CN108074860B - 一种基片固定装置 - Google Patents
一种基片固定装置 Download PDFInfo
- Publication number
- CN108074860B CN108074860B CN201810031427.6A CN201810031427A CN108074860B CN 108074860 B CN108074860 B CN 108074860B CN 201810031427 A CN201810031427 A CN 201810031427A CN 108074860 B CN108074860 B CN 108074860B
- Authority
- CN
- China
- Prior art keywords
- substrate
- groove
- frame
- mounting
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 144
- 238000003825 pressing Methods 0.000 claims abstract description 43
- 238000007747 plating Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004484 Briquette Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810031427.6A CN108074860B (zh) | 2018-01-12 | 2018-01-12 | 一种基片固定装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810031427.6A CN108074860B (zh) | 2018-01-12 | 2018-01-12 | 一种基片固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108074860A CN108074860A (zh) | 2018-05-25 |
CN108074860B true CN108074860B (zh) | 2024-03-15 |
Family
ID=62156757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810031427.6A Active CN108074860B (zh) | 2018-01-12 | 2018-01-12 | 一种基片固定装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108074860B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111426656A (zh) * | 2020-04-09 | 2020-07-17 | 北京石墨烯研究院 | 承载机构 |
CN112779522B (zh) * | 2020-12-28 | 2023-11-28 | 芯思杰技术(深圳)股份有限公司 | 镀膜装置及镀膜方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2261576A2 (de) * | 2009-05-25 | 2010-12-15 | WEMEFA Horst Christopeit GmbH | Befestigungsvorrichtung zur lösbaren Halterung von plattenförmigen Modulen, insbesondere Solarmodulen bzw. Photovoltaikmodulen |
CN103386566A (zh) * | 2013-07-10 | 2013-11-13 | 中国电子科技集团公司第四十一研究所 | 介质基片激光加工夹具及其使用方法 |
CN206328461U (zh) * | 2016-12-23 | 2017-07-14 | 深圳市柔宇科技有限公司 | 一种玻璃压紧装置 |
CN207834268U (zh) * | 2018-01-12 | 2018-09-07 | 北京创昱科技有限公司 | 一种基片固定装置 |
-
2018
- 2018-01-12 CN CN201810031427.6A patent/CN108074860B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2261576A2 (de) * | 2009-05-25 | 2010-12-15 | WEMEFA Horst Christopeit GmbH | Befestigungsvorrichtung zur lösbaren Halterung von plattenförmigen Modulen, insbesondere Solarmodulen bzw. Photovoltaikmodulen |
CN103386566A (zh) * | 2013-07-10 | 2013-11-13 | 中国电子科技集团公司第四十一研究所 | 介质基片激光加工夹具及其使用方法 |
CN206328461U (zh) * | 2016-12-23 | 2017-07-14 | 深圳市柔宇科技有限公司 | 一种玻璃压紧装置 |
CN207834268U (zh) * | 2018-01-12 | 2018-09-07 | 北京创昱科技有限公司 | 一种基片固定装置 |
Also Published As
Publication number | Publication date |
---|---|
CN108074860A (zh) | 2018-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Applicant after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. Address before: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Applicant before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd. Address after: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Applicant after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd. Address before: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Applicant before: Beijing Chuangyu Technology Co.,Ltd. |
|
CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210220 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Applicant after: Zishi Energy Co.,Ltd. Address before: 102299 room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Applicant before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |