JPH01140628A - Resist coating equipment - Google Patents

Abstract

PURPOSE:To obtain a resist film of uniform thickness, by providing a region of a square mask substrate where resist is liable to scatter, with 1 protrusion to capture the scattered resist. CONSTITUTION:In a region adjacent to a corner part 9 of a square mask substrate 1 on a spinner chuck 2, on which corner resist is liable to scatter, a rod-like protrusion 10 to capture the scattered resist 11 from the mask substrate 1 surface is arranged in such a manner as to extend toward the inner peripheral wall of a cup 3. The resist 11 extending in the form of a fiber which is scattered from the corner part 9 of the mask substrate 1 is effectively made to attach to the cup 3, and can be prevented from attaching again on the mask substrate surface. Thereby forming a resist film of uniform thickness on the mask substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to semiconductor manufacturing equipment, and particularly to resist coating equipment.

[Conventional technology]

Conventionally, in this type of resist coating apparatus, a rectangular rusk substrate 1 is held by a spinner chuck 2 and housed in a cup 3, as shown in FIG. 3(a).

This cup 3 has a drain 5 and a duct 6 for collecting the resist solution. After holding the mask substrate 1 on a spinner chuck 2, it is covered with a cup lid 4, and resist is dripped from a nozzle 7. The mask substrate 1 onto which the resist has been dropped is rotated at high speed by a motor 8 to spin-code the resist.

[Problem that the invention seeks to solve]

In such a resist coating device, when a resist with a normal viscosity is dropped onto a mask substrate and rotated, it is spin-coated uniformly and the excess resist is scattered and turned into a mist and absorbed into the duct 6, but resist with high viscosity When the resist is spin-coded, the excess resist is completely scattered and stretched into a thread-like form instead of becoming a mist. As shown in FIG. 3(b), at the rotational position indicated by the broken line, resist with a higher viscosity than the corner 9 of the mask substrate 1 is scattered and stretched into a thread-like shape, and when the mask substrate 1 reaches the rotational position indicated by the solid line, this thread-like resist The stretched resist 11 ends up adhering to the surface of the mask substrate 1. As a result, there is a drawback that a resist film of uniform thickness cannot be obtained and a high quality semiconductor cannot be obtained.

An object of the present invention is to provide a resist coating apparatus that solves the above-mentioned problems.

[Differences between the invention and the prior art]

The present invention differs from the conventional resist coating apparatus described above in that it forcibly collects the resist scattered from the microphone substrate and prevents it from adhering to the mask substrate again.

[Means for solving problems]

The present invention relates to a resist coating apparatus that drops resist onto a rectangular mask substrate held on a spinner chuck and rotates the substrate at high speed in a cup to form a resist film on the mask substrate. A resist coating device characterized in that a rod-shaped protrusion for capturing scattered resist from the mask substrate surface is provided in a region close to a corner where resist is easily scattered, extending toward the inner circumferential wall of the cup. be.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

(Example 1) FIG. 1(a) is a longitudinal sectional view of Embodiment 1 of the present invention.

FIG. 1(b) is a plan view of the present invention. A spinner chuck 2' that holds the mask substrate 1 is housed in a cup 3, and the upper opening of the cup 3 is covered with a cup lid 4. A door inlet 5 and a duct 6 are provided at the bottom of the cup 3 to collect the i-resist solution. The cup M4 can be opened and closed so that the mask substrate 1 can be taken in and taken out. The spinner chuck 2 has a bar-shaped protrusion 10 having the same height as the surface of the mask substrate 1 so as to be in contact with a corner 9 of the mask substrate 1 where the resist is easily scattered. The rod-shaped protrusion 10 extends in the direction of the cup 3 and has a distance from the cup 3 of 2 to 3.
Set the length to have a space of about 3 meters. Further, the angle R between the rod-shaped protrusion 10 and the mask substrate 1 is preferably 45° to 90°.

In this resist coating apparatus, a mask substrate 1 is held by a spinner chuck 2, and a cup lid 4 is closed. After dropping the resist from the nozzle 7 onto the surface of the mask substrate 1,
The spinner chuck 2 holding the mask substrate 1 is rotated by the motor 8 to perform spin coding. The highly viscous resist reaches the rod-shaped protrusion IO from the corner 9 of the mask substrate 1 due to centrifugal force, and from the tip the resist 11 extends like a thread and scatters, adhering to the cup 3 and not adhering to the surface of the mask substrate 1. . When the angle R between the bar-shaped protrusion IO and the mask substrate 1 is set to 90° or more or less than 45°, the bar-shaped protrusion I
The resist does not reach the tip of the O, and from halfway there, the resist stretches like a thread and re-attaches to the surface of the mask substrate 1.

(Example 2) FIG. 2(a) is a longitudinal sectional view of Example 2 of the present invention.

FIG. 2(b) is a plan view of the present invention. A spinner chuck 2 holding a mask substrate 1 is housed in a cup 3, and the top thereof is covered with a cup lid 4. cup 3
There is a drain 5 and a duct 6 at the bottom for collecting the resist solution.
is the provision. The cup lid 4 can be opened and closed so that the mask substrate 1 can be taken in and taken out. The pinner chuck 2 has a bar-shaped protrusion 10 at the same height as the surface of the mask substrate 1 so as to be in contact with a corner 9 of the mask substrate 1 where resist tends to scatter. Further, a wall body 12 is arranged adjacent to the bar-shaped protrusion 10 in a direction opposite to the direction of rotation of the spinner.
have. This wall #12 is higher than the surface of the mask substrate 1. The rod-shaped protrusion 10 has the same length and angle R as in the first embodiment.

In this resist coating apparatus, a mask substrate 1 is held by a spinner chuck 2 and a cup! Close 14. After dropping the resist from the nozzle 7 onto the surface of the mask substrate 1,
The spinner chuck 2 holding the mask substrate 1 is rotated by the motor 8 to perform spin coding. The highly viscous resist reaches the bar-shaped protrusion 10 from the corner 9 of the mask substrate 1 due to centrifugal force, and the resist 11 extends like a thread from the tip, scatters, and adheres to the cup 3. In this second embodiment, since the spinner chuck 2 has the wall body 12, the resist 11
It has the advantage that it spreads like a thread and does not stick to the cup 3, but even if it bounces back, it sticks to the wall 12 and does not stick to the surface of the mask substrate 1 at all.

〔Effect of the invention〕

As explained above, according to the resist coating device of the present invention, the thread-shaped resist scattered from the corners of the mask substrate is efficiently adhered to the cup, preventing re-adhesion to the mask substrate surface, and forming an extremely uniform film. This has the effect of forming a thick resist film on a mask substrate and manufacturing high quality semiconductors.

[Brief explanation of the drawing]

FIG. 1(a) is a longitudinal cross-sectional view of Embodiment 1 of the resist coating apparatus of the present invention, FIG. 1(b) is a plan view thereof, and FIG. 2(a) is Embodiment 2 of the resist coating apparatus of the present invention. 2(b) is a plan view thereof, FIG. 3(a) is a longitudinal sectional view of a conventional resist coating apparatus, and FIG. 3(b) is a plan view thereof. 1...Mask substrate 2...Spinner chuck 3...Cup 4...Cup lid 5...
・Drain 6...Duct 7...Nozzle
8...Motor 9...Corner where resist is likely to scatter 10...Bar-shaped protrusion 11...Resist
12...Wall Patent Applicant NEC Corporation -N Inn 1 sun 100 tobo ℃(Nia') 0- -N tsu dimension ℃σ＼ ptsu) l) G') 0-N -N I" ) size 0 mouth\σY force =

Claims (1)

[Claims] (1) In a resist coating device that drops resist onto a rectangular mask substrate held on a spinner chuck and rotates the substrate at high speed in a cup to form a resist film on the mask substrate, the rectangular mask substrate on the spinner chuck is used. A resist coating device comprising: a rod-shaped protrusion extending toward the inner circumferential wall of the cup to catch scattered resist from the surface of the mask substrate in a region close to a corner where resist is likely to scatter. .