IT201700096658A1 - Trasduttore microelettromeccanico con membrana sottile per pressioni elevate, metodo di fabbricazione dello stesso e sistema includente il trasduttore microelettromeccanico - Google Patents
Trasduttore microelettromeccanico con membrana sottile per pressioni elevate, metodo di fabbricazione dello stesso e sistema includente il trasduttore microelettromeccanicoInfo
- Publication number
- IT201700096658A1 IT201700096658A1 IT102017000096658A IT201700096658A IT201700096658A1 IT 201700096658 A1 IT201700096658 A1 IT 201700096658A1 IT 102017000096658 A IT102017000096658 A IT 102017000096658A IT 201700096658 A IT201700096658 A IT 201700096658A IT 201700096658 A1 IT201700096658 A1 IT 201700096658A1
- Authority
- IT
- Italy
- Prior art keywords
- transducer
- microelettromechanical
- microelectrcanical
- manufacture
- high pressure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0045—Diaphragm associated with a buried cavity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
- G01L13/025—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000096658A IT201700096658A1 (it) | 2017-08-28 | 2017-08-28 | Trasduttore microelettromeccanico con membrana sottile per pressioni elevate, metodo di fabbricazione dello stesso e sistema includente il trasduttore microelettromeccanico |
EP18188756.3A EP3450949B1 (en) | 2017-08-28 | 2018-08-13 | Microelectromechanical transducer with thin-membrane for high pressures, method of manufacturing the same and system including the microelectromechanical transducer |
US16/101,987 US10527511B2 (en) | 2017-08-28 | 2018-08-13 | Microelectromechanical transducer with thin-membrane for high pressures, method of manufacturing the same and system including the microelectromechanical transducer |
CN201821387111.2U CN208736597U (zh) | 2017-08-28 | 2018-08-27 | 微机电换能器和包括微机电换能器的系统 |
CN201810983712.8A CN109425460B (zh) | 2017-08-28 | 2018-08-27 | 用于高压的具有薄膜的微机电换能器、其制造方法和包括微机电换能器的系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000096658A IT201700096658A1 (it) | 2017-08-28 | 2017-08-28 | Trasduttore microelettromeccanico con membrana sottile per pressioni elevate, metodo di fabbricazione dello stesso e sistema includente il trasduttore microelettromeccanico |
Publications (1)
Publication Number | Publication Date |
---|---|
IT201700096658A1 true IT201700096658A1 (it) | 2019-02-28 |
Family
ID=60628111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT102017000096658A IT201700096658A1 (it) | 2017-08-28 | 2017-08-28 | Trasduttore microelettromeccanico con membrana sottile per pressioni elevate, metodo di fabbricazione dello stesso e sistema includente il trasduttore microelettromeccanico |
Country Status (4)
Country | Link |
---|---|
US (1) | US10527511B2 (it) |
EP (1) | EP3450949B1 (it) |
CN (2) | CN109425460B (it) |
IT (1) | IT201700096658A1 (it) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110926684A (zh) * | 2019-12-17 | 2020-03-27 | 中国电子科技集团公司第四十九研究所 | 一种耐350℃高温压力传感器的转接环结构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993012410A1 (en) * | 1991-12-13 | 1993-06-24 | Honeywell Inc. | Piezoresistive silicon pressure sensor design |
US20100083766A1 (en) * | 2008-10-07 | 2010-04-08 | Yamatake Corporation | Pressure sensor |
US20100083765A1 (en) * | 2008-10-07 | 2010-04-08 | Yamatake Corporation | Pressure sensor |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101228383B1 (ko) * | 2005-07-22 | 2013-02-07 | 에스티마이크로일렉트로닉스 에스.알.엘. | 두 배의 측정 스케일 및 높은 정밀도의 풀 스케일의 통합된압력 센서 |
TWI265555B (en) * | 2005-08-23 | 2006-11-01 | Touch Micro System Tech | Method of forming a piezoresistive device capable of selecting standards and method of forming a circuit layout capable of selecting sub circuit layouts |
JP5248317B2 (ja) * | 2006-11-29 | 2013-07-31 | 株式会社フジクラ | 圧力センサモジュール |
ITTO20120145A1 (it) * | 2012-02-17 | 2013-08-18 | St Microelectronics Srl | Trasduttore integrato provvisto di un sensore di temperatura, e metodo per rilevare una temperatura di tale trasduttore |
US20150122039A1 (en) * | 2013-11-06 | 2015-05-07 | Honeywell International Inc. | Silicon on nothing pressure sensor |
US10023461B2 (en) * | 2014-10-31 | 2018-07-17 | Stmicroelectronics S.R.L. | Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof |
CN106197776B (zh) * | 2015-05-27 | 2019-11-05 | 意法半导体股份有限公司 | 压力传感器、压力测量设备、制动系统和测量压力的方法 |
CN205262665U (zh) * | 2015-06-22 | 2016-05-25 | 意法半导体股份有限公司 | 压力传感器 |
GB201512288D0 (en) * | 2015-07-14 | 2015-08-19 | Melexis Technologies Nv | Pressure sensor with built in stress buffer |
EP3147258A1 (en) * | 2015-09-22 | 2017-03-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Connection panel for electronic components |
-
2017
- 2017-08-28 IT IT102017000096658A patent/IT201700096658A1/it unknown
-
2018
- 2018-08-13 US US16/101,987 patent/US10527511B2/en active Active
- 2018-08-13 EP EP18188756.3A patent/EP3450949B1/en active Active
- 2018-08-27 CN CN201810983712.8A patent/CN109425460B/zh active Active
- 2018-08-27 CN CN201821387111.2U patent/CN208736597U/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993012410A1 (en) * | 1991-12-13 | 1993-06-24 | Honeywell Inc. | Piezoresistive silicon pressure sensor design |
US20100083766A1 (en) * | 2008-10-07 | 2010-04-08 | Yamatake Corporation | Pressure sensor |
US20100083765A1 (en) * | 2008-10-07 | 2010-04-08 | Yamatake Corporation | Pressure sensor |
Also Published As
Publication number | Publication date |
---|---|
US10527511B2 (en) | 2020-01-07 |
CN109425460B (zh) | 2021-05-18 |
CN109425460A (zh) | 2019-03-05 |
CN208736597U (zh) | 2019-04-12 |
EP3450949B1 (en) | 2020-10-14 |
US20190064020A1 (en) | 2019-02-28 |
EP3450949A1 (en) | 2019-03-06 |
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