CN108538999B - 发光器件封装 - Google Patents

发光器件封装 Download PDF

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Publication number
CN108538999B
CN108538999B CN201810344191.1A CN201810344191A CN108538999B CN 108538999 B CN108538999 B CN 108538999B CN 201810344191 A CN201810344191 A CN 201810344191A CN 108538999 B CN108538999 B CN 108538999B
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China
Prior art keywords
light emitting
emitting device
heat dissipation
device package
ceramic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201810344191.1A
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English (en)
Chinese (zh)
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CN108538999A (zh
Inventor
金炳穆
姜宝姬
金夏罗
小平洋
反田祐一郎
大关聪司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
LG Innotek Co Ltd
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Publication of CN108538999A publication Critical patent/CN108538999A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
    • A61L2/08—Radiation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
    • A61L2/08—Radiation
    • A61L2/10—Ultraviolet radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

Landscapes

  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN201810344191.1A 2012-09-25 2013-09-25 发光器件封装 Expired - Fee Related CN108538999B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020120106341A KR20140039740A (ko) 2012-09-25 2012-09-25 발광소자 패키지
KR10-2012-0106341 2012-09-25
CN201310450651.6A CN103700750B (zh) 2012-09-25 2013-09-25 发光器件封装

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201310450651.6A Division CN103700750B (zh) 2012-09-25 2013-09-25 发光器件封装

Publications (2)

Publication Number Publication Date
CN108538999A CN108538999A (zh) 2018-09-14
CN108538999B true CN108538999B (zh) 2021-08-06

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CN201810344192.6A Expired - Fee Related CN108520914B (zh) 2012-09-25 2013-09-25 发光器件封装
CN201810344191.1A Expired - Fee Related CN108538999B (zh) 2012-09-25 2013-09-25 发光器件封装
CN201310450651.6A Expired - Fee Related CN103700750B (zh) 2012-09-25 2013-09-25 发光器件封装

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US (5) US8754423B2 (enExample)
EP (1) EP2711997B1 (enExample)
JP (2) JP6338838B2 (enExample)
KR (1) KR20140039740A (enExample)
CN (3) CN108520914B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140039740A (ko) * 2012-09-25 2014-04-02 엘지이노텍 주식회사 발광소자 패키지
DE102012113014A1 (de) * 2012-12-21 2014-06-26 Epcos Ag Bauelementträger und Bauelementträgeranordnung
WO2015111452A1 (ja) * 2014-01-24 2015-07-30 旭硝子株式会社 発光素子用基板および発光装置
US9620559B2 (en) * 2014-09-26 2017-04-11 Glo Ab Monolithic image chip for near-to-eye display
KR20160141301A (ko) 2015-05-29 2016-12-08 삼성전자주식회사 반도체 발광 소자 패키지
JP2017143971A (ja) * 2016-02-16 2017-08-24 三菱重工メカトロシステムズ株式会社 容器の殺菌装置
US20170356640A1 (en) * 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
KR102361856B1 (ko) * 2016-06-10 2022-02-11 니폰 덴키 가라스 가부시키가이샤 기밀 패키지의 제조 방법 및 기밀 패키지
JP2018032608A (ja) * 2016-08-26 2018-03-01 パナソニックＩｐマネジメント株式会社 発光モジュール、移動体用照明装置及び移動体
CN107575849B (zh) * 2017-09-22 2020-02-21 宁波中物光电杀菌技术有限公司 紫外灯散热装置
WO2019080126A1 (zh) * 2017-10-27 2019-05-02 深圳前海小有技术有限公司 一种杀菌模块及杀菌单元
JP7231809B2 (ja) 2018-06-05 2023-03-02 日亜化学工業株式会社 発光装置
JP7135645B2 (ja) * 2018-09-19 2022-09-13 住友大阪セメント株式会社 光モジュール
CN117814752A (zh) * 2018-11-27 2024-04-05 晶元光电股份有限公司 光学感测模块
JP7262985B2 (ja) * 2018-12-04 2023-04-24 スタンレー電気株式会社 光源モジュール装置、流体殺菌装置
US12194168B2 (en) * 2018-12-19 2025-01-14 Vyv, Inc. Lighting and dissipation device
US11508641B2 (en) * 2019-02-01 2022-11-22 Toyota Motor Engineering & Manufacturing North America, Inc. Thermally conductive and electrically insulative material
US11784102B2 (en) 2020-07-29 2023-10-10 UTAC Headquarters Pte. Ltd. Hermetic semiconductor packages
CN112344222B (zh) * 2020-11-09 2022-12-30 深圳市聚丰彩光电有限公司 一种带有防护结构的led发光二极管
CN114498285B (zh) * 2022-01-24 2024-02-06 中国科学院半导体研究所 一种半导体激光器
WO2025047377A1 (ja) * 2023-08-30 2025-03-06 ソニーセミコンダクタソリューションズ株式会社 発光装置、および発光装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7250681B2 (en) * 2004-07-07 2007-07-31 Kabushiki Kaisha Toshiba Semiconductor device and a method of manufacturing the semiconductor device
CN101800201A (zh) * 2009-01-22 2010-08-11 三洋电机株式会社 电子元件用封装体和电子部件
CN102136541A (zh) * 2010-01-22 2011-07-27 中国科学院上海硅酸盐研究所 一种透明陶瓷白光led器件

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6330741B1 (en) * 1999-10-05 2001-12-18 The United States Of America As Represented By The Secretary Of The Navy Method of shrink fitting crystalline sapphire
KR100419611B1 (ko) 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
KR100439402B1 (ko) * 2001-12-24 2004-07-09 삼성전기주식회사 발광다이오드 패키지
JP2005126275A (ja) * 2003-10-23 2005-05-19 Kyocera Corp セラミック焼結体及びその撥水処理方法並びに回路基板及びセラミックパッケージ
EP1708284B1 (en) 2004-01-20 2017-03-29 Nichia Corporation Semiconductor light-emitting device
US7964883B2 (en) * 2004-02-26 2011-06-21 Lighting Science Group Corporation Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
WO2005106973A1 (ja) 2004-04-27 2005-11-10 Kyocera Corporation 発光素子用配線基板
JP2006093565A (ja) * 2004-09-27 2006-04-06 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
KR100709890B1 (ko) * 2004-09-10 2007-04-20 서울반도체 주식회사 다중 몰딩수지를 갖는 발광다이오드 패키지
KR100678848B1 (ko) 2004-10-07 2007-02-06 서울반도체 주식회사 힛트 싱크를 갖는 발광다이오드 패키지 및 그 제조방법
US7670872B2 (en) * 2004-10-29 2010-03-02 LED Engin, Inc. (Cayman) Method of manufacturing ceramic LED packages
US7821023B2 (en) * 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
JP2006303366A (ja) * 2005-04-25 2006-11-02 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ及びその製造方法
TW200704283A (en) * 2005-05-27 2007-01-16 Lamina Ceramics Inc Solid state LED bridge rectifier light engine
JP2007048969A (ja) * 2005-08-10 2007-02-22 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
EP1970968B1 (en) 2005-12-12 2016-07-06 Nichia Corporation Light emitting semiconductor device
JP2008109079A (ja) * 2006-09-26 2008-05-08 Kyocera Corp 表面実装型発光素子用配線基板および発光装置
US20080179618A1 (en) * 2007-01-26 2008-07-31 Ching-Tai Cheng Ceramic led package
JP2008288536A (ja) * 2007-05-21 2008-11-27 Panasonic Electric Works Co Ltd 表面実装型セラミック基板
KR101459752B1 (ko) * 2007-06-22 2014-11-13 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
JP5167977B2 (ja) 2007-09-06 2013-03-21 日亜化学工業株式会社 半導体装置
JP2009094213A (ja) * 2007-10-05 2009-04-30 Panasonic Electric Works Co Ltd 発光装置
KR101438808B1 (ko) * 2007-10-08 2014-09-05 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
TW200928203A (en) * 2007-12-24 2009-07-01 Guei-Fang Chen LED illuminating device capable of quickly dissipating heat and its manufacturing method
US8304660B2 (en) * 2008-02-07 2012-11-06 National Taiwan University Fully reflective and highly thermoconductive electronic module and method of manufacturing the same
CN101510542B (zh) * 2008-02-13 2013-01-16 张秀梅 大功率发光二极管芯片的一种封装结构与制造方法
JP5345363B2 (ja) * 2008-06-24 2013-11-20 シャープ株式会社 発光装置
JP2010087181A (ja) 2008-09-30 2010-04-15 Panasonic Corp 光素子用パッケージ、半導体発光装置および照明装置
TWI416586B (zh) * 2008-12-26 2013-11-21 Young Lighting Technology Inc 光源模組
TWM361098U (en) 2009-01-22 2009-07-11 Tcst Tech Co Ltd LED base structure capable of preventing leakage
KR101035335B1 (ko) * 2009-03-24 2011-05-23 김강 발광다이오드 패키지
US8384097B2 (en) * 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
CN101865436A (zh) * 2009-04-20 2010-10-20 必奇股份有限公司 发光二极管座体结构
JP2012532441A (ja) * 2009-07-03 2012-12-13 ソウル セミコンダクター カンパニー リミテッド 発光ダイオードパッケージ
CN102024710B (zh) 2009-09-18 2012-08-29 展晶科技(深圳)有限公司 光电元件的制造方法、封装结构及其封装装置
US8089086B2 (en) * 2009-10-19 2012-01-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light source
CN201549531U (zh) * 2009-10-30 2010-08-11 彩虹集团公司 一种大功率led封装结构
JP2011205009A (ja) * 2010-03-26 2011-10-13 Kyocera Corp 表面実装型発光素子用配線基板および発光装置
CN201936915U (zh) * 2010-12-22 2011-08-17 盐城六方体光电科技有限公司 一种led封装结构及其led模组
JP5372045B2 (ja) * 2011-02-25 2013-12-18 株式会社東芝 半導体発光素子
TW201242122A (en) * 2011-04-15 2012-10-16 Chi Mei Lighting Tech Corp Light-emitting diode device
JP5968674B2 (ja) 2011-05-13 2016-08-10 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを備える紫外線ランプ
US20120314419A1 (en) * 2011-06-08 2012-12-13 Wen-Kung Sung Heat dissipation structure of light-emitting diode
US8773006B2 (en) * 2011-08-22 2014-07-08 Lg Innotek Co., Ltd. Light emitting device package, light source module, and lighting system including the same
US8704433B2 (en) * 2011-08-22 2014-04-22 Lg Innotek Co., Ltd. Light emitting device package and light unit
US9115885B2 (en) * 2012-04-12 2015-08-25 Amerlux Inc. Water tight LED assembly with connector through lens
KR20140039740A (ko) * 2012-09-25 2014-04-02 엘지이노텍 주식회사 발광소자 패키지
KR102007404B1 (ko) * 2012-12-14 2019-08-05 엘지이노텍 주식회사 발광소자 패키지
EP3001466B1 (en) * 2013-05-23 2019-07-03 LG Innotek Co., Ltd. Light-emitting module
US9412911B2 (en) * 2013-07-09 2016-08-09 The Silanna Group Pty Ltd Optical tuning of light emitting semiconductor junctions

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7250681B2 (en) * 2004-07-07 2007-07-31 Kabushiki Kaisha Toshiba Semiconductor device and a method of manufacturing the semiconductor device
CN101800201A (zh) * 2009-01-22 2010-08-11 三洋电机株式会社 电子元件用封装体和电子部件
CN102136541A (zh) * 2010-01-22 2011-07-27 中国科学院上海硅酸盐研究所 一种透明陶瓷白光led器件

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JP6629382B2 (ja) 2020-01-15
US9076949B2 (en) 2015-07-07
US20160211429A1 (en) 2016-07-21
US8754423B2 (en) 2014-06-17
JP6338838B2 (ja) 2018-06-06
CN103700750A (zh) 2014-04-02
JP2018137481A (ja) 2018-08-30
US20150270463A1 (en) 2015-09-24
EP2711997A1 (en) 2014-03-26
EP2711997B1 (en) 2018-08-01
US20140084182A1 (en) 2014-03-27
US8872195B2 (en) 2014-10-28
JP2014068013A (ja) 2014-04-17
CN103700750B (zh) 2018-05-18
US9842975B2 (en) 2017-12-12
KR20140039740A (ko) 2014-04-02
CN108520914B (zh) 2021-10-26
US20140246604A1 (en) 2014-09-04
CN108538999A (zh) 2018-09-14
US9831406B2 (en) 2017-11-28
US20150048262A1 (en) 2015-02-19
CN108520914A (zh) 2018-09-11

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