TWI452163B - 鍍膜治具 - Google Patents
鍍膜治具 Download PDFInfo
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- TWI452163B TWI452163B TW099110832A TW99110832A TWI452163B TW I452163 B TWI452163 B TW I452163B TW 099110832 A TW099110832 A TW 099110832A TW 99110832 A TW99110832 A TW 99110832A TW I452163 B TWI452163 B TW I452163B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B5/00—Clamps
- B25B5/06—Arrangements for positively actuating jaws
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B5/00—Clamps
- B25B5/14—Clamps for work of special profile
- B25B5/142—Clamps for work of special profile for windows and frames
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Coating Apparatus (AREA)
Description
本發明涉及一種鍍膜治具,尤其涉及一種用於玻璃片鍍膜之鍍膜治具。
濾光片表面鍍有一層濾光膜,可過濾某一預定波長之光線,係一種重要之光學元件。製作濾光片時,通常係將製作濾光片之玻璃母板固定於蒸鍍加工中之鍍膜傘架上,蒸鍍靶材設置於鍍膜傘架下方,通過蒸發而將靶材沖至鍍膜傘架,從而對玻璃母板之朝向鍍膜傘架下方之一個表面進行鍍膜。同時,為控制膜層的厚度,一般直接在鍍膜機內安裝一台光譜儀,直接量測監控片,當監控片某些光學特性符合時,表示膜層厚度已經達到要求,鍍膜機停止鍍膜,即完成一層膜層之鍍製。
但是,蒸鍍過程通常係處於200攝氏度左右之環境,對於製作濾光片之玻璃母板來説,這種高溫環境極易造成厚度較薄之玻璃片發生彎曲,使得鍍膜過程玻璃片中央及周邊膜層之厚度不均,影響濾光片之濾光性能,並降低玻璃片之利用率,增加濾光片之製作成本。
有鑒於此,有必要提供一種結構簡單、易於改善先前紅外濾光片鍍膜加工過程存在問題之鍍膜治具。
一種鍍膜治具包括具有至少一個承載孔之鍍膜傘架,所述鍍膜治具還進一步包括至少一個承載治具。所述承載治具包括一基體部分,一形成於所述基體部分上之承載部分,及用於固定待鍍元件之固定元件。所述基體部分承靠於鍍膜傘架之外表面且跨設於所述鍍膜傘架之承載孔的至少兩側。所述承載部分收容在承載孔內,所述承載部分具有一承載待鍍元件之承載面,所述承載面為平面,待鍍元件承載於所述承載面上時,待鍍元件朝向所述承載面之表面與所述承載面相貼合。所述固定元件使所述待鍍元件朝向所述承載面之表面與所述承載面保持貼合狀態。所述承載治具進一步設有一個穿透所述基體部分與所述承載部分之通孔,用於監控光線穿透所述通孔並射向待鍍元件以監控待鍍元件膜層之形成。
相對於先前技術,本發明提供之鍍膜治具用於濾光片鍍膜時具有如下優點:其一,製作濾光片之玻璃母板貼合於鍍膜治具中承載治具之承載面上,且由固定元件固定保持待鍍膜面與承載面之貼合狀態,由此可有效防止製作濾光片之玻璃母板發生彎曲,避免鍍膜過程玻璃母板中央及周邊膜層之厚度不均,保證最終形成之濾光片之濾光性能。其二,可提高製作濾光片之玻璃母板之利用率,降低濾光片之製作成本。其三,本發明之鍍膜治具結構簡單,易於操作,適於推廣應用,且便於調節以配合不同尺寸之玻璃母板。
下面將結合附圖及實施例對本技術方案作進一步詳細說明。
請參閱圖1,本發明一實施例提供一種鍍膜治具200,其包括一個鍍膜傘架80,及至少一個承載治具100。
所述鍍膜傘架80開設有多個用於收容所述承載治具100之承載孔82。所述鍍膜傘架80之内表面朝向鍍膜源(圖未示),且所述鍍膜傘架80可相對於鍍膜源轉動,以使鍍膜膜層均勻。
請參閱圖2,所述承載治具100用於鍍膜時承載板狀或片狀待鍍元件(圖未示),如製作濾光片之玻璃母板等。所述承載治具100包括一個基體部分10,一個承載部分20,及固定元件30。
於本實施例中,所述基體部分10為一方形平板。所述承載部分20亦為一方形平板。所述承載部分20設置在所述基體部分10的一表面上,且所述承載部分20背離所述基體部分10之表面之面積小於所述基體部分10朝向所述承載部分20之表面之面積,即,所述基體部分10及所述承載部分20整體呈現臺階狀結構,所述承載部分20之四邊與所述基體部分10之對應四邊之間形成承靠面12。
所述基體部分10承靠於鍍膜傘架80之外表面(圖未示)且跨設於鍍膜傘架80之承載孔82兩側,由此,便於所述承載治具100放置於鍍膜傘架80上進行鍍膜加工。即,將所述承載治具100放置於鍍膜傘架80上時,所述承靠面12承靠於鍍膜傘架80之外表面。
可以理解的係,所述基體部分10與所述承載部分20的形狀不限於本實施例,只要由所述基體部分10與所述承載部分20限定的承靠面12能夠承靠於鍍膜傘架之外表面且跨設於鍍膜傘架之承載孔兩側即可。例如,可以僅由所述承載部分20之兩相對邊與所述基體部分10之兩相對邊形成所述承靠面12或者僅由所述承載部分20之兩相對角與所述基體部分10之兩相對角形成所述承靠面12。
所述承載部分20遠離所述基體部分10的表面為承載面22。所述承載面22為平面,待鍍元件承載於所述承載面22上時,待鍍元件朝向所述承載面22之表面與所述承載面22相貼合。
本實施例中,所述承載治具100中基體部分10與承載部分20為一體成型,當然,所述承載治具100中基體部分10與承載部分20也可以組合而成。
所述承載治具100進一步設有一個穿透所述基體部分10與所述承載部分20之通孔40。所述通孔40用於鍍膜過程中監控待鍍元件所形成之膜層之厚度。監控光線穿透所述通孔40並射向待鍍元件,並由安裝於鍍膜機內之光譜儀(圖未示)進行量測,以監控待鍍元件膜層之形成是否完成。
優選地,所述通孔40位於所述承載治具100的中心位置。可以理解的係,所述通孔40可以依據實際需要設計為不同形狀及尺寸,本實施例中,所述通孔40之橫截面形狀為方形。
所述固定元件30用於固定承載於所述承載面22上之待鍍元件,以使待鍍元件朝向所述承載面22之表面與所述承載面22保持貼合之狀態,由此,可保證板狀待鍍元件在鍍膜時不易發生形變。
本實施例中,於所述承載部分20之其中一對對角位置分別設置一個所述固定元件30。
請參閲所圖3,所述固定元件30具有一個夾緊部31,兩個安裝部33及兩個連接部35。所述兩個連接部35位於所述夾緊部31之同一側並與所述夾緊部31的兩端垂直連接。所述兩個安裝部33分別設於所述兩個連接部35。所述兩個安裝部33同軸,且平行於所述夾緊部31。本實施例中,所述連接部35用於連接所述夾緊部31與所述安裝部33。所述夾緊部31用於壓緊承載於所述承載面22上之待鍍元件。
所述承載治具100進一步設有與所述兩個安裝部33配合的兩個軸孔(圖未示)。每個軸孔位於所述承載部分20之一角且貫穿承載部分20之相鄰兩側面。
進一步地,所述兩個安裝部33分別套設有一個彈簧37,由此,將所述安裝部33及所述彈簧37設置於承載部分20時,所述固定元件30受所述彈簧37的彈簧力作用,形成壓向所述承載面22之夾緊力,即,所述固定元件30具有夾緊承載於所述承載面22上之待鍍元件之夾緊力,此夾緊力通過所述夾緊部31作用於承載於所述承載面22上之待鍍元件。
可以理解的係,所述固定元件30的實現形式並不局限於本實施例,所述固定元件30也可以設計為其他形式,如卡扣,只要能實現固定承載於所述承載面22上之待鍍元件,並使待鍍元件朝向所述承載面22之表面與所述承載面22保持貼合之狀態即可。
請參閲圖4,本實施例中,以製作濾光片之玻璃母板60為待鍍元件對所述承載治具100作進一步之説明。
撥開設置於所述承載部分20之對角之固定元件30,將玻璃母板60放置於所述承載治具100之承載面22上,在自身重力的作用下,玻璃母板60之一面與所述承載面22相貼合,回復固定元件30,所述固定元件30之夾緊部31即在彈簧力之作用下壓緊承載於所述承載面22上之玻璃母板60。玻璃母板60背離所述承載面22之另一面即為待鍍膜表面62。
請參閲圖1輿圖5,為承載有玻璃母板60之承載治具100放置於鍍膜傘架80之示意圖。所述基體部分10之承靠面12朝向鍍膜源(圖未示)承靠於鍍膜傘架之外表面84且跨設於鍍膜傘架之承載孔82兩側,所述承載部分20容置於承載孔82内,且玻璃母板60之待鍍膜表面62朝向鍍膜源。
優選地,所述承載部分20及玻璃母板60沿通孔40的軸向的尺寸之和大於或等於承載孔82的軸向尺寸,即,玻璃母板60之待鍍膜表面62平貼於鍍膜傘架之内表面86或朝鍍膜源凸起。由此,可避免待鍍膜表面62因内凹於鍍膜傘架之内表面86造成邊緣被遮擋而不能充分鍍膜,影響玻璃母板60之膜層均勻性。
可以理解的係,承載治具100之形狀並不局限於本實施例,對於不同之鍍膜傘架,承載治具100可以依據鍍膜傘架之承載孔之具體形狀設計為不同形狀,如圓形。
相對於先前技術,本發明提供之鍍膜治具用於濾光片鍍膜時具有如下優點:其一,製作濾光片之玻璃母板貼合於鍍膜治具中承載治具之承載面上,且由固定元件固定保持待鍍膜面與承載面之貼合狀態,由此可有效防止製作濾光片之玻璃母板發生彎曲,避免鍍膜過程玻璃母板中央及周邊膜層之厚度不均,保證最終形成之濾光片之濾光性能。其二,可提高製作濾光片之玻璃母板之利用率,降低濾光片之製作成本。其三,本發明之鍍膜治具結構簡單,易於操作,適於推廣應用,且便於調節以配合不同尺寸之玻璃母板。
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。
10‧‧‧基體部分
12‧‧‧承靠面
20‧‧‧承載部分
22‧‧‧承載面
30‧‧‧固定元件
31‧‧‧夾緊部
33‧‧‧安裝部
35‧‧‧連接部
37‧‧‧彈簧
40‧‧‧通孔
60‧‧‧玻璃母板
62‧‧‧待鍍膜表面
80‧‧‧鍍膜傘架
82‧‧‧承載孔
84‧‧‧鍍膜傘架之外表面
86‧‧‧鍍膜傘架之内表面
100‧‧‧承載治具
200‧‧‧鍍膜治具
圖1係本發明一實施例提供的鍍膜治具的示意圖,所述鍍膜治具包括鍍膜傘架及承載治具。
圖2係圖1所示的承載治具的示意圖,所述承載治具包括基體部分、承載部分及固定元件。
圖3係圖2所示的固定元件的示意圖。
圖4係圖2所示的承載治具承載待鍍膜玻璃母板的示意圖。
圖5係圖4所示的承載有待鍍膜玻璃母板的承載治具放置於圖1所示的鍍膜傘架後沿II-II方向的剖視圖。
10‧‧‧基體部分
12‧‧‧承靠面
20‧‧‧承載部分
22‧‧‧承載面
30‧‧‧固定元件
40‧‧‧通孔
100‧‧‧承載治具
Claims (9)
- 一種鍍膜治具,其包括具有至少一個承載孔的鍍膜傘架,所述鍍膜治具還進一步包括至少一個承載治具,其中,所述承載治具包括:
一個基體部分,所述基體部分承靠於鍍膜傘架之外表面且跨設於所述鍍膜傘架之承載孔的至少兩側;
一個形成於所述基體部分上之承載部分,所述承載部分收容在承載孔內,所述承載部分具有一個承載待鍍元件之承載面,所述承載面為平面,待鍍元件承載於所述承載面上時,待鍍元件朝向所述承載面之表面與所述承載面相貼合;及
用於固定承載於所述承載面上之待鍍元件之固定元件,所述固定元件使所述待鍍元件朝向所述承載面之表面與所述承載面保持貼合狀態;
所述承載治具進一步設有一個穿透所述基體部分與所述承載部分之通孔,用於監控光線穿透所述通孔並射向待鍍元件以監控待鍍元件膜層之形成。 - 如申請專利範圍第1項所述之鍍膜治具,其中,所述基體部分與所述承載部分分別為一方形平板,所述承載部分設置於所述基體部分之一表面上,且所述承載部分背離所述基體部分之表面之面積小於所述基體部分朝向所述承載部分之表面之面積。
- 如申請專利範圍第2項所述之鍍膜治具,其中,所述承載部分之四邊與所述基體部分之對應四邊之間形成所述承靠面。
- 如申請專利範圍第2項所述之鍍膜治具,其中,所述承載部分的對角位置分別設有一個所述固定元件。
- 如申請專利範圍第4項所述之鍍膜治具,其中,所述固定元件為彈性夾緊機構或卡扣配合機構。
- 如申請專利範圍第1項所述之鍍膜治具,其中,所述承載治具放入鍍膜傘架之承載孔後,所述基體部分朝向鍍膜源之表面承靠於鍍膜傘架之外表面,所述承載部分容置於承載孔内,承載於所述承載面上之待鍍元件之鍍膜表面朝向鍍膜源。
- 如申請專利範圍第6項所述之鍍膜治具,其中,所述承載部分及待鍍元件沿所述通孔的軸向的尺寸之和大於或等於承載孔的軸向尺寸。
- 如申請專利範圍第1項所述之鍍膜治具,其中,所述通孔位於所述承載治具的中心位置。
- 如申請專利範圍第1項所述之鍍膜治具,其中,所述通孔的橫截面形狀為方形或圓形。
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TW099110832A TWI452163B (zh) | 2010-04-08 | 2010-04-08 | 鍍膜治具 |
US12/859,266 US8371565B2 (en) | 2010-04-08 | 2010-08-19 | Clamping device and coating apparatus having same |
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TW099110832A TWI452163B (zh) | 2010-04-08 | 2010-04-08 | 鍍膜治具 |
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TW201134968A TW201134968A (en) | 2011-10-16 |
TWI452163B true TWI452163B (zh) | 2014-09-11 |
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Families Citing this family (4)
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CN103014617B (zh) * | 2011-09-22 | 2014-05-14 | 株式会社新柯隆 | 薄膜形成装置 |
CN105887036B (zh) * | 2016-05-12 | 2018-07-06 | 成都西沃克真空科技有限公司 | 一种工件装夹夹具 |
CN206692727U (zh) * | 2017-04-28 | 2017-12-01 | 京东方科技集团股份有限公司 | 一种基板承载组件及磁控溅射装置 |
CN115739572B (zh) * | 2021-09-03 | 2023-07-25 | 曼德电子电器有限公司 | 遮镀治具的制作方法、遮镀治具及遮镀方法 |
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TWI253512B (en) * | 2004-06-08 | 2006-04-21 | Prodisc Technology Inc | Coating jig for optical components |
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FR2633452B1 (fr) * | 1988-06-28 | 1990-11-02 | Doue Julien | Dispositif de support pour un substrat mince, notamment en un materiau semiconducteur |
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WO1996008838A1 (en) * | 1994-09-15 | 1996-03-21 | Materials Research Corporation | Apparatus and method for clampling a substrate |
DE19822064A1 (de) * | 1998-05-16 | 1999-11-18 | Leybold Ag | Vorrichtung zum Halten von Linsen, insbesondere für in einer Vakuum-Aufdampfanlage oder Sputteranlage zu beschichtender Brillengläser |
US6783299B2 (en) * | 1999-07-26 | 2004-08-31 | Ovadia Meron | Latch for detachably attaching and mounting a semiconductor wafer to a support ring |
DE10324928A1 (de) * | 2003-06-03 | 2005-07-14 | Leybold Optics Gmbh | Vakuumbeschichtungsanlage |
TWI265202B (en) * | 2005-03-02 | 2006-11-01 | Asia Optical Co Inc | Tool and device for dedicate coating a photochemical film on a substrate |
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2010
- 2010-04-08 TW TW099110832A patent/TWI452163B/zh not_active IP Right Cessation
- 2010-08-19 US US12/859,266 patent/US8371565B2/en not_active Expired - Fee Related
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US4767984A (en) * | 1985-10-04 | 1988-08-30 | Amp Incorporated | Protective fixture for chip carrier |
TWI253512B (en) * | 2004-06-08 | 2006-04-21 | Prodisc Technology Inc | Coating jig for optical components |
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US20110248437A1 (en) | 2011-10-13 |
TW201134968A (en) | 2011-10-16 |
US8371565B2 (en) | 2013-02-12 |
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