JP4805051B2 - Liquid processing equipment - Google Patents

Description

  The present invention relates to a liquid processing apparatus that performs predetermined liquid processing on a substrate such as a semiconductor wafer.

  In a semiconductor device manufacturing process and a flat panel display (FPD) manufacturing process, a process of supplying a processing liquid to a semiconductor wafer or a glass substrate, which is a substrate to be processed, and performing liquid processing is frequently used. As such a process, for example, a cleaning process for removing particles or contamination attached to the substrate, a coating process of a photoresist solution or a developing solution in a photolithography process, and the like can be given.

  As such a liquid processing apparatus, a substrate such as a semiconductor wafer is held on a spin chuck, a processing liquid is supplied to the front surface or front and back surfaces of the wafer while the substrate is rotated, and a liquid film is applied to the front or back surface of the wafer. A single-wafer type is known in which processing is performed by forming a film.

  In this type of apparatus, the processing liquid is usually supplied to the center of the wafer, and by rotating the substrate, the processing liquid is spread outward to form a liquid film, and the processing liquid is generally released. ing. A member such as a cup surrounding the outside of the wafer is provided so as to guide the processing liquid shaken off the substrate downward, so that the processing liquid shaken off from the wafer is quickly discharged. However, when a cup or the like is provided in this way, the processing liquid may scatter as mist and reach the substrate to cause defects such as watermarks and particles.

As a technique capable of preventing such a problem, Patent Document 1 discloses a processing liquid that receives a processing liquid scattered in the outer peripheral direction from a substrate so as to rotate integrally with a rotation support unit that rotates the substrate while being horizontally supported. There is disclosed a technique in which a receiving member is provided to receive a processing liquid and guide the processing liquid to the outside for recovery. In this Patent Document 1, the processing liquid receiving member includes, in order from the substrate side, a horizontal eaves part, an inclined guide part that guides the processing liquid outward and downward, a horizontal guide part that guides the processing liquid horizontally outward, and a vertical standing part. It has a wall to be installed, and the process liquid is forced into a narrow area and discharged to the horizontal outside through the drain port provided at the corner of the process receiving member while preventing the mist from reattaching to the substrate. Furthermore, the liquid is drained through a groove extending outwardly inside the spacer disposed outside the processing liquid receiving member.
JP-A-8-1064

  However, in Patent Document 1, since the processing liquid receiving member that rotates together with the substrate drives the processing liquid into a narrow area outside the substrate, the spacer portion outside the substrate becomes large, and the footprint of the apparatus is reduced. It will be big. On the other hand, when trying to reduce the size of the apparatus, it becomes difficult to effectively prevent the adhesion of particles due to the mist reattaching to the substrate.

  This invention is made | formed in view of this situation, Comprising: It aims at providing the liquid processing apparatus which can achieve size reduction, preventing the adhesion of the particle to a board | substrate effectively.

In order to solve the above-described problems, the present invention provides a liquid processing apparatus for supplying a processing liquid for cleaning processing to a substrate to clean the substrate, which holds the substrate horizontally and can rotate with the substrate. A rotating cup that surrounds the substrate held by the substrate holding unit and can rotate with the substrate and receives the processing liquid shaken off from the substrate, and a rotation that integrally rotates the rotating cup and the substrate holding unit A mechanism, a processing liquid supply mechanism for supplying a processing liquid to the substrate, a drainage cup provided so as to surround the outer side of the rotating cup, and receiving and draining the processing liquid discharged from the rotating cup; A treatment liquid discharged from the rotating cup and bounced off the wall of the drain cup includes an upward flow suppression unit that suppresses an upward flow formed by rising between the rotary cup and the drain cup; The rotating force And a cylindrical outer wall portion extending vertically downward from an outer end portion of the collar portion, and the drainage cup is disposed on the outer side of the rotating cup. The processing liquid splashed from the substrate held by the substrate holding part has a vertical wall provided close to the outside of the wall part and a bottom part extending inward from a lower end part of the vertical wall, The drainage cup is led from between the substrate holding part and the outer wall part, and the upward flow suppressing part is formed at a position below the outer wall part of the rotating cup in the vertical wall of the drainage cup. In addition, a notch portion including an inclined portion that bounces down the processing liquid that has flew from the lower end of the outer wall portion by centrifugal force, and an inward direction so as to cover the flange portion of the rotating cup from the upper end of the vertical wall. the liquid processing apparatus characterized by having an overhanging projecting portion Subjected to.

The said structure WHEREIN: The said protrusion part shall have a return part which rebounds the said upward flow in the front-end | tip part. The drain cup may further include an exhaust cup that is provided outside the drain cup so as to surround the drain cup and exhausts mainly the gas components from the rotary cup and its surroundings. .

  According to the present invention, since the rotating cup that rotates with the rotation of the substrate is provided, the centrifugal force acts on the rotating cup, and the direct reversal of the mist of the processing liquid as when the fixed cup is provided is prevented. By adopting a configuration in which a drainage cup is provided on the outer side, the drainage cup can be brought close to the rotating cup and the apparatus configuration can be reduced in size. In this case, the processing liquid discharged from the rotating cup hits the wall of the draining cup by centrifugal force, and rebounds there, and a part of it rises to contaminate the outer part of the rotating cup or jump out of the draining cup. There is a possibility that particles may adhere to the substrate due to mist formation, etc., but the upward flow suppression unit that suppresses the upward flow formed by the rise of the processing liquid that has been discharged from the rotating cup and bounced off the wall of the drainage cup Therefore, it is possible to effectively prevent contamination of the outer side of the rotating cup due to the processing liquid or the processing liquid jumping out of the draining cup and becoming a mist, and effectively preventing particles from adhering to the substrate. .

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, a case where the present invention is applied to a liquid processing apparatus that performs front and back surface cleaning of a semiconductor wafer (hereinafter simply referred to as a wafer) will be described.

  1 is a sectional view showing a schematic configuration of a liquid processing apparatus according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a schematic view showing a liquid processing supply mechanism of the liquid processing apparatus of FIG. FIG. 2 is an enlarged cross-sectional view showing an exhaust / drainage part of the liquid processing apparatus of FIG. 1. A plurality of liquid processing apparatuses 100 are incorporated in a liquid processing system (not shown), and a base plate 1, a wafer holding unit 2 that rotatably holds a wafer W that is a substrate to be processed, and a rotation of the wafer holding unit 2. A rotating motor 3 that rotates, a rotary cup 4 that is provided so as to surround the wafer W held by the wafer holder 2, and rotates with the wafer holder 2, and a surface treatment liquid supply that supplies a treatment liquid to the surface of the wafer W It has a nozzle 5, a back surface processing liquid supply nozzle 6 for supplying a processing liquid to the back surface of the wafer W, and an exhaust / drainage unit 7 provided at the peripheral edge of the rotating cup 4. A casing 8 is provided so as to cover the periphery of the exhaust / drainage unit 7 and the upper portion of the wafer W. At the upper part of the casing 8 is provided an airflow introduction part 9 for introducing an airflow from a fan filter unit (FFU) of the liquid processing system through an introduction port 9a provided on the side part, and the wafer holding part 2 A down flow of clean air is supplied to the wafer W held on the substrate.

  The wafer holding unit 2 includes a horizontally-rotating rotating plate 11 having a disk shape and a cylindrical rotating shaft 12 connected to the center of the back surface and extending vertically downward. A circular hole 11 a that communicates with the hole 12 a in the rotating shaft 12 is formed at the center of the rotating plate 11. And the raising / lowering member 13 provided with the back surface process liquid supply nozzle 6 is provided so that raising / lowering is possible in the hole 12a and the hole 11a. The rotating plate 11 is provided with holding members 14 for holding the outer edge of the wafer W, and as shown in FIG. 2, three of them are arranged at equal intervals. The holding member 14 is configured to hold the wafer W horizontally with the wafer W slightly floating from the rotating plate 11. The holding member 14 includes a holding portion 14a capable of holding the end surface of the wafer W, an attaching / detaching portion 14b extending from the holding portion 14a toward the center of the back surface of the rotating plate, and a rotating shaft for rotating the holding portion 14a in a vertical plane. 14c, and the upper end of the detachable portion 14b is pushed upward by a cylinder mechanism (not shown), whereby the holding portion 14a rotates outwardly and the holding of the wafer W is released. The holding member 14 is urged in a direction in which the holding portion 14a holds the wafer W by a spring member (not shown), and the wafer W is held by the holding member 14 when the cylinder mechanism is not operated.

  The rotating shaft 12 is rotatably supported by the base plate 1 via a bearing member 15 having two bearings 15a. A pulley 16 is fitted into the lower end of the rotating shaft 12, and a belt 17 is wound around the pulley 16. The belt 17 is also wound around a pulley 18 attached to the shaft of the motor 3. The rotating shaft 12 is rotated via the pulley 18, the belt 17 and the pulley 16 by rotating the motor 3.

  The surface treatment liquid supply nozzle 5 is attached to the tip of the nozzle arm 22a while being held by the nozzle holding member 22, and passes through a flow path provided in the nozzle arm 22a from the treatment liquid supply mechanism 85 described later. A processing liquid or the like is supplied, and the processing liquid is discharged through a nozzle hole 5a provided therein. Examples of the processing liquid to be discharged include a chemical for wafer cleaning, a rinse liquid such as pure water, and the like. The nozzle holding member 22 is also provided with a dry solvent nozzle 21 for discharging a dry solvent typified by IPA, and discharges a dry solvent such as IPA through a nozzle hole 21a provided therein. It has become.

  As shown also in FIG. 2, the nozzle arm 22a is rotatably provided about the shaft 23 by the drive mechanism 81, and the surface treatment liquid supply nozzle 5 is centered on the wafer W by rotating the nozzle arm 22a. The wafer cleaning position on the upper and outer circumferences and the retracted position on the outside of the wafer W can be taken. The nozzle arm 22a can be moved up and down by an elevating mechanism 82 such as a cylinder mechanism.

  As shown in FIG. 3, a channel 83a is provided in the nozzle arm 22a, and the nozzle hole 5a of the surface treatment liquid supply nozzle 5 is connected to one end of the channel 83a. A pipe 84a is connected to the other end of the flow path 83a. On the other hand, a flow path 83b is also provided in the nozzle arm 22a, and the nozzle hole 21a of the dry solvent nozzle 21 is connected to one end of the flow path 83b. A pipe 84b is connected to the other end of the flow path 83b. A predetermined processing liquid is supplied from the processing liquid supply mechanism 85 to the pipes 84a and 84b. The processing liquid supply mechanism 85, for example, a DHF supply source 86 that supplies dilute hydrofluoric acid (DHF) that is an acid chemical liquid, and an SC1 supply source that supplies ammonia perwater (SC1) that is an alkaline chemical liquid as chemical liquids for cleaning processing. 87, a DIW supply source 88 that supplies, for example, pure water (DIW) as a rinsing liquid, and an IPA supply source 95 that supplies, for example, IPA as a dry solvent. Pipes 89, 90, 91 extend from the DHF supply source 86, the SC1 supply source 87, and the DIW supply source 88, and these pipes 89, 90, 91 are connected to the pipe 84a via open / close valves 92, 93, 94. ing. Therefore, by operating the on-off valves 92, 93, 94, ammonia superwater (SC1), dilute hydrofluoric acid (DHF), and pure water (DIW) can be selectively supplied to the surface treatment liquid supply nozzle 5. Yes. In this case, a pipe 91 extending from the DIW supply source 88 is connected to the most upstream side of the pipe 84a. On the other hand, a pipe 84b extending from the flow path 83b is directly connected to the IPA supply source 95, and an open / close valve 96 is provided in the pipe 84b. Therefore, the IPA can be supplied to the dry solvent nozzle 21 by opening the opening / closing valve 96.

  The back surface treatment liquid supply nozzle 6 is provided at the center of the elevating member 13, and a nozzle hole 6a extending along the longitudinal direction is formed therein. A predetermined processing liquid is supplied from the lower end of the nozzle hole 6a by a processing liquid supply mechanism (not shown), and the processing liquid is discharged to the back surface of the wafer W through the nozzle hole 6a. Examples of the treatment liquid to be discharged include cleaning chemicals, rinse liquids such as pure water, and the like, similar to the surface treatment liquid supply nozzle 5. The processing liquid supply mechanism for supplying the processing liquid to the back surface processing liquid supply nozzle 6 can be configured in substantially the same manner as the processing liquid supply mechanism 85 except for the IPA supply system. A wafer support 24 for supporting the wafer W is provided at the upper end of the elevating member 13. On the upper surface of the wafer support 24, there are three wafer support pins 25 (only two are shown) for supporting the wafer W. A cylinder mechanism 27 is connected to the lower end of the back surface treatment liquid supply nozzle 6 via a connection member 26. The wafer mechanism W is moved up and down by the cylinder mechanism 27 so that the wafer W is loaded. And unloading is performed.

  The rotary cup 4 has an annular flange 31 that extends obliquely upward inward from the upper end of the rotary plate 11 and a cylindrical outer wall 32 that extends vertically downward from the outer end of the flange 31. . As shown in the enlarged view of FIG. 4, an annular gap 33 is formed between the outer wall portion 32 and the rotary plate 11, and the wafer W is transferred from the gap 33 to the rotary plate 11 and the rotary cup 4. At the same time, the processing liquid (mist) that is rotated and scattered is guided downward.

  A plate-shaped guide member 35 is interposed between the flange portion 31 and the rotating plate 11 at a position substantially the same height as the wafer W. As shown in FIG. 5, a plurality of openings 36 and 37 for allowing the processing liquid to pass therethrough are formed between the flange 31 and the guide member 35 and between the guide member 35 and the rotating plate 11, respectively. Spacer members 38 and 39 are arranged along the circumferential direction. The flange 31, the guide member 35, the rotating plate 11, and the spacer members 38 and 39 between them are screwed with screws 40.

  The guide member 35 is provided such that the front and back surfaces thereof are substantially continuous with the front and back surfaces of the wafer W. When the wafer 3 is rotated together with the wafer W by the motor 3 and the processing liquid is supplied from the surface processing liquid supply nozzle 5 to the center of the surface of the wafer W, the processing liquid is centrifuged by the centrifugal force. Is spread out from the periphery of the wafer W. The processing liquid shaken off from the surface of the wafer W is guided to the surface of the guide member 35 provided substantially continuously, discharged outward from the opening 36, and guided downward by the outer wall portion 32. Similarly, when the wafer holder 2 and the rotating cup 4 are rotated together with the wafer W and the processing liquid is supplied from the back surface processing liquid supply nozzle 6 to the center of the back surface of the wafer W, the processing liquid is subjected to the wafer W by centrifugal force. Is spread from the periphery of the wafer W. The processing liquid spun off from the back surface of the wafer W is guided to the back surface of the guide member 35 provided substantially continuously with the back surface of the wafer W, is discharged outward from the opening 37, and is guided downward by the outer wall portion 32. It is burned. At this time, since the centrifugal force acts on the processing liquid that has reached the spacer members 38 and 39 and the outer wall portion 32, they are prevented from returning to the inside as mist.

  Further, since the guide member 35 guides the processing liquid shaken off from the front surface and the back surface of the wafer W in this way, the processing liquid detached from the peripheral edge of the wafer W is not easily turbulent and rotates without causing the processing liquid to be misted. It can be led out of the cup 4. As shown in FIG. 2, the guide member 35 is provided with a notch 41 at a position corresponding to the wafer holding member 14 so as to avoid the wafer holding member 14.

  The exhaust / drainage unit 7 is mainly for recovering gas and liquid discharged from the space surrounded by the rotary plate 11 and the rotary cup 4, and as shown in the enlarged view of FIG. An annular drain cup 51 that receives the processing liquid discharged from the cup 4 and an annular exhaust cup 52 that is provided outside the drain cup 51 so as to surround the drain cup 51 are provided. .

  The drainage cup 51 has a vertical wall 53 provided vertically near the outer wall portion 32 and a bottom portion 54 extending inward from the lower end portion of the vertical wall 53 on the outside of the rotating cup 4. Yes.

  A cutout portion 72 is formed in the surface portion of the vertical wall 53 below the lower end of the outer wall portion 32 of the rotating cup 4 along the circumferential direction. The cutout portion 72 has an inclined portion 73 formed on the upper portion thereof so as to bounce the processing liquid downward. That is, the inclined portion 73 is an inclined surface facing downward, and the processing liquid guided downward along the outer wall portion 32 of the rotating cup 4 in a rotating state is centrifuged from the lower end of the outer wall portion 32. The treatment liquid is bounced downward when it flies toward the vertical wall 53 by force and hits the inclined portion 73. When the inclined portion 73 is not formed, a part of the processing liquid that has hit the outer wall portion 32 rises between the outer wall portion 32 of the rotating cup 4 and the vertical wall 53 of the drainage cup 51. However, the upward flow can be suppressed by the inclined portion 73. Therefore, the inclined part 73 functions as an upward flow suppressing part.

  Further, at the upper end of the vertical wall 53, an overhanging portion 53 a that protrudes inward so as to cover the upper portion of the flange portion 31 of the rotating cup 4 is provided. This overhanging portion 53 a prevents the upward flow that cannot be blocked by the inclined portion 73 from contaminating the upper surface of the flange portion 31 or jumping out the drainage cup 51. That is, the overhang portion 53a also functions as an upward flow suppressing portion. A return portion 53b is provided below the distal end portion of the overhang portion 53a, so that the treatment liquid can be more reliably prevented from reaching the upper surface of the flange portion 31.

  A drainage cup 51 has a partition wall 55 that extends from the bottom 54 to the vicinity of the lower surface of the rotating plate 11 and is provided annularly along the circumferential direction at a position outside the holding member 14 inside the drainage cup 51. The drain cup 51 includes a main cup portion 56 that receives the processing liquid discharged from the gap 33 and a sub cup portion that receives the processing liquid dropped from the vicinity of the holding portion 14 a of the holding member 14. 57. The bottom portion 54 is divided by a partition wall 55 into a first portion 54a corresponding to the main cup 56 and a second portion 54b corresponding to the sub cup 57, both of which are directed from the outside to the inside (rotation center side). It is inclined to rise. The inner end of the second portion 54b reaches a position corresponding to the inner side (rotation center side) of the holding portion 14a of the holding member 14. The partition wall 55 serves to prevent the airflow formed by the portion of the holding member 14 protruding below the rotating plate 11 from reaching the wafer W side with mist when the rotating plate 11 rotates. Have. The partition wall 55 is formed with a hole 58 for guiding the processing liquid from the sub cup portion 57 to the main cup portion 56.

  One drainage port 60 is provided in the outermost part of the bottom 54 of the drainage cup 51, and a drainage pipe 61 is connected to the drainage port 60. The drainage pipe 61 is provided with a drainage switching unit (not shown), which is separated and collected or discarded according to the type of processing liquid. Note that a plurality of drain ports 60 may be provided.

  The exhaust cup 52 is provided so that the outer wall 64 provided perpendicular to the outer portion of the vertical wall 53 of the drain cup 51 and the inner portion of the holding member 14 are perpendicular to the upper end of the holding member 14. The inner wall 65, the bottom wall 66 provided on the base plate 1, and the upper wall 67 that is curved upward from the outer wall 64 and is provided so as to cover the upper side of the rotating cup 4. The exhaust cup 52 takes in and exhausts mainly gas components in and around the rotary cup 4 from an annular inlet 68 formed between the upper side wall 67 and the flange 31 of the rotary cup 4. ing. As shown in FIG. 1, an exhaust port 70 is provided below the exhaust cup 52, and an exhaust pipe 71 is connected to the exhaust port 70. A suction mechanism (not shown) is provided on the downstream side of the exhaust pipe 71 so that the periphery of the rotary cup 4 can be exhausted. A plurality of exhaust ports 70 are provided, and can be switched and used in accordance with the type of treatment liquid.

  Thus, the processing liquid is guided to the drainage cup 51 through the rotating cup 4, the gas component is guided from the introduction port 68 to the exhaust cup 52, and the drainage liquid from the drainage cup 51 and the exhaust cup 52 Since the exhaust is performed independently, it is possible to guide the drainage and the exhaust in a separated state. Further, even if mist leaks from the drain cup 51, the exhaust cup 52 surrounds the periphery thereof, so that it is quickly discharged through the exhaust port 70, and the mist is reliably prevented from leaking outside.

  Next, the operation of the liquid processing apparatus 100 configured as described above will be described with reference to FIG. First, as shown in FIG. 6A, the wafer W is delivered from the transfer arm (not shown) onto the support pins 25 of the wafer support 24 in a state where the elevating member 13 is raised. Next, as shown in FIG. 6B, the elevating member 13 is lowered to a position where the wafer W can be held by the holding member 14, and the wafer W is chucked by the holding member 14. Then, as shown in FIG. 6C, the surface treatment liquid supply nozzle 5 is moved from the retracted position to the wafer cleaning position.

  In this state, as shown in FIG. 6D, the motor 3 rotates the wafer holding unit 2 together with the rotating cup 4 and the wafer W, while the surface treatment liquid supply nozzle 5 and the back surface treatment liquid supply nozzle 6 The wafer W is cleaned by supplying the processing liquid.

  In this wafer cleaning process, the processing liquid is supplied to the front and back surfaces of the wafer W by the front surface processing liquid supply nozzle 5 and the back surface processing liquid supply nozzle 6, and the cleaning liquid spreads outside the wafer W by centrifugal force. It is shaken off from the periphery.

  In this wafer cleaning process, since the cup provided so as to surround the outside of the wafer W is the rotating cup 4 that rotates together with the wafer W, when the processing liquid shaken off from the wafer W hits the rotating cup 4. In addition, since centrifugal force acts on the treatment liquid, scattering (misting) unlike the case of the fixed cup hardly occurs. Then, the processing liquid that has reached the rotating cup 4 is guided downward and discharged from the gap 33 to the main cup portion 56 of the draining cup 51. On the other hand, since the hole for inserting the holding portion 14 a is provided at the attachment position of the holding member 14 of the rotating plate 11, the processing liquid is dropped from that portion into the sub-cup portion 57 of the draining cup 51. Then, the processing liquid received in the drain cup 51 in this manner is discharged from the drain port 60 through the drain pipe 61. Further, the exhaust cup 52 mainly receives gas components in and around the rotary cup 4 from an inlet 68 that forms an annular shape between the upper wall 67 of the rotary cup 4 and the flange 31 of the rotary cup 4. The exhaust is exhausted through the exhaust pipe 71.

  When cleaning the wafer W in this way, as described above, the processing liquid hardly rebounds from the rotating cup 4 to form mist, but the draining cup 51 is simply brought close to the rotating cup 4. 7, as shown in FIG. 7, the processing liquid discharged from the rotating cup 4 flies toward the vertical wall 53 of the draining cup 51 by centrifugal force, and when it hits the vertical wall 53, a part of the processing liquid is discharged to the rotating cup 4. Ascending flow A rises between the outer wall portion 32 of the liquid and the vertical wall 53 of the draining cup 51, and this may rise to the upper part of the rotating cup. It has the adverse effect of becoming mist and adhering as particles on the wafer W. Further, when such an upward flow occurs, the treatment liquid adheres to the surface of the flange 31 in the rotary cup 4, and if it is, for example, an acid-based treatment liquid, it reacts when an alkaline treatment liquid adheres thereafter. As a result, a salt is formed, which is dried to form particles, which also adhere to the wafer W. Further, there is a disadvantage that the processing liquid that has risen is guided to the exhaust cup 52.

  On the other hand, in the case where the notched portion 72 is formed in accordance with the present embodiment and the inclined portion 73 that functions as the upward flow suppressing portion is provided, as shown in FIG. The treatment liquid that has flowed toward the vertical wall 53 of the drainage cup 51 hits the inclined portion 73 of the cutout portion 72 and is largely rebounded downward, and the upward flow can be suppressed. Further, even if an upward flow of the processing liquid remains, a protruding portion 53a is provided at the upper end of the draining cup 51. The protruding portion 53a also functions as an upward flow suppressing portion, and the upward flow is discharged from the draining cup 51. And the effect of preventing particle contamination of the wafer W can be further enhanced. In addition, since the return portion 53b is provided below the tip of the overhang portion 53a, even if there is an upward flow reaching the overhang portion 53a, the treatment liquid is bounced back against the return portion 53b. Reaching the upper surface of the collar portion 31 can be prevented more reliably.

  In addition, since the effect which suppresses an upward flow becomes large when both the inclination part 73 and the overhang | projection part 53a exist, it is preferable to provide both, but even if it is any of the inclination part 73 and the overhang part 53a, Even in this case, a certain degree of upward flow suppression effect can be obtained.

Next, another example of the upward flow suppressing unit will be described.
FIG. 9 is an enlarged view showing another example of the upward flow suppressing unit, and FIG. 10 is an enlarged view showing still another example of the upward flow suppressing unit.

  In the example of FIG. 9, a protrusion 74 is formed on the portion of the vertical wall 53 corresponding to the lower end of the outer wall portion 32 of the rotating cup 4 along the circumferential direction on the rotating cup 4 side. The lower surface of the protrusion 74 is an inclined portion 75 formed so as to bounce the processing liquid downward. That is, the inclined portion 75 is formed as an inclined surface facing downward, and when it flies from the lower end of the outer wall portion 32 of the rotating cup 4 toward the vertical wall 53 by centrifugal force and hits the inclined portion 75. The treatment liquid is bounced downward. Therefore, the inclined portion 75 functions in the same manner as the inclined portion 73.

  In the example of FIG. 10, a step is formed at a position corresponding to a portion above the lower end of the outer wall portion 32 of the vertical wall 53, and the step portion is used as a return portion 76. That is, by providing the return portion 76 between the outer wall portion 32 of the rotating cup 4 and the vertical wall 53 of the draining cup 51, the upward flow formed by hitting the vertical wall 53 is rebounded downward by the return portion 76. As a result, the upward flow of the processing liquid can be effectively suppressed.

  Further, as shown in FIG. 11 (a), the inclined portion 73 and the return portion 76 are combined, and as shown in FIG. 11 (b), the inclined portion 75 and the return portion 76 are combined. The suppression effect can be further increased.

  The present invention can be variously modified without being limited to the above embodiment. For example, in the above-described embodiment, a liquid processing apparatus that performs front and back surface cleaning of a wafer has been described as an example. Further, the liquid processing is not limited to the cleaning processing, and may be other liquid processing such as resist liquid coating processing and subsequent development processing. Furthermore, although the case where a semiconductor wafer is used as the substrate to be processed has been described in the above embodiment, it may be applied to another substrate such as a flat panel display (FPD) substrate represented by a glass substrate for a liquid crystal display (LCD). Needless to say, it is applicable.

  The present invention is effective for a cleaning apparatus for removing particles and contamination adhering to a semiconductor wafer.

1 is a cross-sectional view illustrating a schematic configuration of a liquid processing apparatus according to an embodiment of the present invention. 1 is a schematic plan view showing a liquid processing apparatus according to an embodiment of the present invention with a part cut away. Schematic which shows the process liquid supply mechanism of the liquid processing apparatus of FIG. Sectional drawing which expands and shows the exhaust_gas | exhaustion / drainage part of the liquid processing apparatus of FIG. The figure for demonstrating the attachment state of the rotating cup and guide member of the liquid processing apparatus of FIG. The figure for demonstrating the processing operation of the liquid processing apparatus which concerns on one Embodiment of this invention. The enlarged view for demonstrating the state at the time of performing a washing process without providing an upper amount flow suppression part. The enlarged view for demonstrating the state at the time of performing a cleaning process by providing an upward flow suppression part according to this invention. The enlarged view for demonstrating the other example of an upward flow suppression part. The enlarged view for demonstrating the further another example of an upward flow control part. The figure for demonstrating the example of the composite type upward flow suppression part of an inclination part and a return part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Base plate 2; Wafer holding part 3; Rotating motor 4; Rotating cup 5; Surface treatment liquid supply nozzle 6; Back surface treatment liquid supply nozzle 7; Exhaust / drainage part 8; Casing 9; Rotating shaft 13; Elevating member 14; Holding member 22; Nozzle holding member 22a; Nozzle arm 31; Gutter part 32; Outer wall part 33; Gap 35; Guide member 51; Draining cup 52; ; Overhanging part (upflow control part)
53b; return part 72; notch part 73; inclined part (upflow restraint part)
74; protrusion 75; inclined portion (upflow restraint portion)
76; Return part (upflow restraint part)
81; Drive mechanism 85; Processing liquid supply mechanism 88; Pure water supply source 100; Liquid processing apparatus W; Wafer

Claims (3)

A liquid processing apparatus for cleaning a substrate by supplying a processing liquid for cleaning processing to the substrate,
A substrate holding unit that holds the substrate horizontally and can rotate with the substrate;
A rotating cup that surrounds the substrate held by the substrate holding unit, is rotatable with the substrate, and receives the processing liquid shaken off from the substrate;
A rotation mechanism for integrally rotating the rotary cup and the substrate holding part;
A processing liquid supply mechanism for supplying the processing liquid to the substrate;
A drainage cup provided so as to surround the outer side of the rotating cup, and receiving and draining the processing liquid discharged from the rotating cup;
An ascending flow suppression unit that suppresses an upward flow formed by the processing liquid discharged from the rotating cup and rebounding from the wall of the draining cup ascending between the rotating cup and the draining cup; ,
The rotating cup has a collar portion that covers the upper portion of the end portion of the substrate holding portion and a cylindrical outer wall portion that extends vertically downward from the outer end portion of the collar portion,
The drainage cup has a vertical wall provided close to the outside of the outer wall portion of the rotating cup, and a bottom portion extending inward from a lower end portion of the vertical wall,
The processing liquid splashed from the substrate held by the substrate holding part is guided to the drainage cup from between the substrate holding part and the outer wall part,
The upward flow suppression unit is formed at a position below the outer wall portion of the rotating cup in the vertical wall of the draining cup, and the processing liquid that has flew by centrifugal force downward from the lower end of the outer wall portion. A liquid processing apparatus , comprising: a notch portion including an inclined portion that bounces back; and a projecting portion that projects inward from an upper end of the vertical wall so as to cover a flange portion of the rotating cup . The liquid processing apparatus according to claim 1 , wherein the projecting portion has a return portion that repels the upward flow at a tip portion thereof. Claim 1, wherein the provided so as to surround the drain cup to the outside of the drain cup, further comprising an exhaust cup for exhausting incorporating mainly of gaseous components from the rotary cup and around the Or the liquid processing apparatus of Claim 2 .

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