CN108349724A - 电子部件接线板 - Google Patents
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Abstract
在电子部件接线板(1)中包括多个绝缘层(8、9、2、11、12)和导电层(13、14、15),并且还包括电子传感器(4),该传感器(4)由挠曲层(2)形成的至少一个挠曲件(4’)构成,该挠曲件(4’)从挠曲层(2)凸出并且进入挠曲层(2)内的间隙(3)中,并且带有挠曲感测器件(6)的至少一部分。
Description
技术领域
本发明涉及一种电子部件接线板及其用途,该电子部件接线板包括多个绝缘层和导电层,并且还包括电子传感器。
背景技术
本发明涉及一般的电子部件接线板,其中诸如晶体管、集成电路(IC,微芯片)等的电子部件排列于或嵌入带有并且电连接这些电子部件的线路板上或内。这种接线板可以是印刷电路板(PCB)或用于将单个集成电路或多个集成电路连接到印刷电路板的IC衬底。实际上,IC衬底和印刷电路板在基本功能方面非常类似,仅尺寸不同,这在本说明书的稍后部分将进行描述和定义。出于理解本说明书的目的,术语“印刷电路板”、“IC衬底”和“电子部件接线板”可互换地使用。为了简洁起见,下面的描述主要针对印刷电路板,然而,技术人员明白参照IC衬底也是可以理解到本说明书中给出的详情。
部件在本发明的意义上可以是任何有源电子部件或无源电子部件。特别是,部件可以是电子芯片,特别是,半导体芯片、电容器、电阻器、电感、诸如DRAM的数据储存器、滤波器(高通滤波器、低通滤波器、带通滤波器)、微处理器、性能管理部件、光电子部件、电压转换器(AC/DC转换器、DC/DC转换器)、机电换能器(例如,PZT(锆钛酸铅)-传感器和/或-行动器(actor))、电磁波发射器和/或接收器(例如,RFID-芯片或应答器)、密码部件、开关(例如,基于晶体管的开关)、微机电系统(MEMS)、电池、摄像头、天线等。
印刷电路板和IC衬底还被称为印刷布线板或电子部件连接板,其是带有并且电连接诸如晶体管等的电子部件的线路板,并且因此,其形成电子器件的关键部分。根据具体应用,印刷电路板具有大致复杂的结构。通常,印刷电路板包括多层导电层和绝缘层交替施敷,并且导电层通过固化的线路板或以有机树脂浸渍的玻璃纤维片接合在一起,所述线路板形成绝缘层。生产印刷电路板中使用这种线路板在行业内被普遍称为“半固化片”(预浸纤维),其在有机树脂未固化并因此而处于粘性的状态時被输送和处理。当有机树脂被固化时,得到实际上的绝缘层。因此,绝缘层带有例如由铜箔形成的导电层,适当处理该导电层,以形成布线,从而电连接电子部件。尽管绝缘层大多数是连续的,以在印刷电路板的导电层之间提供电绝缘,但是导电层通常被强烈图形化并且起孔。现代印刷电路板使得电子部件及其适当布线能够高度集成。在印刷布线板技术领域,就交替施敷导电层和绝缘层而言,公知IC衬底提供类似的功能,然而,IC衬底小得多并且通常用于将微芯片连接到印刷电路板。为达到此目的,IC衬底的绝缘层通常由能够实现高精度的较小结构的玻璃或陶瓷材料生产。
例如,现有技术文献WO 2008/076929 A1描述了一种声波衬底,其中类似薄膜的单独声敏元件安置于由层叠结构的层中的开口形成的空腔内。该声波器件中的声敏元件的组装复杂而且成本高。
文献EP 1 605 258 A2、US 2014/0137668 A1和WO 2007/029133 A2分别描述了利用半导体行业中公知的基于晶片的工艺构建的器件。例如,WO 2007/029133 A2示出一种微系统,其中利用几个柔性箔构建可动元件或传感器,其实施在这种柔性箔上的导电层中。不利的是,组装一叠柔性箔是劳动密集的,而且柔性箔容易被破坏。此外,总体上说,按比例增大用于印刷电路板生产的基于晶片的工艺是有问题。
然而,在电子工业中,为了向消费者和专业人士提供日益细小而能力日益增强的电子器件和电子装置,始终存在对进一步小型化的需要,这种电子器件和电子装置需要在较小的空间内封装并且布线连接更多的电子部件。特别是,类似智能电话的移动电子设备要求在非常有限的空间上封装许多个类似加速计和压力传感器的传感器,以提供客户寻求的各种功能。许多这种传感器占据印刷电路板上相当大的空间,并且因此需要在印刷电路板上提供这些功能,而无需将这些部件安装于印刷电路板的表面上。
发明内容
为了进一步提高将诸如加速度计和压力传感器的传感器集成到电子部件接线板或印刷电路板中的集成度,本发明因此针对一种电子部件接线板,其中这些传感器可由该电子部件接线板本身的材料形成,使得这些传感器不必安装于电子部件接线板上。因此,利用生产印刷电路板或电子部件接线板的已知方法,能够在电子部件接线板或印刷电路板的层级上生产传感器。获得的电子部件接线板具有电子传感器,并且以特别高的集成度集成且生产廉价。
具体地说,本发明提供最初提及的一种电子部件接线板,其特征在于:传感器由挠曲层形成的至少一个挠曲件构成,该挠曲件从挠曲层凸出并且进入挠曲层内的间隙中,并且带有挠曲感测器件的至少一部分。挠曲层通常由一个绝缘层形成,但是其也可由多个绝缘层和导电层构成。出于理解本说明书和所附权利要求的目的,将挠曲层定义为具有间隙的层,以挠曲层的到达间隙中的一部分形成挠曲件,因此,与挠曲层的其余部分相比,更容易受压挠曲、振动和/或压下。该间隙可以是具有弯曲的简单切口,使得挠曲件最少是挠曲层的舌形区的构造。利用挠曲件比挠曲层的其余部分更容易挠曲、振动或被压下的性质,挠曲件通过在一个方向上或另一个方向上挠曲而对印刷电路板的加速作出反应。同样地,通过挠曲,挠曲件对于印刷电路板的一侧受压而作出反应,并且,自然地,例如,当例如用户的手指触摸根据本发明的电子部件接线板时,挠曲件能够被触觉压力压下。此外,根据本发明,挠曲件带有挠曲感测器件的至少一部分,这样使得能够从挠曲件因为本发明的电子部件接线板可能承受的上述影响产生的挠曲采集数据。如下所述,挠曲件能够带有相应挠曲感测器件的基本上全部部件,然而,还可以设想在挠曲感测器件要求元件位于电子部件接线板的相邻元件上以及挠曲件上的情况下,仅一部分挠曲感测器件排列于挠曲件上。在这两种情况下,挠曲感测器件使得能够测量挠曲件的运动,并且将该运动转换为微型计算机能够处理的数据,该微型计算机能够例如是以微芯片的方式排列于本发明的电子部件接线板上。因此,本发明使得能够生产集成度高且廉价的加速传感器和/或压力传感器。由于挠曲件由挠曲层形成,该挠曲层是本发明的印刷电路板的重要部分,并且如上所述,其很可能是无论如何也存在于本发明的电子部件接线板中的绝缘层,所以加速传感器和/或压力传感器的生产变得非常容易,并且能够集成到印刷电路板等的自动化生产工艺中,并且因此,能够在印刷电路板本身的层级上实现,而不必为了必须安装于印刷电路板上的电子部件提供。
尽管已经描述了挠曲件可以采取排列于挠曲层的间隙内的舌的形式,但是,优选地,挠曲件的构造更精制,使得与以往大体上刚性地连接到挠曲层的舌可提供的挠曲灵敏性相比,挠曲件的挠曲灵敏性更高。因此,本发明优选地设计成挠曲件由至少一个支承臂悬挂于间隙中。脱离产生从挠曲层凸出的圆形的或带圆角的舌形的具有弯曲的简单切口,该优选实施例中的间隙为在挠曲层中矩形孔或圆形孔的形式,臂到达该孔中,该臂带有挠曲件的主部。因此,挠曲件表现得类似于挠曲层内的半岛。该支承臂呈现的刚性小得多,并且因此挠曲件更容易振动或挠曲,对本发明的电子部件接线板形成能力更强的加速传感器和/或压力传感器。
尽管刚才描述的本发明的优选实施例的支承臂呈现显著降低挠曲件的稳定性并且因此提供高传感器灵敏度的优点,但是仅提供一个支承臂使得不能精确确定加速力或压力的方向。为了克服该缺点,根据本发明的优选实施例,本发明可以设计成挠曲件由多个支承臂,优选地由两个支承臂,更优选地由三个支承臂,并且最优选地由四个支承臂悬挂于间隙中。当压力件由四个臂支承于挠曲层中的间隙内时,使得挠曲感测器件能够排列于每个支承臂上,因此,能够互相独立地测量所有方向上的偏斜,因此,能够采集本发明的电子部件接线板承受的加速力和/或压力的方向数据。
优选地,使至少一个支承臂偏斜。挠曲件的至少一个支承臂的偏斜形式使得能够使较长的支承臂排列于一限定尺寸的挠性层内的间隙内,使得支承臂变得更不稳定,因此,对传感器和本发明的电子部件接线板提供额外灵敏度。
当挠曲感测器件由排列于至少一个支承臂上的至少一个压电元件形成时,则实现本发明的优选实施例。应用压电技术能够实现高度灵敏、精确并且还廉价的感测器件,并且根据本发明能够非常容易地将该技术应用于生产印刷电路板的领域,下面将作出更详细解释。
例如,根据本发明的优选实施例,能够提供由排列于每个支承臂上的至少一个压电元件形成的挠曲感测器件。本发明的情境下使用的压电元件的尺寸可非常小,并且因此适配成排列于支承臂上,如上所述。
例如,这可通过由与布线接触的一层压电材料形成压电元件来实现。压电材料能够印刷于或溅涂于挠曲层上,该挠曲层例如,如已经描述的,是例如FR4半固化片材料的常规绝缘层,并且因此,利用一般生产印刷电路板或电子部件接线板的技术领域内的技术人员众所周知的方法,能够将该压电材料涂敷于挠曲件上。自然地,压电材料层与布线的接触也属于现有技术的范围。
根据优选实施例,压电材料由选自如下组中的材料构成:压电活性聚合物和橡胶,特别是,铁电性聚合物、弛豫铁电性聚合物(ferro-relaxor polymer)、压电活性玻璃、陶瓷、氧化锌ZnO以及氮化铝AlN。弛豫铁电性聚合物而且铁电性聚合物都具有综合了优良机电特性和容易处理特性的优点,因为这些材料能够印刷,特别是能够用于丝网印刷。举例说明,这些铁电性聚合物和弛豫铁电性聚合物在市场上分别以品牌名称EAP市售,EAP是Solvay International Chemical Group的商标。EAP是具有本质高介电常数并且能够利用各种技术印刷成用于电子器件的透明、有韧性、弹性活性层的电活性聚合物溶液。此外,基于铁电材料并且以商标市售的印刷型压电压力感测箔能够用于该用途。
尽管利用压电技术形成本发明的本发明的挠曲感测器件非常方便,但是对于某些应用,挠曲感测器件优选地由独立地排列于至少一个支承臂上、优选地作为惠斯通电桥的一部分的多个电阻器形成。在电阻器变长和/或震颤时,电阻器将随着挠曲件的挠曲或振动改变其电阻。能够计算电阻的变化,成为加速度数据和/或压力数据。
该电阻器可由碳轨迹形成,如上所述,该碳轨迹将变长或震颤。
测量挠曲件的挠曲和振动的另一种方式是采用电动式测量。在本发明的该优选实施例中,感测器件由电磁线圈和磁体形成,该电磁线圈和磁体中的一个排列于挠曲件上,而另一个排列于挠曲层上、在挠曲层的至少包围挠曲件的区域中,以形成电动式传感器。在该实施例中,磁体可排列于挠曲件上,并且其由排列于挠曲层包围挠曲件的区域中的线圈包围。因此,当挠曲件挠曲或振动时,磁体相对于电磁线圈运动,因此,感生电流,该电流因此能够被测量,并且能够将该电流转换为加速数据和/或压力数据。
原则上,当挠曲层未被覆盖并且因此是可直接接触到挠曲层内的挠曲件时,可使挠曲件与本发明的电子部件接线板的周围连通。然而,当挠曲层在至少位于挠曲件的该区域由至少一个覆盖层覆盖时,实现本发明的更坚固并且因此更优选的实施例。在该实施例中,较好地保护挠曲件并且因此较好地保护挠曲感测器件,并且因此,利用本发明的电子部件接线板提供更坚固的电子器件。
为了保证挠曲件能够在各方向上自由地运动,优选地以这样的方式设计本发明,即,在挠曲件与该至少一个覆盖层之间设置空腔。
根据本发明的优选实施例,该空腔能够由减小厚度的挠曲层和/或挠曲件区中的至少一个覆盖层实现,也能够由排列于挠曲层与覆盖层之间的绝缘层内的间隙形成空腔来实现。还请注意,本说明书中定义的各种层,即,挠曲层、该至少一个覆盖层以及绝缘层都能够是同一种类型的,并且特别是,能够是由一层或多层例如FR4半固化片材料的纤维形成的绝缘层。然而,出于理解本说明书的目的,将挠曲层限定为具有间隙的层,以形成挠曲件,覆盖层是覆盖挠曲层内的挠曲件的层,并且绝缘层是对电流绝缘的层,而不是由挠曲层和覆盖层组成的组的层。此外,如已经陈述的,挠曲层能够由多个绝缘层和偶数的导电层构成,并且当情况如此时,将挠曲层限定为一组具有间隙的奇数的层,挠曲件凸入该间隙内。与减小挠曲层和/或挠曲件区内的覆盖层的厚度的实施例相比,最新描述的本发明的优选实施例的确更容易实现将空腔设置于挠曲件与至少一个覆盖层之间,其中空腔由排列于挠曲层与覆盖层之间的绝缘层内的间隙形成。
将空腔设置于挠曲件与该至少一个覆盖层之间开启了使用其他类型的挠曲感测器件的可能性。在这方面,当挠曲感测器件由其电极位于挠曲件和覆盖层上的至少一个电容器形成时是优选的。在挠曲件挠曲和/或振动时,排列于挠曲件上的与排列于覆盖层上的电极之间的间隙将发生变化,因此,改变由排列于挠曲件和覆盖层上的电极形成的电容器的电容,这电容的变化能够被解释为加速和/或压力的变化。
当挠曲件带有适配成增大挠曲件的挠曲的重件时,能够显著提高本发明的电子部件接线板对加速和/或压力的灵敏度。与位于印刷电路板上或嵌入印刷电路板内的电子部件不同,本发明的权利要求和说明书定义的重件是诸如简单金属板等的无源元件。在本发明的电子部件接线板加速时,排列于挠曲件上的重件将增大挠曲件的挠曲运动,并且因此导致挠曲感测器件产生更高的信号强度。
当重件由适配成与至少一种化学物质和/或生物物质结合的受体形成时,能够实施将重件排列于挠曲件上的有趣应用。这种受体为生物传感器和化学传感器技术领域内的技术人员公知,并且,自然地,这些受体当与各自敏感的物质结合时该受体的重量发生变化。因此,当相应物质结合到本发明的电子部件接线板的重件时,其变得较重,并且因此,挠曲件的挠曲和/或振动特性发生变化。能够将此解释为在本发明的电子部件接线板周围存在相应物质和/或该物质的浓度发生变化。
上面已经描述了本发明的电子部件接线板的挠曲层、该至少一个覆盖层和绝缘层能够全部由同一种材料制成,并且这三种层之间带有差异从而能够适当地限定本发明,而且这不一定意味着这些层是由不同材料制成的。因此,挠曲层、该至少一个覆盖层和/或至少一个绝缘层优选地由选自如下组成的组中的材料制成:诸如环氧树脂和半固化片材料(例如,FR-4,FR-5)的增强型树脂或非增强型树脂、聚酰胺、聚酰亚胺、氰酸酯、双马来酰亚胺三嗪树脂、玻璃、类似玻璃的承载材料(例如,多层玻璃)、增强型承载材料、陶瓷和金属氧化物、高频材料和例如Cu或Al的金属箔。高频材料是诸如聚四氟乙烯、液晶聚合物或氰酸酯树脂的材料。
根据本发明的优选实施例,电子部件接线板包括至少一个嵌入式部件。
附图说明
下面将利用附图所示的示例性实施例更详细描述本发明。附图中:
-图1示出没有覆盖层情况下的本发明的电子部件接线板的平面图,
-图2示出具有覆盖层情况下的本发明的电子部件接线板的截面图,
-图3示出根据本发明的挠曲件的四个平面图,以及
-图4示出根据本发明的各种挠曲件,其具有不同的支承臂排列。
具体实施方式
在图1中,本发明的电子部件接线板由参考编号1表示。电子部件接线板1可以是印刷电路板或IC衬底等。电子部件接线板1具有例如由FR4半固化片材料形成的挠曲层2。挠曲层2具有间隙3以形成由挠曲件4’构成的传感器4,该挠曲件4’从挠曲层2凸入挠曲层2内的间隙3内。挠曲件4’由主部4”和支承臂5构成,这样使得与挠曲层2的其余部分相比,挠曲件4’具有较高柔性,使得挠曲件4’能够在挠曲层2的间隙3内相对自由地挠曲和/或振动。挠曲件4’带有挠曲感测器件6的至少一部分,在这种情况下,挠曲件4’带有四个压电元件6’,该些压电元件在支承臂5上形成整个挠曲感测器件6。如上所述,挠曲感测器件6还能够由电阻器构成,在变型实施例中,能够由电阻器代替压电元件6’排列于支承臂5’上。在该实施例中,挠曲件4’还带有重件7,该重件7可以是简单的金属板或较高密度的其他板,其也可以是适配成与化学物质和/或生物物质结合从而改变重量并且因此改变挠曲件4’的挠曲特性和/或振动特性的受体。压电元件6’由一层压电涂糊和适当布线16形成。
在图2所示的截面图中,挠曲件4’带有电极6”,该电极6”与覆盖层8上的相应电极6”形成电容,具有空腔10的绝缘层9使该覆盖层8与挠曲层2隔开,以允许挠曲件4’自由地挠曲和/或振动。在图2中,挠曲件4’的已挠曲位置以点划线绘出,并且显然,挠曲件4’在已挠曲位置时的相应电极6”之间的距离d变更为不同的距离d’,这当然地导致相应电极6”形成的电容器具有不同的电容,从而,这又能被解释为挠曲件4’的挠曲和/或振动,因此,给出关于对本发明的电子部件接线板施加的加速和/或压力的信息。此外,在图2中,能够看出本发明的电子部件接线板1不仅包括多个导电层13、14和15,而且包括多个绝缘层8、9、2、11和12。
在图3中,示出了挠曲件4’能够仅在一个支承臂5上悬挂于挠曲层2内的间隙3内。然而,可以设想对挠曲件4’具有两个、三个、四个支承臂5并且甚至当然地具有更多个支承臂5的配置,而不脱离本发明的精神。
如图4a所示,一个或者多个支承臂5能够偏斜,并且在此还能够想到具有一个、两个、三个甚或更多个支承臂5的配置。在图4b中,示出了支承臂5还能够从本发明的电子部件接线板1的挠曲层2内的间隙3的角部凸出。
Claims (15)
1.一种电子部件接线板(1),包括:多个绝缘层(8、9、2、11、12)和导电层(13、14、15),并且还包括电子传感器(4),其特征在于:所述传感器(4)由挠曲层(2)形成的至少一个挠曲件(4’)构成,所述挠曲件(4’)从所述挠曲层(2)凸出并且进入所述挠曲层(2)内的间隙(3)中,并且带有挠曲感测器件(6)的至少一部分。
2.根据权利要求1所述的电子部件接线板,其特征在于:所述挠曲件(4’)由至少一个支承臂(5)悬挂于所述间隙(3)中。
3.根据权利要求1或2所述的电子部件接线板,其特征在于:所述挠曲件(4’)由多个支承臂(5)、优选地由两个支承臂、更优选地由三个支承臂(5)和最优选地由四个支承臂(5)悬挂于所述间隙(3)中。
4.根据权利要求1至3中的任何一项所述的电子部件接线板,其特征在于:所述至少一个支承臂(5)是偏斜的。
5.根据权利要求1至4中的任何一项所述的电子部件接线板,其特征在于:所述挠曲感测器件(6)由排列于所述至少一个支承臂(5)上的至少一个压电元件(6’)形成。
6.根据权利要求5所述的电子部件接线板,其特征在于:所述挠曲感测器件(6)由排列于每个所述支承臂(5)上的至少一个压电元件(6’)形成。
7.根据权利要求5或6所述的电子部件接线板,其特征在于:压电元件(6’)是由与布线(16)接触的一层压电材料形成。
8.根据权利要求5至7中的任何一项所述的电子部件接线板,其特征在于:所述压电材料由选自包括如下的组中的材料构成:压电活性聚合物和橡胶,特别是,铁电性聚合物、弛豫铁电性聚合物、压电活性玻璃、陶瓷、氧化锌ZnO以及氮化铝AlN。
9.根据权利要求1至4中的任何一项所述的电子部件接线板,其特征在于:所述挠曲感测器件(6)由独立地排列于所述至少一个支承臂(5)上、优选地作为惠斯通电桥的一部分的多个电阻器形成。
10.根据权利要求1至4中的任何一项所述的电子部件接线板,其特征在于:所述感测器件(6)由电磁线圈和磁体形成,所述电磁线圈和所述磁体中的其中一个排列于所述挠曲件(4’)上,而另一个排列于所述挠曲层(2)上、至少在所述挠曲层(2)包围所述挠曲件(4’)的区域中,以形成电动式传感器。
11.根据权利要求1至10中的任何一项所述的电子部件接线板,其特征在于:所述挠曲层(2)在至少所述挠曲件(4)的区域中由至少一个覆盖层(8)覆盖。
12.根据权利要求11所述的电子部件接线板,其特征在于:空腔(10)设置于所述挠曲件(4’)与所述至少一个覆盖层(8)之间。
13.根据权利要求11或12所述的电子部件接线板,其特征在于:所述空腔(10)由排列于所述挠曲层(2)与所述覆盖层(8)之间的绝缘层(9)内的间隙形成。
14.根据权利要求12或13所述的电子部件接线板,其特征在于:所述挠曲感测器件(6)由至少一个电容器形成,所述至少一个电容器具有的电极(6”)位于所述挠曲件(4’)和所述覆盖层(8)上。
15.根据权利要求1至14中的任何一项所述的电子部件接线板,其特征在于:电子部件接线板(1)包括至少一个嵌入式部件。
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EP15186162.2 | 2015-09-22 | ||
EP15186162.2A EP3147258A1 (en) | 2015-09-22 | 2015-09-22 | Connection panel for electronic components |
PCT/EP2016/072168 WO2017050696A1 (en) | 2015-09-22 | 2016-09-19 | Connection panel for electronic components |
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US (1) | US20180310411A1 (zh) |
EP (2) | EP3147258A1 (zh) |
CN (1) | CN108349724A (zh) |
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US20180310411A1 (en) | 2018-10-25 |
EP3353112A1 (en) | 2018-08-01 |
EP3353112B1 (en) | 2024-05-01 |
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