CN108140623B - 一种指纹识别模组及其制备方法 - Google Patents

一种指纹识别模组及其制备方法 Download PDF

Info

Publication number
CN108140623B
CN108140623B CN201680000609.6A CN201680000609A CN108140623B CN 108140623 B CN108140623 B CN 108140623B CN 201680000609 A CN201680000609 A CN 201680000609A CN 108140623 B CN108140623 B CN 108140623B
Authority
CN
China
Prior art keywords
fingerprint identification
filling material
layer
area
identification chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680000609.6A
Other languages
English (en)
Other versions
CN108140623A (zh
Inventor
吴宝全
龙卫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goodix Technology Co Ltd
Original Assignee
Shenzhen Goodix Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Goodix Technology Co Ltd filed Critical Shenzhen Goodix Technology Co Ltd
Publication of CN108140623A publication Critical patent/CN108140623A/zh
Application granted granted Critical
Publication of CN108140623B publication Critical patent/CN108140623B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92—Specific sequence of method steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Fluid Mechanics (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Dicing (AREA)
  • Image Input (AREA)

Abstract

本发明公开了一种指纹识别模组及其制备方法，涉及指纹识别技术领域。指纹识别模组通过对板级模组进行切割得到，包括：指纹识别芯片、填充材料、色彩涂层和盖板；其中，色彩涂层位于填充材料和盖板之间，指纹识别芯片在真空环境下，倒置贴合在填充材料的镂空区中。所述模组结构简单便于制作，所述制备方法能有效消除指纹识别芯片与盖板之间的气泡，提高了指纹识别模组的制备效率。

Description

一种指纹识别模组及其制备方法
技术领域
本发明涉及指纹识别技术领域，尤其涉及一种指纹识别模组及其制备方法。
背景技术
现有技术中指纹识别模组的制作包含至少以下的三道工序：
参考图2，首先将指纹识别芯片100采用表面贴装技术(surface mountedtechnology，SMT),焊接到柔性电路板300(flexible printed circuit,FPC)上。参考图3，然后把金属环400贴合到柔性电路板300上。参考图4，最后把玻璃盖板500贴合到指纹识别芯片100的表面。
参考图4，这样的制作过程使得玻璃盖板500与指纹识别芯片100的贴合容易受到金属环和柔性电路板的影响，造成指纹识别芯片100与玻璃盖板500之间存留有气泡，进而影响指纹识别模组整体的性能。此外，这样的制作过程，对焊接和贴合的操作精度要求相对较高，客观上影响到了生产的效率。
中国专利申请“指纹识别模组及其制备方法，以及具备该指纹识别模组的电子设备”(申请公布号CN 105046244 A)公开了一种指纹识别模组、制备方法及其电子设备。所述指纹识别模组包括：叠层结构；以及支撑件，其中，支撑件包裹叠层结构，叠层结构包括：盖板；设置在所述盖板的下方的指纹识别芯片；设置在所述指纹识别芯片的下方，并与所述指纹识别芯片电连接的柔性电路板；以及设置在所述柔性电路板的下方的补强板。所述指纹识别模组的贴合面非常平整，不仅触摸时具有光滑、平整的良好触感，且指纹识别芯片感应效果会更好。
所述制备方法包括以下内容：(1)将从下至上依次设置有补强板、柔性电路板、指纹识别芯片以及盖板的叠层结构置于模具中；(2)向所述模具中注入胶液使其包裹所述叠层结构，并使所述胶液固化形成支撑件，然后脱模，以便获得所述指纹识别模组，其中，所述指纹识别芯片与所述柔性电路板电连接。所述方法能够快速有效地制备获得贴合面平整的指纹识别模组，获得的指纹识别模组信号传导效果较好，有效减少了由于贴合面不平整而引起的电磁场损耗，提高了信号传导效果，同时通过注入胶液并使其固化形成支撑件能够有效减小指纹识别模组的厚度。另外，根据本发明实施例的制备指纹识别模组的方法不需要打磨，简化了操作步骤，节省了人力、物力资源。
综上所述，这种指纹识别模组结构紧凑、集成度高，但是这种指纹识别模组的叠层结构相对复杂，其制备方法易在指纹识别芯片100和玻璃盖板500之间残留气泡，进而可能影响到指纹识别模组整体的性能。
发明内容
为了有效消除指纹识别芯片与盖板之间的气泡，提高指纹识别模组的制作效率，本发明所述的一种指纹识别模组及其制备方法采用了以下的技术方案。
一种指纹识别模组，所述指纹识别模组通过对板级模组进行切割得到，包括：指纹识别芯片、填充材料、色彩涂层和盖板；
其中，所述色彩涂层位于填充材料和盖板之间，所述指纹识别芯片在真空环境下，倒置贴合在填充材料的镂空区中。
进一步，所述指纹识别芯片包括：识别区、互连金线、塑封层、基板层、和焊盘；
其中，识别区设置在塑封层内，基板层与塑封层粘连在一起，焊盘设置在基板层的上表面和下表面，还设置在识别区的上表面，识别区上表面的焊盘与基板层上表面的焊盘之间通过互连金线相连。
进一步，倒置的指纹识别芯片的上表面高于所述填充材料的上表面。
进一步，所述填充材料为有机胶体、薄膜或者塑料，具有光致效应；所述镂空区由对所述填充材料的局部进行曝光显影得到。
进一步，所述盖板为条形玻璃、条形陶瓷、基板形玻璃、基板形陶瓷或者与晶圆形状相同的圆片玻璃。
一种指纹识别模组的制备方法，所述方法包括以下内容：
制作由填充材料、色彩涂层和盖板组成的板级模组，在所述板级模组的填充材料上加工出阵列式的数量可预设的镂空区；
真空环境下，将指纹识别芯片贴合在所述填充材料的阵列式的各个镂空区内；
切割所述板级模组，得到各个指纹识别模组。
进一步，将指纹识别芯片贴合在所述填充材料的阵列式的各个镂空区内包括：
在各个镂空区的底部均匀填充预设厚度的胶水，并对胶水进行脱泡工艺处理；
将指纹识别芯片倒置放置于所述填充材料的阵列式的各个镂空区内；
对指纹识别芯片加压并升温烘烤，使指纹识别芯片与胶水紧密贴合、胶水固化。
进一步，倒置放置的指纹识别芯片的上表面高于所述填充材料的上表面。
进一步，所述填充材料为有机胶体、薄膜或者塑料，具有光致效应；
所述填充材料的阵列式的各个镂空区由对所述填充材料进行曝光显影得到。
进一步，所述盖板为条形玻璃、条形陶瓷、基板形玻璃、基板形陶瓷或者与晶圆形状相同的圆片玻璃。
与现有技术相比，本发明有以下有益效果：
1、本发明实施例所述的指纹识别模组为通过对板级模组进行切割得到，包括指纹识别芯片、填充材料、色彩涂层和盖板。其中，所述色彩涂层位于填充材料和盖板之间，所述指纹识别芯片在真空环境下，倒置贴合在填充材料的镂空区中。这种结构的指纹识别模组构造简单，便于制作。
2、本发明实施例所述的指纹识别模组的制备方法通过制作由填充材料、色彩涂层和盖板组成的板级模组，填充材料中包含阵列式的镂空区；在真空环境下，将多个指纹识别芯片分别贴合在填充材料的镂空区中；切割所述板级模组得到多个指纹识别模组等步骤有效消除了指纹识别芯片与盖板之间的气泡，提高了指纹识别模组的制备效率。
附图说明
图1为本发明实施例提供的指纹识别芯片的构造示意图。
图2为现有技术中指纹识别芯片与柔性电路板贴合工序的示意图。
图3为现有技术中金属环与柔性电路板贴合工序的示意图。
图4为现有技术中玻璃盖板与柔性电路板贴合工序的示意图。
图5为本发明实施例提供的指纹识别模组的构造示意图。
图6为本发明实施例提供的指纹识别模组的盖板示意图。
图7为本发明实施例提供的指纹识别模组的盖板与色彩涂层示意图。
图8为本发明实施例提供的板级模组示意图。
图9为本发明实施例提供的板级模组的镂空区示意图。
图10为本发明实施例提供的板级模组的胶水填充示意图。
图11为本发明实施例提供的指纹识别芯片贴合示意图。
附图标记说明：100—指纹识别芯片、101—识别区、102—互连金线、103—塑封层、104—基板层、105—焊盘、200—指纹识别模组、201—填充材料、202—色彩涂层、203—盖板、204—胶水层、300—柔性电路板、400—金属环、500—玻璃盖板。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。
参考图1，本发明实施例所述的指纹识别模组包含的指纹识别芯片100包括识别区101、互连金线102、塑封层103、基板层104和焊盘105。其中，识别区101设置在塑封层103内，基板层104与塑封层103粘连在一起，焊盘105设置在基板层104的上表面和下表面，还设置在识别区101的上表面，识别区101上表面的焊盘105与基板层104上表面的焊盘105之间通过互连金线102相连。
参考图5，本发明实施例所述的指纹识别模组包括指纹识别芯片100、填充材料201、色彩涂层202、盖板203和胶水层204。其中，色彩涂层202位于填充材料201和盖板203之间，在真空环境下，指纹识别芯片100倒置贴合在填充材料201的镂空区中。填充材料201为有机胶体、薄膜或者塑料等具有光致效应的材料，通过对填充材料201的局部进行曝光显影得到镂空区，其中镂空区填充有用于贴合指纹识别芯片100的胶水层204。该指纹识别模组为在板级模组上进行批量制备，然后切割得到，构造简单便于制作。
本发明实施例所述的指纹识别模组的制备方法包括以下内容：
步骤S1：制作由填充材料201、色彩涂层202和盖板203组成的板级模组。
参考图6，盖板203作为载体，可以使用条形玻璃、条形陶瓷、基板形玻璃、基板形陶瓷或者与晶圆形状相同的圆片玻璃等材料，并可依据工业界或者晶圆级模组工艺的特性选择不同的尺寸。参考图7，色彩涂层202可以采用丝印等工艺涂布在盖板203上，具体的颜色根据客户需求定制。
参考图8，在色彩涂层202上涂布一层填充材料201，填充材料201为具有有光致效应的有机胶体、薄膜或者塑料等材料，厚度根据指纹识别芯片100的厚度定制。
步骤S2：在板级模组的填充材料201上加工出阵列式的数量可预设的镂空区。
参考图9，对于步骤S2，由于填充材料201具有光致效应，镂空区可以通过对填充材料201进行曝光显影等光刻制程完成。对填充材料201镂空后，每个镂空区的大小略大于指纹识别芯片100，填充材料201可以环绕、支撑指纹识别芯片100，对其起到保护作用。在同一块板级模组的填充材料201上可以加工阵列式的多个镂空区用于指纹识别模组的制备，以便节省材料和工序，提高生产效率。
步骤S3：真空环境下，将指纹识别芯片100贴合在填充材料的阵列式的各个镂空区内。
对于步骤S3，将指纹识别芯片100贴合在填充材料201的阵列式的各个镂空区内包括：
S31：在各个镂空区的底部均匀填充预设厚度的胶水，并对胶水进行脱泡工艺处理。
参考图10，在各个镂空区的底部涂布胶水层204，使得有适当厚度的胶水均匀填充镂空区的底部，并且为了消除气泡，对胶水层204进行脱泡工艺处理。
S32：将指纹识别芯片100倒置放置于填充材料201的阵列式的各个镂空区内。
将制成的板级模组置于真空环境中，清除在镂空区存在的大气环境，同时将指纹识别芯片100倒置放置于镂空区内，倒置放置的指纹识别芯片100的上表面高于填充材料201的上表面。
S33：对指纹识别芯片100加压并升温烘烤，使指纹识别芯片100与胶水紧密贴合、胶水固化。
参考图11，对于步骤S33，在真空环境下，贴合指纹识别芯片100时可以适当加压，并通过升温烘烤，使胶水层204固化，并能极大地消除指纹识别芯片100与盖板203之间的气泡。
步骤S4：切割板级模组，得到各个指纹识别模组。
由于盖板203可以为8英寸、12英寸或者更大，因此在对应的板级模组上可以一次形成数百个镂空区。每次制备时，我们可以在板级模组上对多个指纹识别模组进行制备。制备完成后，对同一板级模组上的多个指纹识别模组进行分割，所以单次制备后可以获得多个贴合好的指纹识别模组，提高了生产效率，易于进行规模化量产。
上述指纹识别模组的制备方法并不仅限于制备本发明所述的指纹识别模组。
本发明实施例主要有以下的有益效果：
1、本发明实施例所述的指纹识别模组200为通过对板级模组进行切割得到，包括指纹识别芯片100、填充材料201、色彩涂层202和盖板203。其中，所述色彩涂层202位于填充材料201和盖板203之间，指纹识别芯片100在真空环境下，倒置贴合在填充材料201的镂空区中。这种结构的指纹识别模组构造简单，便于制作。
2、本发明实施例所述的指纹识别模组的制备方法通过制作由填充材料201、色彩涂层202和盖板203组成的板级模组，在板级模组的填充材料201上加工出阵列式的数量可预设的镂空区；真空环境下，将指纹识别芯片100分别贴合在填充材料201的镂空区中；切割板级模组得到多个指纹识别模组200等步骤，有效消除了指纹识别芯片100与盖板203之间的气泡，提高了指纹识别模组的制备效率。
上述实施例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。

Claims (8)

1.一种指纹识别模组，其特征在于，所述指纹识别模组(200)通过对板级模组进行切割得到，包括：指纹识别芯片(100)、填充材料(201)、色彩涂层(202)和盖板(203)；
其中，所述色彩涂层(202)位于填充材料(201)和盖板(203)之间，所述指纹识别芯片(100)在真空环境下，倒置贴合在填充材料(201)的镂空区中；填充材料(201)为有机胶体或者塑料，具有光致效应；通过对填充材料(201)的局部进行曝光显影得到镂空区，胶水层(204)位于所述镂空区底部，所述指纹识别芯片(100)通过所述胶水层(204)连接于所述色彩涂层(202)；所述指纹识别芯片(100)与所述填充材料(201)之间存在空隙；
所述指纹识别芯片(100)包括：识别区(101)、互连金线(102)、塑封层(103)、基板层(104)、和焊盘(105)；
其中，识别区(101)设置在塑封层(103)内，基板层(104)与塑封层(103)粘连在一起，焊盘(105)设置在基板层(104)的上表面和下表面，还设置在识别区(101)的上表面，识别区(101)上表面的焊盘(105)与基板层(104)上表面的焊盘(105)之间通过互连金线(102)相连；
所述塑封层(103)通过所述胶水层(204)连接于所述色彩涂层(202)。
2.根据权利要求1所述的指纹识别模组，其特征在于，倒置的指纹识别芯片(100)的上表面高于所述填充材料(201)的上表面。
3.根据权利要求1-2任意一项所述的指纹识别模组，其特征在于，所述盖板(203)为条形玻璃、条形陶瓷、基板形玻璃、基板形陶瓷或者与晶圆形状相同的圆片玻璃。
4.一种指纹识别模组的制备方法，其特征在于，所述方法包括以下内容：
制作由填充材料、色彩涂层和盖板依次堆叠组成的板级模组，在所述板级模组的填充材料上加工出阵列式的数量可预设的镂空区；
真空环境下，将指纹识别芯片贴合在所述填充材料的阵列式的各个镂空区内；
切割所述板级模组，得到各个指纹识别模组；
所述指纹识别芯片包括：识别区、互连金线、塑封层、基板层、和焊盘；其中，识别区设置在塑封层内，基板层与塑封层粘连在一起，焊盘设置在基板层的上表面和下表面，还设置在识别区的上表面，识别区上表面的焊盘与基板层上表面的焊盘之间通过互连金线相连；
所述塑封层通过胶水层连接于所述色彩涂层。
5.根据权利要求4所述的制备方法，其特征在于，将指纹识别芯片贴合在所述填充材料的阵列式的各个镂空区内包括：
在各个镂空区的底部均匀填充预设厚度的胶水，并对胶水进行脱泡工艺处理；
将指纹识别芯片倒置放置于所述填充材料的阵列式的各个镂空区内；
对指纹识别芯片加压并升温烘烤，使指纹识别芯片与胶水紧密贴合、胶水固化。
6.根据权利要求5所述的制备方法，其特征在于，倒置放置的指纹识别芯片的上表面高于所述填充材料的上表面。
7.根据权利要求4所述的制备方法，其特征在于，所述填充材料为有机胶体或者塑料，具有光致效应；
所述填充材料的阵列式的各个镂空区由对所述填充材料进行曝光显影得到。
8.根据权利要求4-7任意一项所述的制备方法，其特征在于，所述盖板为条形玻璃、条形陶瓷、基板形玻璃、基板形陶瓷或者与晶圆形状相同的圆片玻璃。
CN201680000609.6A 2016-07-15 2016-07-15 一种指纹识别模组及其制备方法 Active CN108140623B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/090101 WO2018010158A1 (zh) 2016-07-15 2016-07-15 一种指纹识别模组及其制备方法

Publications (2)

Publication Number Publication Date
CN108140623A CN108140623A (zh) 2018-06-08
CN108140623B true CN108140623B (zh) 2021-06-25

Family

ID=60941664

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680000609.6A Active CN108140623B (zh) 2016-07-15 2016-07-15 一种指纹识别模组及其制备方法

Country Status (5)

Country Link
US (1) US10350869B2 (zh)
EP (1) EP3288072A4 (zh)
KR (1) KR20180022626A (zh)
CN (1) CN108140623B (zh)
WO (1) WO2018010158A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108205650B (zh) * 2016-12-20 2021-11-30 致伸科技股份有限公司 指纹辨识模块
TWI642158B (zh) * 2017-07-21 2018-11-21 致伸科技股份有限公司 指紋感測晶片封裝結構
TWI627720B (zh) * 2017-08-25 2018-06-21 致伸科技股份有限公司 指紋感測晶片封裝結構
CN109492480A (zh) * 2017-09-12 2019-03-19 南昌欧菲生物识别技术有限公司 超声波生物识别装置和电子设备
CN111968948A (zh) * 2020-08-28 2020-11-20 江苏凯尔生物识别科技有限公司 一种指纹模组及其生产工艺
TWM612841U (zh) * 2021-02-19 2021-06-01 安帝司股份有限公司 指紋辨識智慧卡

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5546654A (en) * 1994-08-29 1996-08-20 General Electric Company Vacuum fixture and method for fabricating electronic assemblies
CN203102316U (zh) * 2012-10-12 2013-07-31 周正三 生物传感器模块、组件及使用其的电子设备
CN104866814A (zh) * 2015-04-17 2015-08-26 麦克思股份有限公司 指纹识别装置及其制造方法
CN105068685A (zh) * 2015-07-30 2015-11-18 广东欧珀移动通信有限公司 终端
TWM516228U (zh) * 2015-09-25 2016-01-21 Metrics Technology Co Ltd J 指紋感測封裝模組

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5880300B2 (ja) * 2012-06-14 2016-03-08 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置
KR20140076712A (ko) * 2012-12-13 2014-06-23 (주)파트론 지문인식모듈 및 그 제조방법
CN103198547A (zh) * 2013-03-29 2013-07-10 杨浩 指纹识别控制器
KR20150009481A (ko) * 2013-07-16 2015-01-26 주식회사 아이피시티 모바일 장치용 지문센서 모듈 및 이의 제조방법
KR20150020024A (ko) * 2013-08-13 2015-02-25 주식회사 아이피시티 지문센서 모듈, 이를 구비한 휴대용 전자기기 및 그 제조방법
CN104916549B (zh) * 2014-10-31 2018-08-14 深圳市东方聚成科技有限公司 一种具有弧边的指纹识别芯片的封装设备及封装和切割方法
TW201631716A (zh) * 2015-02-16 2016-09-01 Xintec Inc 一種晶片尺寸等級的感測晶片封裝模組及其製造方法
CN105046244A (zh) 2015-08-28 2015-11-11 南昌欧菲生物识别技术有限公司 指纹识别模组及其制备方法，以及具备该指纹识别模组的电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5546654A (en) * 1994-08-29 1996-08-20 General Electric Company Vacuum fixture and method for fabricating electronic assemblies
CN203102316U (zh) * 2012-10-12 2013-07-31 周正三 生物传感器模块、组件及使用其的电子设备
CN104866814A (zh) * 2015-04-17 2015-08-26 麦克思股份有限公司 指纹识别装置及其制造方法
CN105068685A (zh) * 2015-07-30 2015-11-18 广东欧珀移动通信有限公司 终端
TWM516228U (zh) * 2015-09-25 2016-01-21 Metrics Technology Co Ltd J 指紋感測封裝模組

Also Published As

Publication number Publication date
WO2018010158A1 (zh) 2018-01-18
US10350869B2 (en) 2019-07-16
US20180015711A1 (en) 2018-01-18
KR20180022626A (ko) 2018-03-06
EP3288072A4 (en) 2018-05-23
EP3288072A1 (en) 2018-02-28
CN108140623A (zh) 2018-06-08

Similar Documents

Publication Publication Date Title
CN108140623B (zh) 一种指纹识别模组及其制备方法
JP3901427B2 (ja) 電子装置とその製造方法およびその製造装置
JP2002280480A (ja) 回路装置の製造方法
TW200818350A (en) Semiconductor packaging method by using large panel size
JP2002280488A (ja) 回路装置の製造方法
CN101425469A (zh) 使用大尺寸面板的半导体构装方法
JP2003338587A (ja) 半導体装置及びその製造方法
TWI245430B (en) Fabrication method of semiconductor package with photosensitive chip
KR20030019082A (ko) 회로 장치의 제조 방법
JP2002076246A (ja) 回路装置の製造方法
JPH032099A (ja) Ｉｃカードの製造方法
CN211507610U (zh) 芯片模组
JP2009099850A (ja) 半導体モジュールの製造方法及び製造装置、半導体モジュール
CN111276450A (zh) 芯片模组及其形成方法
CN111341672B (zh) 半导体封装方法及其封装结构
JP2003037125A (ja) 回路装置の製造方法
CN111696975B (zh) 一种led显示模组封装方法
JP2000222549A (ja) 半導体集積回路チップの封止方法、半導体集積回路チップ装置及び半導体集積回路カード
CN114256279A (zh) Cis芯片的封装方法
JP3600130B2 (ja) 回路装置の製造方法
JP3600135B2 (ja) 回路装置の製造方法
JP3600136B2 (ja) 回路装置の製造方法
JP4471559B2 (ja) 回路装置の製造方法
TW495942B (en) Semiconductor packaging device of chip base with opening and its manufacturing method
CN110970329A (zh) 一种基于可溶解的保护膜制备晶体二极管的方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant