust port 70, and the mist is reliably prevented from leaking outside.

  As described above, since the bottom portion 54 of the drainage cup 51 is formed so as to rise from the outside toward the inside (rotation center side), the inner bottom surface 54a and the sub-portion of the main liquid receiving portion 56 are formed. The inner bottom surface 54b of the liquid receiving portion 57 is also inclined so as to rise from the outside toward the inside (rotation center side). The secondary liquid receiving part 57 is formed shallower than the main liquid receiving part 56. This corresponds to the magnitude relationship between the amount of processing liquid received by the main liquid receiving part 56 and the sub liquid receiving part 57. That is, the amount of processing liquid that goes around to the back side (lower surface) through the opening 11 b of the rotating plate 11 is smaller than the amount of processing liquid received by the main liquid receiving portion 56, and therefore the main volume compared to the volume of the sub liquid receiving portion 57. It is preferable to increase the volume of the liquid receiving portion 56.

Further, when the rotating plate 11 rotates, the shielding wall 55 has an airflow (for example, a swirling flow) formed by a portion protruding below the rotating plate 11 of the holding member 14 on the wafer W side accompanied with mist. It has a role to prevent it from reaching.
That is, since the holding member 14 protrudes downward toward the center of the back surface side of the rotating plate 11 toward the attaching / detaching portion 14b which is the opposite end of the holding portion 14a, the rotating plate 11 is rotated. Thus, the holding member 14 functions like a blade to form an air flow in the lower space of the rotating plate 11. When such an air flow is generated, the flow of exhaust in one direction toward the exhaust port 70 in the exhaust cup 52 is disturbed. As a result, the mist contained in the exhaust gas is diffused, causing water marks and particles to be generated on the surface of the wafer W. Therefore, in the present embodiment, by arranging the cylindrical shielding wall 55 so as to surround the holding member 14, the airflow generated by the circular motion of the holding member 14 accompanying the rotation of the rotating plate 11 is prevented from moving in the outer circumferential direction. The normal exhaust flow is not disturbed.

  Further, in order to reliably recover the processing liquid that goes to the back side (lower surface) through the opening 11b of the rotating plate 11, the processing liquid leaks from the outer peripheral side of the rotating plate 11 to the back side of the rotation support means. It is necessary to cover the range reaching the position below the opening 11 b of the rotating plate 11, which is a part, with the drainage cup 51. For this purpose, when the treatment liquid receiving portion (concave portion) of the drainage cup 51 is enlarged inward, the rotating plate 11 is rotated when the holding member 14 that protrudes and is mounted on the back surface side of the rotating plate 11 rotates. The airflow generated in the space below the turbulence disturbs the flow of the processing liquid collected in the recess of the drainage cup 51 and causes mist to be generated.

For this reason, in the drainage cup 51 of the present embodiment, the treatment liquid receiving part of the drainage cup 51 is divided into the main liquid receiving part 56 and the sub liquid receiving part 57 by the shielding wall 55, and the airflow is discharged. Disturbance of the flow of the processing liquid flowing in the main liquid receiving portion 56 of the liquid cup 51 is suppressed, so that generation of mist can be prevented and a normal flow of drainage can be maintained. Further, as shown in FIGS. 1 and 3, the main liquid receiving part 56 and the sub liquid receiving part 57 of the drainage cup 51 divided into two by the shielding wall 55 are grooves each having a substantially V-shaped cross-sectional view. Since the drainage port 60 and the hole 58 which is the communication port are formed at the lowermost end of the groove, the processing liquid can be quickly conveyed to the drainage port 60.
Further, since the shielding wall 55 has a function of shielding the airflow, it is possible to prevent the airflow from reaching the exhaust path and disturbing the normal exhaust flow in the exhaust cup 52.

  As described above, by providing the shielding wall 55, the influence of the airflow generated by the rotation of the holding member 14 on the exhaust in the exhaust cup 52 and the influence on the drainage in the drainage cup 51 are simultaneously performed. Can be relaxed. Therefore, it is possible to improve the efficiency of exhaust and drainage in the liquid processing apparatus 100, and to provide a highly reliable liquid processing apparatus with less mist generation and particle contamination.

  Next, the operation of the liquid processing apparatus 100 configured as described above will be described with reference to FIG. First, as shown in FIG. 5A, the wafer W is transferred from the transfer arm (not shown) onto the support pins 25 of the wafer support 24 in a state where the elevating member 13 is raised. Next, as shown in FIG. 5B, the elevating member 13 is lowered to a position where the wafer W can be held by the holding member 14, and the wafer W is chucked by the holding member 14. Then, as shown in FIG. 5C, the surface treatment liquid supply nozzle 5 is moved from the retracted position to the ejection position on the center of the wafer W.

  In this state, as shown in FIG. 5D, a predetermined process is performed from the surface treatment liquid supply nozzle 5 and the back surface treatment liquid supply nozzle 6 while the rotating plate 11 is rotated together with the rotation cup 4 and the wafer W by the motor 3. The liquid is supplied to perform the cleaning process.

  In this cleaning process, a processing liquid is supplied to the center of the front and back surfaces of the wafer W, and the cleaning liquid spreads outside the wafer W by centrifugal force and is shaken off from the periphery of the wafer W. In this case, since the cup provided so as to surround the outside of the wafer W is the rotating cup 4 that rotates together with the wafer W, when the processing liquid shaken off from the wafer W hits the rotating cup 4, the processing liquid Centrifugal force acts on the surface, and scattering (misting) unlike the case of the fixed cup hardly occurs. Then, the processing liquid that has reached the rotating cup 4 is guided downward, and is discharged from the gap 33 to the main liquid receiving portion 56 of the draining cup 51. On the other hand, since the opening 11b into which the holding portion 14a is inserted is provided at the attachment position of the holding member 14 of the rotating plate 11, the processing liquid is dripped from the portion to the secondary liquid receiving portion 57 of the drainage cup 51. .

  Since the processing liquid discharged from the rotating cup 4 during the cleaning of the wafer W is discharged from the annular gap 33 while rotating, the draining cup 51 that receives the processing liquid must be annular.

  As described above, since the processing liquid can be discharged from the annular drain cup 51 in a short time, it is easy to determine the timing for switching the discharge destination when using a plurality of types of processing liquids. It is possible to prevent the two types of processing liquids from being discharged in a mixed state when the liquids are switched.

  In this case, the bottom portion 54 of the drainage cup 51 (that is, the inner bottom surface 54a of the main liquid receiving portion 56 and the inner bottom surface 54b of the sub liquid receiving portion 57) is inclined so as to rise from the outside toward the inside. In addition, the processing liquid discharged to the main liquid receiving part 56 and the sub liquid receiving part 57 can quickly flow to the outer part, and it is possible to make it difficult to generate liquid residue. Further, the shielding wall 55 having a function of shielding the airflow blocks the airflow generated mainly by the holding member 14 when the rotating plate 11 rotates, so that the airflow does not disturb the flow of the processing liquid in the draining cup 51. I have to. Furthermore, by providing the shielding wall 55, it is possible to prevent airflow from reaching the exhaust path and disturbing normal exhaust in the exhaust cup 52, and to suppress diffusion of mist and particles.

Second Embodiment
Next, a liquid processing apparatus according to a second embodiment of the present invention will be described with reference to FIGS.
FIG. 6 is a cross-sectional view showing a schematic configuration of a liquid processing apparatus 101 according to the second embodiment of the present invention. Since the basic configuration of the liquid processing apparatus 101 is the same as that of the liquid processing apparatus 100 according to the first embodiment of FIG. 1, only differences will be described below, and the same reference numerals are given to the same configurations. The description is omitted.
In the liquid processing apparatus 100 of the first embodiment, the processing liquid receiving part is divided into the main liquid receiving part 56 and the sub liquid receiving part 57 by standing the shielding wall 55 from the bottom part 54 of the draining cup 51. On the other hand, in the liquid processing apparatus 101 of this embodiment, it was set as the structure which provides the cylindrical shielding wall 55a toward the downward direction from the rotating plate 11. FIG. The shielding wall 55a is provided in the vicinity of the outer peripheral side of the opening 11a of the rotating plate 11, and the height thereof is configured to reach the vicinity of the bottom 54c of the draining cup 51a. Therefore, the drainage cup 51a does not have the shielding wall 55 (FIG. 1) as in the first embodiment.

  The function of the shielding wall 55a is substantially the same as that of the shielding wall 55 in the first embodiment. That is, the shielding wall 55a has a function of shielding the airflow generated in the space S2, and can prevent the airflow from reaching the exhaust path and disturbing the normal exhaust flow in the exhaust cup 52. Further, since the treatment liquid receiving part of the drainage cup 51a can be divided into two parts, the main liquid receiving part 56a and the sub liquid receiving part 57a, by the shielding wall 55a, the air flow generated by the revolving motion of the holding member 14 in the space S2 is drained. It suppresses disturbing the flow of the processing liquid flowing in the main liquid receiving portion 56a of the cup 51, and prevents the generation of mist and maintains the normal flow of drainage. In the present embodiment, the main liquid receiving part 56a and the secondary liquid receiving part 57a of the drainage cup 51a divided into two by the shielding wall 55a communicate with each other in the gap between the lower end of the shielding wall 55a and the bottom part 54c of the drainage cup 51a. Therefore, the processing liquid dropped on the secondary liquid receiving part 57a quickly flows down the inner bottom part of the bottom part 54c inclined from the inner side (the rotation center side of the wafer W) toward the outer peripheral side, and the main liquid receiving part 56a. Led to. Then, the processing liquid is quickly conveyed to the drainage port 60 formed at the lowermost end of the main liquid receiving portion 56a, which is a groove (annular recess) having a substantially V shape in cross section.

  Moreover, in the liquid processing apparatus 101 of this embodiment, the arc-shaped convex part 11c as an airflow suppression means is provided in the lower surface of the rotation plate 11. FIG. FIG. 7 is a perspective view showing the lower surface of the rotating plate 11, and FIG. 8 is a cross-sectional view of the main part of the rotating plate 11 including the convex portion 11c. A plurality of protrusions 11c (three in this embodiment) are provided so as to sandwich the mounting portion P of the holding member 14 from both sides. The reason why an air flow such as a swirl flow is generated in the space S <b> 2 when the rotating plate 11 is rotated is that the holding member 14, which is a relatively large member, circulates in a state of protruding below the rotating plate 11 as described above. This is because it works as a stirring blade. Therefore, by forming the protruding portion 11c so as to project on the lower surface of the rotating plate 11 at a position where it can move on the same circular orbit as the holding member 14, the stirring function by the holding member 14 can be weakened and the generation of airflow itself can be reduced. . In order to obtain such an airflow suppression effect, the height h of the convex portion 11c is preferably the same as or higher than the fulcrum portion 14d of the holding member 14. The convex portion 11 c may be hollow or solid, may be formed integrally with the rotating plate 11, or may be formed by joining another member to the lower surface of the rotating plate 11.

As described above, by providing the shielding wall 55a on the rotating cup 11 side, the influence of the airflow generated in the space S2 by the rotation of the holding member 14 on the exhaust in the exhaust cup 52 and the inside of the drain cup 51a At the same time, the effect on drainage can be reduced. In addition to the provision of the shielding wall 55a, the airflow intensity can be attenuated by providing the lower surface of the rotating plate 11 with the airflow suppressing means (convex portion 11c) that weakens the stirring function of the holding member 14. Therefore, it is possible to increase the efficiency of exhaust and drainage in the liquid processing apparatus 101, and to provide a highly reliable liquid processing apparatus with less mist generation and particle contamination.
In addition, it is also possible to apply the airflow suppression means (convex part 11c) of this embodiment to the liquid processing apparatus 100 of 1st Embodiment.

<Third Embodiment>
Next, FIG. 9 is a sectional view showing a schematic configuration of a liquid processing apparatus 102 according to the third embodiment of the present invention. Since the basic configuration of the liquid processing apparatus 102 is the same as that of the liquid processing apparatus 100 according to the first embodiment of FIG. 1, only the differences will be described below, and the same reference numerals are given to the same configurations. The description is omitted. In the liquid processing apparatus 102 according to the present embodiment, in addition to the shielding wall 55, a second shielding wall 73 is provided below the inner side (rotating shaft 12 side). The second shielding wall 73 is a cylindrical wall erected from a bottom wall 66 provided on the base plate 1. The second shielding wall 73 is formed at a position below the holding member 14, and an upper end thereof is formed at a height close to the holding member 14. The second shielding wall 73 acts to prevent the airflow generated in the space S2 due to the revolving motion of the holding member 14 during the rotation of the rotating plate 11 from moving toward the drainage cup 51 and the surrounding exhaust path. Have. In order to enhance such an airflow shielding effect, it is preferable that the distance between the shielding plate 73 and the holding member 14 is as small as possible in a range not contacting the holding member 14 that moves along a circular orbit.

Further, the second shielding wall 73 can prevent the airflow generated in the space S <b> 2 from flowing into the exhaust port 70 from below the drain cup 51. When the airflow generated in the space S <b> 2 travels directly to the exhaust port 70, the gas component taken in from the introduction port 68 between the upper wall 67 of the exhaust cup 52 and the flange 31 of the rotating cup 4 enters the exhaust port 70. Disturbing the flow of exhaust going. As a result, the mist in the exhaust gas diffuses and adheres to the wafer W, causing watermarks and particle contamination. By providing the second shielding wall 73, normal exhaust can be performed while eliminating the influence of the airflow as described above.
Further, since a cylinder mechanism (not shown) is provided in the vicinity of the holding member 14 to push up the attaching / detaching portion 14b of the holding member 14, a treatment is performed from the drain cup 51 by providing the second shielding wall 73. It is possible to prevent liquid and mist from splashing and adhering to the cylinder mechanism and causing corrosion.

  Thus, in the liquid processing apparatus 102 of this embodiment, since the double shielding structure provided with the second shielding wall 73 in addition to the shielding wall 55 is adopted, the air flow generated in the space S2 is generated in the exhaust cup 52. It is possible to simultaneously reduce the influence exerted on the exhaust in the drainage and the influence exerted on the drainage in the drainage cup 51. Accordingly, it is possible to improve the efficiency of exhaust and drainage in the liquid processing apparatus 102, and to provide a highly reliable liquid processing apparatus with less mist generation and particle contamination. In addition, the 2nd shielding wall 73 in the liquid processing apparatus 102 of 3rd Embodiment can also be arrange | positioned also in the liquid processing apparatus 101 of 2nd Embodiment.

The present invention can be variously modified without being limited to the above embodiment. For example, in each of the above embodiments, a liquid processing apparatus that performs front and back surface cleaning of a wafer has been described as an example. However, the present invention is not limited thereto, and is a liquid processing apparatus that performs cleaning processing on one of the front and back surfaces. In addition, the liquid process is not limited to the cleaning process, and other liquid processes such as a resist liquid coating process and a subsequent development process may be used.
In each of the above embodiments, the rotating cup 4 that rotates in synchronization with the rotating plate 11 is provided. However, the liquid receiving cup that surrounds the wafer W held on the rotating plate 11 does not rotate. But you can use it.
In the above embodiment, the case where a semiconductor wafer is used as the substrate to be processed has been described. However, other substrates such as a flat panel display (FPD) substrate represented by a glass substrate for a liquid crystal display device (LCD) are used. Needless to say, it is applicable.

  The present invention is effective for a cleaning apparatus for removing particles and contamination adhering to a semiconductor wafer.

1 is a cross-sectional view showing a schematic configuration of a liquid processing apparatus according to a first embodiment of the present invention. 1 is a schematic plan view showing a liquid processing apparatus according to a first embodiment of the present invention with a part cut away. Sectional drawing which expands and shows the exhaust_gas | exhaustion / drainage part of the liquid processing apparatus of FIG. The figure for demonstrating the attachment state of the rotating cup and guide member of the liquid processing apparatus of FIG. The figure for demonstrating the processing operation of the liquid processing apparatus which concerns on one Embodiment of this invention. Sectional drawing which shows schematic structure of the liquid processing apparatus which concerns on 2nd Embodiment of this invention. The perspective view which shows the structure of the lower surface of the rotating plate used for 2nd Embodiment. Sectional drawing of the principal part of the rotating plate used for 2nd Embodiment. Sectional drawing which shows schematic structure of the liquid processing apparatus which concerns on 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Base plate 2; Wafer holding part 3; Rotating motor 4; Rotating cup 5; Surface treatment liquid supply nozzle 6; Back surface treatment liquid supply nozzle 7; Exhaust / drainage part 8; Casing 9;
11; Rotating plate 12; Rotating shaft 13; Elevating member 14; Holding member 31; Gutter 32; Outer wall portion 33; Clearance 35; Guide member 51; Drainage cup 52; Exhaust cup 53; Vertical wall 54; Shielding wall 56; main liquid receiving part (first liquid receiving part)
57; Secondary liquid receiving part (second liquid receiving part)
60; drainage port 65; partition walls 100, 101, 102; liquid processing apparatus W; wafer

Claims (13)

A substrate holder that holds the substrate horizontally and can rotate with the substrate;
A ring-shaped so as to surround the substrate held by the substrate holder, a liquid receiving cup for receiving the processing liquid shaken off from the rotating substrate;
A rotation mechanism for rotating the substrate holder;
A liquid supply mechanism for supplying a processing liquid to the substrate;
An annular shape corresponding to the liquid receiving cup, a first processing liquid receiving portion for receiving the processing liquid discharged from the liquid receiving cup, and a substrate processing body provided inside the first processing liquid receiving portion, A drainage cup having a second processing liquid receiving portion for receiving the processing liquid leaked to the back surface of
A liquid processing apparatus comprising:   The liquid processing apparatus according to claim 1, further comprising a communication port through which the processing liquid is discharged from the second processing liquid receiving unit to the first processing liquid receiving unit.   The bottom of the first processing liquid receiving part and the bottom of the second processing liquid receiving part are inclined so as to rise from the outside toward the inside, respectively. 2. The liquid processing apparatus according to 2.   The substrate holding body has a holding member that is disposed on the lower surface side thereof and holds the substrate by a holding portion that protrudes to the upper surface side of the substrate holding body through an opening, and the second processing liquid 4. The liquid processing apparatus according to claim 1, wherein the receiving part receives the processing liquid leaked to the back surface of the substrate holder via the opening. 5.   A partition wall is provided between the first processing liquid receiving part and the second processing liquid receiving part, and the partition wall is radially outer than the holding member when viewed from the rotation center of the substrate holder. The liquid processing apparatus according to claim 4, wherein the liquid processing apparatus is located in the position.   The first processing liquid receiving portion is formed as a first annular recess, and the second processing liquid receiving portion is formed as a second annular recess provided inside the first annular recess. The liquid processing apparatus according to claim 1, wherein:   The liquid processing apparatus according to claim 6, further comprising a communication port that discharges the processing liquid from the second annular recess to the first annular recess.   The liquid processing apparatus according to claim 6 or 7, wherein the second annular recess is formed to be shallower than the first annular recess.   The bottom portion of the first annular recess and the bottom portion of the second annular recess are inclined so as to rise from the outside toward the inside, respectively. The liquid processing apparatus according to item 1.   The substrate holding body has a holding member that is disposed on the lower surface side thereof and holds the substrate by a holding portion that protrudes to the upper surface side of the substrate holding body through an opening, and the second processing liquid 10. The liquid processing apparatus according to claim 6, wherein the receiving portion receives a processing liquid leaked to a back surface of the substrate holder through the opening. 11.   A partition wall is provided between the first annular recess and the second annular recess, and the partition wall is positioned on the radially outer side than the holding member when viewed from the rotation center of the substrate holder. The liquid processing apparatus according to any one of claims 6 to 10, wherein   An exhaust cup is provided outside the drain cup so as to surround the drain cup, and further includes an exhaust cup for taking in and exhausting mainly gas components from the liquid receiving cup and its surroundings. The liquid processing apparatus of any one of Claims 1-11. A substrate holder that holds the substrate horizontally and can be rotated together with the substrate; and a liquid receiving cup that receives the processing liquid shaken off from the rotating substrate and has an annular shape surrounding the substrate held by the substrate holder. A rotating mechanism for rotating the substrate holder, a liquid supply mechanism for supplying a processing liquid to the substrate, an annular shape corresponding to the liquid receiving cup, and a draining cup having a draining port for discharging the processing liquid, A liquid processing method using a liquid processing apparatus having a drain cup for receiving the processing liquid discharged from the liquid receiving cup,
A processing liquid discharged from the liquid receiving cup is received by a first processing liquid receiving part provided in the draining cup, and a first provided in the draining cup inside the first processing liquid receiving part. A liquid processing method, wherein the processing liquid leaked to the back surface of the substrate holding body is received by the processing liquid receiving portion of 2, and the processing liquid is guided to the drain port.

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